HIN238CPZ [INTERSIL]
+5V Powered RS-232 Transmitters/Receivers; + 5V供电的RS - 232发射器/接收器
| 型号： | HIN238CPZ |
| 厂家： | 
Intersil |
| 描述： | +5V Powered RS-232 Transmitters/Receivers |
| 文件： | 总20页 (文件大小：625K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HIN232, HIN236, HIN237,HIN238,
HIN239, HIN240, HIN241
®
Data Sheet
August 31, 2005
FN3138.15
+5V Powered RS-232
Features
Transmitters/Receivers
• Meets All RS-232E and V.28 Specifications
The HIN232-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN239) and feature onboard charge pump voltage converters
which generate +10V and -10V supplies from the 5V supply.
The family of devices offer a wide variety of RS-232
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN239)
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
transmitter/receiver combinations to accommodate various
applications (see Selection Table).
• Three-State TTL/CMOS Receiver Outputs
The drivers feature true TTL/CMOS input compatibility, slew-
rate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ
input impedance. The receivers also feature hysteresis to
greatly improve noise rejection.
• Multiple Drivers
- ±10V Output Swing for 5V lnput
- 300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Multiple Receivers
- ±30V Input Voltage Range
- 3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
PART
NUMBER
POWER SUPPLY
VOLTAGE
EXTERNAL
COMPONENTS
NUMBER OF
LEADS
HIN232
+5V
2
4
5
4
3
5
4
2
3
3
4
5
5
5
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
2 Capacitors
4 Capacitors
4 Capacitors
No/No
Yes/Yes
No/No
16
24
24
24
24
44
28
HIN236
HIN237
HIN238
HIN239
HIN240
HIN241
+5V
+5V
+5V
No/No
+5V and +7.5V to 13.2V
No/Yes
Yes/Yes
Yes/Yes
+5V
+5V
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2005. All Rights Reserved.
1
All other trademarks mentioned are the property of their respective owners.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pin Descriptions
PIN
FUNCTION
V
Power Supply Input 5V ±10%.
CC
V+
V-
Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.
Internally generated negative supply (-10V nominal).
GND
C1+
C1-
C2+
C2-
Ground lead. Connect to 0V.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
T
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
IN
T
OUT
R
IN
R
OUT
EN
SD
NC
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed in
a high impedance state.
Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
transmitters are shut off.
No Connect. No connections are made to these leads.
2
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Ordering Information (Continued)
Ordering Information
TEMP.
TEMP.
PART
NUMBER
PART
MARKING
RANGE
PKG.
DWG. #
PART
NUMBER
PART
MARKING
RANGE
PKG.
DWG. #
o
o
( C)
PACKAGE
( C)
PACKAGE
HIN239CPZ
(See Note)
HIN239CPZ 0 to 70 24 Ld PDIP*
(Pb-free)
E24.3
HIN232CB
232CB
0 to 70 16 Ld SOIC
M16.3
HIN232CB-T 232CB
0 to 70 Tape and Reel
HIN240CN
HIN240CN
0 to 70 44 Ld MQFP Q44.10X10
HIN232CBZ
(See Note)
232CBZ
0 to 70 16 Ld SOIC
(Pb-free)
M16.3
HIN240CNZ
(See Note)
HIN240CNZ 0 to 70 44 Ld MQFP Q44.10X10
(Pb-free)
HIN232CBZ-T 232CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN240CNZ-T HIN240CNZ 0 to 70 44 Ld MQFP Tape and Reel
