UPD6379LGR-A [RENESAS]

IC,D/A CONVERTER,SINGLE,16-BIT,CMOS,SOP,8PIN;
UPD6379LGR-A
型号: UPD6379LGR-A
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

IC,D/A CONVERTER,SINGLE,16-BIT,CMOS,SOP,8PIN

文件: 总18页 (文件大小:248K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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DATA SHEET  
MOS INTEGRATED CIRCUIT  
µPD6379, 6379A, 6379L, 6379AL  
2-CHANNEL 16-BIT D/A CONVERTER FOR AUDIO APPLICATION  
The µPD6379 and 6379A are 2-channel 16-bit D/A converters for digital audio signal demodulation. These D/A  
converters employ the resistor string conversion method which has been tested by existing model µPD6376 but they  
are more compact and require fewer external components than the µPD6376. In addition, low-voltage models, the  
µPD6379L and 6379AL (minimum operating supply voltage = +3.0 V) are also available for applications in portable  
systems.  
FEATURES  
Resistor string conversion method  
0-point digital shift circuit  
× 4 oversampling  
Sampling frequency: 200 kHz MAX.  
Signal processing format for 2’s complement, MSB first, and backward justification data accommodated  
Left and right in-phase output  
High performance (at VDD = +5.0 V)  
S/N ratio: 100 dB TYP.  
Dynamic range: 96 dB TYP.  
Low-voltage models available  
Bipolar LR clock (LRCK)  
Low power dissipation: 10 mW TYP.  
(with µPD6379L, 6379AL at VDD = +3.3 V)  
LRCK  
LRCK = L  
LRCK = H  
Supply voltage  
when L-ch data is input  
when L-ch data is input  
+3.3 V (VDD = +3.0 to 5.5 V)  
+5.0 V (VDD = +4.5 to 5.5 V)  
µPD6379L  
µPD6379  
µPD6379AL  
µPD6379A  
Few external components  
Internal output operational amplifier  
Only one electrolytic capacitor required for smoothing reference voltage, instead of two capacitors required by  
existing D/A converters  
Small package: 8-pin plastic SOP (5.72 mm (225))  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for availability  
and additional information.  
Document No. S11588EJ5V0DS00 (5th edition)  
Date Published June 2002 N CP(K)  
Printed in Japan  
The mark shows major revised points.  
1996  
©
µPD6379, 6379A, 6379L, 6379AL  
ORDERING INFORMATION  
Part number  
Package  
µPD6379GR  
8-pin plastic SOP (5.72 mm (225))  
8-pin plastic SOP (5.72 mm (225))  
8-pin plastic SOP (5.72 mm (225))  
8-pin plastic SOP (5.72 mm (225))  
µPD6379LGR  
µPD6379AGR  
µPD6379ALGR  
BLOCK DIAGRAM  
REF  
L. OUT  
Main DAC  
LRCK  
Sub DAC  
Sub DAC  
Main DAC  
CLK  
SI  
GND  
R. OUT  
VDD  
Data Sheet S11588EJ5V0DS  
2
µPD6379, 6379A, 6379L, 6379AL  
PIN CONFIGURATIONS (Top View)  
8-pin plastic SOP (5.72 mm (225))  
µPD6379GR, 6379LGR  
LRCK  
SI  
1
2
3
4
8
7
6
5
L. OUT  
GND  
CLK  
REF  
VDD  
R. OUT  
µPD6379AGR, 6379ALGR  
R. OUT  
REF  
1
2
3
4
8
7
6
5
V
DD  
CLK  
SI  
GND  
L. OUT  
LRCK  
Remark The pin configuration of the µPD6379 and 6379L is different from that of the µPD6379A and 6379AL.  
Data Sheet S11588EJ5V0DS  
3
µPD6379, 6379A, 6379L, 6379AL  
1. PIN FUNCTIONS  
Table 1-1 Pin Functions  
Pin No.  
