2PB709ARL,235 [NXP]
2PB709ARL; 2PB709ASL - 45 V, 100 mA PNP general-purpose transistors TO-236 3-Pin;
| 型号： | 2PB709ARL,235 |
| 厂家： | 
NXP |
| 描述： | 2PB709ARL; 2PB709ASL - 45 V, 100 mA PNP general-purpose transistors TO-236 3-Pin PC 开关 光电二极管 晶体管 |
| 文件： | 总9页 (文件大小：48K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2PB709ARL; 2PB709ASL
45 V, 100 mA PNP general-purpose transistors
Rev. 01 — 12 November 2008
Product data sheet
1. Product profile
1.1 General description
PNP general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted
Device (SMD) plastic package.
Table 1.
Product overview
Type number[1]
Package
NXP
NPN complement
JEDEC
2PB709ARL
SOT23
TO-236AB
2PD601ARL
2PB709ASL
2PD601ASL
2PB709ARL/DG
2PB709ASL/DG
SOT23
TO-236AB
2PD601ARL/DG
2PD601ASL/DG
[1] /DG: halogen-free
1.2 Features
I General-purpose transistors
I Two current gain selections
I AEC-Q101 qualified
I Small SMD plastic package
1.3 Applications
I General-purpose switching and amplification
1.4 Quick reference data
Table 2.
Symbol
VCEO
IC
Quick reference data
Parameter
Conditions
Min
Typ
Max Unit
−45
collector-emitter voltage
collector current
open base
-
-
-
-
V
−100 mA
hFE
DC current gain
VCE = −10 V;
IC = −2 mA
hFE group R
hFE group S
210
290
-
-
340
460
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
2. Pinning information
Table 3.
Pinning
Pin
1
Description
base
Simplified outline
Graphic symbol
3
3
2
emitter
3
collector
1
1
2
2
sym013
3. Ordering information
Table 4.
Ordering information
Type number[1]
Package
Name
-
Description
Version
2PB709ARL
plastic surface-mounted package; 3 leads
SOT23
2PB709ASL
2PB709ARL/DG
2PB709ASL/DG
[1] /DG: halogen-free
4. Marking
Table 5.
Marking codes
Type number
2PB709ARL
Marking code[1]
SN*
SL*
SS*
SZ*
2PB709ASL
2PB709ARL/DG
2PB709ASL/DG
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
2PB709AXL_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 12 November 2008
2 of 9
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
open emitter
open base
Min
Max
−45
−45
−6
Unit
V
VCBO
VCEO
VEBO
IC
collector-base voltage
-
-
-
-
-
collector-emitter voltage
emitter-base voltage
collector current
V
open collector
V
−100
−200
mA
mA
ICM
peak collector current
single pulse;
tp ≤ 1 ms
IBM
peak base current
single pulse;
-
−100
mA
tp ≤ 1 ms
[1]
Ptot
Tj
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb ≤ 25 °C
-
250
mW
°C
-
150
Tamb
Tstg
−55
−65
+150
+150
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol Parameter
Conditions
Min
Typ
Max Unit
500 K/W
[1]
Rth(j-a)
thermal resistance from junction in free air
to ambient
-
-
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
ICBO
collector-base cut-off
current
VCB = −45 V; IE = 0 A
-
-
-
-
−10
−5
nA
VCB = −45 V; IE = 0 A;
Tj = 150 °C
µA
IEBO
hFE
emitter-base cut-off
current
VEB = −5 V; IC = 0 A
-
-
−10
nA
DC current gain
hFE group R
VCE = −10 V; IC = −2 mA
210
290
-
-
-
-
340
460
hFE group S
[1]
VCEsat
collector-emitter
saturation voltage
IC = −100 mA;
IB = −10 mA
−500 mV
2PB709AXL_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 12 November 2008
3 of 9
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
Table 8.
Characteristics …continued
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
fT
transition frequency
VCE = −10 V; IC = −1 mA;
f = 100 MHz
hFE group R
70
80
-
-
-
-
-
MHz
MHz
pF
hFE group S
-
Cc
collector capacitance
VCB = −10 V; IE = ie = 0 A;
5
f = 1 MHz
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
3.0
2.8
1.1
0.9
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
0.48
0.38
0.15
0.09
1.9
Dimensions in mm
04-11-04
Fig 1. Package outline SOT23 (TO-236AB)
2PB709AXL_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 12 November 2008
4 of 9
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number[2]
Package
Description
Packing quantity
3000
10000
2PB709ARL
SOT23
4 mm pitch, 8 mm tape and reel
-215
-235
2PB709ASL
2PB709ARL/DG
2PB709ASL/DG
[1] For further information and the availability of packing methods, see Section 14.
[2] /DG: halogen-free
11. Soldering
3.3
2.9
1.9
solder lands
solder resist
2
3
1.7
solder paste
occupied area
0.6
0.7
(3×)
(3×)
Dimensions in mm
0.5
(3×)
0.6
(3×)
1
sot023_fr
Fig 2. Reflow soldering footprint SOT23 (TO-236AB)
2PB709AXL_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 12 November 2008
5 of 9
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
2.2
1.2
(2×)
1.4
(2×)
solder lands
solder resist
2.6
4.6
occupied area
Dimensions in mm
1.4
preferred transport direction during soldering
sot023_fw
2.8
4.5
Fig 3. Wave soldering footprint SOT23 (TO-236AB)
2PB709AXL_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 12 November 2008
6 of 9
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
12. Revision history
Table 10. Revision history
Document ID
Release date
20081112
Data sheet status
Change notice
Supersedes
2PB709AXL_1
Product data sheet
-
-
2PB709AXL_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 12 November 2008
7 of 9
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
2PB709AXL_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 12 November 2008
8 of 9
2PB709ARL; 2PB709ASL
NXP Semiconductors
45 V, 100 mA PNP general-purpose transistors
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 4
Quality information . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 November 2008
Document identifier: 2PB709AXL_1
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