RHRG5060 [ONSEMI]

50A,600V,极快二极管;
RHRG5060
型号: RHRG5060
厂家: ONSEMI    ONSEMI
描述:

50A,600V,极快二极管

软恢复二极管 超快速软恢复二极管 局域网
文件: 总6页 (文件大小:286K)
中文:  中文翻译
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Hyperfast Diode  
50 A, 600 V  
RHRG5060  
Description  
The RHRG5060 is a hyperfast diode with soft recovery  
characteristics. It has the half recovery time of ultrafast diodes  
and is silicon nitride passivated ionimplanted epitaxial planar  
construction. These devices are intended to be used  
as freewheeling/ clamping diodes and diodes in a variety of switching  
power supplies and other power switching applications. Their low  
stored charge and hyperfast soft recovery minimize ringing  
and electrical noise in many power switching circuits reducing power  
loss in the switching transistors.  
www.onsemi.com  
CATHODE  
Features  
ANODE  
Hyperfast Recovery ( t = 50 ns (@ I = 50 A )  
rr  
F
JEDEC STYLE  
TO247  
Max Forward Voltage( V = 2.1 V (@ T = 25 °C )  
F
C
340CL  
600 V Reverse Voltage and High Reliability  
Avalanche Energy Rated  
This Device is PbFree and is RoHS Compliant  
MARKING DIAGRAM  
Applications  
Switching Power Supplies  
Power Switching Circuits  
General Purpose  
$Y&Z&3&K  
RHRG5060  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
600  
600  
600  
50  
Unit  
V
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
RRM  
RWM  
V
V
V
R
V
$Y  
= ON Semiconductor Logo  
&Z  
&3  
&K  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
Average Rectified Forward Current  
I
A
F(AV)  
(T = 93 °C)  
C
Repetitive Peak Surge Current  
(Square Wave, 20 kHz)  
I
100  
500  
A
A
FRM  
RHRG5060  
= Specific Device Code  
Nonrepetitive Peak Surge Current  
(Halfwave 1 Phase, 60 Hz)  
I
FSM  
Maximum Power Dissipation  
P
150  
40  
W
D
Avalanche Energy  
(See Figure 10 and Figure 11)  
E
AVL  
mJ  
1. Cathode  
2. Anode  
Operating and Storage Temperature  
T
STG,  
T
J
65 to  
+175  
°C  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
July, 2021 Rev. 4  
RHRG5060/D  
RHRG5060  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Package  
Brand  
RHRG5060  
TO2472L  
RHRG5060  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
I = 50 A  
Min  
Typ  
Max  
2.1  
Unit  
V
V
F
Instantaneous Forward Voltage  
(Pulse Width = 300 ms, Duty Cycle = 2%)  
F
I = 50 A,  
1.7  
V
F
C
T
= 150°C  
I
R
Instantaneous Reverse Current  
V
V
= 600 V  
250  
1.5  
mA  
R
= 600 V  
= 150°C  
mA  
R
C
T
t
Reverse Recovery Time (See Figure 9 )  
Summation of t + t  
I = 1 A,  
F
45  
50  
ns  
ns  
ns  
ns  
rr  
F
dl /dt = 100 A/ms  
a
b
I = 50 A,  
F
dI /dt = 100 A/ms  
F
t
t
Time to Reach Peak Reverse Current (See Figure 9)  
Time from Peak I to Projected Zero Crossing of I  
I = 50 A,  
25  
20  
a
F
dI /dt = 100 A/ms  
F
I = 50 A,  
b
RM  
RM  
F
Based on a Straight Line from Peak I  
Through 25%  
dI /dt = 100 A/ms  
RM  
F
of I  
(See Figure 9)  
RM  
Q
Reverse Recovery Charge  
Junction Capacitance  
I = 50 A,  
F
65  
nC  
pF  
rr  
F
dI /dt = 100 A/ms  
C
V
F
= 10 V,  
140  
J
R
I = 0 A  
R
Thermal Resistance Junction to Case  
1.0  
°C/W  
q
JC  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
RHRG5060  
TYPICAL PERFORMANCE CURVES  
300  
100  
3000  
1000  
o
175 C  
100  
10  
1
o
100 C  
o
o
o
175 C  
100 C  
25 C  
10  
o
25 C  
0.1  
1
0.01  
0
0.5  
12  
1.5  
2.5  
0
100  
200  
300  
400  
500  
600  
3
V , Forward Voltage (V)  
F
V , Reverse Voltage (V)  
R
Figure 1. Forward Current vs. Forward Voltage  
Figure 2. Reverse Current vs. Reverse Voltage  
150  
60  
50  
o
o
T
= 100 C, dI /dt = 100A/ms  
T
= 25 C, dI /dt = 100A/ms  
C
F
C
F
125  
100  
75  
50  
25  
0
T
T
rr  
rr  
40  
30  
t
a
t
a
20  
10  
0
t
b
t
b
1
1
10  
50  
10  
50  
I , Forward Current (A)  
F
I , Forward Current (A)  
F
Figure 3. Trr, ta and tb Curves vs. Forward Current  
Figure 4. Trr, ta and tb Curves vs. Forward Current  
50  
40  
250  
o
T
= 175 C, dI /dt = 100A/ms  
C
F
200  
T
rr  
DC  
SQ. WAVE  
30  
20  
150  
100  
50  
t
a
t
10  
0
b
0
1
175  
25  
50  
125  
10  
50  
75  
100  
150  
I , Forward Current (A)  
F
T , Case Temperature (5C)  
C
Figure 5. Trr, ta and tb Curves vs. Forward Current  
Figure 6. Current Derating Curve  
www.onsemi.com  
3
RHRG5060  
TYPICAL PERFORMANCE CURVES (continued)  
350  
300  
250  
200  
150  
100  
50  
0
0
50  
100  
150  
200  
V , Reverse Voltage (V)  
R
Figure 7. Junction Capacitance vs. Reverse Voltage  
TEST CIRCUITS AND WAVEFORMS  
V
GE  
AMPLITUDE AND  
R
CONTROL dl /dt  
G
F
L
t AND t CONTROL I  
1
2
F
DUT  
CURRENT  
SENSE  
dI  
F
T
rr  
R
G
I
F
dt  
t
t
b
+
a
V
GE  
0
V
DD  
IGBT  
t
1
0.25I  
RM  
t
2
I
RM  
Figure 8. Trr Test Circuit  
Figure 9. Trr Waveforms and Definitions  
I = 1 A  
L = 40 mH  
R < 0.1 W  
2
E
AVL  
= 1/2LI [V  
/(V V )]  
R(AVL) R(AVL) DD  
Q = IGBT (BV  
> DUT V  
)
V
AVL  
1
CES  
R(AVL)  
L
R
+
V
CURRENT  
SENSE  
I
L
I
L
DD  
I V  
Q
1
V
DD  
DUT  
t
t
t
2
t
0
1
Figure 10. Avalanche Energy Test Circuit  
Figure 11. Avalanche Current and Voltage Waveforms  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2472LD  
CASE 340CL  
ISSUE A  
DATE 03 DEC 2019  
GENERIC  
MARKING DIAGRAM*  
AYWWZZ  
XXXXXXX  
XXXXXXX  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13850G  
TO2472LD  
PAGE 1 OF 1  
ON Semiconductor and  
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
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© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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TECHNICAL PUBLICATIONS:  
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