HIN238CP [RENESAS]
QUAD LINE TRANSCEIVER, PDIP24, PLASTIC, MS-001AF, DIP-24;
| 型号： | HIN238CP |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | QUAD LINE TRANSCEIVER, PDIP24, PLASTIC, MS-001AF, DIP-24 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总22页 (文件大小：1127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATASHEET
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
+5V Powered RS-232 Transmitters/Receivers
FN3138
Rev 17.00
August 6, 2015
The HIN232-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
Features
• Meets All RS-232E and V.28 Specifications
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN239) and feature onboard charge pump voltage converters
which generate +10V and -10V supplies from the 5V supply.
The family of devices offer a wide variety of RS-232
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN239)
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
transmitter/receiver combinations to accommodate various
applications (see “Selection Table” on page 1).
The drivers feature true TTL/CMOS input compatibility,
slew-rate-limited output, and 300 power-off source
impedance. The receivers can handle up to ±30V, and have
a 3k to 7k input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
- ±10V Output Swing for 5V lnput
- 300 Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Multiple Receivers
- ±30V Input Voltage Range
- 3k to 7k Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
• Pb-free Available (RoHS compliant)
Applications
• Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
PART
NUMBER
POWER SUPPLY
VOLTAGE
EXTERNAL
COMPONENTS
NUMBER OF
LEADS
HIN232
+5V
2
4
5
4
3
5
4
2
3
3
4
5
5
5
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
2 Capacitors
4 Capacitors
4 Capacitors
No/No
Yes/Yes
No/No
16
24
24
24
24
44
28
HIN236
HIN237
HIN238
HIN239
HIN240
HIN241
+5V
+5V
+5V
No/No
+5V and +7.5V to 13.2V
No/Yes
Yes/Yes
Yes/Yes
+5V
+5V
FN3138 Rev 17.00
August 6, 2015
Page 1 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pin Descriptions
PIN
FUNCTION
V
Power Supply Input 5V ±10%.
CC
V+
V-
Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.
Internally generated negative supply (-10V nominal).
GND
C1+
C1-
C2+
C2-
Ground lead. Connect to 0V.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
T
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kpull-up resistor to VCC is connected to each lead.
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kpull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
IN
T
OUT
R
IN
R
OUT
EN
SD
NC
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed
in a high impedance state.
Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