Name  
Symbol  
LRCK  
I/O  
Function  
µPD6379,  
µPD6379A,  
6379L  
6379AL  
1
5
Left/Right Clock  
Input  
Input pin to identify left or right input data.  
µPD6379, 6379L: Input “L” to this pin when  
inputting L-ch data to SI pin.  
µPD6379A, 6379AL: Input “H” to this pin  
when  
inputting L-ch data to SI pin.  
2
6
Serial Input  
SI  
Input  
Serial data input pin.  
Input data on 2’s complement, MSB first, and  
backward justification.  
3
4
5
6
7
8
1
2
Clock  
CLK  
VDD  
Input  
Serial input data read clock (bit clock) input pin  
Positive power supply pin  
Supply Voltage  
R-ch Output  
Reference Voltage  
Output  
R. OUT  
REF  
Right analog signal output pin  
Reference voltage pin. Connect this pin to GND  
through capacitor.  
7
8
3
4
Ground  
GND  
GND pin  
L-ch Output  
L. OUT  
Output  
Left analog signal output pin  
Data Sheet S11588EJ5V0DS  
4
µPD6379, 6379A, 6379L, 6379AL  
2. ELECTRICAL SPECIFICATIONS  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)  
Parameter  
Supply voltage  
Symbol  
VDD  
VI  
Ratings  
Unit  
V
– 0.3 to +7.0  
Input voltage  
– 0.3 to VDD + 0.3  
– 0.3 to VDD + 0.3  
220 (TA = 75 ˚C)  
V
Output voltage  
VO  
V
Permissible package  
power dissipation  
PD  
mW  
Operating ambient temperature  
Storage temperature  
TA  
–20 to +75  
°C  
°C  
Tstg  
–40 to +125  
Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability;  
exceeding the ratings could cause permanent damage. The parameters apply independently. The  
device should be operated within the limits specified under DC and AC Characteristics.  
Data Sheet S11588EJ5V0DS  
5
µPD6379, 6379A, 6379L, 6379AL  
µPD6379, 6379A  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Supply voltage  
Symbol  
VDD  
VIH  
VIL  
Condition  
MIN.  
4.5  
TYP.  
5.0  
MAX.  
5.5  
Unit  
V
Logic input voltage (HIGH)  
Logic input voltage (LOW)  
Operating ambient temperature  
Output load resistance  
Conversion frequency  
Clock frequency  
0.7 VDD  
0
VDD  
V
0.3 VDD  
+75  
V
TA  
–20  
5
+25  
°C  
kΩ  
kHz  
MHz  
ns  
RL  
R. OUT, L. OUT pins  
fS  
200  
10  
fCLK  
tSCK  
tDC  
Clock pulse width  
40  
12  
12  
SI, LRCK setup time  
SI, LRCK hold time  
ns  
tCD  
ns  
ELECTRICAL CHARACTERISTICS (TA = 25 °C, VDD = +5 V, fS = 176.4 kHz)  
Parameter  
Resolution  
Symbol  
RES  
Condition  
MIN.  
TYP.  
16  
MAX.  
Unit  
Bit  
%
Total harmonic distortion  
THD  
fIN = 1 kHz, 0 dB  
0.04  
0.09  
2.3  
Full-scale output voltage  
S/N ratio  
VFS  
S/N  
D.R  
C.T  
IDD  
1.7  
93  
89  
82  
2.0  
100  
96  
96  
5
Vp-p  
dB  
With A-weight filter  
Dynamic range  
Crosstalk  
fIN = 1 kHz, –60 dB  
dB  
One side channel = 0 dB, fIN = 1 kHz  
fIN = 1 kHz, 0 dB  
dB  
Current dissipation  
12  
mA  
Data Sheet S11588EJ5V0DS  
6
µPD6379, 6379A, 6379L, 6379AL  
µPD6379L, 6379AL  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Supply voltage  
Symbol  
VDD  
VIH  
VIL  
Condition  
MIN.  
