ISL6455IRZ [RENESAS]

1.3 A SWITCHING REGULATOR, 880 kHz SWITCHING FREQ-MAX, PQCC24, 4 X 4 MM, GREEN, PLASTIC, MO-220VGGD-2, QFN-24;
ISL6455IRZ
型号: ISL6455IRZ
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

1.3 A SWITCHING REGULATOR, 880 kHz SWITCHING FREQ-MAX, PQCC24, 4 X 4 MM, GREEN, PLASTIC, MO-220VGGD-2, QFN-24

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文件: 总13页 (文件大小:591K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
OBSOLETE PRODUCT  
DATASHEET  
NO RECOMMENDED REPLACEMENT  
contact our Technical Support Center at  
1-888-INTERSIL or www.intersil.com/tsc  
ISL6455, ISL6455A  
Triple Output Regulator with Single Synchronous Buck and Dual LDO  
FN9196  
Rev 1.00  
Feb 19, 2014  
The ISL6455 is a highly integrated triple output regulator  
which provides a single chip solution for FPGAs and wireless  
Features  
• Fully integrated synchronous buck regulator + dual LDO  
chipset power management. The device integrates an  
adjustable high efficiency synchronous buck regulator with  
two adjustable ultra low noise LDO regulators. Either the  
ISL6455 or ISL6455A can be selected based on whether  
3.3V ±10% or 5V ±10% is required as an input voltage.  
• PWM output voltage adjustable.  
- 0.8V to 2.5V with ISL6455 (VIN = 3.3V)  
- 0.8V to 3.3V with ISL6455A (VIN = 5.0V)  
• High output current. . . . . . . . . . . . . . . . . . . . . . . . . 600mA  
The synchronous current mode control PWM regulator with  
integrated N- Channel and P-Channel power MOSFET  
provides adjustable voltages based on external resistor  
setting. Synchronous rectification with internal MOSFETs is  
used to achieve higher efficiency and reduced number of  
external components. Operating frequency is typically  
750kHz, allowing the use of smaller inductor and capacitor  
values. The device can be synchronized to an external clock  
signal in the range of 500kHz to 1MHz. The PG_PWM  
output indicates loss of regulation on PWM output.  
• Dual LDO adjustable options  
- LDO1, 1.2V to Vin - 0.3V (3.3Vmax). . . . . . . . . . 300mA  
- LDO2, 1.2V to Vin - 0.3V (3.3Vmax). . . . . . . . . . 300mA  
• Ultra-compact DC/DC converter design  
• Stable with small ceramic output capacitors and no load  
• High conversion efficiency  
• Low shutdown supply current  
• Low dropout voltage for LDOs  
- LDO1 . . . . . . . . . . . . . . . . . . 150mV (typical) at 300mA  
- LDO2 . . . . . . . . . . . . . . . . . . 150mV (typical) at 300mA  
The ISL6455 also has two LDO adjustable regulators using  
internal PMOS transistors as pass devices. LDO2 features  
ultra low noise typically below 30µV  
to aid VCO stability.  
• Low output voltage noise  
RMS  
The EN_LDO pin controls LDO1 and LDO2 outputs. The  
ISL6455 also integrates a RESET function, which eliminates  
the need for additional RESET IC required in WLAN and  
other applications. The IC asserts a RESET signal whenever  
- <30µV  
(typical) for LDO2 (VCO supply)  
RMS  
• PG_LDO and PG_PWM (PWM and LDO) outputs  
• Extensive circuit protection and monitoring features  
- PWM overvoltage protection  
- Overcurrent protection  
the V supply voltage drops below a preset threshold,  
IN  
keeping it asserted for at least 25ms after V has risen  
IN  
above the reset threshold. The PG_LDO output indicates  
loss of regulation on either of the two LDO outputs. Other  
features include overcurrent protection and thermal  
shutdown for all of the three outputs. High integration and  
the thin Quad Flat No-lead (QFN) package makes ISL6455  
an ideal choice for powering FPGAs and small form factor  
wireless cards such as PCMCIA, mini-PCI and Cardbus-32.  
- Shutdown  
- Thermal shutdown  
• Integrated RESET output for microprocessor reset  
• Proven reference design for total WLAN system solution  
• QFN package  
- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat  
No Leads - Product Outline  
Ordering Information  
- Near Chip-Scale package footprint Improves PCB  
efficiency and is thinner in Profile  
PART NUMBER*  
(Note)  
PART  
TEMP.  
PACKAGE  
PKG.  
MARKING RANGE (°C) (Pb-Free) DWG. #  
• Pb-free (RoHS compliant)  
ISL6455IRZ  
64 55IRZ -40 to +85 24 Ld QFN L24.4x4B  
64 55AIRZ -40 to +85 24 Ld QFN L24.4x4B  
Applications  
ISL6455AIRZ  
Add “-TK” or T5K suffix for tape and reel. Please refer to TB347 for  
details on reel specifications.  
• WLAN cards  
- PCMCIA, Cardbus32, MiniPCI cards  
- Compact flash cards  
NOTE: These Intersil Pb-free plastic packaged products employ  
special Pb-free material sets; molding compounds/die attach  
materials and 100% matte tin plate PLUS ANNEAL - e3 termination  
finish, which is RoHS compliant and compatible with both SnPb and  
Pb-free soldering operations. Intersil Pb-free products are MSL  
classified at Pb-free peak reflow temperatures that meet or exceed the  
Pb-free requirements of IPC/JEDEC J STD-020.  