transmitters are shut off.
No Connect. No connections are made to these leads.
FN3138 Rev 17.00
August 6, 2015
Page 2 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PKG.
DWG. #
PACKAGE
16 Ld SOIC
HIN232CBZ*
(Note)
HIN232CBZ
0 to +70
M16.3
E16.3
M16.3
E16.3
M24.3
(Pb-free)
HIN232CPZ
(Note)
HIN232CPZ
HIN232IBZ
HIN232IPZ
HIN236CBZ
0 to +70
16 Ld PDIP**
(Pb-free)
HIN232IBZ*
(Note)
-40 to +85
-40 to +85
0 to +70
16 Ld SOIC
(Pb-free)
HIN232IPZ
(Note)
16 Ld PDIP**
(Pb-free)
HIN236CBZ (No longer
available or supported
recommended replacement
part ICL3243E) (Note)
24 Ld SOIC
(Pb-free)
HIN237CBZ* (No longer
available or supported
recommended replacement
part ICL3243E) (Note)
HIN237CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CBZ*(Note)
HIN238CBZ
HIN238IBZ
HIN239CBZ
HIN239CPZ
HIN240CNZ
HIN241CAZ
HIN241CBZ
HIN241IBZ
0 to +70
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
-40 to +85
24 Ld SOIC
(Pb-free)
M24.3
M24.3
M24.3
E24.3
HIN238IBZ*
(Note)
24 Ld SOIC
(Pb-free)
HIN239CBZ*
(Note)
24 Ld SOIC
(Pb-free)
HIN239CPZ
(Note)
24 Ld PDIP**
(Pb-free)
HIN240CNZ* (No longer
available or supported) (Note)
44 Ld MQFP
(Pb-free)
Q44.10X10
M28.209
M28.3
HIN241CAZ (No longer
available or supported) (Note)
28 Ld SSOP
(Pb-free)
HIN241CBZ* (No longer
available or supported) (Note)
28 Ld SOIC
(Pb-free)
HIN241IBZ (No longer
Available or supported) (Note)
28 Ld SOIC
(Pb-free)
M28.3
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
FN3138 Rev 17.00
August 6, 2015
Page 3 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
HIN232
(16 LD PDIP, SOIC)
TOP VIEW
HIN236
(24 LD SOIC)
TOP VIEW
1
2
24
T4
OUT
T3
T1
T2
OUT
OUT
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V+
V
CC
23
22
21
20
19
18
17
R2
IN
GND
T1
3
R2
OUT
C1-
C2+
C2-
V-
OUT
4
R1
SD
EN
IN
OUT
R1
R1
T1
IN
5
R1
OUT
6
T2
T4
T3
IN
IN
IN
IN
IN
IN
7
T1
T2
T2
R2
OUT
8
R3
GND
OUT
IN
R2
IN
9
16 R3
V
OUT
CC
10
11
12
15
14
13
V-
C1+
V+
C2-
C2+
C1-
+5V
+5V
9
+
1µF
1µF
10
+
12
1µF
V
16
+
+
CC
C1+
11
V+
V-
1µF
1µF
+5V TO 10V
VOLTAGE DOUBLER
C1-
V
CC
13
+
14
1
C2+
NOTE 1
C1+
+10V TO -10V
VOLTAGE INVERTER
+
+
15
2
+
+
2
+5V TO 10V
NOTE 1
NOTE 1
V+
3
4
C2-
VOLTAGE DOUBLER
C1-
+5V
T1
400k
C2+
7
T1
T1
+10V TO -10V
VOLTAGE INVERTER
OUT
OUT
IN
6
V-
5
C2-
NOTE 1
T1
+5V
+5V
+5V
T2
400k
400k
400k
6
3
1
T2
T2
IN
+5V
T1
14
400k
11
T3
T4
T1
OUT
IN
18
T3
T4
T3
T4
OUT
OUT
IN
+5V
T2
400k
10
12
7
T2
R1
T2
19
5
24
4
OUT
IN
IN
13
R1
R1
IN
OUT
R1
IN
OUT
5k
5k
R1
5k
5k
R1
22
23
R2
R2
R3
IN
OUT
9
8
R2
R2
IN
OUT
R2
R3
R2
17
20
16
21
R3
SD
IN
OUT
EN
5k
15
NOTE:
8
1. Either 0.1µF or 1µF capacitors may be used.
FN3138 Rev 17.00
August 6, 2015
Page 4 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts (Continued)
