NSPM3042MXT5G [ONSEMI]

4.8 V 双向 ESD 和浪涌防护器件;
NSPM3042MXT5G
型号: NSPM3042MXT5G
厂家: ONSEMI    ONSEMI
描述:

4.8 V 双向 ESD 和浪涌防护器件

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NSPM3042  
4.8 V Bidirectional ESD and  
Surge Protection Device  
The NSPM3042 is designed to protect voltage sensitive components  
from ESD. Excellent clamping capability, low leakage, high peak  
pulse current handling capability and fast response time provide best  
in class protection on designs that are exposed to ESD. Because of its  
small size, it is suited for use in cellular phones, tablets, MP3 players,  
digital cameras and many other portable applications where board  
space comes at a premium.  
www.onsemi.com  
1
2
Features  
Low Clamping Voltage  
Low Leakage  
Small Body Outline: 1.0 mm x 0.6 mm  
MARKING  
DIAGRAM  
Protection for the following IEC Standards:  
IEC61000−4−2 Level 4: 30 kV Contact Discharge  
IEC61000−4−5 (Lightning) 43 A (8/20 ms)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
QM  
X2DFN2  
CASE 714AB  
Q
M
= Specific Device Code  
= Date Code  
Typical Applications  
Battery Line Protection  
Audio Line Protection  
GPIO  
ORDERING INFORMATION  
Device  
NSPM3042MXT5G  
Package  
Shipping  
X2DFN2  
8000 / Tape &  
Reel  
MAXIMUM RATINGS  
(Pb−Free)  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Contact  
Air  
30  
30  
kV  
Operating Junction and Storage  
Temperature Range  
T , T  
−65 to +150  
°C  
J
stg  
Maximum Peak Pulse Current  
I
PP  
43  
A
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
September, 2018 − Rev. 2  
NSPM3042/D  
NSPM3042  
ELECTRICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted)  
A
I
I
PP  
Symbol  
Parameter  
R
V
I
Maximum Reverse Peak Pulse Current  
DYN  
PP  
I
T
I
V
R
BR RWM  
V
Clamping Voltage @ I  
V
C
V
C
PP  
V
I
V
V
R
T
RWM BR  
C
V
RWM  
Working Peak Reverse Voltage  
I
R
I
R
Maximum Reverse Leakage Current @ V  
DYN  
RWM  
V
Breakdown Voltage @ I  
Test Current  
BR  
T
I
PP  
I
T
Bi−Directional Surge Protection  
*See Application Note AND8308/D for detailed explanations of  
datasheet parameters.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
A
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
Reverse Working Voltage  
V
RWM  
I/O Pin to GND  
Pin 1 to 2  
Pin 2 to 1  
4.8  
4.5  
V
Breakdown Voltage  
V
BR  
I = 1 mA, I/O Pin to GND  
T
Pin 1 to 2  
Pin 2 to 1  
4.85  
4.55  
5.2  
5.0  
6.0  
6.0  
V
Reverse Leakage Current  
I
R
V
RWM  
V
RWM  
= 4.8 V, Pin 1 to Pin 2  
= 4.5 V, Pin 2 to Pin 1  
0.5  
0.5  
mA  
Clamping Voltage  
V
IEC61000−4−2, 8 kV Contact  
I = 8 A, IEC61000−4−2 Level 2 Equivalent  
PP  
See Figures 1 & 2  
5.50  
V
V
C
Clamping Voltage TLP (Note 1)  
V
C
( 4 kV Contact, 8 kV Air)  
I
= 16 A, IEC61000−4−2 Level 4 Equivalent  
5.74  
PP  
( 8 kV Contact, 15 kV Air)  
Reverse Peak Pulse Current  
I
IEC61000−4−5 (8 x 20 ms) per Figure 14  
43  
A
V
PP  
Clamping Voltage 8x20 ms  
Waveform per Figure 14 (Note 2)  
V
I
PP  
I
PP  
= 1 A  
= 43 A  
4.9  
7.4  
6.2  
8.0  
C
Dynamic Resistance  
Junction Capacitance  
R
100 ns TLP Pulse  
= 0 V, f = 1 MHz  
0.03  
80  
W
DYN  
C
V
200  
pF  
J
R
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
1. ANSI/ESD STM5.5.1 Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model.  
TLP condtions: Z = 50 W, t = 100 ns, t = 1 ns, averaging window: t = 70 ns to t = 90 ns.  
0
p
r
1
2
2. Non−repetitive current pulse at T = 25°C, per IEC61000−4−5 waveform.  
A
www.onsemi.com  
2
 
