NVHL072N65S3 [ONSEMI]
单 N 沟道，功率 MOSFET，SUPERFET® III，Easy Drive，650 V，65 A，72 mΩ，TO-247;
| 型号： | NVHL072N65S3 |
| 厂家： | 
ONSEMI |
| 描述： | 单 N 沟道，功率 MOSFET，SUPERFET® III，Easy Drive，650 V，65 A，72 mΩ，TO-247 |
| 文件： | 总8页 (文件大小：313K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
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MOSFET - Power,
BV
R
MAX
I MAX
D
DSS
DS(on)
N-Channel, SUPERFET) III,
Automotive, Easy-drive
650 V, 72 mW, 44 A
650 V
72 mΩ
ꢀ
ꢁ
ꢂ
V
44 A
D
NVHL072N65S3
G
Description
SuperFET III MOSFET is onsemi’s brand−new high voltage
super−junction (SJ) MOSFET family that is utilizing charge balance
technology for outstanding low on−resistance and lower gate charge
performance. This advanced technology is tailored to minimize
conduction loss provide superior switching performance, and with−
stand extreme dv/dt rate. Consequently, SuperFET III MOSFET
Easy−drive series helps manage EMI issues and allows for easier
design implementation.
S
N-Channel MOSFET
Features
TO−247−3LD
CASE 340CX
• AEC−Q101 Qualified
• Max Junction Temperature 150°C
• Typ. R (on) = 61 mΩ
DS
• Ultra Low Gate Charge (Typ. Q = 82 nC)
G
MARKING DIAGRAM
• Low Effective Output Capacitance (Typ. C (eff.) = 724 pF)
OSS
• 100% Avalanche Tested
$Y&Z&3&K
NVHL
072N65S3
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• Automotive PHEV−BEV DC−DC Converter
• Automotive Onboard Charger for PHEV−BEV
$Y
= onsemi Logo
&Z
&3
&K
= Assembly Plant Code
= Numeric Date Code
= Lot Code
NVHL072N65S3
= Specific Device Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
September, 2021 − Rev. 2
NVHL072N65S3/D
NVHL072N65S3
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)
C
Symbol
Parameter
Value
650
Unit
V
V
DSS
V
GSS
Drain to Source Voltage
Gate to Source Voltage
DC
30
V
AC (f > 1 Hz)
Continuous (T = 25°C)
30
V
I
D
Drain Current
44
A
C
Continuous (T = 100°C)
28
A
C
I
Pulsed Drain Current
Pulsed (Note 1)
110
A
DM
E
Single Pulsed Avalanche Energy (Note 2)
Repetitive Avalanche (Note 1)
MOSFET dv/dt
214
mJ
mJ
V/ns
V/ns
W
AS
AR
E
3.12
100
dv/dt
Peak Diode Recovery dv/dt (Note 3)
Power Dissipation
20
P
(T = 25°C)
C
312
D
Derate Above 25°C
2.5
W/°C
°C
°C
T ,T
Operating and Storage Temperature Range
−55 to +150
300
J
STG
T
L
Maximum Lead Temperature for Soldering, 1/8″ from Case for 5 Seconds
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Repetitive rating: pulse−width limited by maximum junction temperature.