HIN237
(24 LD SOIC)
TOP VIEW
HIN238
(24 LD PDIP, SOIC)
TOP VIEW
T2
T1
T3
T3
T1
T2
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
24 T4
1
2
OUT
OUT
OUT
OUT
OUT
OUT
OUT
R3
R3
T4
23 R2
IN
IN
R2
R2
T5
3
22
21
20
19
18
17
16
IN
OUT
OUT
R2
R1
4
OUT
IN
IN
IN
T1
IN
T4
T3
T2
R1
T5
T4
T3
5
OUT
IN
OUT
OUT
IN
R1
T2
IN
6
OUT
R1
IN
T1
IN
7
IN
IN
R4
R4
V-
R3
R3
GND
8
GND
OUT
IN
OUT
IN
V
V
9
CC
CC
C1+
V+
C1+ 10
V+ 11
15 V-
10
11
12
C2-
14 C2-
13 C2+
C1-
C2+
C1- 12
+5V
+5V
9
9
1µF
1µF
1µF
10
10
+
12
V
V
+
CC
C1+
+
+
C1+
CC
+
12
11
11
V+
1µF
1µF
V+
V-
1µF
1µF
+5V TO 10V
VOLTAGE DOUBLER
+5V TO 10V
VOLTAGE DOUBLER
C1-
C1-
13
+
14
13
+
14
C2+
C2+
+10V TO -10V
VOLTAGE INVERTER
+10V TO -10V
VOLTAGE INVERTER
15
V-
15
2
C2-
1µF
C2-
+
+5V
T1
+5V
T1
T2
2
3
400k
7
400k
5
T1
T1
IN
T1
OUT
T1
IN
OUT
OUT
+5V
T2
+5V
+5V
+5V
400k
6
400k
18
19
1
T2
T2
IN
T2
OUT
T2
IN
+5V
+5V
+5V
T3
T4
T5
T3
T4
400k
400k
400k
18
19
1
400k
400k
24
T3
T4
T5
T3
IN
T3
T4
OUT
OUT
OUT
T3
IN
OUT
OUT
24
21
6
20
7
T4
IN
T4
IN
R1
R1
21
5
20
4
IN
OUT
T5
IN
5k
R1
R1
R1
IN
OUT
4
22
17
3
5k
5k
R2
R3
R4
R2
R3
R4
R1
IN
IN
IN
OUT
OUT
OUT
5k
5k
5k
R2
R3
R4
22
17
23
16
R2
R2
R3
IN
OUT
23
16
R2
R3
R3
IN
OUT
5k
8
8
FN3138 Rev 17.00
August 6, 2015
Page 5 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts (Continued)
HIN239
(24 LD PDIP, SOIC)
TOP VIEW
HIN240
(44 LD MQFP)
TOP VIEW
R1
T1
T2
1
2
24
23
22
OUT
IN
IN
R1
IN
R2
3
GND
OUT
IN
44 43 42 41 40 39 38 37 36 35 34
V
21 R2
20 T2
4
CC
NC
1
NC
NC
NC
V-
33
32
31
30
29
5
V+
C1+
C1-
V-
T5
OUT
OUT
2
3
4
5
6
7
8
9
IN
R3
6
19 T1
R3
OUT
R3
7
18
17 R3
IN
OUT
OUT
OUT
IN
T4
T3
T1
T2
C2-
C2+
C1-
V+
8
OUT
IN
28
27
26
25
24
23
R5
9
16 T3
IN
R5
10
11
12
15
14
NC
EN
OUT
OUT
OUT
NC
R4
C1+
NC
NC
R4
13 T3
OUT
IN
R2
10
11
IN
NC
12 13 14 15 16 17 18 19 20 21 22
FN3138 Rev 17.00
August 6, 2015
Page 6 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts (Continued)
+5V
+7.5V TO +13.2V (NOTE)
+5V
19
25
+
27
1µF
V
C1+
CC
4
+
26
30
V+
V-
1µF
1µF
6
+5V TO 10V
VOLTAGE DOUBLER
V
CC
C1+
C1-
C1-
5
8
+
V+
V-
1µF
28
+
29
+10V TO -10V
VOLTAGE INVERTER
7
C2+
+10V TO -10V
VOLTAGE INVERTER
(NOTE)
1µF
C2-
1µF
T1
+
+5V
+5V
T1
T1
7
19
20
400k
400k
15
24
23
T1
T1
IN
T1
IN
OUT
OUT
OUT
OUT
OUT
+5V
+5V
+5V
+5V
T2
+5V
T2
T3
400k
400k
400k
400k
14
37
38
8
6
5
400k
400k
T2
T2
IN
T2
T3
T2
IN
T3
T4
T5
+5V
16
1
13
2
T3
T4
T5
T3
IN
OUT
OUT
OUT
T3
IN
R1
R1
IN
OUT
T4
IN
5k
R1
2
41
17
T5
IN
22
17
11
21
18
12
9
R2
R3
R4
R5
R2
16
IN
IN
IN
OUT
R1
R2
R3
R4
R5
R1
IN
OUT
5k
5k
5k
5k
R2
R3
R4
R5
5k
R1
13
3
10
4
R3
OUT
R2
R3
R4
R5
IN
IN
IN
IN
OUT
OUT
OUT
5k
5k
5k
5k
R2
R3
R4
R5
R4
OUT
39
40
10
14
R5
IN
OUT
36
42
35
43
EN
OUT
EN
3
SD
18
NOTE: For V+ > 11V, use C 0.1µF.