3.0  
TYP.  
3.3  
MAX.  
5.5  
Unit  
V
Logic input voltage (HIGH)  
Logic input voltage (LOW)  
Operating ambient temperature  
Output load resistance  
Conversion frequency  
Clock frequency  
0.7 VDD  
0
VDD  
V
0.3 VDD  
+75  
V
TA  
–20  
10  
+25  
°C  
kΩ  
kHz  
MHz  
ns  
RL  
R. OUT, L. OUT pins  
fS  
200  
10  
fCLK  
tSCK  
tDC  
Clock pulse width  
40  
12  
12  
SI, LRCK setup time  
SI, LRCK hold time  
ns  
tCD  
ns  
ELECTRICAL CHARACTERISTICS (TA = 25 °C, VDD = +3.3 V, fS = 176.4 kHz)  
Parameter  
Resolution  
Symbol  
RES  
Condition  
MIN.  
TYP.  
16  
MAX.  
Unit  
Bit  
%
Total harmonic distortion  
THD  
fIN = 1 kHz, 0 dB  
0.04  
0.09  
1.52  
Full-scale output voltage  
S/N ratio  
VFS  
S/N  
D.R  
C.T  
IDD  
1.12  
93  
1.32  
98  
93  
93  
3
Vp-p  
dB  
With A-weight filter  
Dynamic range  
Crosstalk  
fIN = 1 kHz, –60 dB  
89  
dB  
One side channel = 0 dB, fIN = 1 kHz  
fIN = 1 kHz, 0 dB  
82  
dB  
Current dissipation  
6
mA  
Data Sheet S11588EJ5V0DS  
7
µPD6379, 6379A, 6379L, 6379AL  
Timing Chart  
CLK  
LSB  
LSB  
10 11 12 13 14 15 16  
MSB  
1
MSB  
1
SI  
16  
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
10 11  
N
N
LRCK  
PD6379A,  
6379AL)  
(L-ch)  
(L-ch)  
(R-ch)  
(R-ch)  
(
µ
LRCK  
(µPD6379,  
6379L)  
N1  
N1  
L. OUT  
R. OUT  
t
SCK  
tSCK  
CLK  
SI  
CLK  
t
DC  
tCD  
LRCK  
t
DC  
t
CD  
Data Sheet S11588EJ5V0DS  
8
µPD6379, 6379A, 6379L, 6379AL  
3. APPLICATION CIRCUIT EXAMPLE  
µ
µ
µ
µ
PD6379  
VCC  
PD6379A  
PD6379L  
PD6379AL  
+
+
Signal processor  
L-ch  
output  
LRCK L.OUT  
LRCKO  
SO  
1
2
VCC  
SI  
GND  
47 µF  
+
BCKO  
CLK REF  
VCC  
VDD  
R.OUT  
+
+
R-ch  
output  
+
47  
µ
µ
F
F
1
2
VCC  
VDD  
0.1  
Data Sheet S11588EJ5V0DS  
9
µPD6379, 6379A, 6379L, 6379AL  
4. NOTES ON USE  
(1) Input signal format  
Input data must be input as 2s complement, MSB first, and backward justification.  
2s complement is a method of expressing both positive numbers and negative numbers as binary numbers.  
See the table below.  
2s Complement  
Decimal Number  
L.OUT, R.OUT Pin Voltage TYP. (V)  
Note 1  
(Reference Values)  
Note 2  
(MSB)  
(LSB)  
1111  
VDD = 5.0 V  
3.0  
VDD = 3.3 V  
1.98  
0111  
1111  
1111  
1111  
+32767  
+32766  
0111  
1111  
1110  
0000  
0000  
1111  
0000  
0000  
1111  
0000  
0000  
1111  
0001  
0000  
1111  
+1  
0
2.0  
1.0  
1.32  
0.66  
1  
1000  
1000  
0000  
0000  
0000  
0000  
0001  
0000  
32767  
32768  
Notes 1. Values differ depending on IC fabrication variations, supply voltage fluctuations, and ambient  
temperature.  