2. I = 4.8 A, R = 25 Ω, starting T = 25°C.
AS
G
J
3. I < 44 A, di/dt ≤ 200 A/ms, VDD ≤ BVDSS, starting T = 25°C.
SD
J
4. Essentially independent of operating temperature typical characteristics.
THERMAL CHARACTERISTICS
Symbol
Parameter
Value
0.37
40
Unit
°C/W
°C/W
R
R
Thermal Resistance, Junction to Case, Max
Thermal Resistance, Junction to Ambient, Max
θ
J C
J A
θ
PACKAGE MARKING AND ORDERING INFORMATION
Part Number
Top Marking
Package
Packing Method
Tube
Shipping (Qty / Packing)
NVHL072N65S3
NVHL072N65S3
TO−247−3LD
30 Units / Tube
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2
NVHL072N65S3
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
BV
Drain−to−Source Breakdown Voltage
V
V
= 0 V, I = 1 mA, T = 25°C
650
700
−
−
−
−
−
−
V
V
DSS
GS
D
J
= 0 V, I = 1 mA, T = 150°C
GS
D
J
ΔBVDSS / ΔTJ Breakdown Voltage Temperature
I
D
= 1 mA, Referenced to 25°C
0.60
V/°C
Coefficient
I
Zero Gate Voltage Drain Current
V
DS
V
DS
V
GS
= 650 V, V = 0 V
−
−
−
0.30
7.30
−
1
μA
DSS
GS
= 520 V, V = 0 V, Tc = 125°C
−
GS
I
Gate to Body Leakage Current
=
30 V, V = 0 V
100
nA
GSS
DS
ON CHARACTERISTICS
V
R
Gate to Source Threshold Voltage
V
V
V
V
V
, I = 1.0 mA
2.5
−
−
4.5
72
−
V
GS(th)
DS(on)
GS = DS
D
Static Drain to Source On Resistance
= 10 V, I = 22 A, T = 25°C
61
mΩ
mΩ
S
GS
GS
DS
D
J
= 10 V, I = 22 A, T = 100°C
−
107
29.7
D
J
g
FS
Forward Transconductance
= 20 V, I = 44 A
−
−
D
DYNAMIC CHARACTERISTICS
C
Input Capacitance
V
= 400 V, V = 0 V, f = 1 MHz
−
−
−
−
−
−
−
−
−
3300
72.8
14.6
724
−
−
−
−
−
−
−
−
−
pF
pF
pF
pF
pF
nC
nC
nC
mΩ
iss
oss
rss
DS
GS
C
C
Output Capacitance
Reverse Transfer Capacitance
Effective Output Capacitance
Energy Related Output Capacitance
Total Gate Charge
C
V
V
= 0 V to 400 V, V = 0 V
GS
oss(eff.)
DS
C
= 0 V to 400 V, V = 0 V
104
oss(er.)
DS
GS
Q
82.0
23.3
34.0
0.685
V
DS
= 400 V, V = 10 V, I = 44 A
g(tot)
GS
D
(Note 4)
Q
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Gate Resistance
gs
Q
gd
R
f = 1 MHz
G
SWITCHING CHARACTERISTICS
t
Turn−On Delay Time
Turn−On Rise Time
Turn−Off Delay Time
Fall Time
−
−
−
−
26.3
50
−
−
−
−
ns
ns
ns
ns
V
= 400 V, I = 44 A, V = 10 V,
d(on)
DD
G
D
GS
R
= 4.7 Ω (Note 4)
t
r
t
65.9
32
d(off)
t
f
DRAIN−SOURCE DIODE CHARACTERISTICS
I
Maximum Continuous Drain to Source Diode Forward Current
Maximum Plused Drain to Source Diode Forward Current
−
−
−
−
−
−
44
110
1.2
A
A
V
S
I
SM
V
SD
Drain to Source Diode Forward
Voltage
V
GS
= 0 V, I = 22 A
SD
t
Reverse Recovery Time
V
GS
= 0 V, I = 44 A dI /dt = 100 A/μs
−
−
576
−
−
nS
rr
SD
F
Q
Reverse Recovery Charge
14.3
μC
rr
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NVHL072N65S3
TYPICAL CHARACTERISTICS
90
40
V
V
Pulse Duration = 250 μs
T = 150°C
J
Pulse Duration = 250 μs
T = 25°C
J
GS
GS
20 V Top
10 V
20 V Top
10 V
30
20
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
5.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
60
30
0
10
0
0
1
2
3
4
5
0
1
2
3
4
5
V
DS
, Drain to Source Voltage (V)
V
DS
, Drain to Source Voltage (V)
Figure 1. Saturation Characteristics
Figure 2. Saturation Characteristics
100
0.15
0.10
Pulse Duration = 250 μs
T
C
= 25°C
Duty Cycle = 0.5% Max
V
DS
= 5 V
V
GS