1
HIN241
(28 SOIC, SSOP)
TOP VIEW
T3
T1
T2
1
28 T4
OUT
OUT
2
3
4
5
6
7
8
9
27 R3
26 R3
OUT
OUT
IN
OUT
25 SD
24 EN
R2
IN
R2
OUT
T2
T1
23 R4
22 R4
IN
IN
IN
OUT
IN
R1
21 T4
20
OUT
R1
IN
T3
IN
GND 10
11
19 R5
18 R5
17 V-
OUT
IN
V
CC
C1+ 12
V+ 13
16 C2-
15 C2+
C1- 14
FN3138 Rev 17.00
August 6, 2015
Page 7 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts (Continued)
+5V
11
1µF
1µF
12
V
+
+
CC
C1+
13
17
+
V+
V-
1µF
1µF
+5V TO 10V
VOLTAGE DOUBLER
14
C1-
15
C2+
+
16
+10V TO -10V
VOLTAGE INVERTER
C2-
+5V
T1
2
3
1
400k
7
6
T1
T1
IN
OUT
OUT
+5V
+5V
+5V
T2
T3
T4
400k
400k
400k
T2
T3
T4
T2
IN
20
T3
IN
OUT
OUT
21
8
28
9
T4
IN
R1
R1
IN
OUT
5k
R1
5
26
22
4
R2
R3
R4
R5
R2
R3
R4
R5
IN
IN
IN
OUT
OUT
OUT
5k
5k
5k
5k
R2
R3
R4
R5
27
23
19
24
18
25
IN
OUT
EN
SD
10
FN3138 Rev 17.00
August 6, 2015
Page 8 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Absolute Maximum Ratings
Thermal Information
V
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
< 6V
Thermal Resistance (Typical, Note 3)
16 Ld PDIP Package*
JC
(°C/W)
90
CC
V+ to Ground (Note 2. . . . . . . . . . . . . . . . (V
CC
-0.3V) < V+ < 13.2V
CC
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
70
100
75
70
95
T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)
IN
IN
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
IN
Output Voltages
80
T
R
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
< (V+ +0.3V)
< (V+ +0.3V)
OUT
TXOUT
RXOUT
OUT
Short Circuit Duration
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
OUT
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Temperature Range
HIN2xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
HIN2xxIx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be 0.1µF.
3. is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range
CC
A
MIN
MAX
PARAMETER
SUPPLY CURRENTS
Power Supply Current, I
TEST CONDITIONS
(Note 5)
TYP
(Note 5) UNITS
No Load,
HIN232
-
-
-
-
5
10
15
1
mA
mA
mA
mA
CC
T
= +25°C
A
HIN236-HIN238, HIN240-HIN241
7
HIN239
HIN239
0.4
5.0
V+ Power Supply Current, I
No Load,
15
CC
No Load, T = +25°C
T
= +25°C
A
A
Shutdown Supply Current, I (SD)
CC
T
= +25°C
-
1
10
µA
A
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
T
T
, EN, Shutdown
-
-
-
0.8
-
V
V
lL
IN
Input Logic High, V
2.0
2.4
-
lH
IN
EN, Shutdown
= 0V
-
-
V
Transmitter Input Pull-up Current, I
T
15
0.1
4.6
200
0.4
-
µA
V
P
IN
TTL/CMOS Receiver Output Voltage Low, V
I
I
= 1.6mA
= -1.0mA
-
OL
OUT
OUT
TTL/CMOS Receiver Output Voltage High, V
3.5
V
OH
RECEIVER INPUTS
RS-232 Input Voltage Range V
-30
3.0
0.8
-
-
+30
7.0
-
V
k
V
IN
Receiver Input Impedance R
V
V
V
= ±3V
5.0
1.2
1.7
0.5
IN
IN
Receiver Input Low Threshold, V (H-L)
= 5V, T = +25°C
A
lN
CC
CC
Receiver Input High Threshold, V (L-H)
= 5V, T = +25°C
2.4
1.0
V
IN
A
Receiver Input Hysteresis V
0.2
V
HYST
FN3138 Rev 17.00
August 6, 2015
Page 9 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range (Continued)
CC
A
MIN
MAX
PARAMETER
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching)
TEST CONDITIONS
(Note 5)
TYP
(Note 5) UNITS
R
= 3k
120
-
400
250
0.5
-
-
-
kbps
ns
L
Output Enable Time, t
