NE662M03 [RENESAS]
RF SMALL SIGNAL TRANSISTOR;型号: | NE662M03 |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | RF SMALL SIGNAL TRANSISTOR |
文件: | 总12页 (文件大小:223K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Old Company Name in Catalogs and Other Documents
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Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
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April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
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Notice
1.
2.
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3.
4.
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DATA SHEET
NPN SILICON RF TRANSISTOR
NE662M03
NPN SILICON RF TRANSISTOR FOR
LOW NOISE HIGH-GAIN AMPLIFICATION
FLAT-LEAD 3-PIN THIN-TYPE ULTRA SUPER MINIMOLD
FEATURES
•
Ideal for low noise high-gain amplification and high-frequency oscillation
NF = 1.2 dB TYP. @ VCE = 2 V, IC = 5 mA, f = 2 GHz
•
•
•
•
MSG = 15 dB TYP. @ VCE = 2 V, IC = 20 mA, f = 2 GHz
S21e 2 = 12.5 dB TYP. @ VCE = 2 V, IC = 20 mA, f = 2 GHz
fT = 21 GHz TYP. @ VCE = 2 V, IC = 20 mA, f = 2 GHz
Flat-lead 3-pin thin-type ultra super minimold package
ORDERING INFORMATION
Part Number
Quantity
Supplying Form
NE662M03
50 pcs (Non reel)
3 kpcs/reel
• 8 mm wide embossed taping
• Pin 3 (Collector) face the perforation side of the tape
NE662M03-T1
Remark To order evaluation samples, contact your nearby sales office.
The unit sample quantity is 50 pcs.
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameter
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current
Symbol
VCBO
VCEO
VEBO
IC
Ratings
Unit
V
15
3.3
V
1.5
V
35
mA
mW
°C
°C
P
tot Note
115
Total Power Dissipation
Junction Temperature
Storage Temperature
Tj
150
Tstg
−65 to +150
Note Mounted on 1.08 cm2 × 1.0 mm (t) glass epoxy PCB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PU10324EJ02V0DS (2nd edition)
Date Published May 2003 CP(K)
The mark • shows major revised points.
Printed in Japan
NEC Compound Semiconductor Devices 2002, 2003
NE662M03
ELECTRICAL CHARACTERISTICS (TA = +25°C)
Parameter
DC Characteristics
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Collector Cut-off Current
Emitter Cut-off Current
DC Current Gain
ICBO
IEBO
h
VCB = 5 V, IE = 0 mA
VEB = 1 V, IC = 0 mA
= 2 V, I = 5 mA
–
–
–
–
200
200
100
nA
nA
–
FE Note 1
CE
C
V
60
80
RF Characteristics
Gain Bandwidth Product
Insertion Power Gain
Noise Figure
fT
VCE = 2 V, IC = 20 mA, f = 2 GHz
= 2 V, I = 20 mA, f = 2 GHz
–
10.0
–
21
12.5
1.2
–
–
GHz
dB
2
S
21e
V
CE
C
VCE = 2 V, IC = 5 mA, f = 2 GHz,
ZS = Zopt
NF
1.5
dB
Reverse Transfer Capacitance
Maximum Available Power Gain
Maximum Stable Power Gain
C
re Note 2
V
CB
= 2 V, I = 0 mA, f = 1 MHz
E
–
–
–
0.21
14
0.3
–
pF
dB
dB
MAGNote 3 VCE = 2 V, IC = 20 mA, f = 2 GHz
MSGNote 4 VCE = 2 V, IC = 20 mA, f = 2 GHz
15
–
Notes 1. Pulse measurement: PW ≤ 350 µs, Duty Cycle ≤ 2%
2. Collector to base capacitance when the emitter grounded
S21
S12
(K – √ (K2 – 1) )
3. MAG =
S21
S12
4. MSG =
hFE CLASSIFICATION
Rank
FB
UF
Marking
hFE Value
60 to 100
2
Data Sheet PU10324EJ02V0DS
NE662M03
TYPICAL CHARACTERISTICS (TA = +25°C ,unless otherwise specified)
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
0.5
200
150
f = 1 MHz
Mounted on Glass Epoxy PCB
(1.08 cm2 × 1.0 mm (t) )
0.4
0.3
0.2
0.1
115
100
50
0
25
50
7578
100
125
(˚C)
150
0
2
4
6
8
10
Collector to Base Voltage VCB (V)
Ambient Temperature T
A
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
100
10
1
100
10
1
V
CE = 1 V
VCE = 2 V
0.1
0.1
0.01
0.001
0.01
0.001
0.0001
0.0001
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Base to Emitter Voltage VBE (V)
Base to Emitter Voltage VBE (V)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
40
35
30
25
20
15
10
5
500
µ
A
450
400
350
300
250
200
µ
µ
µ
µ
µ
µ
A
A
A
A
A
A
150
µ
A
100
µ
µ
A
A
I
B
= 50
0
1
2
3
4
Collector to Emitter Voltage VCE (V)
3
Data Sheet PU10324EJ02V0DS
NE662M03
DC CURRENT GAIN vs.
