NVHL015N065SC1 [ONSEMI]

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 12 mohm, 650V, M2, TO247−3L;
NVHL015N065SC1
型号: NVHL015N065SC1
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 12 mohm, 650V, M2, TO247−3L

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – 12 mohm, 650 V,  
M2, TO-247-3L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
650 V  
18 m@ 18 V  
163 A  
NCHANNEL MOSFET  
NVHL015N065SC1  
D
Features  
Typ. R  
= 12 m@ V = 18 V  
GS  
= 15 m@ V = 15 V  
GS  
DS(on)  
Typ. R  
DS(on)  
Ultra Low Gate Charge (Q  
= 283 nC)  
G(tot)  
G
High Speed Switching with Low Capacitance (C = 430 pF)  
oss  
100% Avalanche Tested  
AECQ101 Qualified and PPAP Capable  
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
S
Typical Applications  
Automotive On Board Charger  
Automotive DC-DC Converter for EV/HEV  
Automotive Traction Inverter  
G
D
S
TO2473LD  
CASE 340CX  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
Unit  
V
DSS  
650  
V
V
V
MARKING DIAGRAM  
GatetoSource Voltage  
V
GS  
8/+22  
5/+18  
Recommended Operation Values  
of GatetoSource Voltage  
T
< 175°C  
= 25°C  
V
GSop  
C
Continuous Drain  
Current (Note 1)  
Steady  
State  
T
I
D
163  
643  
115  
321  
484  
798  
A
W
A
C
HL015N  
065SC1  
$Y&Z&3&K  
Power Dissipation  
(Note 1)  
P
D
Continuous Drain  
Current (Note 1)  
Steady  
State  
T
C
= 100°C  
I
D
Power Dissipation  
(Note 1)  
P
D
W
A
Pulsed Drain Current  
(Note 2)  
T
= 25°C  
I
DM  
C
HL015N065SC1  
= Specific Device Code  
= onsemi Logo  
$Y  
&Z  
&3  
&K  
Single Pulse Surge  
Drain Current Capability  
T = 25°C, t = 10 s,  
A
I
A
p
DSC  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
R
= 4.7  
G
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
157  
84  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
ORDERING INFORMATION  
Energy (I  
= 13 A, L = 1 mH) (Note 3)  
L(pk)  
Device  
Package  
Shipping  
Maximum Lead Temperature for Soldering  
T
300  
°C  
L
(1/8from case for 5 s)  
NVHL015N065SC1  
TO247  
Long Lead  
30 Units /  
Tube  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive rating, limited by max junction temperature.  
3. EAS of 84 mJ is based on starting T = 25°C; L = 1 mH, I = 13 A,  
J
AS  
V
DD  
= 50 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
May, 2022 Rev. 3  
NVHL015N065SC1/D  
 
NVHL015N065SC1  
Table 1. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Max  
0.24  
40  
Unit  
JunctiontoCase Steady State (Note 1)  
JunctiontoAmbient Steady State (Note 1)  
R
°C/W  
JC  
R
JA  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
= 0 V, I = 1 mA  
650  
V
(BR)DSS  
GS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
I = 20 mA, referenced to 25°C  
D
0.12  
V/°C  
(BR)DSS  
J
Zero Gate Voltage Drain Current  
I
V
V
= 0 V,  
T = 25°C  
10  
1
A  
mA  
nA  
DSS  
GS  
DS  
J
= 650 V  
T = 175°C  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage  
I
V
V
= +22/8 V, V = 0 V  
250  
GSS  
GS  
DS  
V
R
= V , I = 25 mA  
1.8  
5  
2.63  
4.3  
+18  
V
V
GS(TH)  
GS  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
V
GOP  
V
GS  
V
GS  
V
GS  
V
DS  
= 15 V, I = 75 A, T = 25°C  
15  
12  
16  
44  
mꢀ  
DS(on)  
D
J
= 18 V, I = 75 A, T = 25°C  
18  
D
J
= 18 V, I = 75 A, T = 175°C  
D
J
Forward Transconductance  
g
FS  
= 10 V, I = 75 A  
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 0 V, f = 1 MHz, V = 325 V  
4790  
430  
33  
pF  
nC  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
C
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
Q
V
D
= 5/18 V, V = 520 V,  
283  
72  
G(TOT)  
GS  
DS  
I
= 75 A  
GatetoSource Charge  
GatetoDrain Charge  
GateResistance  
Q
Q
GS  
64  
GD  
R
f = 1 MHz  
1.6  
G
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
Rise Time  
t
V
D
= 5/18 V, V = 400 V,  
25  
77  
ns  
d(ON)  
GS  
DS  
I
= 75 A, R = 2.2 ꢀ  
G
t
r
Inductive load  
TurnOff Delay Time  
t
47  
d(OFF)  
Fall Time  
t
f
11  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
ON  
1371  
470  
1841  
J
E
OFF  
E
tot  
SOURCEDRAIN DIODE CHARACTERISTICS  
Continuous SourceDrain Diode Forward  
I
V
V
= 5 V, T = 25°C  
157  
484  
A
V
SD  
GS  
J
Current  
Pulsed SourceDrain Diode Forward  
Current (Note 2)  
I
SDM  
Forward Diode Voltage  
V
= 5 V, I = 75 A, T = 25°C  
4.6  
SD  
GS  
SD  
J
www.onsemi.com  
2
 