(See Note)
(Pb-free)
HIN232CP
HIN232CP
0 to 70 16 Ld PDIP
E16.3
E16.3
HIN241CA
HIN241CA
0 to 70 28 Ld SSOP
M28.209
M28.209
HIN232CPZ
(See Note)
HIN232CPZ 0 to 70 16 Ld PDIP*
(Pb-free)
HIN241CAZ
(See Note)
HIN241CAZ 0 to 70 28 Ld SSOP
(Pb-free)
HIN232IB
232IB
232IB
232IBZ
-40 to 85 16 Ld SOIC
M16.3
M16.3
HIN241CB
241CB
0 to 70 28 Ld SOIC
M28.3
M28.3
HIN232IB-T
-40 to 85 Tape and Reel
HIN241CB-T 241CB
0 to 70 Tape and Reel
HIN232IBZ
(See Note)
-40 to 85 16 Ld SOIC
(Pb-free)
HIN241CBZ
(See Note)
241CBZ
0 to 70 28 Ld SOIC
(Pb-free)
HIN232IBZ-T 232IBZ
(See Note)
-40 to 85 Tape and Reel (Pb-free)
HIN241CBZ-T 241CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN232IP
HIN232IP
-40 to 85 16 Ld PDIP
E16.3
E16.3
HIN241IB
241IB
-40 to 85 28 Ld SOIC
M28.3
M28.3
HIN232IPZ
(See Note)
HIN232IPZ -40 to 85 16 Ld PDIP*
(Pb-free)
HIN241IBZ
(See Note)
241IBZ
-40 to 85 28 Ld SOIC
(Pb-free)
HIN236CB
236CB
0 to 70 24 Ld SOIC
M24.3
M24.3
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
HIN236CBZ
(See Note)
236CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN237CB
237CB
0 to 70 24 Ld SOIC
M24.3
M24.3
HIN237CB-T 237CB
0 to 70 Tape and Reel
HIN237CBZ
(See Note)
237CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN237CBZ-T 237CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN238CB
238CB
0 to 70 24 Ld SOIC
M24.3
M24.3
HIN238CB-T 238CB
0 to 70 Tape and Reel
HIN238CBZ
(See Note)
238CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN238CBZ-T 238CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN238CP
HIN238CP
0 to 70 24 Ld PDIP
E24.3
E24.3
HIN238CPZ
(See Note)
HIN238CPZ 0 to 70 24 Ld PDIP*
(Pb-free)
HIN238IB
238IB
-40 to 85 24 Ld SOIC
M24.3
M24.3
HIN238IBZ
(See Note)
238IBZ
-40 to 85 24 Ld SOIC
(Pb-free)
HIN239CB
239CB
0 to 70 24 Ld SOIC
M24.3
M24.3
HIN239CB-T 239CB
0 to 70 Tape and Reel
HIN239CBZ
(See Note)
239CBZ
0 to 70 24 Ld SOIC
(Pb-free)
HIN239CBZ-T 239CBZ
(See Note)
0 to 70 Tape and Reel (Pb-free)
HIN239CP
HIN239CP
0 to 70 24 Ld PDIP
E24.3
3
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
HIN232 (PDIP, SOIC)
HIN236 (SOIC)
TOP VIEW
TOP VIEW
1
2
24
23
22
21
20
19
18
17
T3
T1
T2
T4
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
C1+
V+
V
CC
OUT
OUT
OUT
R2
IN
GND
T1
3
R2
OUT
C1-
C2+
C2-
V-
OUT
4
R1
SD
EN
IN
R1
R1
T1
IN
5
R1
OUT
OUT
6
T2
IN
T4
IN
IN
11
10
9
IN
IN
7
T3
T1
IN
T2
T2
R2
OUT
8
R3
GND
OUT
R2
IN
OUT
9
16 R3
V
IN
CC
10
11
12
15
14
13
V-
C1+
V+
C2-
C2+
C1-
+5V
+5V
9
+
1µF
1µF
10
+
12
1µF
V
16
+
+
C1+
CC
11
V+
V-
1µF
1µF
+5V TO 10V
VOLTAGE DOUBLER
C1-
V
CC
13
+
14
1
C2+
NOTE 1
C1+
+10V TO -10V
VOLTAGE INVERTER
+
+
15
2
+
+
2
+5V TO 10V
NOTE 1
NOTE 1
V+
3
4
C2-
VOLTAGE DOUBLER
C1-
+5V
T1
400kΩ
C2+
7
T1
T1
+10V TO -10V
VOLTAGE INVERTER
OUT
OUT
IN
6
V-
5
C2-
NOTE 1
T1
+5V
+5V
+5V
T2
400kΩ
400kΩ
400kΩ
6
3
1
T2
T2
IN
+5V
T1
14
400kΩ
11
T3
T4
T1
IN
OUT
18
T3
T4
T3
T4
OUT
OUT
IN
+5V
T2
400kΩ
10
12
7
T2
R1
T2
IN
19
5
24
4
OUT
IN
13
R1
R1
IN
OUT
R1
IN
OUT
5kΩ
5kΩ
R1
5kΩ
5kΩ
R1
22
23
R2
R2
R3
IN
OUT
9
8
R2
R2
IN
OUT
R2
R3
R2
17
20
16
21
R3
SD
IN
OUT
EN
5kΩ
15
NOTE:
8
1. Either 0.1µF or 1µF capacitors may be used. The V+ capacitor
may be terminated to V
or to GND.
