ACS541D/SAMPLE [RENESAS]
AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, SIDE BRAZED, CERAMIC, DIP-20;
| 型号： | ACS541D/SAMPLE |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, SIDE BRAZED, CERAMIC, DIP-20 驱动 CD 输出元件 逻辑集成电路 |
| 文件： | 总3页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ACS541MS
Radiation Hardened Octal Buffer/
Line Driver Three-State
January 1996
Features
Pinouts
20 LEAD CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR,
CDIP2-T20, LEAD FINISH C
TOP VIEW
• Devices QML Qualified in Accordance with MIL-PRF-38535
• Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96710 and Intersil’s QM Plan
• 1.25 Micron Radiation Hardened SOS CMOS
1
2
3
4
5
6
7
8
9
VCC
OE2
OE1
A0
A1
A2
A3
A4
A5
A6
A7
20
19
• Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
• Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day
(Typ)
18 Y0
17 Y1
16 Y2
15 Y3
14 Y4
13 Y5
• SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg
• Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse
• Dose Rate Survivability. . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse
• Latch-Up Free Under Any Conditions
• Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
• Input Logic Levels
12
Y6
GND 10
11 Y7
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
20 LEAD CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR,
CDFP4-F20, LEAD FINISH C
TOP VIEW
• Input Current ≤ 1µA at VOL, VOH
• Fast Propagation Delay . . . . . . . . . . . . . . . . 17ns (Max), 12ns (Typ)
VCC
OE2
Y0
OE1
A0
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Description
The Intersil ACS541MS is a Radiation Hardened Octal Buffer/Line
Driver, with three-state outputs. The output enable pins OE1, OE2 con-
trol the Three-State outputs. If either enable is high the output will be in a
high impedance state. For data output both enables must be low.
A1
Y1
A2
A3
Y2
A4
Y3
The ACS541MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of a radiation hardened,
high-speed, CMOS/SOS Logic family.
A5
Y4
A6
Y5
A7
Y6
Y7
The ACS541MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or a
Ceramic Dual-In-Line package (D suffix).
GND
Ordering Information
PART NUMBER
5962F9671001VRC
5962F9671001VXC
ACS541D/Sample
ACS541K/Sample
ACS541HMSR
TEMPERATURE RANGE
SCREENING LEVEL
PACKAGE
o
o
-55 C to +125 C
MIL-PRF-38535 Class V
20 Lead SBDIP
o
o
-55 C to +125 C
MIL-PRF-38535 Class V
20 Lead Ceramic Flatpack
20 Lead SBDIP
o
25 C
Sample
Sample
Die
o
25 C
20 Lead Ceramic Flatpack
Die
o
25 C
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Spec Number 518856
File Number 4085
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
ACS541MS
Functional Diagram
VCC
2
3
4
5
18
17
16
15
A0
A1
A2
A3
Y0
Y1
Y2
Y3
1
OE1
GND
VCC
19
OE2
GND
VCC
GND
VCC
GND
VCC
6
7
14
13
A4
A5
Y4
Y5
GND
VCC
GND
VCC
8
9
12
11
A6
A7
Y6
Y7
GND
VCC
GND VCC
10
20
GND
TRUTH TABLE
INPUTS
OUTPUTS
OE1
L
OE2
L
An
H
L
Yn
H
L
L
L
H
X
X
Z
X
H
X
Z
NOTE: L = Low Logic Level, H = High Logic Level, Z = High Impedance
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518856
2
ACS541MS
Die Characteristics
DIE DIMENSIONS:
102 mils x 102 mils
2,600mm x 2,600mm
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125kÅ ±1.125kÅ
Metal 2 Thickness: 9kÅ ±1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105 A/cm2
BOND PAD SIZE:
> 4.3 mils x 4.3 mils
> 110µm x 110µm
Metallization Mask Layout
ACS541MS
(17) Y1
A2 (4)
A3 (5)
NC
(16) Y2
NC
NC
NC
(15) Y3
A4 (6)
A5 (7)
(14) Y4
Spec Number 518856
3
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