NTB5D0N15MC [ONSEMI]

MOSFET - N-Channel Shielded Gate PowerTrench® 150 V, 5.0 mΩ, 139 A;
NTB5D0N15MC
型号: NTB5D0N15MC
厂家: ONSEMI    ONSEMI
描述:

MOSFET - N-Channel Shielded Gate PowerTrench® 150 V, 5.0 mΩ, 139 A

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MOSFET - N-Channel  
Shielded Gate PowerTrench[  
150 V, 5.0 mW, 139 A  
NTB5D0N15MC  
Features  
www.onsemi.com  
Shielded Gate MOSFET Technology  
Max R  
= 5.0 mW at V = 10 V, I = 97 A  
GS D  
DS(on)  
50% Lower Qrr than other MOSFET Suppliers  
Lowers Switching Noise/EMI  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
150 V  
5.0 mW @ 10 V  
139 A  
100% UIL Tested  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
D
Typical Applications  
Synchronous Rectification for ATX / Server / Telecom PSU  
Motor Drives and Uninterruptible Power Supplies  
Micro Solar Inverter  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
S
Parameter  
DraintoSource Voltage  
Symbol  
Value  
150  
20  
Unit  
V
NCHANNEL MOSFET  
V
DSS  
GatetoSource Voltage  
V
GS  
V
MARKING  
DIAGRAM  
Continuous Drain  
I
139  
A
D
Current R  
(Note 2)  
q
JC  
Steady  
State  
T
= 25°C  
C
Power Dissipation  
(Note 2)  
P
214  
18  
W
A
D
R
q
JC  
NTB5D0  
N15MC  
AYWWZZ  
Continuous Drain  
Current R  
I
D
2
q
JA  
D PAK3  
Steady  
State  
(Notes 1, 2)  
TO263  
CASE 418AJ  
T = 25°C  
A
Power Dissipation  
P
3.8  
W
D
R
(Notes 1, 2)  
q
JA  
NTB5D0N15MC = Specific Device Code  
Pulsed Drain Current  
T
C
= 25°C, t = 100 ms  
I
761  
A
p
DM  
A
Y
= Assembly Location  
= Year  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
WW  
ZZ  
= Work Week  
= Lot Traceability  
Single Pulse DraintoSource Avalanche  
E
AS  
1014  
mJ  
Energy (I = 26 A , L = 3 mH)  
L
pk  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
Device  
NTB5D0N15MC  
Package  
Shipping  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
D2PAK  
(PbFree)  
800 / Tape &  
Reel  
2
1. Surfacemounted on FR4 board using a 1 in , 2 oz. Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
December, 2020 Rev. 2  
NTB5D0N15MC/D  
 
