NVHL040N65S3 [ONSEMI]

MOSFET – Power, N-Channel, SUPERFET® III,Automotive, Easy-Drive 650 V, 65 A, 40 mΩ;
NVHL040N65S3
型号: NVHL040N65S3
厂家: ONSEMI    ONSEMI
描述:

MOSFET – Power, N-Channel, SUPERFET® III,Automotive, Easy-Drive 650 V, 65 A, 40 mΩ

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MOSFET – Power,  
N-Channel, SUPERFET) III,  
Automotive, Easy-Drive  
650 V, 65 A, 40 mW  
NVHL040N65S3  
Description  
www.onsemi.com  
SUPERFET III MOSFET is ON Semiconductor’s brandnew high  
voltage superjunction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low onresistance and lower gate  
charge performance. This advanced technology is tailored to minimize  
conduction loss, provides superior switching performance, and  
withstand extreme dv/dt rate.  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
650 V  
40 mW @ 10 V  
65 A  
D
Consequently, SUPERFET III MOSFET Easy drive series helps  
manage EMI issues and allows for easier design implementation.  
Features  
AECQ101 Qualified  
G
700 V @ T = 150°C  
J
Typ. R  
= 35.4 mW  
DS(on)  
Ultra Low Gate Charge (Typ. Q = 136 nC)  
S
g
POWER MOSFET  
Low Effective Output Capacitance (Typ. C  
= 1154 pF)  
oss(eff.)  
100% Avalanche Tested  
These Devices are PbFree and are RoHS Compliant  
Applications  
Automotive On Board Charger  
Automotive DC/DC Converter for HEV  
G
D
S
TO247 3LD  
CASE 340CX  
MARKING DIAGRAM  
$Y&Z&3&K  
NVHL  
040N65S3  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
NVHL040N65S3  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
June, 2020 Rev. 0  
NVHL040N65S3/D  
NVHL040N65S3  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)  
C
Symbol  
Parameter  
Value  
650  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
DC  
30  
V
AC (f > 1 Hz)  
30  
I
D
Drain Current  
Continuous (T = 25°C)  
65  
A
C
Continuous (T = 100°C)  
41  
C
I
Drain Current  
Pulsed (Note 1)  
162.5  
358  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
AS  
AS  
I
8.1  
E
4.17  
100  
mJ  
V/ns  
AR  
dv/dt  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
20  
P
(T = 25°C)  
417  
W
W/°C  
°C  
D
C
Derate Above 25°C  
3.33  
55 to +150  
300  
T , T  
Operating and Storage Temperature Range  
J
STG  
T
Maximum Lead Temperature for Soldering, 1/8from Case for 5 seconds  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulse width limited by maximum junction temperature.  
2. I = 8.1 A, R = 25 W, starting T = 25°C.  
AS  
G
J
3. I 32.5 A, di/dt 200 A/ms, V 400 V, starting T = 25°C.  
SD  
DD  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
0.3  
Unit  
R
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
_C/W  
q
JC  
JA  
R
40  
q
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Packing Method  
Reel Size  
Tape Width  
N/A  
Quantity  
NVHL040N65S3  
NVHL040N65S3  
TO247 G03  
Tube  
N/A  
30 Units  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
650  
700  
V
V
V
V
I
= 0 V, I = 1 mA, T = 25_C  
DSS  
GS  
D
J
= 0 V, I = 1 mA, T = 150_C  
GS  
D
J
DBV  
/ DT  
Breakdown Voltage Temperature  
Coefficient  
= 1 mA, Referenced to 25_C  
0.64  
V/_C  
DSS  
J
D
I
Zero Gate Voltage Drain Current  
V
DS  
V
DS  
V
GS  
= 650 V, V = 0 V  
4.5  
1
mA  
DSS  
GS  
= 520 V, T = 125_C  
C
I
Gate to Body Leakage Current  
=
30 V, V = 0 V  
100  
nA  
GSS  
DS  
ON CHARACTERISTICS  
V
Gate Threshold Voltage  
V
GS  
V
GS  
V
DS  
= V , I = 1.7 mA  
2.5  
4.5  
40  
V
mW  
S
GS(th)  
DS(on)  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
= 10 V, I = 32.5 A  
35.4  
46  
D
g
FS  
= 20 V, I = 32.5 A  
D
www.onsemi.com  
2
 