• Hand-held instruments  
Related Literature  
• TB363 - Guidelines for Handling and Processing Moisture  
Sensitive Surface Mount Devices (SMDs)  
• TB389 - PCB Land Pattern Design and Surface Mount  
Guidelines for QFN Packages  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 1 of 13  
ISL6455, ISL6455A  
Pinout  
ISL6455, ISL6455A (24 LD QFN)  
TOP VIEW  
24 23 22 21 20 19  
18  
17  
16  
15  
14  
13  
1
2
3
4
5
6
SGND  
GND  
CT  
FB_LDO2  
FB_LDO1  
CC1  
VOUT  
RESET  
EN  
GND_LDO  
VOUT1  
SYNC  
7
8
9
10 11 12  
Typical Application Schematic  
3.3V  
C9  
C10  
1.0µF  
10µF  
L1  
C8  
Vopwm  
8.2µH  
C7  
10µF  
0.1µF  
R1  
10k  
Re  
Rf  
1
22 21 20 19 18  
FB_PWM  
PG_PWM  
VOUT  
16  
11  
12  
13  
EN_LDO  
VOUT2  
24  
9
SYNC  
CC1  
EN  
Vout2  
Vout1  
ISL6455  
C4  
10µF  
33nF  
C2  
GND_LDO  
Ra  
Rb  
5
6
3
4
14  
23  
VOUT1  
3.3V  
R3  
10k  
Rc  
FB_LDO1  
PG_LDO  
C3  
10µF  
15 17  
7
8
10  
2
Rd  
C1  
3.3V  
10nF  
C6  
33nF  
C5  
4.7µF  
NOTE: All capacitors are ceramic.  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 2 of 13  
ISL6455, ISL6455A  
Functional Block Diagram  
VIN_LDO  
VIN_LDO  
Gm  
10nF  
CT  
VIN_LDO  
BAND  
GAP  
REF  
VOUT1  
RESET  
RESET  
+
-
1.2V  
VOUT1  
LDO1  
0
3.3V  
10k  
WINDOW  
COMP.  
R
c
POR  
POR  
10µF  
FB_LDO1  
PG_LDO  
R
d
EN  
CC1  
CC2  
33nF  
33nF  
Gm  
CONTROL  
LOGIC  
EN_LDO  
VOUT2  
+
-
GND_LDO  
VOUT2  
LDO2  
THERMAL  
SHUTDOWN  
+150°C  
0
R
R
a
WINDOW  
COMP.  
10µF  
FB_LDO2  
b
VIN  
VIN  
PVCC  
3.3V  
CURRENT  
SENSE  
RTN  
SGND  
SLOPE  
COMPENSATION  
SOFT-  
START  
8.2µH  
EN  
VOUT  
PWM  
LX  
GATE  
DRIVE  
OVERCURRENT,  
OVERVOLTAGE  
LOGIC  
FB_PWM  
EA  
GM  
10µF  
COMPENSATION  
PGND  
750kHz  
OSCILLATOR  
R
e
EN  
POWER GOOD  
PWM  
R
f
GND  
V
OUT  
UVLO  
PWM  
REFERENCE  
0.45V  
VOUT  
SYNC EN  
10k  
PG_PWM  
3.3V  
10k  
3.3V  
10k  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 3 of 13  
ISL6455, ISL6455A  
Absolute Maximum Ratings  
Thermal Information  
Supply Voltage V , PV , V _LDO. . . . . . . .GND -0.3V to +6.0V  
CC  
Max Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . 600mA  
Thermal Resistance (Typical)  
(°C/W)  
42  
(°C/W)  
6
JA  
JC  
IN  
IN  
24 Ld QFN (Note 1) . . . . . . . . . . . . . . .  
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C  
Maximum Junction Temperature Range . . . . . . . . .-55°C to +150°C  
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below  
http://www.intersil.com/pbfree/Pb-FreeReflow.asp  
Operating Conditions  
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C  
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and  
result in failures not covered by warranty.  
NOTES:  
1. is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See  
JA  
Tech Brief TB379.  
