LAM67B_18 [OSRAM]
Mini TOPLED;
OSRAM GMBH 
www.osram-os.com
LA M67B
Mini TOPLED®
Applications
— Cluster, Button Backlighting
— Electronic Equipment
— Interior Illumination e.g. Ambient Map
— White Goods
Features:
— Package: white SMT package, colorless clear resin
— Chip technology: InGaAlP
— Typ. Radiation: 120° (Lambertian emitter)
— Color: λdom = 617 nm (● amber)
— Corrosion Robustness Class: 3B
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
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LA M67B
Ordering Information
Type
Luminous Intensity 1)
Ordering Code
Q65110A2368
IF = 30 mA
Iv
LA M67B-T2V1-1
355 ... 900 mcd
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LA M67B
Maximum Ratings
Parameter
Symbol
Top
Values
Operating Temperature
Storage Temperature
Junction Temperature
min.
max.
-40 °C
100 °C
Tstg
min.
max.
-40 °C
100 °C
Tj
IF
max.
max.
125 °C
50 mA
Forward current
TS = 25 °C
Surge Current
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
Reverse voltage 2)
TS = 25 °C
IFS
max.
max.
100 mA
12 V
VR
ESD withstand voltage
VESD
2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
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LA M67B
Characteristics
IF = 30 mA; TS = 25 °C
Parameter
Symbol
Values
Peak Wavelength
Dominant Wavelength 3)
IF = 30 mA
λpeak
λdom
typ.
624 nm
min.
typ.
max.
612 nm
617 nm
624 nm
Spectral Bandwidth at 50% Irel,max
Viewing angle at 50 % IV
∆λ
typ.
typ.
18 nm
120 °
2
φ
Forward Voltage 4)
IF = 30 mA
VF
min.
typ.
max.
1.80 V
2.10 V
2.40 V
Reverse current 2)
VR = 12 V
IR
typ.
max.
0.01 µA
10 µA
Temperature Coefficient of Peak Wavelength
-10°C ≤ T ≤ 100°C
TCλpeak
TCλdom
TCVF
typ.
typ.
typ.
0.15 nm / K
0.07 nm / K
-3.7 mV / K
Temperature Coefficient of Dominant Wavelength
-10°C ≤ T ≤ 100°C
Temperature Coefficient of Forward Voltage
-10°C ≤ T ≤ 100°C
Real thermal resistance junction/ambient 5), 6)
Real thermal resistance junction/solderpoint 5)
RthJA real
RthJS real
max.
max.
480 K / W
230 K / W
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LA M67B
Brightness Groups
Group
Luminous Intensity 1)
Luminous Intensity. 1)
Luminous Flux 7)
IF = 30 mA
IF = 30 mA
IF = 30 mA
min.
Iv
max.
Iv
typ.
ΦV
T2
U1
U2
V1
355 mcd
450 mcd
560 mcd
710 mcd
450 mcd
560 mcd
710 mcd
900 mcd
1210 mlm
1520 mlm
1910 mlm
2420 mlm
Group Name on Label
Example: T2-1
Brightness
Wavelength
1
T2
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LA M67B
7)
Relative Spectral Emission
Irel = f (
λ
); IF = 30 mA; TS = 25 °C
OHL00436
100
%
Irel
80
60
40
20
0
V
amber
λ
400
450
500
550
600
650
nm
700
λ
7)
Radiation Characteristics
Irel = f (
ϕ
); TS = 25 °C
OHL01660
40˚
30˚
20˚
10˚
0˚
1.0
ϕ
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
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LA M67B
7), 8)
7), 8)
Forward current
Relative Luminous Intensity
IF = f(VF); TS = 25 °C
Iv/Iv(30 mA) = f(IF); TS = 25 °C
OHL00874
101
OHL00590
102
IV
IV (30 mA)
mA
IF
101
100
100
10-1
10-1
10-2
10-2
100
1.3 1.5 1.7 1.9 2.1 2.3 V 2.5
101
mA 102
IF
VF
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LA M67B
7)
Relative Luminous Intensity
Iv/Iv(25 °C) = f(Tj); IF = 30 mA
OHL00740
2.0
IV
IV(25 ˚C)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40 -20
0
20 40 60
˚C 100
Tj
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LA M67B
Max. Permissible Forward Current
IF = f(T)
ΙF [mA]
50
40
30
20
10
: TA
0
0
20
40
60
80
100
Ta [°C]
Permissible Pulse Handling Capability Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TS = 25 °C
IF = f(tp); D: Duty cycle; TS = 85 °C
IF [A]
IF [A]
0,100
0,095
0,090
0,085
0,080
0,075
0,070
0,065
0,060
0,055
0,050
0,10
0,09
0,08
0,07
0,06
0,05
0,04
: D = 1
: D = 1
: D = 0,5
: D = 0,2
: D = 0,1
: D = 0,05
: D = 0,02
: D = 0,01
: D = 0,005
: D = 0,5
: D = 0,2
: D = 0,1
: D = 0,05
: D = 0,02
: D = 0,01
: D = 0,005
10-5 10-4 10-3 0,01 0,1
1
10
10-5 10-4 10-3 0,01 0,1
1
10
Pulse Time tp [s]
Pulse Time tp [s]
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LA M67B
9)
Dimensional Drawing
Approximate Weight:
Package marking:
Corrosion test:
7.0 mg
Cathode
Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC
60068-2-43)
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LA M67B
9)
Recommended Solder Pad
2.8 (0.110)
0.8 (0.031)
2.8 (0.110)
0.8 (0.031)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm2
Cu-area > 16 mm 2
Lötstopplack
Solder resist
OHLPY978
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.