HIN236, HIN239, HIN240, HIN241
HIN236, HIN239, HIN240, HIN241
RS-232 to TTL
-
-
-
-
-
EN
Output Disable Time, t
-
ns
DIS
Propagation Delay, t
-
µs
PD
Instantaneous Slew Rate SR
C
= 10pF, R = 3k, T = +25°C (Note 4)
30
-
V/µs
V/µs
L
L
A
Transition Region Slew Rate, SR
R = 3k, C = 2500pF Measured from +3V to -3V
3
T
L
L
or -3V to +3V, 1 Transmitter Switching
TRANSMITTER OUTPUTS
Output Voltage Swing, T
OUT
Transmitter Outputs, 3k to Ground
±5
300
-
±9
-
±10
V
Output Resistance, T
OUT
V
= V+ = V- = 0V, V
OUT
= 2V
-
-
CC
RS-232 Output Short Circuit Current, I
NOTE:
T
shorted to GND
±10
mA
SC
OUT
4. Limits established by characterization and are not production tested.
5. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
VOLTAGE DOUBLER
VOLTAGE INVERTER
+
+
S2
S5
S1
S3
C2
C1
V+ = 2V
S6
CC
V
GND
CC
+
+
-
+
-
+
-
C3
C2
C4
C1
-
V
GND
CC
V- = -(V+)
GND
-
C1-
S4
C2
S7
S8
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
inverted with respect to ground to produce a signal across C4
Detailed Description
The HIN232 thru HIN241 family of RS-232
equal to -2V . The charge pump accepts input voltages up
CC
to 5.5V. The output impedance of the voltage doubler section
(V+) is approximately 200, and the output impedance of the
voltage inverter section (V-) is approximately 450. A typical
application uses 1µF capacitors for C1-C4, however, the value
is not critical. Increasing the values of C1 and C2 will lower the
output impedance of the voltage doubler and inverter,
increasing the values of the reservoir capacitors, C3 and C4,
lowers the ripple on the V+ and V- supplies.
transmitters/receivers are powered by a single +5V power
supply (except HIN239), feature low power consumption, and
meet all ElA RS-232C and V.28 specifications. The circuit is
divided into three sections: The charge pump, transmitter, and
receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the voltage
doubler and the voltage inverter. Each section is driven by a
two-phase, internally generated clock to generate +10V and
-10V. The nominal clock frequency is 16kHz. During phase
During shutdown mode (HIN236, HIN240 and HIN241),
SHUTDOWN control line set to logic “1”, the charge pump is
turned off, V+ is pulled down to V , V- is pulled up to GND,
CC
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
one of the clock, capacitor C1 is charged to V . During
CC
phase two, the voltage on C1 is added to V , producing a
CC
signal across C3 equal to twice V . During phase one, C2 is
CC
also charged to 2V , and then during phase two, it is
CC
FN3138 Rev 17.00
August 6, 2015
Page 10 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Transmitters
Receivers
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic threshold
The receiver inputs accept up to ±30V while presenting the
required 3k to 7k input impedance even if the power is off
is about 26% of V , or 1.3V for V = 5V. A logic 1 at the
(V = 0V). The receivers have a typical input threshold of
CC CC
CC
input results in a voltage of between -5V and V- at the output,
and a logic 0 results in a voltage between +5V and (V+ -0.6V).