NVHL040N65S3  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 400 V, V = 0 V, f = 1 MHz  
4740  
120  
1154  
171  
136  
33  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
W
iss  
DS  
GS  
C
Output Capacitance  
oss  
C
Effective Output Capacitance  
Energy Related Output Capacitance  
Total Gate Charge at 10 V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance  
V
DS  
V
DS  
V
DS  
= 0 V to 400 V, V = 0 V  
GS  
oss(eff.)  
C
= 0 V to 400 V, V = 0 V  
GS  
oss(er.)  
Q
= 400 V, I = 32.5 A, V = 10 V  
D GS  
g(tot)  
(Note 4)  
Q
gs  
gd  
Q
59  
ESR  
f = 1 MHz  
0.7  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
V
V
= 400 V, I = 32.5 A,  
35  
51  
95  
30  
ns  
ns  
ns  
ns  
d(on)  
DD  
GS  
D
= 10 V, R = 3.3 W  
g
t
r
(Note 4)  
t
d(off)  
t
f
SOURCE-DRAIN DIODE CHARACTERISTICS  
I
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
65  
162.5  
1.2  
A
A
S
I
SM  
V
SD  
Drain to Source Diode Forward Voltage  
Reverse Recovery Time  
V
V
= 0 V, I = 32.5 A  
V
GS  
SD  
t
rr  
= 0 V, I = 32.5 A,  
534  
13.6  
ns  
mC  
GS  
SD  
dI /dt = 100 A/ms  
F
Q
Reverse Recovery Charge  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
 
