DMC564030R [PANASONIC]

DMC56403 Silicon NPN epitaxial planar type; DMC56403 NPN硅外延平面型
DMC564030R
型号: DMC564030R
厂家: PANASONIC    PANASONIC
描述:

DMC56403 Silicon NPN epitaxial planar type
DMC56403 NPN硅外延平面型

晶体 晶体管 开关 光电二极管
文件: 总4页 (文件大小:346K)
中文:  中文翻译
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DMC56403  
Silicon NPN epitaxial planar type  
Unit: mm  
For digital circuits  
DMC26403 in SMini6 type package  
Features  
Low collector-emitter saturation voltage VCE(sat)  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  
Marking Symbol: H1  
Basic Part Number  
Dual DRC2144E (Individual)  
1: Emitter (Tr1)  
2: Base (Tr1)  
3: Collector (Tr2)  
Panasonic  
4: Emitter (Tr2)  
5: Base (Tr2)  
6: Collector (Tr1)  
SMini6-F3-B  
SC-113DB  
Packaging  
DMC564030R Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
JEITA  
Absolute Maximum Ratings T = 25°C  
Code  
SOT-363  
a
Parameter  
Symbol  
VCBO  
VCEO  
IC  
Rating  
50  
Unit  
V
(C1) (B2) (E2)  
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector current  
6
5
4
Tr1  
Tr2  
50  
V
R1  
R2  
Tr1  
100  
mA  
mW  
°C  
Tr2  
R1  
R2  
Total power dissipation  
PT  
150  
Overall Junction temperature  
Storage temperature  
Tj  
150  
1
2
3
(E1) (B1) (C2)  
T
stg  
–55 to +150  
°C  
R1  
47  
47  
kΩ  
kΩ  
Resistance value  
R2  
Electrical Characteristics T = 25°C±3°C  
a
Parameter  
Symbol  
Conditions  
Min  
50  
Typ  
Max  
Unit  
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
Collector-emitter saturation voltage  
Input voltage (ON)  
VCBO IC = 10 µA, IE = 0  
VCEO IC = 2 mA, IB = 0  
V
V
50  
ICBO  
ICEO  
IEBO  
hFE  
VCB = 50 V, IE = 0  
VCE = 50 V, IB = 0  
VEB = 6 V, IC = 0  
0.1  
0.5  
0.1  
µA  
µA  
mA  
V
VCE = 10 V, IC = 5 mA  
80  
VCE(sat) IC = 10 mA, IB = 0.5 mA  
VIN(on) VCE = 0.2 V, IC = 5 mA  
VIN(off) VCE = 5 V, IC = 100 µA  
R1  
0.25  
0.8  
3.6  
V
Input voltage (OFF)  
V
Input resistance  
–30%  
0.8  
47  
+30%  
1.2  
kΩ  
Resistance ratio  
R1 / R2  
1.0  
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
Publication date: January 2013  
Ver. EED  
1
DMC56403  
PT T  
IC VCE  
hFE IC  
a
250  
200  
120  
100  
80  
60  
40  
20  
0
350  
Ta = 85°C  
V
CE = 10 V  
Ta = 25°C  
I
B = 500 µA  
25°C  
450 µA  
400 µA  
300  
250  
200  
150  
100  
50  
30°C  
350 µA  
300 µA  
250 µA  
150  
100  
200 µA  
150 µA  
100 µA  
50  
50 µA  
0
0
0
40  
80  
120  
160  
200  
0
2
4
6
8
10  
12  
0.1  
1
10  
100  
(
)
Ambient temperature Ta °C  
Collector-emitter voltage VCE (V)  
Collector current IC (mA)  
VCE(sat) IC  
IO VIN  
VIN IO  
10  
1
10  
1
100  
10  
IC / IB = 20  
V
O = 5 V  
V
O = 0.2 V  
Ta = 85°C  
25°C  
Ta = −30°C  
101  
102  
103  
25°C  
85°C  
30°C  
1
0.1  
Ta = 85°C  
30°C  
25°C  
0.1  
0.01  
0
0.5  
1.0  
1.5  
2.0  
0.1  
1
10  
100  
0.1  
1
10  
100  
Output current IO (mA)  
(V)  
Collector current IC (mA)  
Input voltage VIN  
Ver. EED  
2
DMC56403  
Unit: mm  
SMini6-F3-B  
Land Pattern (Reference) (Unit: mm)  
Ver. EED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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