2. µPD6379L, 6379AL  
Make sure that the delimiter of each bit of the data (SI) and the changing timing of LRCK coincide with the  
falling edge of CLK.  
It is necessary that 16 clocks be input during 1 sample data period (16 bits). Make sure that the time width  
of 1 bit coincides with one cycle of the clock.  
In the input data, the 16 bits preceding the change point of LRCK (shown in 1 sample data periodin Fig.  
4-1, and Fig. 4-2) are considered to be valid data and are incorporated for use in D/A conversion.  
Data Sheet S11588EJ5V0DS  
10  
µPD6379, 6379A, 6379L, 6379AL  
If the clock is also supplied to CLK while data is not sampled (refer to Fig. 4-1), make sure that the changing  
timing of LRCK coincides with the falling edge (point A) of CLK after the LSB has been input.  
Fig. 4-1 Input Timing Chart (1)  
A
A
1 sample data period  
CLK  
SI  
LSB  
16  
MSB  
1
LSB  
10 11 12 13 14 15 16  
MSB  
1
Invalid  
2
3
4
5
6
7
8
9
Invalid  
2
3
4
LRCK  
If the clock is supplied to CLK only while data is sampled (refer to Fig. 4-2), set the changing timing of LRCK  
in between the falling edge (point A) of CLK after the LSB has been input and the start of inputting the next  
MSB (point B) (points A and B are included).  
Fig. 4-2 Input Timing Chart (2)  
A
B
A
B
1 sample data period  
CLK  
SI  
LSB  
16 Invalid  
MSB  
LSB  
10 11 12 13 14 15 16  
MSB  
1
2
3
4
5
6
7
8
9
Invalid  
1
2
3
4
LRCK  
Changing period of LRCK  
Changing period of LRCK  
Data Sheet S11588EJ5V0DS  
11  
µPD6379, 6379A, 6379L, 6379AL  
(2) Output signal updating timing  
The L.OUT and R.OUT signals are updated after the input of 3.5 clocks following the change point indicating  
the end of the LRCK pin R-ch data input period. Therefore, when the clock is supplied to CLK only during  
D/A conversion, the clock must be stopped after the L.OUT and R.OUT signals corresponding to the last input  
data are output. Be aware that the L.OUT and R.OUT signals corresponding to the last sample data are not output,  
especially when the clock is supplied to CLK only during a sample data period.  
Fig. 4-3 Output Timing Chart (1) (for continuous clocks)  
3.5 CLK  
CLK  
MSB  
1
LSB  
MSB  
1
LSB  
16  
16 Invalid  
Invalid  
4
13 14 15  
4
13 14 15  
SI  
2
3
2
3
1
2
3
L-ch data (N)  
R-ch data (N)  
LRCK  
(
µ
PD6379, 6379L)  
LRCK  
(
µ
PD6379A, 6379AL)  
L.OUT  
Delay  
L-ch output (N1)  
R-ch output (N1)  
L-ch output (N)  
R-ch output (N)  
R.OUT  
Fig. 4-4 Output Timing Chart (2) (when there is an interval which the clock is stopped)  
3.5 CLK  
CLK stop  
CLK stop  
CLK  
MSB  
1
LSB  
MSB  
1
LSB  
16 Invalid  
16 Invalid  
4
13 14 15  
4
13 14 15  
SI  
2
3
2
3
1
2
3
4
5
L-ch data (N)  
R-ch data (N)  
LRCK  
µ
( PD6379, 6379L)  
LRCK  
( PD6379A, 6379AL)  
µ
Delay  
L-ch output  
(N)  
L-ch output (N1)  
R-ch output (N1)  
L.OUT  
R.OUT  
R-ch output  
(N)  
(3) Countermeasures against shock noise  
It is recommended that a mute circuit be connected to the next stage of the D/A converter. If a mute circuit is  
not provided, shock noise may occur when power is applied.  