NVHL040N65S3  
TYPICAL PERFORMANCE CHARACTERISTICS  
200  
100  
200  
V
GS  
=10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
5.5 V  
V
GS  
=10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
5.5 V  
100  
10  
1
10  
1
250 ms Pulse Test  
= 25°C  
250 ms Pulse Test  
= 25°C  
T
C
T
C
0.2  
1
10  
20  
0.1  
1
10  
20  
V
DS  
, DrainSource Voltage (V)  
V
DS  
, DrainSource Voltage (V)  
Figure 1. OnRegion Characteristics 255C  
Figure 2. OnRegion Characteristics 1505C  
300  
0.06  
0.05  
0.04  
100  
150°C  
V
GS  
= 10 V  
25°C  
V
GS  
= 20 V  
10  
0.03  
0.02  
55°C  
V
= 20 V  
DS  
T
C
= 25°C  
250 ms Pulse Test  
1
0.01  
3
4
V
5
6
7
8
9
0
60  
120  
180  
, GateSource Voltage (V)  
I , Drain Current (A)  
D
GS  
Figure 4. OnResistance Variation vs.  
Figure 3. Transfer Characteristics  
Drain Current and Gate Voltage  
105  
104  
103  
102  
101  
100  
101  
1000  
100  
10  
C
iss  
150°C  
C
oss  
1
25°C  
V
= 0 V  
GS  
0.1  
f = 1 MHz  
C
rss  
C
C
C
101  
= C + C (C = shorted)  
iss  
gs gd ds  
0.01  
0.001  
V
GS  
= 0 V  
= C + C  
gd  
oss  
rss  
ds  
250 ms Pulse Test  
= C  
gd  
1
10  
102  
103  
0.0  
0.5  
1.0  
1.5  
V
SD  
, Body Diode Forward Voltage (V)  
V
DS  
, DrainSource Voltage (V)  
Figure 5. Body Diode Forward Voltage  
Variation vs. Source Current and  
Temperature  
Figure 6. Capacitance Characteristics  
www.onsemi.com  
4
NVHL040N65S3  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
1.2  
10  
8
V
= 0 V  
= 10 mA  
GS  
I
D
1.1  
1.0  
0.9  
0.8  
V
= 130 V  
DS  
6
V
= 400 V  
DS  
4
2
I
D
= 32.5 A  
0
50  
50  
100  
150  
0
50  
100  
150  
0
Q , Total Gate Charge (nC)  
T , Junction Temperature (5C)  
g
J
Figure 7. Gate Charge Characteristics  
Figure 8. Breakdown Voltage Variation  
vs. Temperature  
1000  
3.0  
2.5  
2.0  
1.5  
R
DS(on) Limit  
100  
10  
1
10 ms  
100 ms  
1 ms  
1.0  
0.5  
0.0  
10 ms  
100 ms  
0.1  
T
R
= 25°C  
C
1s/DC  
= 0.3°C/W  
V
= 10 V  
= 32.5 A  
q
JC  
GS  
Single Pulse  
I
D
0.01  
1
10  
100  
, DrainSource Voltage (V)  
1000  
50  
0
50  
100 150  
T , Junction Temperature (5C)  
V
DS  
J
Figure 10. Maximum Safe Operating Area  
Figure 9. OnResistance Variation  
vs. Temperature  
30  
25  
20  
15  
10  
80  
60  
40  
20  
0
5
0
150  
25  
50  
75  
100  
125  
0
130  
DS  
260  
390  
520  
650  
V
, Drain to Source Voltage (V)  
T , Case Temperature (5C)  
C
Figure 12. EOSS vs. Drain to Source Voltage  
Figure 11. Maximum Drain Current  
vs. Case Temperature  
www.onsemi.com  
5
NVHL040N65S3  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
1000  
1.2  
1.0  
0.8  
0.6  
0.4  
Current Max Limit  
100  
0.2  
0
10  
0.00001 0.0001 0.001  
0.01  
0.1  
1
0
25  
50  
75  
100  
125  
150  
t, Rectangular Pulse (s)  
T , Case Temperature (5C)  
C
Figure 14. Peak Current Capability  
Figure 13. Normalized Power Dissipation  
vs. Case Temperature  
1.2  
1.0  
0.8  
320  
I
D
= 32.5 A  
240  
160  
T = 150°C  
J
80  
0
0.6  
0.4  
I
= 1.7 mA  
D
T = 25°C  
J
10  
5
6
7
8
9
75 50 25  
0
25 50 75 100 125 150  
T , Ambient Temperature (5C)  
J
V
GS  
, GatetoSource Voltage (V)  
Figure 16. Normalized Gate Threshold Voltage vs.  
Temperature  
Figure 15. RDS(on) vs. Gate Voltage Figure  
2
DUTY CYCLE DESCENDING ORDER  
1
D = 0.5  
0.2  
P
DM  
0.1  
0.1  
0.01  
0.05  
0.02  
0.01  
t
1
t
2
Z
q
(t) = r(t) x R  
q
JC  
JC  
R
= 0.3°C/W  
q
JC  
Peak T = P  
Duty Cycle, D = t / t  
x Z (t) + T  
q
JC C  
J
DM  
SINGLE PULSE  
1
2
0.001  
4  
3  
2  
1  
0
1
105  
10  
10  
10  
10  
10  
10  
t, Rectangular Pulse Duration (sec)  
Figure 17. Transient Thermal Response Curve  
www.onsemi.com  
6
NVHL040N65S3  
V
GS  
R
Q
g
L
V
DS  
Q
Q
gs  
gd  
V
GS  
DUT  
I
G
= Const.  
Charge  
Figure 18. Gate Charge Test Circuit & Waveform  
R
L
V
DS  
GS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
V
DUT  
V
GS  
t
t
d(off)  
t
r
t
f
d(on)  
t
on  
t
off  
Figure 19. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
EAS  
+
@ LIAS  
V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I (t)  
D
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 20. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
7
NVHL040N65S3  
+
DUT  
V
DS  
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
dv/dt controlled by R  
G
I controlled by pulse period  
SD  
Gate Pulse Width  
D +  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 21. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
SUPERFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or  
other countries.  
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8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
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