Each transmitter input has an internal 400k pullup resistor so
any unused input can be left unconnected and its output
remains in its low state. The output voltage swing meets the
RS-232C specifications of ±5V minimum with the worst case
conditions of: all transmitters driving 3k minimum load
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to V . The output will be low whenever the input is
CC
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line EN, when set to logic “1”, (HIN236, HIN239, HIN240,
and HIN241) disables the receiver outputs, placing them in
the high impedance mode. The receiver outputs are also
placed in the high impedance state when in shutdown mode.
impedance, V = 4.5V, and maximum allowable operating
CC
temperature. The transmitters have an internally limited output
slew rate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300 with
±2V applied to the outputs and V
= 0V.
CC
V+
V
V
CC
CC
400k
300
R
XIN
R
OUT
T
XIN
T
OUT
-30V < R
< +30V
XIN
GND < V
< V
CC
5k
ROUT
GND < T
< V
CC
XIN
V- < V
TOUT
< V+
GND
V-
FIGURE 3. RECEIVER
FIGURE 2. TRANSMITTER
T
IN
OR
R
IN
T
OUT
OR
V
V
OL
OL
R
OUT
t
t
PLH
PHL
t
t
PHL + PLH
AVERAGE PROPAGATION DELAY =
2
FIGURE 4. PROPAGATION DELAY DEFINITION
FN3138 Rev 17.00
August 6, 2015
Page 11 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Typical Performance Curves
T
= +25°C
A
12
10
8
TRANSMITTER OUTPUTS
OPEN CIRCUIT
12
1µF
10
0.47µF
V+ (V
CC
= 5V)
8
0.10µF
6
V+ (V
= 4.5V)
6
CC
V- (V
CC
= 4.5V)
4
4
2
0
V- (V
= 5V)
CC
2
0
4.0
4.5
5.0
5.5
6.0
5
10
15
|I
20
| (mA)
25
30
35
0
3.0
3.5
V
CC
LOAD
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
FIGURE 5. V- SUPPLY VOLTAGE vs V , VARYING
CC
CAPACITORS
Test Circuits (HIN232)
+4.5V TO
+5.5V INPUT
C1+
V+
1
2
3
4
5
6
7
8
16
15
14
V
CC
GND
T1
-
+
1µF
C3
V
C1+
V+
1
2
3
4
5
6
7
8
16
CC
C1-
C2+
C2-
OUT
+
3k
1µF
C1
GND 15
R1 13
IN
-
T1
C1-
C2+
C2-
V-
14
13
12
11
T1 OUTPUT
OUT
R1
12
11
10
9
OUT
R1
IN
RS-232 30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
1µF
C2
T1
IN
V-
-
R1
OUT
T2
T2
IN
-
+
OUT
T1
IN
R2
R2
IN
OUT
1µF C4
T2
T2 10
IN
3k
OUT
R2
9
R2
IN
R
= V /1T2
IN
OUT
OUT
OUT
T1
T2
OUTPUT
OUT
V
= 2V
A
IN
RS-232
30V INPUT
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
FIGURE 7. GENERAL TEST CIRCUIT
FN3138 Rev 17.00
August 6, 2015
Page 12 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Applications
+5V
+
-
+
The HIN2xx may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where 12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
16
DTR (20) DATA
TERMINAL READY
1
C1
2
1µF
3
4
DSRS (24) DATA
SIGNALING RATE
SELECT
-
HIN232
6
+
-
+
C2
RS-232
INPUTS AND OUTPUTS
5
1µF
-
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5k resistor
connected to V+.
