ACS521K/SAMPLE [RENESAS]
AC SERIES, 8-BIT IDENTITY COMPARATOR, INVERTED OUTPUT, CDFP20, CERAMIC, DFP-20;
| 型号： | ACS521K/SAMPLE |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | AC SERIES, 8-BIT IDENTITY COMPARATOR, INVERTED OUTPUT, CDFP20, CERAMIC, DFP-20 CD 输出元件 逻辑集成电路 |
| 文件： | 总3页 (文件大小：130K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ACS521MS
Radiation Hardened
8-Bit Magnitude Comparator
January 1996
tle
S5
S)
-
Features
Pinouts
• Devices QML Qualified in Accordance with MIL-PRF-38535
20 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T20,
LEAD FINISH C
• Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96709 and Intersil’ QM Plan
TOP VIEW
• 1.25 Micron Radiation Hardened SOS CMOS
ia-
d-
1
2
20
GB
A0
VCC
• Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
19 YB
-10
• Single Event Upset (SEU) Immunity: <1 x 10
(Typ)
Errors/Bit/Day
3
18
B0
B7
A1
4
17
16
15
14
13
12
11
A7
B6
A6
B5
A5
it
ni-
2
• SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm /mg
B1
5
6
A2
11
• Dose Rate Upset . . . . . . . . . . . . . . . . >10 RAD (Si)/s, 20ns Pulse
7
B2
12
• Dose Rate Survivability. . . . . . . . . . . >10 RAD (Si)/s, 20ns Pulse
-
-
8
A3
• Latch-Up Free Under Any Conditions
9
B3
B4
A4
10
GND
o
o
• Military Temperature Range . . . . . . . . . . . . . . . . . . -55 C to +125 C
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
hor
20 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP4-F20,
LEAD FINISH C
• Input Logic Levels
-
ds
r-
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
TOP VIEW
VCC
YB
B7
A7
B6
A6
B5
A5
GB
A0
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
• Input Current ≤ 1µA at VOL, VOH
B0
• Fast Propagation Delay. . . . . . . . . . . . . . . . 15ns (Max), 10ns (Typ)
po-
n,
i-
A1
B1
Description
A2
The Intersil ACS521MS is a Radiation Hardened 8 bit magnitude com-
parator device. It provides a low output YB when Word A equals word B
and input GB is low. All other input states cause a high output.
B2
A3
or,
ia-
B3
B4
A4
GND
The ACS521MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of radiation hardened,
high-speed, CMOS/SOS Logic Family.
d-
,
The ACS521MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or a
Ceramic Dual-In-Line Package (D suffix).
Ordering Information
d,
L,
l-
PART NUMBER
5962F9670901VRC
5962F9670901VXC
ACS521D/Sample
ACS521K/Sample
ACS521HMSR
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
25oC
SCREENING LEVEL
MIL-PRF-38535 Class V
MIL-PRF-38535 Class V
Sample
PACKAGE
20 Lead SBDIP
20 Lead Ceramic Flatpack
20 Lead SBDIP
25oC
Sample
20 Lead Ceramic Flatpack
Die
25oC
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Spec Number 518821
File Number 3111.1
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
ACS521MS
Functional Diagram
1
GB
8
8
1
A
B
+
YB
8
+
TRUTH TABLE
INPUTS
A
OUTPUT
GB
0
B
YB
L
A
A
=
B
B
0
≠
H
1
X
X
H
NOTE: L = Low, H = High, X = Don’t Care
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518821
2
ACS521MS
Die Characteristics
DIE DIMENSIONS:
102mils x 102mils
2,600mm x 2,600mm
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125kÅ ±1.125kÅ
Metal 2 Thickness: 9kÅ ±1kÅ
GLASSIVATION:
Type: SiO
2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
5
2
<2.0 x 10 A/cm
BOND PAD SIZE:
> 4.3mils x 4.3mils
> 110µm x 110µm
Metallization Mask Layout
ACS521MS
(17) A7
A1 (4)
B1 (5)
NC
(16) B6
NC
NC
NC
A2 (6)
B2 (7)
(15) A6
(14) B5
Spec Number 518821
3
相关型号：
ACS541D/SAMPLE-02
AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, SIDE BRAZED, CERAMIC, DIP-20
RENESAS
©2020 ICPDF网 联系我们和版权申明