AXK734227G [PANASONIC]

Card Edge Connector,;


型号：	AXK734227G
厂家：	PANASONIC
描述：	Card Edge Connector, PC 连接器
文件：	总11页 (文件大小：1384K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

For board-to-board For board-to-FPC

Narrow pitch connectors

(0.4mm pitch)

Mated heights of 1.5 to 3.5 mm supported with “TOUGH CONTACT”

construction to withstand of tough environments.

FEATURES

1. Mated heights of 1.5 to 3.5 mm is available

2. “TOUGH CONTACT” construction provides high

resistance to various environment.

3. Pattern wiring is possible on PC board of the connector

undersurface

APPLICATIONS

Mobile devices and industrial equipment

Socket

Header

5.1mm

3.96mm

DETAILED FEATURES

Construction makes designing devices easier.

The lower connector bottom surface construction prevents

contact and shorts between the PC board and metal terminals.

This ﬂexibility of pattern wiring is helping to make PC board’s

smaller.

Constructed with impact dispersion keys inside the body to

disperse shocks when dropped

A high level of shock resistance is ensured by dispersing impact

over the four locations where the socket indentations and header

protrusions are mated together.

Note: Pins 18 or less are not supported due to suction surface considerations.

Socket

Impact dispersion key

Insulation area

Connector bottom: Create any thru-hole and pattern wiring.

Header

Contributes to improved mating

1) Mating insertion guide

2) Simple lock construction

Guides are provided to take up any position shift and facilitate

insertion.

Simple lock construction provides tactile feedback to ensure

excellent mating/unmating operation feel.

Header side

post

Insertion guide

Simple lock

construction

Socket side

contact

ACCTB110E 201809-T

–1–

Narrow pitch connectors P4 (0.4mm pitch)

ORDERING INFORMATION

AXK

W G

Number of pins

(2 digits)

4: (Fixed)

(Header)

W: (Fixed)

Package

G: Includes 3,000 pieces embossed tape and

plastic reel packaging×includes 2 reels (Note 1)

7: Socket

8: Header

Mated height

Surface treatment (Contact portion / Terminal portion)

(Socket)

ꢀ: For mated height ꢀ.5 mm

2: For mated height 2.0 mm

7: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating

(Header)

5: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating

3: For mated height 2.5 and 3.0 mm

4: For mated height 3.5 mm

(Header)

ꢀ: For mated height ꢀ.5, 2.0 and 2.5 mm

2: For mated height 3.0 and 3.5 mm

Note: ꢀ. Only a socket of mated height 3ꢁ5 mm: 2ꢂ000 pieces embossed tape and plastic reel packaging×2 reels

PRODUCT TYPES

Part number

Packing

Inner carton (1-reel)

Mated height

Number of pins

Socket

Header

Outer carton

100

AXK714147G

AXK720147G

AXK724147G

AXK726147G

AXK730147G

AXK740147G

AXK750147G

AXK760147G

AXK770147G

AXK780147G

AXK700147G

AXK714247G

AXK720247G

AXK724247G

AXK726247G

AXK730247G

AXK740247G

AXK750247G

AXK760247G

AXK770247G

AXK780247G

AXK714347G

AXK720347G

AXK724347G

AXK730347G

AXK740347G

AXK750347G

AXK760347G

AXK770347G

AXK780347G

AXK814145WG

AXK820145WG

AXK824145WG

AXK826145WG

AXK830145WG

AXK840145WG

AXK850145WG

AXK860145WG

AXK870145WG

AXK880145WG

AXK800145WG

AXK814145WG

AXK820145WG

AXK824145WG

AXK826145WG

AXK830145WG

AXK840145WG

AXK850145WG

AXK860145WG

AXK870145WG

AXK880145WG

AXK814145WG

AXK820145WG

AXK824145WG

AXK830145WG

AXK840145WG

AXK850145WG

AXK860145WG

AXK870145WG

AXK880145WG

1.5 mm

3,000 pieces

6,000 pieces

2.0 mm

2.5 mm

Note: Order unit: For volume production: outer carton units. For samples, please contact our sales ofﬁce.

