BDW53D [BOURNS]

NPN SILICON POWER DARLINGTONS; NPN硅功率DARLINGTONS
BDW53D
型号: BDW53D
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

NPN SILICON POWER DARLINGTONS
NPN硅功率DARLINGTONS

晶体 晶体管 功率双极晶体管 开关 局域网
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BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
Designed for Complementary Use with  
BDW54, BDW54A, BDW54B, BDW54C and  
BDW54D  
TO-220 PACKAGE  
(TOP VIEW)  
40 W at 25°C Case Temperature  
4 A Continuous Collector Current  
1
2
3
B
C
E
Minimum h of 750 at 3V, 1.5 A  
FE  
Pin 2 is in electrical contact with the mounting base.  
MDTRACA  
absolute maximum ratings at 25°C case temperature (unless otherwise noted)  
RATING  
SYMBOL  
VALUE  
UNIT  
BDW53  
45  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
60  
Collector-base voltage (IE = 0)  
VCBO  
80  
V
100  
120  
45  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
60  
Collector-emitter voltage (IB = 0) (see Note 1)  
VCEO  
80  
V
100  
120  
Emitter-base voltage  
VEBO  
IC  
5
V
A
Continuous collector current  
4
Continuous base current  
IB  
50  
40  
mA  
W
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)  
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)  
Unclamped inductive load energy (see Note 4)  
Operating junction temperature range  
Ptot  
Ptot  
2
W
2
½LIC  
25  
mJ  
°C  
°C  
°C  
Tj  
Tstg  
TA  
-65 to +150  
-65 to +150  
-65 to +150  
Operating temperature range  
Operating free-air temperature range  
NOTES: 1. These values apply when the base-emitter diode is open circuited.  
2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C.  
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.  
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, IB(on) = 5 mA, RBE = 100 ,  
BE(off) = 0, RS = 0.1 , VCC = 20 V.  
V
AUGUST 1978 - REVISED SEPTEMBER 2002  
Specifications are subject to change without notice.  
1
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
electrical characteristics at 25°C case temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
BDW53  
45  
60  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
Collector-emitter  
V(BR)CEO  
IC  
=
30 mA  
IB = 0  
(see Note 5)  
80  
V
breakdown voltage  
100  
120  
VCE  
VCE  
VCE  
VCE  
VCE  
VCB  
VCB  
VCB  
=
30 V  
30 V  
40 V  
50 V  
60 V  
45 V  
60 V  
80 V  
IB = 0  
IB = 0  
IB = 0  
0.5  
0.5  
0.5  
0.5  
0.5  
0.2  
0.2  
0.2  
0.2  
0.2  
5
=
=
=
=
=
=
=
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
Collector-emitter  
cut-off current  
ICEO  
mA  
I
B = 0  
IB = 0  
E = 0  
I
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
IE = 0  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
BDW53  
VCB = 100 V  
VCB = 120 V  
Collector cut-off  
current  
ICBO  
mA  
mA  
VCB  
VCB  
VCB  
=
=
=
45 V  
60 V  
80 V  
TC = 150°C  
TC = 150°C  
TC = 150°C  
TC = 150°C  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
5
5
VCB = 100 V  
CB = 120 V  
5
V
IE = 0  
TC = 150°C  
5
Emitter cut-off  
current  
IEBO  
hFE  
VEB  
=
5 V  
IC = 0  
2
Forward current  
transfer ratio  
Base-emitter  
voltage  
VCE  
VCE  
=
=
3 V  
3 V  
IC = 1.5 A  
750  
100  
20000  
(see Notes 5 and 6)  
(see Notes 5 and 6)  
(see Notes 5 and 6)  
IC = 4 A  
VBE(on)  
VCE(sat)  
VEC  
VCE  
=
3 V  
IC = 1.5 A  
2.5  
V
V
V
Collector-emitter  
saturation voltage  
Parallel diode  
forward voltage  
IB  
IB  
=
=
30 mA  
40 mA  
IC = 1.5 A  
2.5  
4
