Q65110A2487 [OSRAM]
NPN-Silizium-Fototransistor im SMT SIDELED®-Gehause Silicon NPN Phototransistor in SMT SIDELED®-Package;
| 型号： | Q65110A2487 |
| 厂家： | 
OSRAM GMBH |
| 描述： | NPN-Silizium-Fototransistor im SMT SIDELED®-Gehause Silicon NPN Phototransistor in SMT SIDELED®-Package 静态存储器 光电 |
| 文件： | 总10页 (文件大小：203K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NPN-Silizium-Fototransistor im SMT SIDELED®-Gehäuse
Silicon NPN Phototransistor in SMT SIDELED®-Package
Lead (Pb) Free Product - RoHS Compliant
SFH 325
SFH 325 FA
SFH 325
SFH 325 FA
gemäß OS-PCN-2012-008-A/ according to OS-PCN-2012-008-A
Wesentliche Merkmale
Features
• Speziell geeignet für Anwendungen im Bereich
von 450 nm bis 1120 nm (SFH 325) und bei
750 nm bis 1120 nm (SFH 325 FA)
• Hohe Linearität
• Especially suitable for applications from
450 nm to 1120 nm (SFH 325) and from
750 nm to 1120 nm (SFH 325 FA)
• High linearity
• P-LCC-2 Gehäuse
• P-LCC-2 package
• Gruppiert lieferbar
• Available in groups
Anwendungen
Applications
• Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb
• Miniature photointerrupters
• Industrial electronics
• Industrieelektronik
• For control and drive circuits
• „Messen/Steuern/Regeln“
Typ
Bestellnummer
Fotostrom , (Ee=0,1mW/cm2,=950nm VCE = 5 V)
Type
Ordering Code
Photocurrent
Ipce (A)
SFH 3251)
Q65110A2486
Q65110A2488
Q65110A2491
Q65110A2484
Q65110A2487
Q65110A2482
> 16
SFH 325-31)
25-50
25-80
40-80
> 16
SFH 325-3/-41)
SFH 325-41)
SFH 325 FA1)
SFH 325 FA-31)
SFH 325 FA-3/-41) Q65110A2490
SFH 325 FA-41)
Q65110A2485
25-50
25-80
40-80
1)
Gruppierung erfolgt in Halbgruppen (siehe Seite 4), Verpackungseinheit = nur eine Halbgruppe / binning in half
groups (see page 4), packing unit = only one half group
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SFH 325, SFH 325 FA
Grenzwerte
Maximum Ratings
Bezeichnung
Symbol
Wert
Einheit
Parameter
Symbol
Value
Unit
Betriebs- und Lagertemperatur
Top; Tstg
– 40 … + 100
C
Operating and storage temperature range
Kollektor-Emitterspannung
VCE
35
V
Collector-emitter voltage
Kollektorstrom
Collector current
IC
15
mA
mA
mW
K/W
Kollektorspitzenstrom, 10s
Collector surge current
ICS
75
Verlustleistung, TA = 25 C
Total power dissipation
Ptot
165
450
Wärmewiderstand für Montage auf PC-Board
RthJA
Thermal resistance for mounting on pcb
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SFH 325, SFH 325 FA
Kennwerte (TA = 25 C, = 950 nm)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
SFH 325
SFH 325 FA
980
Wellenlänge der max. Fotoempfindlichkeit
Wavelength of max. sensitivity
S max
980
nm
Spektraler Bereich der Fotoempfindlichkeit
S = 10% von Smax
450 … 1120 750 … 1120 nm
Spectral range of sensitivity
S = 10% of Smax
Bestrahlungsempfindliche Fläche220m)
0.038
0.038
mm2
A
Radiant sensitive area
Abmessung der Chipfläche
Dimensions of chip area
L B
L W
0.45 0.45 0.45 0.45 mm mm
Halbwinkel
60
60
Grad
Half angle
deg.
Kapazität, VCE = 0 V, f = 1 MHz, E = 0
Capacitance
CCE
ICEO
5.0
5.0
pF
nA
Dunkelstrom
Dark current
1 (50)
1 (50)
VCE = 20 V, E = 0
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SFH 325, SFH 325 FA
Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern
gekennzeichnet.
The phototransistors are grouped according to their spectral sensitivity and distinguished by
arabian figures.
Bezeichnung
Symbol
Wert
Einheit
Parameter
Symbol
Value
Unit
-2A
-2B
-3A
-3B
-4A
-4B
Fotostrom, 950 nm
Photocurrent
IPCE min
16
25
20
32
25
40
32
50
40
63
50 A
80 A
Ee = 0.1 mW/cm2, VCE = 5 V
SFH 325:
IPCE max
Ev = 1000 Ix,
IPCE
360
450
570
720
900 1140 A
Normlicht/standard light A,
VCE = 5 V
Anstiegszeit/Abfallzeit
Rise and fall time
tr, tf
6
6
7
7
8
8
s
IC = 1 mA, VCC = 5 V, RL = 1 k
Kollektor-Emitter-Sättigungsspannung VCEsat
Collector-emitter saturation voltage
IC = IPCEmin1) 0.3,
150
150
150
150
150
150 mV
Ee = 0.1 mW/cm2
1)
I
PCEmin ist der minimale Fotostrom der jeweiligen Gruppe.