ACCTB110E 201809-T

–2–

Narrow pitch connectors P4 (0.4mm pitch)

Part number

Packing

Mated height

3.0 mm

Number of pins

Socket

Header

Inner carton (1-reel)

Outer carton

6,000 pieces

AXK720347G

AXK724347G

AXK730347G

AXK740347G

AXK750347G

AXK760347G

AXK780347G

AXK720447G

AXK730447G

AXK740447G

AXK820245WG

AXK824245WG

AXK830245WG

AXK840245WG

AXK850245WG

AXK860245WG

AXK880245WG

AXK820245WG

AXK830245WG

AXK840245WG

3,000 pieces

Socket: 2,000 pieces

Header: 3,000 pieces

Socket: 4,000 pieces

Header: 6,000 pieces

3.5 mm

Note: Order unit: For volume production: outer carton units. For samples, please contact our sales ofﬁce.

SPECIFICATIONS

1. Characteristics

Item

Speciﬁcations

0.3A/pin contact (Max. 5 A at total pin contacts)

60V AC/DC

Conditions

Rated current

Rated voltage

Rated voltage is applied for one minute and check for short

circuit or damage with a detection current of 1mA.

Electrical

characteristics

Dielectric strength

150V AC for 1 min.

Insulation resistance

Contact resistance

Min. 1,000MΩ (initial)

Using 250V DC megger (applied for 1 min.)

Based on the contact resistance measurement method

speciﬁed by JIS C 5402.

Max. 70mΩ

Composite insertion force

Max. 0.981N/pin contact × pin contacts (initial)

Min. 0.0588N/pin contact × pin contacts

(Mated height 1.5 mm)

Min. 0.118N/pin contact × pin contacts

(Mated height 2.5 mm D 3.5 mm)

Mechanical

characteristics

Composite removal force

Ambient temperature

–55 to +85°C

No icing. No condensation.

Reﬂow soldering:

Peak temperature: 260°C or less

(on the surface of the PC board around the connector

terminals)

The initial speciﬁcation must be satisﬁed electrically

and mechanically.

Soldering heat resistance

Storage temperature

Soldering iron: 300°C within 5 sec. 350°C within 3 sec.

–55 to +85°C (product only)

–40 to +50°C (emboss packing)

No icing. No condensation.

Conformed to MIL-STD-202F, method 107G

Order Temperature (°C) Time (minutes)

–55₋₃

Max. 5

5 cycles,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Environmental

characteristics

Thermal shock resistance

(header and socket mated)

85⁺³

Max. 5

–55₋₃

120 hours,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Humidity resistance

(header and socket mated)

Conformed to IEC60068-2-78

Temperature 40 2°C, humidity 90 to 95% R.H.

24 hours,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Saltwater spray resistance

(header and socket mated)

Conformed to IEC60068-2-11

Temperature 35 2°C, saltwater concentration 5 1%

H2S resistance

(header and socket mated)

48 hours,

contact resistance max. 70mΩ

Temperature 40 2°C, gas concentration 3 1 ppm,

humidity 75 to 80% R.H.

Lifetime

characteristics

Repeated insertion and removal speed of max. 200 times/

hours

Insertion and removal life

50 times

Mated height 1.5mm

20 pins Socket: 0.04g Header: 0.02g

Unit weight

2. Material and surface treatment

Part name

Material

Surface treatment

—

Molded portion

LCP resin (UL94V-0)

Contact portion: Base: Ni plating, Surface: Au plating

Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)

The terminals of Ni barrier production socket close to the portion to be soldered have nickel

barriers (exposed nickel portions).

Contact and Post

Copper alloy

ACCTB110E 201809-T

–3–

Narrow pitch connectors P4 (0.4mm pitch)

The CAD data of the products with a “CAD” mark can be downloaded from our Website.