Data Sheet S11588EJ5V0DS  
12  
µPD6379, 6379A, 6379L, 6379AL  
5. PACKAGE DRAWING  
8-PIN PLASTIC SOP (5.72 mm (225))  
8
5
detail of lead end  
P
1
4
A
H
F
I
J
G
S
B
L
N
S
C
K
M
D
M
E
NOTE  
ITEM MILLIMETERS  
Each lead centerline is located within 0.12 mm of  
its true position (T.P.) at maximum material condition.  
+0.17  
5.2  
A
0.20  
B
C
0.78 MAX.  
1.27 (T.P.)  
+0.08  
0.42  
D
0.07  
E
F
G
H
I
0.1 0.1  
1.59 0.21  
1.49  
6.5 0.3  
4.4 0.15  
1.1 0.2  
J
+0.08  
0.17  
K
0.07  
L
M
N
0.6 0.2  
0.12  
0.10  
+7°  
3°  
P
3°  
S8GM-50-225B-6  
Data Sheet S11588EJ5V0DS  
13  
µPD6379, 6379A, 6379L, 6379AL  
6. RECOMMENDED SOLDERING CONDITIONS  
The following conditions must be met for soldering conditions of the product.  
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”  
(C10535E).  
Please consult with our sales offices in case other soldering process is used, or in case the soldering is done under  
different conditions.  
Table 6-1 Soldering Conditions  
µPD6379GR, 6379AGR, 6379LGR, 6379ALGR : 8-pin plastic SOP (5.72 mm (225))  
Soldering  
Soldering Conditions  
Symbol  
Process  
Infrared ray  
reflow  
Peak temperature of package surface: 235 °C or below,  
Reflow time: 30 seconds or less (at 210 °C or higher),  
Number of reflow processes: MAX. 2.  
IR35-00-2  
VPS  
Peak temperature of package surface: 215 °C or below,  
Reflow time: 40 seconds or less (at 200 °C or higher),  
Number of reflow processes: MAX. 2.  
VP15-00-2  
WS60-00-1  
Wave soldering  
Solder temperature: 260 °C or below,  
Flow time: 10 seconds or less,  
Pre-heating temperature: 120 °C or below (Package surface),  
Number of flow processes: MAX. 1.  
Partial heating  
method  
Terminal temperature: 300 °C or below,  
Time: 3 seconds or less (Per one side of the device).  
Caution Do not apply more than one soldering method at any one time, except for “Partial heating  
method”.  
Data Sheet S11588EJ5V0DS  
14  
µPD6379, 6379A, 6379L, 6379AL  
NOTES FOR CMOS DEVICES  
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS  
Note:  
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and  
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity  
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control  
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using  
insulators that easily build static electricity. Semiconductor devices must be stored and transported  
in an anti-static container, static shielding bag or conductive material. All test and measurement  
tools including work bench and floor should be grounded. The operator should be grounded using  
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need  
to be taken for PW boards with semiconductor devices on it.  
2
HANDLING OF UNUSED INPUT PINS FOR CMOS  
Note:  
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided  
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence  
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels  
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused  
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of  
being an output pin. All handling related to the unused pins must be judged device by device and  
related specifications governing the devices.  
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES  
Note:  
Power-on does not necessarily define initial status of MOS device. Production process of MOS  
does not define the initial operation status of the device. Immediately after the power source is  
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does  
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the  
reset signal is received. Reset operation must be executed immediately after power-on for devices  
having reset function.  
Data Sheet S11588EJ5V0DS  
15  
µPD6379, 6379A, 6379L, 6379AL  
The information in this document is current as of May, 2002. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4  

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