NTB5D0N15MC  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.7  
Unit  
JunctiontoCase Steady State (Note 2)  
JunctiontoAmbient Steady State (Notes 1, 2)  
R
°C/W  
q
JC  
R
40  
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
150  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/
I
D
= 250 mA, ref to 25°C  
76  
(BR)DSS  
mV/°C  
T
J
Zero Gate Voltage Drain Current  
I
V
DS  
= 0 V,  
T = 25°C  
1.0  
DSS  
GSS  
GS  
J
mA  
V
= 120 V  
GatetoSource Leakage Current  
ON CHARACTERISTICS  
I
V
= 0 V, V  
=
20 V  
100  
nA  
DS  
GS  
Gate Threshold Voltage  
V
V
= V , I = 532 mA  
2.5  
4.5  
5
V
mV/°C  
mW  
S
GS(TH)  
GS  
DS  
D
Negative Threshold Temperature Coefficient  
DraintoSource On Resistance  
Forward Transconductance  
V
/T  
I = 532 mA, ref to 25°C  
D
8.5  
3.8  
GS(TH)  
J
R
V
= 10 V, I = 97 A  
D
DS(on)  
GS  
DS  
g
FS  
V
= 10 V, I = 97 A  
146  
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
6300  
1900  
13  
ISS  
Output Capacitance  
C
OSS  
C
RSS  
V
GS  
= 0 V, f = 1 MHz, V = 75 V  
pF  
DS  
Reverse Transfer Capacitance  
GateResistance  
R
1.1  
75  
2.2  
W
G
Total Gate Charge  
Q
G(TOT)  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
18  
G(TH)  
nC  
Q
31  
V
GS  
= 10 V, V = 75 V; I = 97 A  
GS  
GD  
GP  
DS  
D
Q
V
10  
5.4  
227  
V
Output Charge  
Q
V
DD  
= 75 V, V = 0 V  
nC  
OSS  
GS  
SWITCHING CHARACTERISTICS (Note 3)  
TurnOn Delay Time  
Rise Time  
t
32  
14  
45  
9.0  
d(ON)  
t
r
V
= 10 V, V = 75 V,  
DD  
GS  
D
ns  
V
I
= 97 A, R = 4.7 W  
G
TurnOff Delay Time  
Fall Time  
t
d(OFF)  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
SD  
V
= 0 V,  
= 97 A  
T = 25°C  
J
0.96  
1.2  
GS  
I
S
Reverse Recovery Time  
t
92  
ns  
RR  
V
S
= 0 V, V = 75 V  
DD  
GS  
dI /dt = 100 A/ms, I = 97 A  
S
Reverse Recovery Charge  
Q
189  
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
NTB5D0N15MC  
TYPICAL CHARACTERISTICS  
6
300  
225  
150  
10 V  
V
= 5 V  
7.0 V  
8.0 V  
6 V  
GS  
6.0 V  
Pulse Duration = 250 ms  
Duty Cycle = 0.5% Max  
3
8 V  
7 V  
V
= 5.0 V  
GS  
75  
0
10 V  
0
0
1
2
3
4
5
6
7
8
9
10  
0
4
0
60  
120  
180  
240  
300  
V
, DRAINTOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
DS  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
40  
32  
24  
16  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
I
D
= 97 A  
I
V
= 97 A  
D
= 10 V  
GS  
T = 125°C  
J
8
0
T = 25°C  
J
0.8  
0.6  
75 50 25  
0
25 50 75 100 125 150 175  
5
6
7
8
9
10  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. Normalized OnResistance vs.  
Figure 4. OnResistance vs. GatetoSource  
Junction Temperature  
Voltage  
240  
180  
120  
300  
100  
V
DS  
= 10 V  
V
GS  
= 0 V  
10  
1
T = 25°C  
J
0.1  
60  
0
T = 150°C  
J
0.01  
T = 150°C  
J
T = 55°C  
J
T = 25°C  
J
T = 55°C  
J
0.001  
2
3
4
5
6
7
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. SourcetoDrain Diode Forward  
Voltage vs. Source Current  
www.onsemi.com  
3
NTB5D0N15MC  
TYPICAL CHARACTERISTICS  
10  
8
10K  
V
DD  
= 25 V  
I
D
= 97 A  
C
ISS  
1K  
V
DD  
= 50 V  
C
V
DD  
= 75 V  
OSS  
6
100  
4
10  
1
2
0
f = 1 MHz  
= 0 V  
C
RSS  
V
GS  
0
16  
32  
48  
64  
80  
0.1  
1
10  
, DRAINTOSOURCE VOLTAGE (V)  
DS  
100  
Q , GATE CHARGE (nC)  
V
g
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs. DraintoSource  
Voltage  
150  
100  
1M  
100K  
10K  
1K  
V
= 10 V  
GS  
V
GS  
= 8 V  
50  
0
100  
10  
R
= 0.7°C/W  
q
JC  
25  
50  
75  
100  
125  
150  
175  
0.00001 0.0001  
0.001  
0.01  
0.1  
1
T , CASE TEMPERATURE (°C)  
C
t, PULSE WIDTH (s)  
Figure 9. Drain Current vs. Case Temperature  
Figure 10. Peak Power  
100  
1000  
10 ms  
T
= 25°C  
J(initial)  
100  
10  
100 ms  
T
= 100°C  
J(initial)  
T
= 150°C  
J(initial)  
10  
1 ms  
T
= 25°C  
C
Single Pulse  
10 ms  
R
= 0.7°C/W  
q
JC  
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
100 ms/DC  
1
0.1  
0.001 0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100 200  
t , TIME IN AVALANCHE (mS)  
AV  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Unclamped Inductive Switching  
Capability  
Figure 12. Forward Bias Safe Operating Area  
www.onsemi.com  
4
NTB5D0N15MC  
TYPICAL CHARACTERISTICS  
10  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
P
0.02  
DM  
Notes:  
= 0.7°C/W  
0.01  
R
q
JC  
0.01  
t
Peak T = P  
x Z  
(t) + T  
JC C  
1
q
J
DM  
Duty Cycle, D = t /t  
t
1
2
Single Pulse  
0.00001  
2
0.001  
0.0001  
0.001  
0.01  
0.1  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. Transient Thermal Impedance  
www.onsemi.com  
5
NTB5D0N15MC  
PACKAGE DIMENSIONS  
D2PAK3 (TO263, 3LEAD)  
CASE 418AJ  
ISSUE E  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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