CC
4
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts (Continued)
HIN237 (SOIC)
HIN238 (PDIP, SOIC)
TOP VIEW
TOP VIEW
T2
T1
T3
T3
T1
T2
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
24 T4
1
2
OUT
OUT
OUT
OUT
OUT
OUT
R3
R3
T4
23 R2
OUT
IN
IN
R2
R2
T5
3
22
21
20
19
18
17
16
IN
OUT
OUT
R2
R1
4
OUT
IN
IN
IN
T1
IN
T4
T3
T2
R1
T5
T4
T3
5
OUT
IN
OUT
OUT
IN
R1
T2
IN
6
OUT
R1
IN
T1
IN
7
IN
IN
R4
R4
V-
R3
R3
GND
8
GND
OUT
IN
OUT
IN
V
V
9
CC
CC
C1+
V+
C1+ 10
V+ 11
15 V-
10
11
12
C2-
14 C2-
13 C2+
C1-
C2+
C1- 12
+5V
9
+5V
9
1µF
1µF
1µF
10
10
+
12
V
V
+
CC
C1+
+
+
CC
C1+
+
12
11
11
V+
1µF
1µF
V+
V-
1µF
1µF
+5V TO 10V
VOLTAGE DOUBLER
+5V TO 10V
VOLTAGE DOUBLER
C1-
C1-
13
+
14
13
+
14
C2+
C2+
+10V TO -10V
VOLTAGE INVERTER
+10V TO -10V
VOLTAGE INVERTER
15
V-
15
2
C2-
1µF
C2-
+
+5V
+5V
T1
T1
T2
2
3
400kΩ
7
400kΩ
5
T1
T1
IN
T1
OUT
T1
IN
OUT
OUT
+5V
T2
+5V
+5V
+5V
400kΩ
6
400kΩ
18
19
1
T2
T2
IN
T2
OUT
T2
IN
+5V
+5V
+5V
T3
T4
T5
T3
T4
400kΩ
400kΩ
400kΩ
18
19
1
400kΩ
400kΩ
24
T3
T4
T5
T3
IN
T3
T4
OUT
OUT
OUT
T3
IN
OUT
OUT
24
21
6
20
7
T4
IN
T4
IN
R1
R1
21
5
20
4
IN
OUT
T5
IN
5kΩ
R1
R1
R1
IN
OUT
4
22
17
3
5kΩ
5kΩ
R2
R3
R4
R2
R3
R4
R1
IN
IN
IN
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
R2
R3
R4
22
17
23
16
R2
R2
IN
OUT
23
16
R2
R3
R3
R3
IN
OUT
5kΩ
8
8
5
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts (Continued)
HIN239 (PDIP, SOIC)
HIN240 (MQFP)
TOP VIEW
R1
T1
T2
1
2
24
23
22
OUT
IN
IN
R1
IN
R2
3
GND
OUT
IN
44 43 42 41 40 39 38 37 36 35 34
NC
1
NC
NC
NC
V-
33
32
31
30
29
V
21 R2
20 T2
4
CC
T5
2
3
4
5
6
7
8
9
IN
5
V+
C1+
C1-
V-
OUT
OUT
R3
OUT
6
19 T1
R3
18
R3
IN
OUT
OUT
OUT
7
T4
T3
T1
T2
IN
C2-
C2+
C1-
V+
8
17 R3
16 T3
OUT
28
27
26
25
24
23
R5
IN
9
IN
OUT
NC
R5
10
11
12
15
14
NC
EN
OUT
OUT
C1+
NC
NC
R4
R2
10
11
IN
R4
13 T3
OUT
IN
NC
12 13 14 15 16 17 18 19 20 21 22
+5V
+7.5V TO +13.2V (NOTE)
19
+5V
25
+
27
1µF
V
CC
C1+
4
+
26
30