2. For , the “case temp” location is the center of the exposed metal pad on the package underside.  
JC  
Electrical Specifications Recommended operating conditions unless otherwise noted. V = V _LDO = PV = 3.3V for ISL6455 and  
IN  
IN  
CC  
5.0V for the ISL6455A, Compensation Capacitors = 33nF for LDO1 and LDO2. T = -40°C to +85° (Note 2),  
A
typical values are at T = +25°C.Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless  
A
otherwise specified. Temperature limits established by characterization and are not production tested  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
SUPPLY  
CC  
VIN_PWM Supply Voltage Range  
ISL6455  
3.0  
4.2  
3.0  
-
3.3  
5.0  
-
3.6  
5.5  
5.5  
3.1  
V
V
ISL6455A  
VIN_LDO Supply Voltage Range  
V
Operating Supply Current (Note 4) for ISL6455  
V
= V _LDO = PV  
IN  
= 3.3V  
2.5  
mA  
IN  
CC  
= 10µF, I = 0mA  
f
= 750kHz, C  
SW  
OUT  
L
Operating Supply Current (Note 4) for ISL6455A  
V
= V _LDO = PV  
= 5.0V  
-
-
3.5  
5
4.5  
10  
mA  
µA  
IN  
IN  
= 750kHz, C  
CC  
= 10µF, I = 0mA  
f
SW  
OUT  
L
Shutdown Supply Current  
ISL6455 and ISL6455A  
EN = EN_LDO = GND  
Input Bias Current (EN pin)  
EN = EN_LDO = GND/V  
-1.5  
2.55  
2.51  
3.94  
3.78  
2.46  
2.53  
-
1.0  
2.65  
2.56  
4.05  
3.89  
2.64  
2.59  
150  
20  
1.5  
2.71  
2.61  
4.13  
3.97  
2.82  
2.66  
-
µA  
V
IN  
VIN_PWM UVLO Threshold for ISL6455  
V
V
V
V
V
V
TR  
TF  
TR  
TF  
TR  
TF  
V
VIN_PWM UVLO Threshold for ISL6455A  
V
V
VIN_LDO UVLO Threshold for ISL6455 and  
ISL6455A  
V
V
Thermal Shutdown Temperature (Note 6)  
Thermal Shutdown Hysteresis (Note 6)  
SYNCHRONOUS BUCK PWM REGULATOR  
Output Voltage  
Rising Threshold  
°C  
°C  
-
-
ISL6455  
0.8  
0.8  
-
-
-
-
2.5  
3.3  
0.9  
0.5  
V
V
ISL6455A  
FB_PWM Initial Voltage Accuracy (Note 7)  
FB_PWM Line Regulation  
V
= 0.45V, I  
OUT  
= 3mA, T = -40°C to +85°C  
-0.9  
-0.5  
%
%
REF  
A
I
= 3mA, V = PV  
IN  
= 3.0V - 3.6V (ISL6455)  
CC  
O
or 4.2V - 5.5V (6455A)  
FB_PWM Load Regulation  
Peak Output Current Limit  
I
= 3mA to 500mA, V = PV = 3.0V - 3.6V  
CC  
-1.1  
-
+1.1  
%
O
IN  
(ISL6455) or 4.2V - 5.5V (ISL6455A)  
700mA  
-
-
1300  
-
mA  
PMOS r  
I
= 200mA  
OUT  
170  
m  
DS(ON)  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 4 of 13  
 
 
ISL6455, ISL6455A  
Electrical Specifications Recommended operating conditions unless otherwise noted. V = V _LDO = PV = 3.3V for ISL6455 and  
IN  
IN  
CC  
5.0V for the ISL6455A, Compensation Capacitors = 33nF for LDO1 and LDO2. T = -40°C to +85° (Note 2),  
A
typical values are at T = +25°C.Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless  
A
otherwise specified. Temperature limits established by characterization and are not production tested  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
50  
MAX  
UNITS  
m  
%
NMOS r  
DS(ON)  
I
I
= 200mA  
-
-
-
-
-
-
OUT  
Efficiency  
= 200mA, V = 3.3V, V  
IN  
= 1.8V  
93  
OUT  
OUT  
Soft-Start Time  
OSCILLATOR  
4096 Clock Cycles @ 750kHz  
5.5  
ms  
Oscillator Frequency  
T
= -40°C to +85°C  
620  
500  
70  
-
750  
880  
kHz  
kHz  
%
A
Frequency Synchronization Range (f  
SYNC High Level Input Voltage  
SYNC Low Level Input Voltage  
Sync Input Leakage Current  
)
Clock signal on SYNC pin  
-
-
1000  
SYNC  
As % of V  
As % of V  
-
30  
1.0  
-
IN  
IN  
-
%
SYNC = GND or V  
-1.0  
-
-
A  
%
IN  
Min Duty Cycle of External Clock Signal (Note 6)  
Max Duty Cycle of External Clock Signal (Note 6)  
PG_PWM  
20  
80  
-
-
%
Rising Threshold  
1.2mA source/sink, FB_PWM vs 0.45V V  
+5.5  
-10.5  
-
8.0  
-8.0  
0.01  
+10.5  
-5.5  
0.1  
%
%
REF  
Falling Threshold  
FB_PWM vs 0.45V V  
REF  
Leakage Current  
PG_PWM = GND or V  
A  
IN  
LDO1 SPECIFICATIONS  
Output Voltage Range  
VIN_VLDO > 3.0V  
VIN_VLDO > 3.6V  
1.2  
1.2  
-1.5  
300  
350  
-
-
2.7  
3.3  
1.5  
-
V
V
Output Voltage Range  
-
FB_LDO1 Voltage Accuracy (Note 7)  
Maximum Output Current (Note 6)  
