DMC562050R [PANASONIC]

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SMINI5-F3-B, SC-113CB, 5 PIN;
DMC562050R
型号: DMC562050R
厂家: PANASONIC    PANASONIC
描述:

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SMINI5-F3-B, SC-113CB, 5 PIN

开关 光电二极管 晶体管
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中文:  中文翻译
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DMC56205  
Silicon NPN epitaxial planar type  
For digital circuits  
Unit: mm  
Features  
High forward current transfer ratio hFE with excellent linearity  
Low collector-emitter saturation voltage VCE(sat)  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  
Marking Symbol: K3  
Basic Part Number  
Dual DRC2114T (Common base)  
1: Emitter (Tr1)  
2: Base (Common)  
3: Emitter (Tr2)  
Panasonic  
4: Collector (Tr2)  
5: Collector (Tr1)  
Packaging  
DMC562050R Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
SMini5-F3-B  
SC-113CB  
SOT-353  
JEITA  
Absolute Maximum Ratings Ta = 25°C  
Code  
Parameter  
Symbol  
VCBO  
VCEO  
IC  
Rating  
50  
Unit  
V
(C1)  
5
(C2)  
4
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector current  
Tr1  
Tr2  
50  
V
100  
mA  
mW  
°C  
Tr1  
Tr2  
R1 R1  
Total power dissipation  
PT  
150  
Junction temperature  
Tj  
150  
1
2
3
Overall  
(E1) (B1) (E2)  
Operating ambient temperature  
Storage temperature  
Topr  
–40 to +85  
–55 to +150  
°C  
Resistance value  
R1  
10  
kΩ  
T
stg  
°C  
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Symbol  
Conditions  
Min  
50  
Typ  
Max  
Unit  
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
VCBO IC = 10 µA, IE = 0  
VCEO IC = 2 mA, IB = 0  
V
V
50  
ICBO  
ICEO  
IEBO  
hFE  
VCB = 50 V, IE = 0  
VCE = 50 V, IB = 0  
VEB = 6 V, IC = 0  
0.1  
0.5  
µA  
µA  
mA  
0.01  
460  
VCE = 10 V, IC = 5 mA  
160  
hFE  
(Small/Large)  
1
h
FE ratio *  
VCE = 10 V, IC = 5 mA  
0.50  
0.99  
10  
Collector-emitter saturation voltage  
Input voltage (ON)  
VCE(sat) IC = 10 mA, IB = 0.5 mA  
VI(on) VCE = 0.2 V, IC = 5 mA  
0.25  
0.4  
V
V
1.2  
Input voltage (OFF)  
VI(off) VCE = 5 V, IC = 100 µA  
R1  
V
Input resistance  
–30%  
+30%  
kΩ  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. 1: Ratio between 2 elements  
*
Publication date: October 2013  
Ver. DED  
1
DMC56205  
PT T  
IC VCE  
hFE IC  
a
250  
200  
120  
100  
80  
60  
40  
20  
0
500  
400  
300  
200  
V
CE = 10 V  
Ta = 25°C  
I
B = 500 µA  
450 µA  
Ta = 85°C  
400 µA  
350 µA  
300 µA  
250 µA  
200 µA  
150  
100  
25°C  
40°C  
150 µA  
100 µA  
50 µA  
50  
100  
0
0
0
40  
80  
120  
160  
200  
0
2
4
6
8
10  
12  
0.1  
1
10  
100  
(
)
Ambient temperature Ta °C  
Collector-emitter voltage VCE (V)  
Collector current IC (mA)  
VCE(sat) IC  
IO VIN  
VIN IO  
10  
1
10  
1
100  
10  
IC / IB = 20  
V
O = 5 V  
V
O = 0.2 V  
Ta = 85°C  
25°C  
101  
102  
103  
Ta = −40°C  
25°C  
1
0.1  
Ta = 85°C  
40°C  
85°C  
40°C  
25°C  
0.1  
0.01  
0
0.2  
0.4 0.6  
0.8 1.0  
1.2  
0.1  
1
10  
100  
0.1  
1
10  
100  
Output current IO (mA)  
(V)  
Collector current IC (mA)  
Input voltage VIN  
Ver. DED  
2
DMC56205  
Unit: mm  
SMini5-F3-B  
Land Pattern (Reference) (Unit: mm)  
Ver. DED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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