AXK734145V [PANASONIC]
Board Stacking Connector, 34 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket;型号: | AXK734145V |
厂家: | PANASONIC |
描述: | Board Stacking Connector, 34 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket 连接器 |
文件: | 总3页 (文件大小:536K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AXK(7/8)
NARROW PITCH
NARROW-PITCH
CONNECTORS
FOR PC BOARDS
(0.4mm) CONNECTORS
P4 SERIES
2. High impact-resistant construction.
1) Adoption of bellows-type contacts
structure.
2) Guides are provided to take up any
position shift and facilitate insertion.
The roll surfaces are in contact
with each other, providing high
contact reliability.
Insertion guide
Since the contact is formed by
bending thin plate, it has a spring-
like quality. This construction
helps make it resistant to dropping
and twisting.
2) It is constructed with impact dispersion
keys inside the body to disperse shocks
when dropped.
3) The connector has a simple lock
mechanism.
Impact dispersion Key
Socket
Header side
contact
Socket and
header are
mated
Socket
Header
Socket side
contact
Simple lock
mechanism
Ideal for FPC-to-PCB connections
Header
FPC
Reinforcing plate
0.3mm
Before
mating
Narrow-pitch
connectors
P4
4. Design makes efficient mounting.
Features a terminal flatness of 0.08 mm,
construction resistant to creeping flux,
and design that facilitates visual inspec-
tion of the soldered part.
A high level of shock resistance is
ensured by dispersing impact over the
four locations where the socket indenta-
tions and header protrusions are mated
together.
PCB
After
mating
1.8mm
The simple lock
A stacking height of 1.8mm including
the FPC area has been achieved.
This enables the number of pins to
be doubled white the size remains
the same as that for existing FPC
connectors. This, in turn, contributes
to making products and equipment
more compact.
mechanism ensures
that the connector
clicks into position
when it is inserted for
reliable single-action
insertion on the PCB.
3. Construction makes designing
devices easier.
1) The lower connector surface construc-
tion prevents contact and shorts between
the PCB and metal terminals. This
enables freedom in pattern wiring, help-
ing to make PCB’s smaller.
APPLICATIONS
• Cellular phones
• DVC
• Compact portable devices
FEATURES
<Socket>
<Header>
1. A 0.4 mm pitch and stacking height
of 1.5 mm allow for extra compactness
and helps design lighter, thinner,
shorter, and smaller devices.
Connector bottom: Create any thru-hole pattern wiring.
PRODUCT TYPES
Part No.
Packing
Stacking height
No. of contacts
Socket
Header
Inner carton (1-reel)
Outer carton
Note 1)
20
24
26
30
34
40
50
60
70
80
100
AXK720145
AXK724145
AXK726145
AXK730145
AXK734145
AXK740145
AXK750145
AXK760145
AXK770145
AXK780145
AXK700145
AXK820145Y
AXK824145Y
AXK826145Y
AXK830145Y
AXK834145Y
AXK840145Y
AXK850145Y
AXK860145Y
AXK870145Y
AXK880145Y
AXK800145Y
Note 1)
“Asterisk” mark on end of part No.; “Asterisk” mark on end of part No.;
1.5 mm
J: 3,000 pieces
V: 3,000 pieces
J: 6,000 pieces
V: 15,000 pieces
Notes) 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting confirmation: Please consult us. (See “Regarding sample
orders to confirm proper mounting” on page 9.) Samples: Small lot orders are possible.
2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production. For this type of connector, 8th
digit of the part no. changes from 4 to 3. e.g. Stacking height 1.5mm 20 contacts for sockets: AXK720135J
3. Connectors with holding metal are available for on-demand production.
13
AXK(7/8)
SPECIFICATIONS
1. Characteristics
Item
Specifications
0.3A/contact (Max. 5 A at total contacts)
60V AC/DC
Conditions
Rated current
Rated voltage
Electrical
characteristics
Breakdown voltage
Insulation resistance
150V AC for 1 minute
Detection current: 1mA
Min. 1,000MΩ (initial)
Using 250V DC megger (applied for 1 min.)