COLLECTOR CURRENT
DC CURRENT GAIN vs.
COLLECTOR CURRENT
1 000
100
10
1 000
100
10
V
CE = 1 V
VCE = 2 V
0.1
1
10
(mA)
100
0.1
1
10
(mA)
100
Collector Current I
C
Collector Current I
C
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
25
20
25
20
V
CE = 1 V
V
CE = 2 V
f = 2 GHz
f = 2 GHz
15
10
5
15
10
5
0
0
1
10
100
1
10
100
Collector Current I
C
(mA)
Collector Current I (mA)
C
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
35
30
25
20
15
10
35
30
25
20
15
10
V
CE = 1 V
VCE = 2 V
I
C
= 20 mA
I = 20 mA
C
MSG
MSG
MAG
MAG
2
|S21e
|
2
|S21e
|
5
0
5
0
0.1
1
10
0.1
1
10
Frequency f (GHz)
Frequency f (GHz)
4
Data Sheet PU10324EJ02V0DS
NE662M03
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
25
20
15
10
5
25
20
15
10
5
V
CE = 1 V
VCE = 2 V
f = 1 GHz
f = 1 GHz
MSG
MAG
MSG
MAG
2
2
|S21e|
|S21e
|
0
0
1
10
Collector Current I
100
1
10
Collector Current I (mA)
100
C
(mA)
C
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
25
20
15
10
5
25
20
15
10
5
V
CE = 1 V
VCE = 2 V
f = 2 GHz
f = 2 GHz
MSG
MSG
MAG
MAG
2
2
|S21e
|
|S21e
|
0
0
1
10
Collector Current I
100
1
10
Collector Current I (mA)
100
C
(mA)
C
INSERTION POWER GAIN, MAG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG
vs. COLLECTOR CURRENT
20
15
10
5
20
15
10
5
V
CE = 2 V
V
CE = 1 V
f = 4 GHz
f = 4 GHz
MAG
MAG
2
|S21e
|
2
|S21e
|
0
0
1
10
Collector Current I (mA)
100
1
10
Collector Current I
100
C
(mA)
C
5
Data Sheet PU10324EJ02V0DS
NE662M03
OUTPUT POWER, COLLECTOR
CURRENT vs. INPUT POWER
OUTPUT POWER, COLLECTOR
CURRENT vs. INPUT POWER
15
10
5
50
40
30
20
10
0
15
10
5
50
40
30
20
10
0
V
CE = 2 V, f = 1 GHz
V
CE = 2 V, f = 2 GHz
ICq = 5 mA (RF OFF)
ICq = 5 mA (RF OFF)
Pout
P
out
0
–5
0
–5
I
C
I
C
–10
–25
–10
–20
–20
–15
–10
–5
0
–15
–10
–5
0
5
Input Power Pin (dBm)
Input Power Pin (dBm)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
5
4
3
2
20
16
12
8
5
4
3
2
20
16
12
8
V
CE = 1 V
VCE = 2 V
f = 1 GHz
f = 1 GHz
G
a
G
a
NF
NF
1
0
1
0
4
0
4
0
1
10
Collector Current I
100
1
10
Collector Current I
100
C
(mA)
C
(mA)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
5
4
3
2
20
16
12
8
5
4
3
2
20
16
12
8
V
CE = 1 V
VCE = 2 V
f = 2 GHz
f = 2 GHz
G
a
G
a
NF
NF
1
0
1
0
4
0
4
0
1
10
Collector Current I
100
1
10
Collector Current I
100
C
(mA)
C
(mA)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PU10324EJ02V0DS
NE662M03
S-PARAMETERS
S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form
(S2P) that enables direct import to a microwave circuit simulator without keyboard input.
Click here to download S-parameters.
[RF and Microwave] → [Device Parameters]
URL http://www.csd-nec.com/
7
Data Sheet PU10324EJ02V0DS
NE662M03
PACKAGE DIMENSIONS
FLAT-LEAD 3-PIN THIN-TYPE ULTRA SUPER MINIMOLD (UNIT: mm)
1.2 ± 0.05
0.8 ± 0.1
2
3
1
PIN CONNECTIONS
1. Emitter
2. Base
3. Collector
8
Data Sheet PU10324EJ02V0DS
NE662M03
•
The information in this document is current as of May, 2003. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
9
Data Sheet PU10324EJ02V0DS
NE662M03
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 E-mail: salesinfo@csd-nec.com
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
http://www.ee.nec.de/
TEL: +49-211-6503-01 FAX: +49-211-6503-487
FAX: +852-3107-7309 E-mail: ncsd-hk@elhk.nec.com.hk
NEC Electronics (Europe) GmbH
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0302-1
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