T1
11
14
TD
TD (2) TRANSMIT DATA
T2
10
12
7
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
TTL/CMOS RTS
INPUTS AND
13
RD
OUTPUTS
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
15
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
1
4
+
+
C1
C2
HIN232
T1
5
1µF
3
1µF
-
-
11
14
TD
RTS
RD
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
T2
10
12
7
TTL/CMOS
INPUTS AND
OUTPUTS
13
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
15
16
6
6
2
2
C4
C3
+5V
-
-
V- V+
RS-232
INPUTS AND OUTPUTS
2µF
2µF
16
4
HIN232
T1
1
+
+
C1
1µF
C2
1µF
5
3
-
-
11
14
DTR
DSRS
DCD
R1
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
T2
10
12
7
TTL/CMOS
INPUTS AND
OUTPUTS
13
R2
R1
9
8
15
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
FN3138 Rev 17.00
August 6, 2015
Page 13 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Die Characteristics
SUBSTRATE POTENTIAL
TRANSISTOR COUNT
V+
238
Metallization Mask Layout
HIN240
T2
OUT
T1
T3
T4
R3
R3
OUT
T5
IN
OUT
OUT
OUT
IN
R2
IN
SHUTDOWN
R2
OUT
EN
T2
T1
IN
IN
T5
OUT
R4
R1
IN
OUT
R4
R1
OUT
IN
T4
T3
IN
GND
IN
R5
OUT
V
CC
R5
IN
C1+
V+
C1-
C2+
C2-
V-
FN3138 Rev 17.00
August 6, 2015
Page 14 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
CHANGE
August 6, 2015
FN3138.17
Added Rev History beginning with Rev 17.
Added About Intersil Verbiage
Updated Ordering Information Table on page 3.
Updated POD M24.3 to most current version change is as follows:
Updated to new POD standard by removing table listing dimensions and putting
dimensions on drawing. Added Land Pattern.
Updated POD M28.3 to most current version change is as follows:
Added land pattern
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
FN3138 Rev 17.00
August 6, 2015
Page 15 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
N
E16.3 (JEDEC MS-001-BB ISSUE D)
E1
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INDEX
AREA
1
2
3
N/2
INCHES
MILLIMETERS
-B-
-C-
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-A-
A
A1
A2
B
-
4
D
E
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
18.66
0.13
7.62
6.10
4
BASE
PLANE
A2
0.195
0.022
0.070
0.014
0.775
-
4.95
0.558
1.77
0.355
19.68
-
-
A
SEATING
PLANE
-
L
C
L
B1
C
8, 10
D1
B1
eA
A1
A
D1
-
e
eC
C
B
D
5
eB
0.010 (0.25) M
C
B S
D1
E
5
NOTES:
0.325
0.280
8.25
7.11
6
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
E1
e
5
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
e
e
6
A
B
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
-
0.430
0.150
-
10.92
3.81
7
4. Dimensions A, A1 and L are measured with the package seated in JE-
L
0.115
2.93
4
9
DEC seating plane gauge GS-3.
N
16
16
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
Rev. 0 12/93
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
FN3138 Rev 17.00
August 6, 2015
Page 16 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
N
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
E1
INDEX
AREA
1
2
3
N/2
INCHES
MILLIMETERS
-B-
-C-
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-A-
D
E
A
A1
A2
B
-
4
BASE
PLANE
A2
0.015
0.115
0.014
0.045
0.008
1.230
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
31.24
0.13
7.62
6.10
4
A
SEATING
PLANE
0.195
0.022
0.070
0.014
1.280
-
4.95
0.558
1.77
0.355
32.51
-
-
L
C
L
-
D1
B1
eA
A1
A
D1
B1
C
8
e
eC
C
-
B
eB
0.010 (0.25) M
C
B S
D
5
D1
E
5
NOTES:
0.325
0.280
8.25
7.11
6
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
E1
e
5
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
e
e
6
A
B
-
0.430
0.150
-
10.92
3.81
7
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
L
0.115
2.93
4
9
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
N
24
24
Rev. 0 12/93
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
FN3138 Rev 17.00
August 6, 2015
Page 17 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
0.25(0.010)
M
L
B M
H
AREA
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
10.10
7.40
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
0.4133
0.2992
-
0.30
-
1
2
3
0.51
9
SEATING PLANE
A
0.0091
0.3977
0.2914
0.32
-
-A-
10.50
7.60
3
h x 45°
D
4
-C-
0.050 BSC
1.27 BSC
-
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
16
16
7
0°
8°
0°
8°
-
NOTES:
Rev. 1 6/05
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN3138 Rev 17.00
August 6, 2015
Page 18 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Package Outline Drawing
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 2, 3/11
24
INDEX
AREA
7.60 (0.299)
7.40 (0.291)
10.65 (0.419)
10.00 (0.394)
DETAIL "A"
1
2
3
TOP VIEW
1.27 (0.050)
0.40 (0.016)
SEATING PLANE
2.65 (0.104)
2.35 (0.093)
15.60 (0.614)
15.20 (0.598)
0.75 (0.029)
x 45°
0.25 (0.010)
0.30 (0.012)
0.10 (0.004)
1.27 (0.050)
8°
0°
0.51 (0.020)
0.33 (0.013)
0.32 (0.012)
0.23 (0.009)
SIDE VIEW “A”
SIDE VIEW “B”
1.981 (0.078)
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. Package length does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
3. Package width does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm
(0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
9.373 (0.369)
7. Controlling dimension: MILLIMETER. Converted inch dimensions in
(
) are not necessarily exact.