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LA M67B
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Recommendation Maximum
Unit
K/s
s
Minimum
Ramp-up rate to preheat*)
25 °C to 150 °C
2
100
2
3
120
3
Time tS
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP
tS
60
K/s
Liquidus temperature
TL
tL
217
80
°C
s
Time above liquidus temperature
Peak temperature
100
260
30
TP
tP
245
20
°C
s
Time within 5 °C of the specified peak
10
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
3
6
K/s
s
Time
480
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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LA M67B
9)
Taping
4 (0.157)
Cathode/Collector Side
2 (0.079)
1.5 (0.059)
1.55 (0.061)
4 (0.157)
OHAY0225
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LA M67B
10)
Tape and Reel
Reel dimensions [mm]
A
W
Nmin
60
W1
W2 max
14.4
Pieces per PU
3000
180 mm
8 + 0.3 / - 0.1
8.4 + 2
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LA M67B
Barcode-Product-Label (BPL)
9)
Dry Packing Process and Materials
Moisture-sensitive label or print
Barcode label
M
A
R
S
O
Humidity indicator
Barcode label
.
D o n o t e a t
A v o i d m e t a l c o n t a c t .
D i s c a r d i f c i r c l e s o v e r r u n .
b a g o p e n i n g
.
r
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e
t
c h e c k d o
C o m p a r a t o r
T
W E
s
s
b a k e u n i t
e x a m i n e
I f w e t ,
y
y
u
%
1
i f
n
e c e s s a r
b a k e u n i t
e x a m i n e
I f w e t ,
u
n i t s , i f n e c e s s a r
% 1 0
c h a n g e d e s i c c a n t
p a r t s s t l y d r y .
I f w e t ,
5 %
M I L - I - 8 8 3 5
H u m i d i t y I n d i c a t o r
OSRAM
Desiccant
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
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LA M67B
9)
Transportation Packing and Materials
Barcode label
Barcode label
0
0
-2
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2
:
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(X
Packing
Sealing label
OHA02044
Dimensions of transportation box in mm
Width
Length
Height
30 ± 5 mm
200 ± 5 mm
195 ± 5 mm
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LA M67B
Type Designation System
Wavelength
(λdom typ.)
Emission Color
Color coordinates according
CIE 1931/Emission color:
B:
S:
T:
Y:
O:
G:
P:
A:
D:
470 nm
633 nm
528 nm
587 nm
606 nm
570 nm
560 nm
617 nm
460 nm
blue
W:
white
super red
true green
yellow
orange
green
pure green
amber
deep blue
CW: warm white
CB: color on demand blue
CG: color on demand green
CL: color on demand lagune
Package Type
M:
MiniTOPLED
L:
Light
emitting
diode
L
A
M
6
7
6
Lead / Package Properties
4: through hole
6: folded leads
T: folded leads, improved corrosion stability
(Au-LF), w/o TiO2 jetting
V: folded leads and UX:3 w/ improved corrosion
stability (Au-LF), TiO2 jetting
Encapsulant Type / Lens Properties
7:
Colorless clear or white volume conversion
(resin encapsulation)
S:
Silicone (with or without diffuser)
Chip Technology:
3:
5:
6:
B:
C:
F:
G:
standard InGaN
HOP 2000
Standard InGalP
HOP 2000
ATON
Thinfilm InGaAlP
ThinGaN (Thinfilm InGaN)
(Subcon: Sapphire)
InGaAlP low current
standard InGaN low current
individual definition
TSN
K:
S:
1:
0:
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LA M67B
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from
these devices. As a matter of principle, however, it should be mentioned that intense light sources have a
high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-
duction, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
Version 1.2 | 2018-04-16
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LA M67B
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
Version 1.2 | 2018-04-16
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LA M67B
Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
3)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
6)
7)
Thermal Resistance: Rth max is based on statistic values (6σ).
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-
essarily correspond to the actual parameters of each single product, which could differ from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single LEDs within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
Version 1.2 | 2018-04-16
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LA M67B
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
Version 1.2 | 2018-04-16
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