DIMENSIONS (Unit: mm)

Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

Dimension table

Dimensions

External dimensions

Terminal coplanarity

0ꢁ08

Number

of pins

B±0ꢁꢀ

0ꢁ40±0ꢁ0ꢂ

0ꢁꢀꢂ±0ꢁ0ꢃ

100

5.10

6.30

2.40

3.60

4.40

4.80

5.60

7.60

9.60

–

2.80

–

1.60

2.40

2.80

3.60

5.60

7.60

9.60

7.10

–

7.50

–

8.30

–

10.30

12.30

–

0ꢁ80

14.30 11.60

–

16.30 13.60 11.60

18.30 15.60 13.60

22.30 19.60 17.60

–

Dimensions

Mated height

Max. 18 pins

1.5mm

2.0mm

1.50

1.92

2.42

2.92

2.5mm, 3.0mm

3.5mm

General tolerance: ±0ꢀ2

Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

Dimension table

Dimensions

External dimensions

Terminal coplanarity

0ꢁ08

Number

of pins

B±0ꢁꢀ

0ꢁ40±0ꢁ0ꢂ

0ꢁꢀꢂ±0ꢁ0ꢃ

100

3.90

5.10

5.90

6.30

7.10

9.10

11.10

2.40

3.60

4.40

4.80

5.60

7.60

9.60

–

3.04

–

1.60

2.40

2.80

3.60

5.60

7.60

9.60

–

0ꢁ7ꢅ

–

0ꢁꢀ0±0ꢁ0ꢃ

13.10 11.60

–

15.10 13.60 11.60

17.10 15.60 13.60

21.10 19.60 17.60

–

Max. 18 pins

Dimensions

Mated height

1.5mm, 2.0mm, 2.5mm

3.0mm, 3.5mm

1.31

2.26

1.20

1.26

General tolerance: ±0ꢀ2

Socket and Header are mated

ACCTB110E 201809-T

–4–

Narrow pitch connectors P4 (0.4mm pitch)

EMBOSSED TAPE DIMENSIONS (unit: mm)

Speciﬁcations for taping

Speciﬁcations for the plastic reel

In accordance with EIAJ ET-7200B.

In accordance with JIS C 0806-3:1999. However, not applied to

the mounting-hole pitch of some connectors.

Tape I

Tape Il

（A±0ꢁꢃ）

（B）

（A±0ꢁꢃ）

D±ꢀ

Label

（C）

（ꢀꢁ7ꢂ）

Top cover tape

（C）

（ꢀꢁ7ꢂ）

Embossed carrier tape

Embossed mounting-hole

Taping reel

+0.ꢀ

ꢀꢁꢂ

+0.ꢀ

ꢀꢁꢂ

Dimension table

Type/Mated height

Number of pins

Type of taping

Tape I

Quantity per reel

Common for socket and header

1.5 mm, 2.0 mm,

2.5 mm and 3.0 mm

Header

Max. 18

20 to 70

80 to 100

16.0

—

7.5

11.5

14.2

17.4

25.4

33.4

3,000

Tape I

24.0

32.0

—

Tape II

28.4

—

3.5 mm

Socket

3.5 mm

20 to 40

Tape I

24.0

11.5

25.4

2,000

Connector orientation with respect to embossed tape feeding direction

There is no indication on this product regarding top-bottom or left-right orientation.

Type

Common for P4

Direction

of tape progress

Socket

Header

ACCTB110E 201809-T

–5–

Narrow pitch connectors P4 (0.4mm pitch)

NOTES (Unit: mm)

As shown below, excess force during insertion may result

in damage to the connector or removal of the solder. Also,

to prevent connector damage please conﬁrm the correct

position before mating connectors.

Keep the PC board warp no more than 0.03 mm in relation

to the overall length of the connector.

Max. 0.0ꢃ mm

Design of PC board patterns

Conduct the recommended foot pattern design, in order to

preserve the mechanical strength of terminal solder areas.

Recommended PC board and metal mask patterns

Connectors are mounted with high pitch density, intervals of 0.35

mm, 0.4 mm or 0.5 mm. In order to reduce solder and ﬂux rise,

solder bridges and other issues make sure the proper levels of

solder is used.