PCEmin is the min. photocurrent of the specified group.
1)
I
Directional Characteristics Srel = f ()
40
30
20
10
0
OHF01402
ϕ
1.0
50
0.8
0.6
0.4
60
70
0.2
0
80
90
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
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SFH 325, SFH 325 FA
Relative Spectral Sensitivity,
SFH 325 Srel = f ()
Relative Spectral Sensitivity,
SFH 325 FA Srel = f ()
Photocurrent
I
PCE = f (Ee), VCE = 5 V
OHF01924
10 3
OHF00468
OHF00207
100
100
μ
A
%
Ι PCE
Srel
Srel
%
80
70
60
50
40
30
20
10
80
10 2
10 1
10 0
10 -1
4
60
40
3
2
20
0
0
10 -3
10 -2
mW/cm 2
10 0
400 500 600 700 800 900 nm 1100
400 500 600 700 800 900 nm 1100
Ee
λ
λ
Total Power Dissipation
Photocurrent
Dark Current
P
tot = f (TA)
I
PCE = f (VCE), Ee = Parameter
I
CEO = f (VCE), E = 0
OHF00871
OHF01527
OHF01529
10 1
nA
10 0
mA
200
mW
1
cm2
Ι CEO
Ι PCE
mW
Ptot
mW
cm2
160
0.5
10 0
10 -1
10 -2
10 -3
mW
cm2
0.25
120
80
10 -1
mW
cm2
0.1
40
10 -2
0
0
0
5
10
15
20
25
30
V
35
0
5
10
15
20
25
30
V
35
20
40
60
80 ˚C 100
TA
VCE
VCE
Dark Current
Capacitance
CE = f (VCE), f = 1 MHz, E = 0
Photocurrent
o
I
CEO = f (TA), VCE = 5 V, E = 0
C
I
PCE/IPCE25 = f (TA), VCE = 5 V
OHF01524
OHF01530
OHF01528
10 3
nA
5.0
1.6
Ι PCE
Ι PCE25
Ι CEO
CCE
pF
1.4
1.2
4.0
3.5
3.0
2.5
2.0
1.5
1.0
10 2
10 1
10 0
1.0
0.8
0.6
0.4
0.2
0
0.5
0
10 -1
10 -2
10 -1
10 0
10 1
V
VCE
10 2
-25
0
25
50
75
C
100
-25
0
25
50
75
100
˚C
TA
TA
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SFH 325, SFH 325 FA
Maßzeichnung
Package Outlines
(2.4 (0.094))
(2.85 (0.112))
1.1 (0.043)
0.9 (0.035)
Emitter
2.54 (0.100)
spacing
Collector
(1.4 (0.055))
Collector marking
(R1)
4.2 (0.165)
3.8 (0.150)
GPLY6068
Maße in mm (inch) / Dimensions in mm (inch).
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SFH 325, SFH 325 FA
Empfohlenes Lötpaddesign
Recommended Solderpad Design
3.7 (0.146)
1.2 (0.047)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm2
Cu-area > 16 mm 2
Lötstopplack
Solder resist
OHLPY965
Maße in mm (inch) / Dimensions in mm (inch).
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SFH 325, SFH 325 FA
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020D.01)
(acc. to J-STD-020D.01)
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
Bleifreier Aufbau / Pb-Free Assembly (SnAgCu)
Profileigenschaften
Profile Feature
Empfehlung / Recommendation
Grenzwerte / Max. Ratings
Aufheizrate zum Vorwärmen*) /
2 K / s
3 K / s
Ramp-up rate to preheat*)
25 °C to 150 °C
150 °C to 200 °C
Zeit ts von TSmin bis TSmax /
Time ts from TSmin to TSmax
100 s
min. 60 s max. 120 s
3 K / s
Aufheizrate zur Spitzentemperatur*) /
2 K / s
Ramp-up rate to peak*)
180 °C to TP
Liquidustemperatur TL /
217 °C
Liquidus temperature TL
Zeit tL über TL / Time tL above TL
80 s
max. 100 s
Spitzentemperatur TP / Peak temperature TP
245 °C
20 s
max. 250 °C
Verweilzeit tP innerhalb des spezifizierten
min. 10 s max. 30 s
Spitzentemperaturbereichs TP - 5 K / Time tP within the
specified peak temperature range TP - 5 K
Abkühlrate*) / Ramp-down rate*)
TP to 100 °C
3 K / s
4 K / s maximum
max. 8 min.
Zeitspanne von 25 °C bis zur Spitzentemperatur /
Time from 25 °C to peak temperature
Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of
the package, measured on the top of the package
* Steigungsberechnung T/t: t max. 5 s; erfüllt über den gesamten Temperaturbereich / slope calculation T/t: t max. 5 s; fulfillment
for the whole T-range
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SFH 325, SFH 325 FA
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
10 s
Normalkurve
standard curve
250
200
150
100
50
T
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
1. Welle
1. wave
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
Zwangskühlung
forced cooling
2 K/s
0
0
50
100
150
200
s
250
t
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SFH 325, SFH 325 FA
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2013-01-16
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