2SH20 [RENESAS]

36A, 600V, N-CHANNEL IGBT, SC-65, TO-3P, 3 PIN;
2SH20
型号: 2SH20
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

36A, 600V, N-CHANNEL IGBT, SC-65, TO-3P, 3 PIN

局域网 栅 双极性晶体管 功率控制
文件: 总8页 (文件大小:42K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ADE–208–293 (Z)  
2SH20  
Silicon N-Channel IGBT  
1st. Edition  
Feb. 1995  
Application  
TO–3P  
High speed power switching  
Features  
2
• High speed switching  
• Low on saturation voltage  
1
1. Gate  
2. Collector  
3. Emitter  
1
3
2
3
Table 1 Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
Ratings  
Unit  
———————————————————————————————————————————  
Collector to emitter voltage  
V
600  
V
CES  
———————————————————————————————————————————  
Gate to emitter voltage  
V
±20  
V
GES  
———————————————————————————————————————————  
Collector current  
I
36  
A
C
———————————————————————————————————————————  
Collector peak current  
ic(peak)  
60  
A
———————————————————————————————————————————  
Collector dissipation  
P *  
100  
W
C
———————————————————————————————————————————  
Channel temperature  
T
150  
°C  
j
———————————————————————————————————————————  
Storage temperature  
Tstg  
–55 to +150  
°C  
———————————————————————————————————————————  
* Value at Tc = 25°C  
1
2SH20  
Table 2 Electrical Characteristics (Ta = 25°C)  
Item  
Symbol  
Min  
Typ  
Max  
Unit Test conditions  
———————————————————————————————————————————  
Collector to emitter breakdown  
V
600  
V
I
= 100 µA, V  
= 0  
(BR)CES  
C
GE  
voltage  
———————————————————————————————————————————  
Zero gate voltage collector  
I
0.5  
mA  
V
= 600 V, V  
= 0  
CES  
CE  
GE  
current  
———————————————————————————————————————————  
Gate to emitter leak current  
I
±1  
µA  
V
= ±20 V, V  
= 0  
GES  
GE  
CE  
———————————————————————————————————————————  
Gate to emitter cutoff current  
———————————————————————————————————————————  
V
3.0  
6.0  
V
I
= 1 mA, V  
= 10 V  
GE(off)  
C
CE  
Collector to emitter saturation  
V
1
1.5  
V
I
= 15 A, V  
= 15 V  
CE(sat)  
C
GE  
voltage  
———————————————————————————————————————————  
Collector to emitter saturation  
V
2
2.0  
2.6**  
V
I
= 30 A, V  
= 15 V  
CE(sat)  
C
GE  
voltage  
———————————————————————————————————————————  
Input capacitance  
Cies  
2600  
pF  
V
= 10 V, V  
= 0,  
CE  
GE  
f = 1 MHz  
———————————————————————————————————————————  
Switching time  
t
160  
ns  
I = 30 A,  
r
C
————————————————  
t
300  
R = 10 ,  
L
on  
————————————————  
t
2000  
V
= ±15 V  
f
GE  
————————————————  
t
2500  
Rg = 50 Ω  
off  
———————————————————————————————————————————  
**V  
2 is specified at the correlated test condition (I =20A)  
CE(sat)  
C
2
2SH20  
Power vs. Temperature Derating  
Maximum Safe Operation Area  
200  
150  
100  
50  
100  
10  
1
0.1  
Ta = 25 °C  
0.01  
0
50  
100  
150  
200  
1
10  
100  
1000  
(V)  
Collector to Emitter Voltage V  