The ﬁgures are recommended patterns. Please use them as a

reference.

Socket

Header

Recommended PC board pattern

(TOP VIEW)

0ꢁ40±0ꢁ0ꢂ

0ꢁ2ꢃ±0ꢁ0ꢃ

0.40±0.0ꢂ

0ꢁ40±0ꢁ0ꢂ

0ꢁꢀꢀꢂ±0ꢁ0ꢂ

0ꢁ40±0ꢁ0ꢂ

0ꢁꢀꢀꢂ±0ꢁ0ꢂ

0ꢁ40±0ꢁ0ꢂ

0ꢁ2ꢃ±0ꢁ0ꢃ

0.40±0.0ꢂ

Recommended metal mask pattern

Metal mask thickness: When 150μm

(Opening ratio: 40%)

Recommended metal mask pattern

Metal mask thickness: When 150μm

(Opening ratio: 32%)

0ꢁ40±0ꢁ0ꢀ

0ꢁ20±0ꢁ0ꢀ

0ꢁꢃꢂ±0ꢁ0ꢀ

0ꢁꢀ0±0ꢁ0ꢀ

0ꢁ40±0ꢁ0ꢀ

0ꢁ20±0ꢁ0ꢀ

0ꢁꢃꢂ±0ꢁ0ꢀ

0ꢁꢀ0±0ꢁ0ꢀ

Recommended metal mask pattern

Metal mask thickness: When 120μm

(Opening ratio: 50%)

Recommended metal mask pattern

Metal mask thickness: When 120μm

(Opening ratio: 40%)

0ꢁ40±0ꢁ0ꢀ

0ꢁ20±0ꢁ0ꢀ

0ꢁꢃꢂ±0ꢁ0ꢀ

0ꢁꢀ0±0ꢁ0ꢀ

0ꢁ40±0ꢁ0ꢀ

0ꢁ20±0ꢁ0ꢀ

0ꢁꢃꢂ±0ꢁ0ꢀ

0ꢁꢀ0±0ꢁ0ꢀ

Please refer to “the latest product speciﬁcations” when designing your product.

• Requests to customers:

https://industrial.panasonic.com/ac/e/salespolicies/

ACCTB110E 201809-T

–6–

Notes on Using Narrow pitch Connectors/High Current Connectors

For board-to-board/board-to-FPC

Notes on Using Narrow pitch Connectors/

High Current Connectors

About safety remarks

Observe the following safety remarks to prevent accidents and injuries.

1) Do not use these connectors beyond the speciﬁcation sheets.

The usage outside of speciﬁed rated current, dielectric strength,

and environmental conditions and so on may cause circuitry

damage via abnormal heating, smoke, and ﬁre.

2) In order to avoid accidents, your thorough speciﬁcation review

is appreciated. Please contact our sales ofﬁce if your usage is

out of the speciﬁcations. Otherwise, Panasonic Corporation

cannot guarantee the quality and reliability.

3) Panasonic Corporation is consistently striving to improve

quality and reliability. However, the fact remains that electrical

components and devices generally cause failures at a given

statistical probability. Furthermore, their durability varies with

use environments or use conditions. In this respect, please

check for actual electrical components and devices under actual

conditions before use. Continued usage in a state of degraded

condition may cause the deteriorated insulation, thus result in

abnormal heat, smoke or ﬁring. Please carry out safety design

and periodic maintenance including redundancy design, design

for ﬁre spread prevention, and design for malfunction prevention

so that no accidents resulting in injury or death, ﬁre accidents, or

social damage will be caused as a result of failure of the

products or ending life of the products.

Regarding the design of devices and PC board patterns

1) When using the board to board connectors, do not connect a

pair of board with multiple connectors. Otherwise, misaligned

connector positions may cause mating failure or product

breakage.

2) With mounting equipment, there may be up to a 0.2 to 0.3

mm error in positioning. Be sure to design PC boards and

patterns while taking into consideration the performance and

abilities of the required equipment.

3) Some connectors have tabs embossed on the body to aid in

positioning. When using these connectors, make sure that the

PC board is designed with positioning holes to match these tabs.