Output Current Limit (Note6)  
Dropout Voltage (Note 4)  
FB_LDO1 Line Regulation  
FB_LDO1 Load Regulation  
Output Voltage Noise (Note 6)  
I
= 10mA  
-
%
OUT  
V
= 3.6V  
-
420  
150  
-
mA  
mA  
mV  
%/V  
%
IN  
600  
300  
0.5  
0.5  
I
I
I
= 300mA  
OUT  
OUT  
OUT  
= 10mA, VIN_LDO = 3.0-5.5V  
= 10mA to 300mA  
-0.5  
-0.5  
-
10Hz < f < 100kHz, I  
= 10mA  
OUT  
C
= 2.2µ2F  
= 10µF  
-
-
65  
60  
-
-
V  
V  
OUT  
OUT  
RMS  
RMS  
C
LDO2 SPECIFICATIONS  
Output Voltage Range  
VIN_VLDO > 3.0V  
VIN_VLDO > 3.6V  
1.2  
1.2  
-1.5  
300  
350  
-
-
2.7  
3.3  
1.5  
-
V
V
Output Voltage Range  
-
FB_LDO2 Voltage Accuracy (Note 7)  
Maximum Output Current (Note 6)  
Output Current Limit (Note 6)  
Dropout Voltage (Note 4)  
I
= 10mA  
-
%
mA  
mA  
mV  
%/V  
%
OUT  
V
= 3.6V  
-
420  
150  
-
IN  
600  
300  
0.5  
0.5  
I
I
I
= 300mA  
OUT  
OUT  
OUT  
FB_LDO2 Line Regulation  
FB_LDO2 Load Regulation  
= 10mA, VIN_LDO = 3.0V - 5.5V  
= 10mA to 300mA  
-0.5  
-0.5  
-
FN9196 Rev 1.00  
Feb 19, 2014  
Page 5 of 13  
ISL6455, ISL6455A  
Electrical Specifications Recommended operating conditions unless otherwise noted. V = V _LDO = PV = 3.3V for ISL6455 and  
IN  
IN  
CC  
5.0V for the ISL6455A, Compensation Capacitors = 33nF for LDO1 and LDO2. T = -40°C to +85° (Note 2),  
A
typical values are at T = +25°C.Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless  
A
otherwise specified. Temperature limits established by characterization and are not production tested  
PARAMETER  
TEST CONDITIONS  
10Hz < f < 100kHz, I = 10mA  
MIN  
TYP  
MAX  
UNITS  
Output Voltage Noise (Note 6)  
OUT  
C
C
= 2.2µF  
= 10µF  
-
-
30  
20  
-
-
µV  
µV  
OUT  
RMS  
RMS  
OUT  
ENABLE (EN and (EN_LDO)  
EN High Level Input Voltage  
EN Low Level Input Voltage  
RESET BLOCK SPECIFICATIONS  
RESET (reset released)  
As % of VIN  
As % of VIN  
70  
-
-
-
-
%
%
30  
ISL6455, ISOURCE = 500µA, VIN = 2.90V  
0.8 x  
-
-
V
V
CC  
-
RESET (reset asserted)  
RESET Rising Threshold  
RESET Falling Threshold  
RESET (reset released)  
ISL6455, ISINK = 1.2mA, VIN = 2.50V  
-
0.3  
2.84  
2.81  
-
V
V
V
V
ISL6455  
2.71  
2.69  
0.8 x  
2.77  
2.75  
-
ISL6455  
ISL6455A, ISOURCE = 800µA, VIN = 4.70V  
V
CC  
-
RESET (reset asserted)  
ISL6455A, ISINK = 3.2mA, VIN = 4.10V  
-
0.4  
V
V
RESET Rising Threshold  
ISL6455A  
ISL6455A  
ISL6455  
4.19  
4.27  
4.24  
20  
4.35  
RESET Falling Threshold  
4.16  
4.32  
V
RESET Threshold Hysteresis  
RESET Threshold Hysteresis  
RESET Active Timeout Period (Note 5)  
POWER GOOD (PG_LDO)  
Minimum Input Voltage for Valid PG_LDO  
PGOOD Threshold (Rising)  
PGOOD Threshold (Falling)  
PGOOD Output Voltage Low  
PGOOD Output Leakage Current  
PWM OUTPUT OVERVOLTAGE  
Overvoltage Threshold  
-
-
-
-
-
-
mV  
mV  
ms  
ISL6455A  
30  
C
= 0.01µF  
25  
T
-
+11  
-17  
-
1.2  
+15  
-15  
-
-
V
%
%
V
+17  
-11  
0.4  
0.1  
FB_LDO vs 1.184V VREF  
I
= 1.2mA  
OL  
PG_LDO = GND or VIN  
-
0.01  
µA  
28  
31  
34  
%
FB_PWM vs 0.45V VREF  
NOTES:  
3. This is the V current consumed when the device is active but not switching. Does not include gate drive current.  
IN  
4. The dropout voltage is defined as V - V  
IN  
, when V  
OUT OUT  
is 50mV below the value of V  
for V = V  
IN  
+ 0.5V.  
OUT  
OUT  
5. The RESET timeout period is linear with CT at the slope of 2.5ms/nF. Thus, at 10nF (0.01µF) the RESET time is 25ms; at 1000nF (0.1µF) the  
RESET time would be 250ms.  
6. Limits established by characterization and are not production tested.  
7. Add the external feedback resistor mismatch error to get initial V  
accuracy.  
OUT  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 6 of 13  
 
 
ISL6455, ISL6455A  
PG_LDO Timing Diagram  
V
IN  
V
V
V
UVLO  
UVLO  
V
PG  
PG  
t
RISING  
MAX +18%  
VFB_LDO  
PG_LDO  
THRESHOLD  
VOLTAGE  
FALLING  
MIN -17%  
t
PG_LDO  
OUTPUT  
OUTPUT  
UNDEFINED  
OUTPUT  
UNDEFINED  
t
NOTE:  
8. V  
is the minimum input voltage for a valid PG_LDO.  