Case Temperature Tc (°C)  
CE  
Typical Output Characteristics  
Pulse Test  
Reverse Bias SOA  
100  
80  
100  
10  
Ta = 25 °C  
V
= 15 V  
12 V  
GE  
60  
40  
10 V  
8 V  
1
20  
0
Tc = 25 °C  
6 V  
8
0.1  
2
4
6
10  
(V)  
0
200  
400  
600  
800  
(V)  
Collector to Emitter Voltage V  
Collector to Emitter Voltage V  
CE  
CE  
3
2SH20  
Collector to Emitter Saturation Voltage  
vs. Gate to Emitter Voltage  
Typical Transfer Characteristics  
100  
80  
60  
40  
20  
10  
8
I
= 30 A  
C
20 A  
10 A  
6
25 °C  
75 °C  
Tc = –25 °C  
4
2
Pulse Test  
Pulse Test  
4
V
= 10 V  
CE  
0
4
8
12  
16 20  
0
8
12  
16  
20  
Gate to Emitter Voltage  
V
(V)  
GE  
Gate to Emitter Voltage  
V
(V)  
GE  
Collector to Emitter Saturation Voltage  
vs. Collector Current  
Typical Capacitnace vs.  
Collector to Emitter Voltage  
50  
10000  
1000  
Pulse Test  
V
GE  
= 15 V  
Cies  
20  
10  
5
Tc =75 °C  
25 °C  
–25 °C  
Coes  
Cres  
100  
100  
2
1
V
= 0  
GE  
f = 1 MHz  
0.5  
1
2
5
10  
20  
I
50 100  
(A)  
0
10  
20  
30  
40  
V
50  
(V)  
Collector to Emitter Voltage  
Collector Current  
CE  
C
4
2SH20  
Dynamic Input Characteristics  
Switching Characteristics  
tf  
20  
16  
12  
8
500  
400  
300  
200  
100  
2000  
V
CC  
= 400 V  
300 V  
1000  
500  
200 V  
td(off)  
V
GE  
200  
100  
tr  
td(on)  
V
CC  
= 400 V  
300 V  
V
V
= 300 V  
= ±15 V  
Rg = 50  
CC  
GE  
4
0
50  
200 V  
I
= 30 A  
C
V
CE  
Tc = 25 °C  
20  
0
40  
80  
120  
160  
200  
1
5
10  
50 100  
Gate Charge Qg (nc)  
Collector Current  
I
(A)  
C
Switching Characteristics  
tf  
Switching Characteristics  
tf  
2000  
5000  
2000  
1000  
500  
I
= 30 A  
C
L
GE  
R = 10  
1000  
500  
V
= ±15 V  
Rg = 50 Ω  
td(off)  
200  
100  
td(on)  
tr  
200  
100  
50  
tr  
I = 30 A  
R =10 (V  
L
C
50  
20  
= 300 V)  
CC  
td(on)  
V
= ±15 V  
GE  
Tc = 25 °C  
50 100  
Gate Resistance Rg ( )  
5
10  
500  
–25  
0
25  
50  
75  
100 125  
Case Temperature Tc (°C)  
5
2SH20  
Normalized Transient Thermal Impedance vs. Pulse Width  
3
1
D = 1  
0.5  
0.3  
0.1  
θ
θ
γ
θ
ch – c(t) = s (t) • ch – c  
ch – c = 1.25 °C/W, Tc = 25 °C  
PW  
T
P
CM  
D =  
0.03  
0.01  
PW  
T
10 µ  
100 µ  
1 m  
10 m  
100 m  
1
10  
Pulse Width PW (S)  
Switching Time Test Circuit  
Waveforms  
90%  
10%  
0
Vin  
Ic Monitor  
V
CE  
Vin Monitor  
V
CE  
Monitor  
R
L
Rg  
90%  
90%  
D.U.T.  
V
CC  
Vin ± 15 V  
10%  
Ic  
td(on)  
10%  
tf  
td(off)  
tr  
ton  
toff  
6
2SH20  
Package Dimensions  
Unit : mm  
φ
3.2 ± 0.2  
5.0 max  
1.5 typ  
• TO-3P  
16.0 max  
1.6 typ  
2.8 typ  
1.4 max  
2.0 typ  
0.6 ± 0.2  
1.0 ± 0.2  
0.9 typ  
3.6 typ  
1.0 typ  
TO–3P  
SC–65  
Hitachi Code  
EIAJ  
5.45 ± 0.2  
5.45 ± 0.2  
JEDEC  
7
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Straße 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.  

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