NVHL015N065SC1  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) (continued)  
J
Parameter  
SOURCEDRAIN DIODE CHARACTERISTICS  
Reverse Recovery Time  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
t
V
= 5/18 V, I = 75 A,  
33  
261  
9.2  
16  
ns  
nC  
J  
A
RR  
GS  
S
SD  
dI /dt = 1000 A/s  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
Q
RR  
E
REC  
I
RRM  
Ta  
19  
ns  
ns  
Discharge Time  
Tb  
15  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
NVHL015N065SC1  
TYPICAL CHARACTERISTICS  
280  
240  
200  
160  
120  
80  
4
V
GS  
= 18 V  
15 V  
12 V  
18 V  
12 V  
3
2
15 V  
10 V  
9 V  
8 V  
1
40  
0
0
0
2
4
6
8
10  
0
40  
80  
120  
160  
200  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
1.6  
120  
100  
80  
60  
40  
20  
0
I
D
= 75 A  
I
V
= 75 A  
D
= 18 V  
GS  
1.4  
1.2  
1.0  
0.8  
T = 150°C  
J
T = 25°C  
J
75 50 25  
0
25 50 75 100 125 150 175  
6
9
12  
15  
18  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
280  
100  
280  
240  
V
DS  
= 10 V  
V
GS  
= 5 V  
T = 175°C  
J
200  
160  
120  
80  
T = 25°C  
J
10  
1
T = 175°C  
T = 25°C  
J
J
T = 55°C  
J
40  
T = 55°C  
J
0
2
4
6
8
3
6
9
12  
15  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
www.onsemi.com  
4
NVHL015N065SC1  
TYPICAL CHARACTERISTICS (continued)  
20  
15  
10  
5
10000  
I
D
= 75 A  
C
iss  
V
= 650 V  
DD  
1000  
100  
10  
V
= 390 V  
DD  
V
= 520 V  
C
DD  
oss  
0
C
f = 1 MHz  
= 0 V  
rss  
V
GS  
5  
0
50  
100  
150  
200  
250  
300  
350  
0.1  
1
10  
100  
650  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , GATE CHARGE (nC)  
g
Figure 7. GatetoSource Voltage vs. Total  
Figure 8. Capacitance vs. DraintoSource  
Charge  
Voltage  
100  
10  
1
180  
150  
V
GS  
= 18 V  
120  
90  
T = 25°C  
J
60  
30  
0
R
= 0.24°C/W  
JC  
25  
50  
75  
100  
125  
150  
175  
0.001  
0.01  
0.1  
1
t , TIME IN AVALANCHE (ms)  
AV  
T , CASE TEMPERATURE (°C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
100000  
10000  
1000  
Single Pulse  
R
= 0.24°C/W  
JC  
10 s  
100 s  
1 ms  
T
C
= 25°C  
100  
10  
1000  
100  
10 ms  
Single Pulse  
1
T = Max Rated  
J
R
= 0.24°C/W  
JC  
DC  
T
C
= 25°C  
0.1  
0.1  
1
10  
100  
1000  
0.00001  
0.0001  
0.001  
0.01  
0.1  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
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5
NVHL015N065SC1  
TYPICAL CHARACTERISTICS (continued)  
2
1
0.5 Duty Cycle  
0.2  
0.1  
0.1 0.05  
0.02  
Notes:  
Z (t) = r(t) x R  
JC  
P
0.01  
DM  
JC  
Single Pulse  
0.00001  
R
= 0.24°C/W  
JC  
0.01  
Peak T = P  
x Z (t) + T  
JC C  
J
DM  
t
1
Duty Cycle, D = t /t  
1
2
t
2
0.001  
0.0001  
0.001  
0.01  
0.1  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. JunctiontoCase Thermal Response  
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6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
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