PG  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 7 of 13  
ISL6455, ISL6455A  
V
- This pin is the output of LDO2. Bypass with a  
Pin Descriptions  
PVCC - Positive supply for the power (internal FET) stage of  
the PWM section.  
OUT2  
minimum 2.2µF, low ESR capacitor to GND_LDO for stable  
operation.  
GND_LDO - Ground pin for LDO1 and LDO2.  
SGND - Analog ground for the PWM. All internal control  
circuits are referenced to this pin.  
V
- This pin is the output of LDO1. Bypass with a  
OUT1  
minimum 2.2µF, low ESR capacitor to GND_LDO for stable  
operation.  
EN - The PWM controller is enabled when this pin is HIGH,  
and disabled when the pin is pulled LOW. It is a CMOS  
logic-level input (referenced to V ).  
IN  
PGND - Power ground for the PWM controller stage.  
V
_LDO - This is the input voltage pin for LDO1 and LDO2.  
V
- This I/O pin senses the output voltage of the PWM  
IN  
OUT  
converter for the purpose of detecting the over and  
undervoltage conditions.  
EN_LDO - LDO1 and LDO2 are enabled when this pin is  
HIGH, and disabled when the pin is pulled LOW. It is a  
CMOS logic-level input (referenced to V ).  
IN  
PG_PWM - This pin is an active pull-down able to sink 1mA  
(min). This output is HIGH IMPEDANCE when V  
within ±8% (typical). For pull-up, add a resistor  
approximately 10kfrom PG_PWM to VIN  
is  
OUT  
CT - Timing capacitor pin to set the 25ms minimum pulse  
width for the RESET signal.  
RESET - This pin is the output of the reset supervisory  
circuit, which monitors VIN_PWM. The IC asserts a RESET  
signal whenever the supply voltage drops below a preset  
threshold. It is kept asserted for a minimum of 25ms after  
FB_LDO1 and FB_LDO2 - These pins are used to set the  
LDO output with the proper selection of resistors. i.e. Ra and  
Rb for LDO1 and Rc and Rd for LDO2. Resistors should be  
chosen to provide a minimum current of 200µA load for each  
LDO output.  
V
(V ) has risen above the reset threshold. The output is  
CC IN  
push-pull. The device will continue to operate until V drops  
IN  
below the UVLO threshold.  
LX - The LX pin is the switching node of synchronous buck  
converter, connected internally at the junction point of the  
upper MOSFET source and lower MOSFET drain. Connect  
this pin to the output inductor.  
When EN = LOW then RESET = HIGH and the moment EN  
is made HIGH the RESET will pulse LOW for a period of  
25ms minimum (VIN > Reset threshold). If VIN < reset  
threshold then it will switch low and stay low for a period of  
25ms after VIN_PWM crosses the reset threshold.  
V
- This pin is the power supply for the PWM controller  
IN  
stage and must be closely decoupled to ground.  
PG_LDO - This is a high impedance open drain output that  
provides the status of both LDOs. When either of the outputs  
are out of regulation, PG_LDO goes LOW. Add a pull-up  
resistor approximately 10kfrom PG_LDO to VIN.  
SYNC - This is the external clock synchronization input. The  
device can be synchronized to 500kHz to 1MHz switching  
frequency. If unused then it should be tied to GND or VCC  
GND - Tie this pin to the ground plane with a low impedance,  
CC1 - This is the compensation capacitor connection for  
LDO1. Connect a 0.033µF capacitor from CC1 to  
GND_LDO.  
shortest possible path.  
FB_PWM- This is used to set the value of the output voltage  
of the PWM with external resistors Re and Rf.  
CC2 - This is the compensation capacitor connection for  
LDO2. Connect a 0.033µF capacitor from CC2 to  
GND_LDO.  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 8 of 13  
ISL6455, ISL6455A  
on the SYNC pin is detected for a duration of two internal  
1.3µs clock cycles.  
Functional Description  
The ISL6455 is a 3-in-1 multi-output regulator designed for  
FPGA and wireless chipset power applications. The device  
integrates a single synchronous buck regulator with dual  
LDOs. The PWM output can be set by choosing appropriate  
values for Re and Rf. At a setting of 1.8V the synchronous  
buck regulator provides for an efficiency greater than 92%.  
The LDO1 can be set with resistor pair Rc and Rd. The  
LDO2 can be set with the resistor pair Ra and Rb.  
Soft-Start  
As the EN (Enable) pin goes high, the soft-start function will  
generate an internal voltage ramp. This causes the start-up  
current to slowly rise preventing output voltage overshoot  
and high in-rush currents. The soft-start duration is typically  
5.5ms with 750kHz switching frequency. When the soft-start  
is completed, the error amplifier will be connected directly to  
the internal voltage reference. The SYNC input is ignored  
during soft-start.  
Undervoltage lock-out (UVLO) prevents the converter from  
turning on when the input voltage is less than 2.6V typical.  
Additional blocks include output overcurrent protection,  
thermal sensor, PGOOD detectors, RESET function and  
shutdown logic.  
Enable PWM  
Logic low on EN pin forces the PWM section into shutdown.  