V+
V-
1µF
6
7
+5V TO 10V
VOLTAGE DOUBLER
V
CC
C1+
C1-
C1-
+
5
V+
1µF
28
+
29
+10V TO -10V
VOLTAGE INVERTER
C2+
8
+10V TO -10V
VOLTAGE INVERTER
(NOTE)
V-
1µF
1µF
C2-
1µF
T1
+
+5V
+5V
T1
T1
7
19
400kΩ
400kΩ
15
24
23
T1
T1
IN
T1
IN
OUT
OUT
+5V
+5V
+5V
+5V
T2
+5V
T2
T3
400kΩ
400kΩ
400kΩ
400kΩ
14
37
38
8
6
5
400kΩ
400kΩ
20
T2
T2
IN
OUT
T2
T2
IN
OUT
T3
T4
T5
+5V
16
1
13
T3
T4
T5
T3
IN
OUT
OUT
OUT
T3
T3
IN
OUT
2
R1
IN
R1
OUT
T4
IN
5kΩ
R1
2
41
17
T5
IN
22
17
11
21
18
12
9
R2
R3
R4
R5
R2
16
IN
IN
IN
OUT
R1
R2
R3
R4
R5
R1
IN
OUT
5kΩ
5kΩ
5kΩ
5kΩ
R2
R3
R4
R5
5kΩ
R1
13
3
10
4
R3
OUT
R2
IN
IN
IN
IN
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
5kΩ
R2
R3
R4
R5
R4
R3
R4
R5
OUT
39
40
10
14
R5
IN
OUT
36
42
35
43
EN
OUT
EN
3
SD
18
NOTE: For V+ > 11V, use C ≤ 0.1µF.
1
6
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts (Continued)
HIN241 (SOIC, SSOP)
TOP VIEW
T3
T1
T2
1
2
3
4
5
6
7
8
9
28 T4
OUT
OUT
OUT
OUT
27 R3
26 R3
IN
OUT
25 SD
24 EN
R2
IN
R2
OUT
T2
T1
23 R4
22 R4
IN
IN
IN
OUT
IN
R1
21 T4
20
OUT
R1
IN
T3
IN
GND 10
11
19 R5
18 R5
17 V-
OUT
IN
V
CC
C1+ 12
V+ 13
16 C2-
15 C2+
C1- 14
+5V
11
1µF
1µF
12
V
+
+
CC
C1+
13
+
V+
V-
1µF
1µF
+5V TO 10V
VOLTAGE DOUBLER
14
15
C1-
C2+
+
16
+10V TO -10V
VOLTAGE INVERTER
17
C2-
+5V
T1
2
3
1
400kΩ
7
6
T1
T1
IN
OUT
OUT
+5V
+5V
+5V
T2
T3
T4
400kΩ
400kΩ
400kΩ
T2
T3
T4
T2
IN
20
T3
IN
OUT
OUT
21
8
28
9
T4
IN
R1
R1
IN
OUT
5kΩ
R1
5
26
22
4
R2
R3
R4
R5
R2
R3
R4
R5
IN
IN
IN
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
5kΩ
R2
R3
R4
R5
27
23
19
24
18
25
IN
OUT
EN
SD
10
7
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Absolute Maximum Ratings
Thermal Information
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
< 6V
Thermal Resistance (Typical, Note 3)
θ
( C/W)
CC
V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V
CC
-0.3V) < V+ < 13.2V
JA
CC
16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . .
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
90
70
100
75
70
95
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)
IN
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
IN
Output Voltages
80
o
T
R
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
< (V+ +0.3V)
< (V+ +0.3V)
OUT
TXOUT
RXOUT
Maximum Junction Temperature (Plastic Package) . . . . . . . .150 C
o
o
OUT
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C
o
Short Circuit Duration
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
(SOIC, SSOP, MQFP - Lead Tips Only)
OUT
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.
3. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range
CC
A
PARAMETER
SUPPLY CURRENTS
Power Supply Current, I
TEST CONDITIONS
MIN
TYP
MAX
UNITS
No Load,
o
HIN232
-
-
-
-
5
10
15
1
mA
mA
mA
mA
CC
T = 25 C
A
HIN236-HIN238, HIN240-HIN241
7
HIN239
HIN239
0.4
5.0
V+ Power Supply Current, I
No Load,
o
15
CC
o
No Load, T = 25 C
T = 25 C
A
A
o
Shutdown Supply Current, I (SD)
CC
T = 25 C
-
1
10
µA
A
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
T
T
, EN, Shutdown
-
-
-
0.8
-
V
V
lL
IN
IN
Input Logic High, V
2.0
2.4
-
lH
EN, Shutdown
= 0V
-
-
V
Transmitter Input Pullup Current, I
T
15
0.1
4.6
200
0.4
-
µA
V
P
IN
TTL/CMOS Receiver Output Voltage Low, V
I
I
= 1.6mA
= -1.0mA
-
OL
OUT
OUT
TTL/CMOS Receiver Output Voltage High, V
3.5
V
OH
RECEIVER INPUTS
RS-232 Input Voltage Range V
-30
3.0
0.8
-
-
+30
7.0
-
V
kΩ
V
IN
Receiver Input Impedance R
V
V
V
= ±3V
5.0
1.2
1.7
0.5
IN
IN
o
Receiver Input Low Threshold, V (H-L)
= 5V, T = 25 C
A
lN
Receiver Input High Threshold, V (L-H)
CC
CC
o
= 5V, T = 25 C
2.4
1.0
V
IN
A
Receiver Input Hysteresis V
0.2
V
HYST
8
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range (Continued)
CC
A
PARAMETER
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching)
TEST CONDITIONS
MIN
TYP
MAX
UNITS
R
= 3kΩ
120
-
-
-
kbps
ns
L
Output Enable Time, t
HIN236, HIN239, HIN240, HIN241
HIN236, HIN239, HIN240, HIN241
-
-
-
-
-
400
250
0.5
-
EN
Output Disable Time, t
-
ns
DIS
Propagation Delay, t
RS-232 to TTL
= 10pF, R = 3kΩ, T = 25 C (Note 4)
-
µs
PD
o
Instantaneous Slew Rate SR
C
30
-
V/µs
V/µs
L
L
A
Transition Region Slew Rate, SR
R = 3kΩ, C = 2500pF Measured from +3V to -3V or
3
T
L
L
-3V to +3V, 1 Transmitter Switching
TRANSMITTER OUTPUTS
Output Voltage Swing, T
OUT
Transmitter Outputs, 3kΩ to Ground
±5
300
-
±9
-
±10
V
Ω
Output Resistance, T
OUT
V
= V+ = V- = 0V, V
OUT
= ±2V
-
-
CC
RS-232 Output Short Circuit Current, I
T
shorted to GND
±10
mA
SC
OUT
NOTE:
4. Guaranteed by design.
VOLTAGE DOUBLER
+
VOLTAGE INVERTER
+
S5
S1
S3
S2
C2
C1
V+ = 2V
S6
CC
V
GND
CC
+
-
+
-
+
-
+
C4
-
C3
C2
C1
V
GND
CC
V- = -(V+)
GND
-
C1-
S4
C2
S7
S8
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
to 5.5V. The output impedance of the voltage doubler section
(V+) is approximately 200Ω, and the output impedance of the
voltage inverter section (V-) is approximately 450Ω. A typical
application uses 1µF capacitors for C1-C4, however, the value
is not critical. Increasing the values of C1 and C2 will lower the
output impedance of the voltage doubler and inverter,
increasing the values of the reservoir capacitors, C3 and C4,
lowers the ripple on the V+ and V- supplies.
Detailed Description
The HIN232 thru HIN241 family of RS-232
transmitters/receivers are powered by a single +5V power
supply (except HIN239), feature low power consumption, and
meet all ElA RS-232C and V.28 specifications. The circuit is
divided into three sections: The charge pump, transmitter, and
receiver.
Charge Pump
During shutdown mode (HIN236, HIN240 and HIN241),
SHUTDOWN control line set to logic “1”, the charge pump is
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the voltage
doubler and the voltage inverter. Each section is driven by a
two phase, internally generated clock to generate +10V and
-10V. The nominal clock frequency is 16kHz. During phase
turned off, V+ is pulled down to V , V- is pulled up to GND,
CC
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
one of the clock, capacitor C1 is charged to V . During
CC
phase two, the voltage on C1 is added to V , producing a
CC
signal across C3 equal to twice V . During phase one, C2 is
CC
also charged to 2V , and then during phase two, it is
CC
inverted with respect to ground to produce a signal across C4
equal to -2V . The charge pump accepts input voltages up
CC
9
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Transmitters
Receivers
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic threshold
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
is about 26% of V , or 1.3V for V
= 5V. A logic 1 at the
(V = 0V). The receivers have a typical input threshold of
CC CC
CC
input results in a voltage of between -5V and V- at the output,
and a logic 0 results in a voltage between +5V and (V+ -0.6V).
Each transmitter input has an internal 400kΩ pullup resistor so
any unused input can be left unconnected and its output
remains in its low state. The output voltage swing meets the
RS-232C specifications of ±5V minimum with the worst case
conditions of: all transmitters driving 3kΩ minimum load
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to V . The output will be low whenever the input is
CC
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line EN, when set to logic “1”, (HIN236, 239, 240, and 241)
disables the receiver outputs, placing them in the high
impedance mode. The receiver outputs are also placed in
the high impedance state when in shutdown mode.
impedance, V
= 4.5V, and maximum allowable operating
CC
temperature. The transmitters have an internally limited output
slew rate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300Ω with
V
CC
±2V applied to the outputs and V
= 0V.