= 10 V
10
1
V
= 20 V
T = 25°C
GS
J
0.05
0
T = 150°C
J
T = −55°C
J
2
3
4
5
6
7
8
0
20
40
60
80
100
V
GS
, Gate to Source Voltage (V)
I , Drain Current (A)
D
Figure 3. Transfer Characteristic
Figure 4. On−Resistance Variation vs. Drain
Current and Gate Voltage
100K
V
GS
= 0 V
100
10
1
10K
1K
Ciss
Coss
100
0.1
T = 150°C
J
10
1
f = 1 MHz
= 0 V
Crss
0.01
V
GS
T = 25°C
T = −55°C
J
J
0.001
0.1
1
10
100
1000
0
0.2
0.4
0.6
0.8
1.0
1.2
V
DS
, Drain to Source Voltage (V)
V
SD
, Body Diode Forward Voltage (V)
Figure 5. Forward Diode Characteristics
Figure 6. Capacitance vs. Drain to Source Volatage
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4
NVHL072N65S3
TYPICAL CHARACTERISTICS (continued)
10
8
1.2
I
D
= 75 A
V
DS
= 130 V
I
D
= 10 mA
1.1
1.0
0.9
0.8
V
DS
= 400 V
6
4
2
0
0
15
30
45
60
75
90
−80
−40
0
40
80
120
160
Q , Gate Charge (nC)
G
T , Junction Temperature (°C)
J
Figure 7. Gate Charge vs. Gate to Source Voltage
Figure 8. Normalized Drain to Source
Breakdown Voltage vs. Junction Temperature
3.0
2.5
2.0
1.5
1.0
10 us
100
10
100 us
1 ms
Operation in this Area
is Limited by R
10 ms
DC
DS(on)
1
Single Pulse
I
V
= 44 A
D
0.5
0
T = 150°C
= 10 V
J
GS
T
C
= 25°C
0.1
1
10
100
1000
−80
−40
0
40
80
120
160
T , Junction Temperature (°C)
J
V
DS
, Drain−Source Voltage (V)
Figure 9. Normalized RDSON vs. Junction
Temperature
Figure 10. Forward Bias Safe Operating Area
20
60
50
18
16
14
12
40
30
20
10
0
10
8
6
4
2
0
25
50
75
100
125
150
0
100
200
V , Drain to Source Voltage (V)
DS
300
400
500
600
700
T , Case Temperature (°C)
C
Figure 11. Maximum Continuous Drain Current
vs. Case Temperature
Figure 12. EOSS vs. Drain to Source Voltage
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5
NVHL072N65S3
TYPICAL CHARACTERISTICS (continued)
1000
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
Current Max Limited
10
0
25
50
75
100
125
150
0.00001 0.0001 0.001
0.01
0.1
1
T , Case Temperature (°C)
C
t, Rectangular Pulse Duration (s)
Figure 13. Normalized Power Dissipation vs. Case
Temperature
Figure 14. Peak Current Capability
1.2
1.0
250
V
I
= V
DS
= 1 mA
GS
T = 150°C
J
D
200
150
100
Pulse Duration = 250 μs
0.8
0.6
0.4
Duty Cycle = 0.5% Max
I
D
= 44 A
T = 25°C
J
50
0
6
7
8
9
10
−80
−40
0
40
80
120
160
V
GS
, Gate to Source Voltage (V)
T , Junction Temperature (°C)
J
Figure 15. EOSS vs. Drain to Source Voltage
Figure 16. Normalized Gate Threshold Voltage
vs. Temperature
10
DUTY CYCLE − DESCENDING ORDER
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
P
DM
0.1
t
1
t
2
0.01
SINGLE PULSE
Z
ꢄ
(t) = r(t) x R
ꢄ
JC
JC
Peak T = P
x Z (t) + T
ꢄ
JC C
J
DM
Duty Cycle, D = t /t
1
2
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t, Rectangular Pulse Duration (s)
Figure 17. Normalized Maximum Transient Thermal Impedance
SUPERFET is registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−247−3LD
CASE 340CX
ISSUE A
DATE 06 JUL 2020
GENERIC
MARKING DIAGRAM*
XXXXX = Specific Device Code
A
Y
= Assembly Location
= Year
WW
G
= Work Week
= Pb−Free Package
XXXXXXXXX
AYWWG
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON93302G
TO−247−3LD
PAGE 1 OF 1
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