4) To ensure the required mechanical strength when soldering

the connector terminals, make sure the PC board meets

recommended PC board pattern design dimensions given.

5) PC board

Control the thicknesses of the cover lay and adhesive to prevent

poor soldering. This connector has no stand-off. Therefore,

minimize the thickness of the cover lay, etc. so as to prevent the

occurrence of poor soldering.

7) When mounting connectors on a FPC

• When the connector soldered to FPC is mated or unmated,

solder detachment may occur by the force to the terminals.

Connector handling is recommended in the condition when the

reinforcing plate is attached to the backside of FPC where the

connector is mounted. The external dimension of the reinforcing

plate is recommended to be larger than the dimension of

“Recommended PC board pattern” (extended dimension of one

side is approximately 0.5 to 1.0 mm). The materials and

thickness of the reinforcing plate are glass epoxy or polyimide

(thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm).

• As this connector has temporary locking structure, the

connector mating may be separated by the dropping impact

depend on the size, weight or bending force of the FPC. Please

consider the measures at usage to prevent the mating

separation.

8) The narrow pitch connector series is designed to be compact

and thin. Although ease of handling has been taken into

account, take care when mating the connectors, as

displacement or angled mating could damage or deform the

connector.

6) For all connectors of the narrow pitch series, to prevent the

PC board from coming off during vibrations or impacts, and to

prevent loads from falling directly on the soldered portions, be

sure to design some means to ﬁx the PC board in place.

Example) Secure in place with screws

Screw

↓

Connector

Spacer

PC board

When connecting PC boards, take appropriate measures to

prevent the connector from coming off.

ACCTB48E 201809-T

–7–

Notes on Using Narrow pitch Connectors/High Current Connectors

Regarding the selection of the connector placement machine and the mounting

procedures

1) Select the placement machine taking into consideration the

connector height, required positioning accuracy, and packaging

conditions.

2) Be aware that if the chucking force of the placement machine

is too great, it may deform the shape of the connector body or

connector terminals.

3) Be aware that during mounting, external forces may be

applied to the connector contact surfaces and terminals and

cause deformations.

5) The positioning bosses give an approximate alignment for

positioning on the PC board. For accurate positioning of the

connector when mounting it to the PC board, we recommend

using an automatic positioning machine.

6) In case of dry condition, please note the occurrence of static

electricity. The product may be adhered to the embossed carrier

tape or the cover tape in dry condition. Recommended humidity

is from 40 to 60%RH and please remove static electricity by

ionizer in manufacturing process.

4) Depending on the size of the connector being used, self

alignment may not be possible. In such cases, be sure to

carefully position the terminal with the PC board pattern.

Regarding soldering

Reﬂow soldering

1) Measure the recommended proﬁle temperature for reﬂow

soldering by placing a sensor on the PC board near the

connector surface or terminals. (Please refer to the speciﬁcation

for detail because the temperature setting differs by products.)

2) As for cream solder printing, screen printing is recommended.

3) When setting the screen opening area and PC board foot

pattern area, refer the recommended PC board pattern and

window size of metal mask on the speciﬁcation sheet, and make

sure that the size of board pattern and metal mask at the base of

the terminals are not increased.

7) Do not use resin-containing solder. Otherwise, the contacts

might be ﬁrmly ﬁxed.

8) Soldering conditions

Please use the reﬂow temperature proﬁle conditions

recommended below for reﬂow soldering. Please contact our

sales ofﬁce before using a temperature proﬁle other than that

described below (e.g. lead-free solder)

Temperature

Peak temperature

Peak temperature 260℃

230℃

220℃

200℃

Preheating

180℃

150℃

Upper limited

4) Please pay attentions not to provide too much solder. It

makes miss mating because of interference at soldering portion

when mating.

(Solder heat resistance)

25 sec.

70 sec.

Lower limited

60 to 120 sec.

(Solder wettability)

Time

Terminal

For products other than the ones above, please refer to the

AXK734227G [PANASONIC]

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