CC
R
XIN
R
OUT
-30V < R
< +30V
XIN
GND < V
< V
CC
5kΩ
ROUT
V+
GND
V
T
CC
400kΩ
300Ω
FIGURE 3. RECEIVER
XIN
XIN
T
OUT
GND < T
< V
CC
V- < V
TOUT
< V+
V-
FIGURE 2. TRANSMITTER
T
IN
OR
R
IN
T
OUT
OR
V
OL
V
OL
R
OUT
t
t
PLH
PHL
t
t
PHL + PLH
2
Average Propagation Delay =
FIGURE 4. PROPAGATION DELAY DEFINITION
10
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Typical Performance Curves
o
T
= 25 C
A
12
10
8
TRANSMITTER OUTPUTS
OPEN CIRCUIT
12
1µF
10
8
0.47µF
V+ (V
CC
= 5V)
0.10µF
6
V+ (V
= 4.5V)
6
CC
V- (V
CC
= 4.5V)
4
4
V- (V
= 5V)
CC
2
2
0
0
3.0
4.0
4.5
5.0
5.5
6.0
5
10
15
|I
20
| (mA)
25
30
35
0
3.5
V
LOAD
CC
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
FIGURE 5. V- SUPPLY VOLTAGE vs V , VARYING
CC
CAPACITORS
Test Circuits (HIN232)
+4.5V TO
+5.5V INPUT
C1+
V+
1
2
3
16
15
14
V
CC
GND
T1
-
+
1µF
C3
V
C1+
V+
1
2
3
4
5
6
7
8
16
CC
C1-
OUT
+
3kΩ
1µF
C1
GND 15
4 C2+
5 C2-
R1 13
IN
-
T1
C1-
C2+
C2-
V-
14
13
12
11
T1 OUTPUT
OUT
R1
12
11
10
9
OUT
R1
IN
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
1µF
C2
T1
IN
6 V-
T2
-
R1
OUT
T2
IN
-
7
8
+
OUT
T1
IN
R2
R2
IN
OUT
1µF C4
T2
T2 10
IN
3kΩ
OUT
R2
9
R2
IN
R
= V /1T2
IN
OUT
OUT
OUT
T1
T2
OUTPUT
OUT
V
= ±2V
A
IN
RS-232
±30V INPUT
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
FIGURE 7. GENERAL TEST CIRCUIT
11
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Applications
+5V
-
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
+
16
DTR (20) DATA
TERMINAL READY
1
+
C1
1µF
2
3
4
DSRS (24) DATA
SIGNALING RATE
SELECT
-
HIN232
6
+
-
+
C2
1µF
RS-232
INPUTS AND OUTPUTS
5
-
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
T1
11
14
TD
TD (2) TRANSMIT DATA
T2
10
12
7
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
TTL/CMOS RTS
INPUTS AND
13
RD
OUTPUTS
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
15
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
1
4
+
+
C1
C2
HIN232
T1
5
1µF
3
1µF
-
-
11
14
TD
RTS
RD
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
T2
10
12
7
TTL/CMOS
INPUTS AND
OUTPUTS
13
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
15
16
6
6
2
2
C4
C3
+5V
-
-
V- V+
RS-232
INPUTS AND OUTPUTS
2µF
2µF
16
4
HIN232
T1
1
+
+
C1
1µF
C2
1µF
5
3
-
-
11
14
DTR
DSRS
DCD
R1
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
T2
10
12
7
TTL/CMOS
INPUTS AND
OUTPUTS
13
R2
R1
9
8
15
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
12
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Die Characteristics
DIE DIMENSIONS
PASSIVATION
160 mils x 140 mils
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
METALLIZATION
Type: Al
Thickness: 10kÅ ±1kÅ
TRANSISTOR COUNT
238
SUBSTRATE POTENTIAL
PROCESS
V+
CMOS Metal Gate
Metallization Mask Layout
HIN240
T2
OUT
T1
T3
T4
R3
R3
OUT
T5
IN
OUT
OUT
OUT
IN
R2
IN
SHUTDOWN
R2
OUT
EN
T2
T1
IN
IN
T5
OUT
R4
R1
IN
OUT
R4
R1
OUT
IN
T4
T3
IN
GND
IN
R5
OUT
V
CC
R5
IN
C1+
V+
C1-
C2+
C2-
V-
13
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
INCHES
MILLIMETERS
1 2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
18.66
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.775
-
4.95
0.558
1.77
0.355
19.68
-
-
A2
A
-C-
-
SEATING
PLANE
B1
C
8, 10
L
C
L
-
D1
B1
eA
A1
A
D1
e
D
5
eC
C
B
D1
E
5
eB
0.010 (0.25) M
C
B S
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
A
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
e
-
0.430
0.150
-
10.92
3.81
7
B
L
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated in JE-
N
16
16
DEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
14
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
N
E1
INDEX
AREA
1 2
3
N/2
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-A-
A
A1
A2
B
-
4
D
E
0.015
0.115
0.014
0.045
0.008
1.230
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
31.24
0.13
7.62
6.10
4
BASE
PLANE
A2
A
0.195
0.022
0.070
0.014
1.280
-
4.95
0.558
1.77
0.355
32.51
-
-
-C-
SEATING
PLANE
-
L
C
L
B1
C
8
D1
B1
eA
A1
A
D1
-
e
eC
C
B
D
5
eB
0.010 (0.25) M
C
B S
D1
E
5
0.325
0.280
8.25
7.11
6
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
E1
e
5
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
e
e
6
A
B
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
-
0.430
0.150
-
10.92
3.81
7
4. Dimensions A, A1 and L are measured with the package seated in
L
0.115
2.93
4
9
JEDEC seating plane gauge GS-3.