In shutdown all the major blocks of the PWM including power  
switches, drivers, voltage reference, and oscillator are  
turned off.  
Synchronous Buck Regulator  
The synchronous buck regulator with integrated N-Channel  
and P-Channel power MOSFETs and external voltage  
setting resistors provides for adjustable voltages from the  
PWM. Synchronous rectification with internal MOSFETs is  
used to achieve higher efficiency and reduced number of  
external components. Operating frequency is typically  
750kHz allowing the use of smaller inductor and capacitor  
values. The device can be synchronized to an external clock  
signal in the range of 500kHz to 1MHz. The PG_PWM  
output indicates loss of regulation on PWM output.  
Power Good (PG_PWM)  
When chip is enabled, this output is asserted HIGH, when  
V
is within 8% of V value and active low outside  
OUT  
OPWM  
this range. When the PWM is disabled, the output is active  
low.  
Leave the PG_PWM pin unconnected when not used.  
PWM Overvoltage and Overcurrent Protection  
The PWM output current is sampled at the end of each PWM  
cycle. Should it exceed the overcurrent limit, a 4-bit up/down  
counter counts up two LSB. Should it not be in overcurrent,  
the counter counts down one LSB, (but the counter will not  
"rollover" or count below 0000). If > 33% of the PWM cycles  
go into overcurrent, the counter rapidly reaches count 1111  
and the PWM output is shut down and the soft-start counter  
is reset. After 16 clocks the PWM, output is enabled and the  
SS cycle is started.  
The PWM architecture uses a peak current mode control  
scheme with internal slope compensation. At the beginning  
of each clock cycle, the high side P-channel MOSFET is  
turned on. The current in the inductor ramps up and is  
sensed via an internal circuit. The error amplifier sets the  
threshold for the PWM comparator. The high side switch is  
turned off when the sensed inductor current reaches this  
threshold. After a minimum dead time preventing shoot  
through current, the low side N-Channel MOSFET will be  
turned on, and the current ramps down again. As the clock  
cycle is completed, the low side switch will be turned off and  
the next clock cycle starts.  
If V  
OUT  
exceeds the overvoltage limit for 32 consecutive  
clock cycles, the PWM output is shut off and the SS counters  
reset. The chip waits for the output voltage to go below  
undervoltage (8% below nominal) then goes through two  
dummy soft-start cycles (PWM disabled for 2 SS cycles =  
11ms) and then starts a normal soft-start cycle.  
The control loop is internally compensated reducing the  
amount of external components.  
The switch current is internally sensed and the maximum  
peak current limit is 1300mA.  
PG_LDO  
PG_LDO is an open drain pulldown NMOS output that will  
sink 1mA at 0.4V maximum. It goes to the active low state if  
either LDO output is out of regulation by a value greater than  
15%. When the LDO is disabled, the output is active low.  
Synchronization  
The typical operating frequency for the converter is 750kHz  
if no clock signal is applied to SYNC pin. It is possible to  
synchronize the converter to an external clock within a  
frequency range from 500kHz to 1MHz. The device  
LDO Regulators  
Each LDO consists of a 1.184V reference, error amplifier,  
MOSFET driver, P-Channel pass transistor, and dual-mode  
comparator. The voltage is set by means of two resistors: the  
Ra and Rb for LDO2 and Rc and Rd for LDO1. The 1.184V  
band gap reference is connected to the error amplifier’s  
inverting input. The error amplifier compares this reference  
automatically detects the rising edge of the first clock and  
will synchronize immediately to the external clock. If the  
clock signal is stopped, the converter automatically switches  
back to the internal clock and continues operation without  
interruption. The switch-over will be initiated if no rising edge  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 9 of 13  
ISL6455, ISL6455A  
to the selected feedback voltage and amplifies the  
difference. The MOSFET driver reads the error signal and  
applies the appropriate drive to the P-Channel pass  
transistor. If the feedback voltage is lower than the reference  
voltage, the pass transistor gate is pulled lower, allowing  
more current to pass and increasing the output voltage. If the  
feedback voltage is higher than the reference voltage, the  
pass transistor gate is driven higher, allowing less current to  
pass to the output.  
can be shorted to ground without damaging the part due to  
the current limit and thermal protection features.  
Thermal Overload Protection  
Thermal overload protection limits total power dissipation in  
the ISL6455, ISL6455A. When the junction temperature (T )  
J
exceeds +150°C, the thermal sensor sends a signal to the  
shutdown logic, turning off the pass transistor and allowing  
the IC to cool. The pass transistor turns on again after the  
IC’s junction temperature typically cools by +20°C, resulting  
in an intermittent output condition during continuous thermal  
overload. Thermal overload protection protects the ISL6455,  
ISL6455A against fault conditions. For continuous operation,  
the absolute maximum junction temperature rating of  
+150°C in not to be exceeded.  
Internal P-Channel Pass Transistors  
Both the LDO Regulators in ISL6455 feature a typical 0.5  
r
P-channel MOSFET pass transistor. This provides  
DS(on)  
several advantages over similar designs using PNP bipolar  
pass transistors. The P-Channel MOSFET requires no base  
drive, which reduces quiescent current considerably. PNP  
based regulators waste considerable current in dropout  
when the pass transistor saturates. They also use high base  
drive currents under large loads. The ISL6455 does not have  
these drawbacks.  
