2N7002KDW_10 [PANJIT]

60V N-Channel Enhancement Mode MOSFET - ESD Protected; 60V N沟道增强型MOSFET - ESD保护
2N7002KDW_10
型号: 2N7002KDW_10
厂家: PAN JIT INTERNATIONAL INC.    PAN JIT INTERNATIONAL INC.
描述:

60V N-Channel Enhancement Mode MOSFET - ESD Protected
60V N沟道增强型MOSFET - ESD保护

文件: 总5页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2N7002KDW  
60V N-Channel Enhancement Mode MOSFET - ESD Protected  
SOT-363  
Unit: inch (mm)  
FEATURES  
• RDS(ON), VGS@10V,IDS@500mA=3Ω  
• RDS(ON), VGS@4.5V,IDS@200mA=4Ω  
0.054(1.35)  
0.045(1.15)  
• Advanced Trench Process Technology  
• High Density Cell Design For Ultra Low On-Resistance  
• Very Low Leakage Current In Off Condition  
• Specially Designed for Battery Operated Systems, Solid-State Relays  
Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc.  
• ESD Protected 2KV HBM  
0.040(1.00)  
0.031(0.80)  
• In compliance with EU RoHS 2002/95/EC directives  
0.10 MAX.  
0.018(0.45)  
0.006(0.15)  
MECHANICALDATA  
0.087(2.20)  
0.078(2.00)  
• Case: SOT-363 Package  
6
1
5
2
4
3
Terminals : Solderable per MIL-STD-750,Method 2026  
• Marking : K27  
Maximum RATINGS and Thermal Characteristics (TA=25OC unless otherwise noted )  
PARAMETER  
Drain-Source Voltage  
Symbol  
VDS  
Limit  
60  
Units  
V
Gate-Source Voltage  
VGS  
ID  
+20  
115  
800  
V
Continuous Drain Current  
mA  
mA  
1)  
Pulsed Drain Current  
IDM  
TA=25OC  
TA=75OC  
200  
120  
Maximum Power Dissipation  
PD  
TJ,TSTG  
RθJA  
mW  
OC  
Operating Junction and Storage  
Temperature Range  
-55 to + 150  
625  
Junction-to Ambient Thermal  
Resistance(PCB mounted)2  
OC/W  
Note: 1. Maximum DC current limited by the package  
2. Surface mounted on FR4 board, t < 5 sec  
PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
May 21.2010-REV.01  
PAGE . 1  
2N7002KDW  
ELECTRICALCHARACTERISTICS  
Parameter  
Static  
Symbol  
Test Condition  
Min.  
Typ.  
Max.  
Units  
Drain-Source Breakdown  
Voltage  
BVDSS  
VGS(th)  
RDS(on)  
RDS(on)  
IDSS  
VGS=0V, ID=10uA  
VDS=VGS, ID=250uA  
VGS=4.5V, I D=200mA  
VGS=10V, I D=500mA  
VDS=60V, VGS=0V  
60  
-
-
-
-
-
-
-
-
2.5  
4.0  
3.0  
1
V
V
Gate Threshold Voltage  
1
Drain-Source On-State  
Resistance  
-
Ω
Drain-Source On-State  
Resistance  
-
Zero Gate Voltage Drain  
Current  
-
-
uA  
uA  
Gate Body Leakage  
Forward Transconductance  
Dynamic  
IGSS  
VGS=+20V, VDS=0V  
VDS=15V, ID=250mA  
+10  
-
gfS  
100  
mS  
VDS=15V, ID=200mA  
VGS=4.5V  
Total Gate Charge  
Qg  
-
-
0.8  
nC  
ns  
Turn-On Delay Time  
Turn-Off Delay Time  
Input Capacitance  
Output Capacitance  
ton  
toff  
-
-
-
-
-
-
-
-
-
-
20  
40  
35  
10  
5
VDD=30V , RL=150Ω  
ID=200mA , VGEN=10V  
RG=10Ω  
Ciss  
Coss  
Crss  
VDS=25V, VGS=0V  
f=1.0MHZ  
pF  
Reverse Transfer  
Capacitance  
Source-Drain Diode  
Diode Forward Voltage  
VSD  
Is  
IS=200mA , VGS=0V  
-
-
-
0.82  
1.3  
115  
800  
V
Continuous Diode Forward  
Current  
-
-
-
-
mA  
mA  
Pulsed Diode Forward  
Current  
IsM  
V
DD  
V
DD  
Switching  
Gate Charge  
Test Circuit  
Test Circuit  
RL  
RL  
V
IN  
V
GS  
V
OUT  
1mA  
RG  
RG  
May 21.2010-REV.01  
PAGE . 2  
2N7002KDW  
Typical CChhaarraacctteerriissttiiccss Curves (TA=25OC,unless otherwise noted)  
1.2  
1
1.2  
V
DS=10V  
= 10V ~ 6.0V  
GS
5.0V  
1
0.8  
0.6  
0.4  
0.2  
0
4.0V  
0.8  
0.6  
0.4  
0.2  
0
4.0V  
T
J
=25  
3.0V  
3.0V  
0
1
2
3
4
5
6
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)  
VDS - Drain-to-Source Voltage (V)  
FIG.1-Output
Characteristic  
FIG.2- Transfer Characteristic  
5
4
3
2
1
0
5
4
3
2
1
0
VGS = 4.5V  
ID =500mA  
ID=200mA  
V
GS=10V  
2
3
4
5
6
7
8
9
10  
0
0.2  
0.4  
0.6  
0.8  
1
VGS - Gate-to-Source Voltage (V)  
ID - Drain Current (A)  
FIG.3- On Resistance vs Drain Current  
FIG.4- On Resistance vs Gate to Source Voltage  
1.8  
VGS =10V  
ID =500mA  
1.6  
1.4  
1.2  
1
0.8  
0.6  
-50 -25  
0
25  
50  
75 100 125 150  
TJ - Junction Temperature (oC)  
FIG.5- On Resistance vs Junction Temperature  
May 21.2010-REV.01  
PAGE . 3  
2N7002KDW  
10  
8
V
DS=10V  
Vgs  
I
D
=250mA  
Qg  
6
4
2
Qsw  
Vgs(th)  
Qg(th)  
0
0
0.2  
0.4  
0.6  
0.8  
1
Qg - Gate Charge (nC)  
Qgs  
Qgd  
Qg  
Fig.6 - Gate Charge Waveform  
Fig.7 - Gate Charge  
1.2  
88  
ID =250mA  
ID = 250uA  
86  
84  
82  
80  
78  
76  
74  
72  
1.1  
1
0.9  
0.8  
0.7  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TJ - Junction Temperature (oC)  
TJ - Junction Temperature (oC)  
Fig.8 - Threshold Voltage vs Temperature  
Fig.9 - Breakdown Voltage vs Junction Temperature  
10  
V
GS=0V  
1
25  
0.1  
T
J
=125  
-55℃  
0.01  
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
VSD - Source-to-Drain Voltage (V)  
Fig.10 - Source-Drain Diode Forward Voltage  
May 21.2010-REV.01  
PAGE . 4  
2N7002KDW  
MOUNTING PAD LAYOUT  
ORDER INFORMATION  
• Packing information  
T/R - 10K per 13" plastic Reel  
T/R - 3K per 7” plastic Reel  
LEGAL STATEMENT  
Copyright PanJit International, Inc 2010  
The information presented in this document is believed to be accurate and reliable. The specifications and information herein  
are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit  
does not convey any license under its patent rights or rights of others.  
May 21.2010-REV.01  
PAGE . 5  

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