DSA300100L [PANASONIC]
Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SSSMINI3-F2-B, SC-105AA, 3 PIN;
| 型号： | DSA300100L |
| 厂家： | 
PANASONIC |
| 描述： | Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SSSMINI3-F2-B, SC-105AA, 3 PIN 放大器 光电二极管 晶体管 |
| 文件： | 总4页 (文件大小：771K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSA3001
Silicon PNP epitaxial planar type
Unit: mm
For general amplification
Complementary to DSC3001
DSA9001 in SSSMini3 type package
Features
High forward current transfer ratio hFE with excellent linearity
Low collector-emitter saturation voltage VCE(sat)
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
Marking Symbol: A1
Packaging
1: Base
DSA300100L Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard)
2: Emitter
3: Collector
Panasonic
JEITA
Absolute Maximum Ratings Ta = 25°C
SSSMini3-F2-B
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector current
Symbol
VCBO
VCEO
VEBO
IC
Rating
–60
Unit
V
SC-105AA
SOT-723
Code
–50
V
–7
V
–100
mA
mA
mW
°C
Peak collector current
ICP
–200
Collector power dissipation
Junction temperature
PC
100
Tj
150
Operating ambient temperature
Storage temperature
Topr
–40 to +85
–55 to +150
°C
T
stg
°C
Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
–60
–50
–7
Typ
Max
Unit
V
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector-base cutoff current (Emitter open)
Collector-emitter cutoff current (Base open)
Forward current transfer ratio
VCBO IC = –10 mA, IE = 0
VCEO IC = –2 mA, IB = 0
VEBO IE = –10 mA, IC = 0
V
V
ICBO
ICEO
hFE
VCB = –20 V, IE = 0
VCE = –10 V, IB = 0
VCE = –10 V, IC = –2 mA
– 0.1
–100
460
mA
mA
210
Collector-emitter saturation voltage
Transition frequency
VCE(sat) IC = –100 mA, IB = –10 mA
– 0.2
150
– 0.5
V
fT
VCE = –10 V, IC = –2 mA
MHz
Collector output capacitance
Cob
VCB = –10 V, IE = 0, f = 1 MHz
2
pF
(Common base, input open circuited)
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: March 2014
Ver. EED
1
DSA3001
PC T
IC VCE
hFE IC
a
−120
−100
−80
−60
−40
−20
0
600
500
400
300
200
100
0
125
100
Ta = 25°C
V
CE = −10 V
I
B = −600 µA
−500 µA
−400 µA
Ta = 85°C
75
50
−300 µA
−200 µA
25°C
−40°C
25
−100 µA
0
0
0
−2
−4
−6
−8 −10 −12
− 0.1
−1
−10
−100
40
80
120
160
(
200
Collector-emitter voltage VCE (V)
)
Collector current IC (mA)
Ambient temperature Ta °C
VCE(sat) IC
IC VBE
Cob VCB
−120
−100
−80
−60
−40
−20
0
−10
−1
IC / IB = 10
IE = 0
V
CE = −10 V
f = 1 MHz
4.0
3.0
2.0
1.0
0
25°C
Ta = 25°C
Ta = 85°C
−40°C
− 0.1
Ta = 85°C
25°C
−40°C
− 0.01
− 0.1
0
− 0.2 − 0.4 − 0.6 − 0.8 −1.0 −1.2
−1
−10
−100
−1
−10
−100
Base-emitter voltage VBE (V)
Collector current IC (mA)
Collector-base voltage VCB (V)
fT IC
250
200
150
100
50
VCE = −10 V
T
a = 25°C
0
− 0.1
−1
−10
−100
Collector current IC (mA)
Ver. EED
2
DSA3001
Unit: mm
SSSMini3-F2-B
Land Pattern (Reference) (Unit: mm)
Ver. EED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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