Operating Region and Power Dissipation  
The maximum power dissipation of ISL6455 depends on the  
thermal resistance of the IC package and circuit board, the  
temperature difference between the die junction and ambient  
air, and the rate of air flow. The power dissipated in the  
device is:  
Integrated RESET for MAC/Baseband Processors  
The ISL6455 includes a microprocessor supervisory block.  
This block eliminates an extra RESET IC and external  
components needed in wireless chipset applications. This  
block performs a single function; it asserts a RESET signal  
whenever the VIN_PWM supply voltage decreases below a  
preset threshold, and keeps it asserted for a programmable  
time period set by the external capacitor CT.  
PT = P1 + P2 + P3, where:  
P1 = I  
P2 = I  
P3 = I  
x V x n, n is the efficiency of the PWM  
OUT1  
OUT1  
(V – V  
)
OUT2 IN OUT2  
(V - V  
OUT3 IN OUT3  
)
UVLO Reset threshold is always lower than the RESET  
The maximum power dissipation is:  
= (T – T )/  
threshold. This insures that as V falls, the reset goes low  
IN  
P
max  
jmax  
A
JA  
before the LDOs and PWM are shut off.  
Where T  
= +150°C, T = ambient temperature, and   
jmax  
A
JA  
Integrator Circuitry  
is the thermal resistance from the junction to the surrounding  
Both ISL6455 LDO Regulators use external 33nF  
compensation capacitors for minimizing load and line  
regulation errors and for lowering output noise. When the  
output voltage shifts due to varying load current or input  
voltage, the integrator capacitor voltage is raised or lowered  
to compensate for the systematic offset at the error amplifier.  
Compensation is limited to ±5% to minimize transient  
overshoot when the device goes out of dropout, current limit,  
or thermal shutdown.  
environment.  
The ISL6455, ISL6455A package feature an exposed  
thermal pad on its underside. This pad lowers the thermal  
resistance of the package by providing a direct heat  
conduction path from the die to the PC board. Additionally,  
the ISL6455 and ISL6455A ground (GND_LDO and PGND)  
performs the dual function of providing an electrical  
connection to system ground and channeling heat away.  
Connect the exposed bottom pad direct to the GND_LDO  
ground plane.  
Shutdown  
Driving the EN_LDO pin low will put LDO1 and LDO2 into  
the shutdown mode. Driving the EN pin low will put the PWM  
into shutdown mode. Pulling both the EN and EN_LDO pins  
low simultaneously, puts the ISL6455, ISL6455A in a  
shutdown mode, and supply current drops to 15µA typical.  
Application Information  
LDO Regulator Capacitor Selection and Regulator  
Stability  
Capacitors are required at the ISL6455, ISL6455A LDO  
regulators’ input and output for stable operation over the  
entire load range and the full temperature range. Use >1µF  
Protection Features for the LDOs  
Current Limit  
capacitor at the input of LDO regulators, V _LDO pins. The  
IN  
The ISL6455 and ISL6455A monitor and control the pass  
transistor’s gate voltage to limit the output current. The  
current limit for both LDO1 and LDO2 is 330mA. The output  
input capacitor lowers the source impedance of the input  
supply. Larger capacitor values and lower ESR provide  
better PSRR and line transient response. The input  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 10 of 13  
ISL6455, ISL6455A  
capacitor must be located at a distance of not more than 0.5  
The overall output ripple voltage is the sum of the voltage spike  
caused by the output capacitor ESR plus the voltage ripple  
caused by charge and discharging the output capacitor as  
shown in Equation 2:  
inches from the V pins of the IC and returned to a clean  
IN  
analog ground. Any good quality ceramic capacitor can be  
used as an input capacitor.  
V
O
The output capacitor must meet the requirements of minimum  
amount of capacitance and ESR for both LDOs. The ISL6455  
is specifically designed to work with small ceramic output  
capacitors. The output capacitor’s ESR affects stability and  
output noise. Use an output capacitor with an ESR of 50mor  
less to insure stability and optimum transient response. For  
stable operation, a ceramic capacitor, with a minimum value of  
1 -------  
V
I
1
(EQ. 2)  
-----------------  
V = V  
O
------------------------- + ESR  
O
L f  
8 C f  
O
Where the highest output voltage ripple occurs at the highest  
input voltage.  
3.3µF, is recommended for V  
and 3.3µF is recommended for V  
for 300mA output current,  
at 300mA load current.  
TABLE 2. RECOMMENDED CAPACITORS  
OUT1  
OUT2  
CAPACITOR  
VALUE  
VENDOR PART  
NUMBER  
There is no upper limit to the output capacitor value. A larger  
capacitor can reduce noise and improve load transient  
response, stability and PSRR. A higher value output capacitor  
(10µF) is recommended for LDO2 when used to power VCO  
circuitry in wireless chipsets. The output capacitor should be  
ESR/m  
COMMENTS  
10µF  
<50  
TDK  
C2012X5R0J106M  
Ceramic  
INPUT CAPACITOR SELECTION  
located very close to V  
pins to minimize impact of PC  
OUT  
Because of the nature of the buck converter having a pulsating  
input current, a low ESR input capacitor is required for best  
input voltage filtering and minimizing the interference with  
other circuits caused by high input voltage spikes.  
board inductances and the other end of the capacitor should  
be returned to a clean analog ground.  