Measured based on the HP4338B measurement method
of JIS C 5402
Contact resistance
Max. 70mΩ
Composite insertion force
Composite removal force
Max. 0.981N {100gf}/contacts × contacts (initial)
Min. 0.0588N {6gf}/contacts × contacts
Mechanical
characteristics
Measures the maximum load in the post axial direction
until removal
Post holding force
Min. 0.981N {100gf}/contact
Ambient temperature
–55°C to +85°C
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
Max. peak temperature of 245°C
300°C within 5 seconds
Soldering heat resistance
Sequence Temperature (°C) Time (minutes)
+0
1
2
3
4
–55
25
85
25
30
Max. 5
30
−3
Thermal shock resistance
(header and socket mated)
5 cycles, insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
+10
−5
+3
−0
+10
−5
Environmental
characteristics
Max. 5
Humidity resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
Bath temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
Bath temperature 35±2°C, saltwarter concentration 5±1%
H2S resistance
(header and socket mated)
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
48 hours, contact resistance max. 70mΩ
Repeated insertion and removal speed of max. 200 times/
hours
Insertion and removal life
50 times
Stacking height 1.5mm, 20 contacts; Socket: 0.04g
Header: 0.02g
Unit weight
2. Material and surface treatment
Part name
Material
Surface treatment
—
Molded portion
Heat-resistant resin (UL94V-0), Black
Contact portion: Au plating over Ni
Terminal portion: Au plating over Ni (Except for thick of terminal)
Contact/Post
Copper alloy
mm General tolerance ±0.2
DIMENSIONS
• Socket (stacking height: 1.5mm)
A
0.08
B±0.1
Dimension table (mm)
0.40±0.05
0.40±0.05
0.15±0.03
No. of
A
B
1.50
contacts
20
6.3
7.1
3.6
4.4
24
26
7.5
4.8
30
8.3
5.6
34
9.1
6.4
0.10±0.03
40
10.3
12.3
14.3
16.3
18.3
22.3
7.6
50
9.6
60
11.6
13.6
15.6
19.6
70
80
100
• Header (stacking height: 1.5mm)
Dimension table (mm)
A
0.08
No. of
contacts
B±0.1
A
B
0.40±0.05
0.40±0.05
0.15±0.03
20
5.1
5.9
3.6
4.4
1.31
24
26
6.3
4.8
30
7.1
5.6
34
7.9
6.4
40
9.1
7.6
0.10±0.03
50
11.1
13.1
15.1
17.1
21.1
9.6
60
11.6
13.6
15.6
19.6
70
80
100
14
AXK(7/8)
• Socket and header are mated
Stacking height 1.5 mm
EMBOSSED TAPE DIMENSIONS
Please refer to page 56.
• Socket
• Header
NOTES
1. As shown below, excess force dur-
ing insertion may result in damage to
the connector or removal of the solder.
Please be careful. Also, to prevent
connector damage plese confirm the
correct position before mating con-
nectors.
Recommended PC board pattern
(TOP VIEW)
Recommended PC board pattern
(TOP VIEW)
0.40±0.05
0.23±0.03
0.40±0.05
0.40±0.05
0.40±0.05
0.23±0.03
0.115±0.05
0.40±0.05
0.115±0.05
0.40±0.05
B±0.05
B±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 40%)
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 32%)
±0.01
0.40
±0.01
0.35
±0.01
0.40
±0.01
0.20
±0.01
±0.01
0.35
0.10
0.10
±0.01
0.20
±0.01
Max. 0.03mm
Max. 0.03mm
3. PC Boards and Recommended
Metal Mask Patterns
Connectors are mounted with high den-
sity, with a pitch interval of 0.4 to 0.5 mm.
It is therefore necessary to make sure
that the right levels of solder are used, in
order to reduce solder bridge and other
issues.The figures to the right are recom-
mended metal mask patterns. Please use
them as a reference.
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 50%)
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 40%)
±0.01
0.40
±0.01
0.35
±0.01
±0.01
0.40
0.20
±0.01
±0.01
0.35
0.10
0.10
±0.01
0.20
±0.01
* See the dimension table on page 14 for more information on the B dimension of the socket and header.
Regarding general notes, please
refer to pages 8 and 9.
12/1/2002
All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
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