N
24
24
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
Rev. 0 12/93
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
15
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
10.10
7.40
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
0.4133
0.2992
-
0.30
-
1
2
3
L
0.51
9
SEATING PLANE
A
0.0091
0.3977
0.2914
0.32
-
-A-
10.50
7.60
3
h x 45°
D
4
-C-
0.050 BSC
1.27 BSC
-
α
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
α
16
16
7
0°
8°
0°
8°
-
NOTES:
Rev. 1 6/05
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
16
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
15.60
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.020
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.5985
0.2914
0.0125
-
-A-
o
0.6141 15.20
3
h x 45
D
0.2992
7.40
4
-C-
0.05 BSC
1.27 BSC
-
α
µ
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C A M B S
N
α
24
24
7
o
o
o
o
0
8
0
8
-
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
17
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
18.10
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.6969
0.2914
-
0.7125 17.70
3
-A-
o
h x 45
D
0.2992
7.40
4
0.05 BSC
1.27 BSC
-
-C-
α
µ
H
h
0.394
0.01
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
0.016
6
0.25(0.010) M
C A M B S
N
α
28
28
7
o
o
o
o
0
8
0
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
18
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
-
MAX
0.078
-
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
0.002
0.065
0.009
0.004
0.390
0.197
0.05
1.65
0.22
0.09
9.90
5.00
-
1
2
3
0.072
0.014
0.009
0.413
0.220
1.85
0.38
0.25
10.50
5.60
-
L
0.25
SEATING PLANE
A
9
0.010
A2
-A-
C
D
E
-
D
3
-C-
4
α
e
0.026 BSC
0.65 BSC
-
e
A1
C
H
L
0.292
0.022
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
6
0.25(0.010) M
C
A M B S
N
α
28
28
7
NOTES:
0°
8°
0°
8°
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
Rev. 2 6/05
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
19
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Metric Plastic Quad Flatpack Packages (MQFP)
D
Q44.10x10 (JEDEC MS-022AB ISSUE B)
D1
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
-D-
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
-
MAX
2.45
NOTES
A
A1
A2
b
-
0.096
0.010
0.083
0.018
0.016
0.524
0.399
0.523
0.398
0.040
-
0.004
0.077
0.012
0.012
0.515
0.389
0.516
0.390
0.029
0.10
1.95
0.30
0.30
13.08
9.88
13.10
9.90
0.73
0.25
-
2.10
-
-A-
-B-
0.45
6
E
E1
b1
D
0.40
-
13.32
10.12
13.30
10.10
1.03
3
D1
E
4, 5
3
E1
L
4, 5
e
-
N
44
0.032 BSC
44
0.80 BSC
7
PIN 1
e
-
SEATING
PLANE
Rev. 2 4/99
-H-
A
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
0.076
0.003
o
o
-C-
12 -16
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
0.40
0.016
o
0.20
0.008
MIN
M
C
A-B S D S
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
0
MIN
b
A2
o
A1
o
o
b1
0 -7
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
0.13/0.17
0.005/0.007
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
o
12 -16
L
7. “N” is the number of terminal positions.
BASE METAL
WITH PLATING
0.13/0.23
0.005/0.009
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
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20
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