PWM Regulator Component Selection  
INDUCTOR SELECTION  
The input capacitor should have a minimum value of 10µF and  
can be increased without any limit for better input voltage  
filtering. The input capacitor should be rated for the maximum  
input ripple current calculated as shown in Equation 3:  
A 8.2µH typical output inductor is used with the ISL6455 and a  
12µH typical with the ISL6455A PWM section. Values less than  
this may cause stability problems because of the internal  
compensation of the regulator. The important parameters of  
the inductor that need to be considered are the current rating  
of the inductor and the DC resistance of the inductor. The DC  
resistance of the inductor will influence directly the efficiency of  
the converter. Therefore, an inductor with lowest DC resistance  
should be selected for highest efficiency. In order to avoid  
saturation of the inductor, the inductor should be rated at least  
for the maximum output current plus the inductor ripple current.  
(See Table 1).  
V
V
O
O
(EQ. 3)  
-------  
I
= I  
Omax  
1 -------  
RMS  
V
I
V
I
The worst case RMS ripple current occurs at D = 0.5.  
Ceramic capacitors show good performance because of their  
low ESR value, and because they are less sensitive to voltage  
transients, compared to tantalum capacitors.  
TABLE 1. RECOMMENDED INDUCTORS  
Place the input capacitor as close as possible to the input pin  
of the IC for best performance.  
OUTPUT INDUCTOR  
VENDOR PART  
NUMBER  
CURRENT  
VALUE  
COMMENTS  
600mA  
8.2µH  
Coilcraft  
MSS6122-822MX  
ISL6455  
Output Voltage Setting  
The equations for the Output voltages are shown in Equation  
4:  
600mA  
12µH  
Coilcraft  
MSS6122-123MX  
ISL6455A  
0.45  
Rf  
-----------  
VOUT =  
VOUT1 =  
VOUT2 =  
Re + Rf  
OUTPUT CAPACITOR SELECTION  
For the best performance, a low ESR output capacitor is  
needed. If an output capacitor is selected with an ESR value  
120m, its RMS ripple current rating will always meet the  
application requirements. The RMS ripple current is calculated  
as shown in Equation 1:  
1.184  
(EQ. 4)  
--------------  
Ra + Rb  
Rc + Rd  
Rb  
1.184  
--------------  
Rd  
V
O
1 -------  
V
(EQ. 1)  
1
I
----------------- ----------------  
I
= V  
O
RMSC  
L f  
O
2   
3
FN9196 Rev 1.00  
Feb 19, 2014  
Page 11 of 13  
 
 
 
ISL6455, ISL6455A  
The output resistors should be selected so that the minimum  
output load is about 200µA.  
Layout Considerations  
As for all switching power supplies, the layout is an important  
step in the design of ISL6455, ISL6455A based power  
supply due to the high switching frequency and low noise  
LDO implementations.  
Allocate two board levels as ground planes, with many vias  
between them to create a low impedance, high-frequency  
plane. Tie all the device ground pins through multiple vias  
each to this ground plane, as close to the device as possible.  
Also tie the exposed pad on the bottom of the device to this  
ground plane.  
Use wide and short traces for the high current paths. The  
input capacitor should be placed as close as possible to the  
IC pins as well as the inductor and output capacitor. Use a  
common ground node to minimize the effects of ground  
noise.  
© Copyright Intersil Americas LLC 2005-2014. All Rights Reserved.  
All trademarks and registered trademarks are the property of their respective owners.  
For additional products, see www.intersil.com/en/products.html  
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted  
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html  
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such  
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are  
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its  
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 12 of 13  
ISL6455, ISL6455A  
Package Outline Drawing  
L24.4x4B  
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE  
Rev 2, 10/06  
4X  
2.5  
4.00  
A
20X  
0.50  
PIN #1 CORNER  
(C 0 . 25)  
B
19  
24  
PIN 1  
INDEX AREA  
1
18  
2 . 34 ± 0 . 15  
13  
0.15  
(4X)  
12  
24X 0 . 4 ± 0 . 1  
7
0.10 M C  
A B  
TOP VIEW  
+ 0 . 07  
24X 0 . 23  
4
- 0 . 05  
BOTTOM VIEW  
SEE DETAIL "X"  
C
0.10  
0 . 90 ± 0 . 1  
C
BASE PLANE  
( 3 . 8 TYP )  
SEATING PLANE  
0.08  
SIDE VIEW  
C
(
2 . 34 )  
( 20X 0 . 5 )  
5
C
0 . 2 REF  
( 24X 0 . 25 )  
0 . 00 MIN.  
0 . 05 MAX.  
( 24X 0 . 6 )  
DETAIL "X"  
TYPICAL RECOMMENDED LAND PATTERN  
NOTES:  
1. Dimensions are in millimeters.  
Dimensions in ( ) for Reference Only.  
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.  
3.  
Unless otherwise specified, tolerance : Decimal ± 0.05  
4. Dimension b applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
Tiebar shown (if present) is a non-functional feature.  
5.  
6.  
The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 indentifier may be  
either a mold or mark feature.  
FN9196 Rev 1.00  
Feb 19, 2014  
Page 13 of 13  

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