BDW53B [POINN]

NPN SILICON POWER DARLINGTONS; NPN硅功率DARLINGTONS
BDW53B
型号: BDW53B
厂家: POWER INNOVATIONS LTD    POWER INNOVATIONS LTD
描述:

NPN SILICON POWER DARLINGTONS
NPN硅功率DARLINGTONS

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BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
Copyright © 1997, Power Innovations Limited, UK  
AUGUST 1978 - REVISED MARCH 1997  
Designed for Complementary Use with  
BDW54, BDW54A, BDW54B, BDW54C and  
BDW54D  
TO-220 PACKAGE  
(TOP VIEW)  
40 W at 25°C Case Temperature  
4 A Continuous Collector Current  
1
2
3
B
C
E
Minimum h of 750 at 3 V, 1.5 A  
FE  
Pin 2 is in electrical contact with the mounting base.  
MDTRACA  
absolute maximum ratings at 25°C case temperature (unless otherwise noted)  
RATING  
SYMBOL  
VALUE  
UNIT  
BDW53  
45  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
60  
Collector-base voltage (IE = 0)  
VCBO  
80  
V
100  
120  
45  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
60  
Collector-emitter voltage (IB = 0) (see Note 1)  
VCEO  
80  
V
100  
120  
Emitter-base voltage  
VEBO  
IC  
5
V
A
Continuous collector current  
4
Continuous base current  
IB  
50  
40  
mA  
W
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)  
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)  
Unclamped inductive load energy (see Note 4)  
Operating junction temperature range  
Ptot  
Ptot  
2
W
2
½LIC  
25  
mJ  
°C  
°C  
°C  
Tj  
Tstg  
TA  
-65 to +150  
-65 to +150  
-65 to +150  
Operating temperature range  
Operating free-air temperature range  
NOTES: 1. These values apply when the base-emitter diode is open circuited.  
2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C.  
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.  
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, IB(on) = 5 mA, RBE = 100 W,  
VBE(off) = 0, RS = 0.1 W, VCC = 20 V.  
P R O D U C T  
I N F O R M A T I O N  
Information is current as of publication date. Products conform to specifications in accordance  
with the terms of Power Innovations standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
electrical characteristics at 25°C case temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
BDW53  
45  
60  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
Collector-emitter  
V(BR)CEO  
IC  
=
30 mA  
IB = 0  
(see Note 5)  
80  
V
breakdown voltage  
100  
120  
VCE  
VCE  
VCE  
VCE  
VCE  
VCB  
VCB  
VCB  
=
30 V  
30 V  
40 V  
50 V  
60 V  
45 V  
60 V  
80 V  
I
B = 0  
0.5  
0.5  
0.5  
0.5  
0.5  
0.2  
0.2  
0.2  
0.2  
0.2  
5
=
=
=
=
=
=
=
IB = 0  
IB = 0  
IB = 0  
IB = 0  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
Collector-emitter  
cut-off current  
ICEO  
mA  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
VCB = 100 V  
VCB = 120 V  
Collector cut-off  
current  
ICBO  
mA  
mA  
VCB  
VCB  
VCB  
=
=
=
45 V  
60 V  
80 V  
TC = 150°C  
TC = 150°C  
TC = 150°C  
TC = 150°C  
TC = 150°C  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
5
5
VCB = 100 V  
VCB = 120 V  
5
5
Emitter cut-off  
current  
IEBO  
hFE  
VEB  
=
5 V  
IC = 0  
2
Forward current  
transfer ratio  
Base-emitter  
voltage  
VCE  
VCE  
=
=
3 V  
3 V  
IC = 1.5 A  
750  
100  
20000  
(see Notes 5 and 6)  
(see Notes 5 and 6)  
(see Notes 5 and 6)  
IC 4 A  
=
VBE(on)  
VCE(sat)  
VEC  
VCE  
=
3 V  
IC = 1.5 A  
2.5  
V
V
V
Collector-emitter  
saturation voltage  
Parallel diode  
forward voltage  
IB  
IB  
=
=
30 mA  
40 mA  
IC = 1.5 A  
2.5  
4
IC 4 A  
=
IE  
=
4 A  
IB = 0  
3.5  
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle £ 2%.  
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.  
thermal characteristics  
PARAMETER  
Junction to case thermal resistance  
Junction to free air thermal resistance  
MIN  
MIN  
TYP  
MAX  
UNIT  
RqJC  
RqJA  
3.125  
62.5  
°C/W  
°C/W  