8. This outline conforms to JEDEC publication MS-013-AD ISSUE C.
1.27 (0.050)
0.533 (0.021)
TYPICAL RECOMMENDED LAND PATTERN
FN3138 Rev 17.00
August 6, 2015
Page 19 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
0.25(0.010)
M
L
B M
H
AREA
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
-
0.30
-
1
2
3
0.51
9
SEATING PLANE
A
0.0091
0.6969
0.2914
0.32
-
0.7125 17.70
18.10
7.60
3
-A-
h x 45o
D
0.2992
7.40
4
0.05 BSC
1.27 BSC
-
-C-
a
H
h
0.394
0.01
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
0.016
6
0.25(0.010) M
C
A M B S
N
28
28
7
o
o
o
o
0
8
0
8
-
Rev. 1, 1/13
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
TYPICAL RECOMMENDED LAND PATTERN
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
(1.50mm)
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
(9.38mm)
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
(1.27mm TYP)
(0.51mm TYP)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN3138 Rev 17.00
August 6, 2015
Page 20 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
0.078
-
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
-
0.002
0.065
0.009
0.004
0.390
0.197
0.05
1.65
0.22
0.09
9.90
5.00
-
1
2
3
0.072
0.014
0.009
0.413
0.220
1.85
0.38
0.25
10.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-A-
C
D
E
-
D
3
-C-
4
e
0.026 BSC
0.65 BSC
-
A2
e
A1
C
H
L
0.292
0.022
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
6
0.25(0.010) M
C
A M B S
N
28
28
7
NOTES:
0°
8°
0°
8°
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
Rev. 2 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
FN3138 Rev 17.00
August 6, 2015
Page 21 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Metric Plastic Quad Flatpack Packages (MQFP)
D
D1
Q44.10x10 (JEDEC MS-022AB ISSUE B)
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
-D-
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
-
MAX
2.45
NOTES
A
A1
A2
b
-
0.096
0.010
0.083
0.018
0.016
0.524
0.399
0.523
0.398
0.040
-
0.004
0.077
0.012
0.012
0.515
0.389
0.516
0.390
0.029
0.10
1.95
0.30
0.30
13.08
9.88
13.10
9.90
0.73
0.25
-
-A-
-B-
2.10
-
0.45
6
E
E1
b1
D
0.40
-
13.32
10.12
13.30
10.10
1.03
3
D1
E
4, 5
3
e
E1
L
4, 5
-
PIN 1
N
44
0.032 BSC
44
0.80 BSC
7
e
-
SEATING
PLANE
-H-
A
Rev. 2 4/99
NOTES:
0.076
0.003
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
o
o
-C-
12 -16
0.40
0.016
o
0.20
2. All dimensions and tolerances per ANSI Y14.5M-1982.
MIN
M
C
A-B S D S
0.008
3. Dimensions D and E to be determined at seating plane -C- .
0
MIN
b
4. Dimensions D1 and E1 to be determined at datum plane
A2
o
A1
o
o
-H- .
b1
0 -7
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
0.13/0.17
0.005/0.007
o
12 -16
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
L
BASE METAL
7. “N” is the number of terminal positions.
WITH PLATING
0.13/0.23
0.005/0.009
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For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
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For information regarding Intersil Corporation and its products, see www.intersil.com
FN3138 Rev 17.00
August 6, 2015
Page 22 of 22
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