NSR0630P2T5G [ONSEMI]
600 mA, 30 V, Schottky Barrier Diode;
| 型号： | NSR0630P2T5G |
| 厂家： | 
ONSEMI |
| 描述： | 600 mA, 30 V, Schottky Barrier Diode |
| 文件： | 总4页 (文件大小：252K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Schottky Barrier Diode
NSR0630P2
Schottky barrier diodes are optimized for very low forward voltage
drop and low leakage current and are used in a wide range of dc−dc
converter, clamping and protection applications in portable devices.
NSR0630P2 in a SOD−923 miniature package enables designers to
meet the challenging task of achieving higher efficiency and meeting
reduced space requirements.
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Features
30 V SCHOTTKY
BARRIER DIODE
• Very Low Forward Voltage Drop − 370 mV @ 100 mA
• Low Reverse Current − 1.4 mA @ 10 V VR
• 600 mA of Continuous Forward Current
• Power Dissipation of 190 mW with Minimum Trace
• Very High Switching Speed
1
2
CATHODE
ANODE
• Low Capacitance − CT = 10 pF
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MARKING
DIAGRAM
2
Typical Applications
• LCD and Keypad Backlighting
• Camera Photo Flash
• Buck and Boost dc−dc Converters
• Reverse Voltage and Current Protection
• Clamping & Protection
1
6F M
SOD−923
CASE 514AB
1
2
6F = Specific Device Code
= Month Code
M
Markets
• Mobile Handsets
• MP3 Players
ORDERING INFORMATION
• Digital Camera and Camcorders
• Notebook PCs & PDAs
• GPS
Device
Package
Shipping†
NSR0630P2T5G SOD−923
2 mm Pitch
(Pb−Free) 8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Reverse Voltage
Symbol
Value
30
Unit
V
V
R
Forward Current (DC)
I
F
600
mA
ESD Rating: Human Body Model
Machine Model
ESD
Class 3B
Class C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
September, 2019 − Rev. 1
NSR0630P2/D
NSR0630P2
THERMAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
Thermal Resistance
Junction−to−Ambient (Note 1)
R
520
190
°C/W
mW
q
JA
Total Power Dissipation @ T = 25°C
P
D
A
Thermal Resistance
Junction−to−Ambient (Note 2)
R
175
570
°C/W
mW
q
JA
Total Power Dissipation @ T = 25°C
P
D
A
Junction and Storage Temperature Range
T , T
−55 to +125
°C
J
stg
1. Mounted onto a 4 in square FR−4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Leakage
(V = 10 V)
I
R
mA
1.4
24
10
200
R
(V = 30 V)
R
Forward Voltage (I = 10 mA)
V
F
0.28
0.37
0.52
0.37
0.46
0.62
V
F
(I = 100 mA)
F
(I = 500 mA)
F
Total Capacitance
10
pF
CT
(V = 1.0 V, f = 1 MHz)
R
10,000
1,000,000
100,000
10,000
1000
100
10
125°C
85°C
25°C
1000
100
10
125°C
85°C
1
−40°C
1
0.1
0.1
0.01
0.01
25°C
0.1
−40°C
0.001
0.001
0
0.2
0.3
0.4
0.5
0.6
0
5
10
15
20
25
30
35
V , FORWARD VOLTAGE (V)
F
V , REVERSE VOLTAGE (V)
R
Figure 1. Forward Voltage
Figure 2. Leakage Current
20
18
T = 25°C
A
16
14
12
10
8
6
4
2
0
0
5
10
15
20
25
30
35
V , REVERSE VOLTAGE (V)
R
Figure 3. Total Capacitance
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2
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE D
DATE 03 SEP 2020
STYLE 1
STYLE 2
SCALE 8:1
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
−Y−
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5. DIMENSION L WILL NOT EXCEED 0.30mm.
E
1
2
2X b
0.08 X Y
TOP VIEW
MILLIMETERS
DIM MIN NOM MAX
INCHES
NOM MAX
MIN
A
A
b
c
0.34
0.15
0.07
0.75
0.55
0.95
0.37
0.20
0.12
0.80
0.60
0.40
0.25
0.17
0.85
0.65
1.05
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
D
E
H
1.00
E
L
0.19 REF
0.10
c
H
E
L2 0.05
0.15
0.002 0.004 0.006
SIDE VIEW
GENERIC
MARKING DIAGRAM*
2X
L
X M
X M
STYLE 1
STYLE 2
2X
L2
X
M
= Specific Device Code
= Date Code
BOTTOM VIEW
SOLDERING FOOTPRINT*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
1.20
2X
2X
0.25
0.36
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
STYLE 2:
NO POLARITY
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON23284D
SOD−923, 1.0x0.6x0.37, MAX HEIGHT 0.40
PAGE 1 OF 1
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