resistive-load-switching characteristics at 25°C case temperature  
PARAMETER  
TEST CONDITIONS  
B(on) = 8 mA  
RL = 15 W  
TYP  
MAX  
UNIT  
ton  
toff  
Turn-on time  
Turn-off time  
IC = 2 A  
I
IB(off) = -8 mA  
1
µs  
µs  
VBE(off) = -5 V  
tp = 20 ms, dc £ 2%  
4.5  
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.  
P R O D U C T  
I N F O R M A T I O N  
2
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
TYPICAL CHARACTERISTICS  
TYPICAL DC CURRENT GAIN  
vs  
COLLECTOR-EMITTER SATURATION VOLTAGE  
vs  
COLLECTOR CURRENT  
COLLECTOR CURRENT  
TCS110AB  
TCS110AD  
20000  
10000  
2·0  
tp = 300 µs, duty cycle < 2%  
IB = IC / 100  
TC = -40°C  
TC = 25°C  
TC = 100°C  
1·5  
1·0  
0·5  
1000  
TC = -40°C  
TC = 25°C  
VCE  
=
3 V  
tp = 300 µs, duty cycle < 2%  
TC = 100°C  
100  
0·5  
0
0·5  
1·0  
5·0  
1·0  
5·0  
IC - Collector Current - A  
IC - Collector Current - A  
Figure 1.  
Figure 2.  
BASE-EMITTER SATURATION VOLTAGE  
vs  
COLLECTOR CURRENT  
TCS110AC  
3·0  
2·5  
2·0  
1·5  
1·0  
0·5  
TC = -40°C  
TC = 25°C  
TC = 100°C  
IB = IC / 100  
tp = 300 µs, duty cycle < 2%  
0·5  
1·0  
5·0  
IC - Collector Current - A  
Figure 3.  
P R O D U C T  
I N F O R M A T I O N  
3
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
MAXIMUM SAFE OPERATING REGIONS  
MAXIMUM FORWARD-BIAS  
SAFE OPERATING AREA  
SAS110AC  
10  
1·0  
0·1  
BDW53  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
0.01  
1·0  
10  
100  
1000  
VCE - Collector-Emitter Voltage - V  
Figure 4.  
THERMAL INFORMATION  
MAXIMUM POWER DISSIPATION  
vs  
CASE TEMPERATURE  
TIS110AB  
60  
50  
40  
30  
20  
10  
0
0
25  
50  
75  
100  
125  
150  
TC - Case Temperature - °C  
Figure 5.  
P R O D U C T  
I N F O R M A T I O N  
4
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
MECHANICAL DATA  
TO-220  
3-pin plastic flange-mount package  
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic  
compound. The compound will withstand soldering temperature with no deformation, and circuit performance  
characteristics will remain stable when operated in high humidity conditions. Leads require no additional  
cleaning or processing when used in soldered assembly.  
TO220  
4,70  
4,20  
10,4  
10,0  
1,32  
1,23  
3,96  
3,71  
ø
2,95  
2,54  
see Note B  
6,6  
6,0  
15,90  
14,55  
see Note C  
6,1  
3,5  
14,1  
12,7  
1,70  
1,07  
0,97  
0,61  
1
2
3
2,74  
2,34  
0,64  
0,41  
2,90  
2,40  
5,28  
4,88  
VERSION 1  
VERSION 2  
ALL LINEAR DIMENSIONS IN MILLIMETERS  
NOTES: A. The centre pin is in electrical contact with the mounting tab.  
B. Mounting tab corner profile according to package version.  
C. Typical fixing hole centre stand off height according to package version.  
Version 1, 18.0 mm. Version 2, 17.6 mm.  
MDXXBE  
P R O D U C T  
I N F O R M A T I O N  
5
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
IMPORTANT NOTICE  
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any  
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the  
information being relied on is current.  
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI  
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except as mandated by government requirements.  
PI accepts no liability for applications assistance, customer product design, software performance, or infringement  
of patents or services described herein. Nor is any license, either express or implied, granted under any patent  
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,  
machine, or process in which such semiconductor products or services might be or are used.  
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE  
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.  
Copyright © 1997, Power Innovations Limited  
P R O D U C T  
I N F O R M A T I O N  
6

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