IC = 4 A  
IE  
=
4 A  
IB = 0  
3.5  
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle 2%.  
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.  
thermal characteristics  
PARAMETER  
Junction to case thermal resistance  
Junction to free air thermal resistance  
MIN  
MIN  
TYP  
MAX  
UNIT  
RθJC  
RθJA  
3.125  
62.5  
°C/W  
°C/W  
resistive-load-switching characteristics at 25°C case temperature  
PARAMETER  
TEST CONDITIONS  
B(on) = 8 mA  
RL = 15 Ω  
TYP  
MAX  
UNIT  
ton  
toff  
Turn-on time  
Turn-off time  
IC = 2 A  
I
I
B(off) = -8 mA  
1
µs  
µs  
VBE(off) = -5 V  
tp = 20 µs, dc 2%  
4.5  
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.  
AUGUST 1978 - REVISED SEPTEMBER 2002  
Specifications are subject to change without notice.  
2
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
TYPICAL CHARACTERISTICS  
TYPICAL DC CURRENT GAIN  
vs  
COLLECTOR-EMITTER SATURATION VOLTAGE  
vs  
COLLECTOR CURRENT  
COLLECTOR CURRENT  
TCS110AB  
TCS110AD  
20000  
10000  
2·0  
tp = 300 µs, duty cycle < 2%  
IB = IC / 100  
TC = -40°C  
TC = 25°C  
TC = 100°C  
1·5  
1·0  
0·5  
1000  
TC = -40°C  
TC = 25°C  
VCE  
=
3 V  
tp = 300 µs, duty cycle < 2%  
TC = 100°C  
100  
0·5  
0
0·5  
1·0  
5·0  
1·0  
5·0  
IC - Collector Current - A  
IC - Collector Current - A  
Figure 1.  
Figure 2.  
BASE-EMITTER SATURATION VOLTAGE  
vs  
COLLECTOR CURRENT  
TCS110AC  
3·0  
2·5  
2·0  
1·5  
1·0  
0·5  
TC = -40°C  
TC = 25°C  
TC = 100°C  
IB = IC / 100  
tp = 300 µs, duty cycle < 2%  
0·5  
1·0  
5·0  
IC - Collector Current - A  
Figure 3.  
AUGUST 1978 - REVISED SEPTEMBER 2002  
Specifications are subject to change without notice.  
3
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
MAXIMUM SAFE OPERATING REGIONS  
MAXIMUM FORWARD-BIAS  
SAFE OPERATING AREA  
SAS110AC  
10  
1·0  
0·1  
BDW53  
BDW53A  
BDW53B  
BDW53C  
BDW53D  
0.01  
1·0  
10  
100  
1000  
VCE - Collector-Emitter Voltage - V  
Figure 4.  
THERMAL INFORMATION  
MAXIMUM POWER DISSIPATION  
vs  
CASE TEMPERATURE  
TIS110AB  
60  
50  
40  
30  
20  
10  
0
0
25  
50  
75  
100  
125  
150  
TC - Case Temperature - °C  
Figure 5.  
AUGUST 1978 - REVISED SEPTEMBER 2002  
Specifications are subject to change without notice.  
4
BDW53, BDW53A, BDW53B, BDW53C, BDW53D  
NPN SILICON POWER DARLINGTONS  
MECHANICAL DATA  
TO-220  
3-pin plastic flange-mount package  
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic  
compound. The compound will withstand soldering temperature with no deformation, and circuit performance  
characteristics will remain stable when operated in high humidity conditions. Leads require no additional  
cleaning or processing when used in soldered assembly.  
TO220  
4,70  
4,20  
10,4  
10,0  
1,32  
1,23  
3,96  
3,71  
ø
2,95  
2,54  
see Note B  
6,6  
6,0  
15,90  
14,55  
see Note C  
6,1  
3,5  
14,1  
12,7  
1,70  
1,07  
0,97  
0,61  
1
2
3
2,74  
2,34  
0,64  
0,41  
2,90  
2,40  
5,28  
4,88  
VERSION 1  
VERSION 2  
ALL LINEAR DIMENSIONS IN MILLIMETERS  
NOTES: A. The centre pin is in electrical contact with the mounting tab.  
B. Mounting tab corner profile according to package version.  
C. Typical fixing hole centre stand off height according to package version.  
Version 1, 18.0 mm. Version 2, 17.6 mm.  
MDXXBE  
AUGUST 1978 - REVISED SEPTEMBER 2002  
Specifications are subject to change without notice.  
5

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