NSPM3042  
TYPICAL CHARACTERISTICS  
40  
35  
30  
25  
20  
15  
10  
5
5
0
−5  
−10  
−15  
−20  
−25  
−30  
0
−35  
−40  
−5  
−20  
0
20  
40  
60  
80  
100  
120  
140  
−20  
0
20  
40  
60  
80  
100 120 140  
TIME (ns)  
TIME (ns)  
Figure 1. ESD Clamping Voltage  
Positive 8 kV Contact per IEC61000−4−2  
Figure 2. ESD Clamping Voltage  
Negative 8 kV Contact per IEC61000−4−2  
10  
9
10  
9
20  
18  
16  
14  
12  
10  
8
−20  
−18  
8
−16  
−14  
−12  
−10  
−8  
8
7
7
6
6
5
5
4
4
6
3
−6  
3
4
2
−4  
2
2
1
0
10  
−2  
1
0
0
0
0
1
2
3
4
5
6
7
8
9
0
−1 −2 −3 −4 −5 −6 −7 −8 −9 −10  
V
CTLP  
(V)  
V
CTLP  
(V)  
Figure 3. Positive TLP I−V Curve  
Figure 4. Negative TLP I−V Curve  
10  
9
10  
9
8
8
7
7
6
6
5
5
4
3
2
1
0
4
3
2
1
0
0
5
10 15 20 25 30 35 40 45 50 55 60  
(A)  
0
5
10 15 20 25 30 35 40 45 50 55 60  
I
PK  
I
PK  
(A)  
Figure 5. Positive Clamping Voltage vs. Peak  
Figure 6. Negative Clamping Voltage vs. Peak  
Pulse Current (tp = 8/20 ms)  
Pulse Current (tp = 8/20 ms)  
www.onsemi.com  
3
NSPM3042  
TYPICAL CHARACTERISTICS  
1E−03  
1E−04  
1E−05  
1E−06  
1E−07  
1E−08  
1E−03  
1E−04  
1E−05  
1E−06  
1E−07  
1E−08  
1E−09  
1E−10  
1E−09  
1E−10  
1E−11  
1E−11  
1E−12  
−6 −5 −4 −3 −2 −1  
0
1
2
3
4
5
6
−7 −6 −5 −4 −3 −2 −1  
0
1
2
3
4
5
6
7
V
R
(V)  
V (V)  
R
Figure 7. Breakdown Voltage  
Figure 8. Reverse Leakage Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
−5 −4 −3 −2 −1  
0
1
2
3
4
5
V
BIAS  
(V)  
Figure 9. Line Capacitance, f = 1 MHz  
www.onsemi.com  
4
NSPM3042  
50 W Coax  
Cable  
Transmission Line Pulse (TLP) Measurement  
L
Attenuator  
S
Transmission Line Pulse (TLP) provides current versus  
voltage (I−V) curves in which each data point is obtained  
from a 100 ns long rectangular pulse from a charged  
transmission line. A simplified schematic of a typical TLP  
system is shown in Figure 10. TLP I−V curves of ESD  
protection devices accurately demonstrate the product’s  
ESD capability because the 10s of amps current levels and  
under 100 ns time scale match those of an ESD event. This  
is illustrated in Figure 11 where an 8 kV IEC 61000−4−2  
current waveform is compared with TLP current pulses at  
8 A and 16 A. A TLP I−V curve shows the voltage at which  
the device turns on as well as how well the device clamps  
voltage over a range of current levels. For more information  
on TLP measurements and how to interpret them please  
refer to AND9007/D.  
÷
50 W Coax  
Cable  
I
M
V
M
10 MW  
DUT  
V
C
Oscilloscope  
Figure 10. Simplified Schematic of a Typical TLP  
System  
Figure 11. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms  
www.onsemi.com  
5
 
NSPM3042  
IEC61000−4−2 Waveform  
IEC 61000−4−2 Spec.  
I
peak  
First Peak  
Current  
(A)  
100%  
90%  
Test Volt-  
age (kV)  
Current at  
30 ns (A)  
Current at  
60 ns (A)  
Level  
1
2
3
4
2
4
6
8
7.5  
15  
4
8
2
4
6
8
I @ 30 ns  
22.5  
30  
12  
16  
I @ 60 ns  
10%  
t
P
= 0.7 ns to 1 ns  
Figure 12. IEC61000−4−2 Spec  
Oscilloscope  
ESD Gun  
DUT  
50 W  
Cable  
50 W  
Figure 13. Diagram of ESD Test Setup  
ESD Voltage Clamping  
at the device level. ON Semiconductor has developed a way  
to examine the entire voltage waveform across the ESD  
protection diode over the time domain of an ESD pulse in the  
form of an oscilloscope screenshot, which can be found on  
the datasheets for all ESD protection diodes. For more  
information on how ON Semiconductor creates these  
screenshots and how to interpret them please refer to  
AND8307/D.  
For sensitive circuit elements it is important to limit the  
voltage that an IC will be exposed to during an ESD event  
to as low a voltage as possible. The ESD clamping voltage  
is the voltage drop across the ESD protection diode during  
an ESD event per the IEC61000−4−2 waveform. Since the  
IEC61000−4−2 was written as a pass/fail spec for larger  
systems such as cell phones or laptop computers it is not  
clearly defined in the spec how to specify a clamping voltage  
100  
t
r
PEAK VALUE I  
@ 8 ms  
RSM  
90  
80  
70  
60  
50  
40  
30  
20  
PULSE WIDTH (t ) IS DEFINED  
P
AS THAT POINT WHERE THE  
PEAK CURRENT DECAY = 8 ms  
HALF VALUE I /2 @ 20 ms  
RSM  
t
P
10  
0
0
20  
40  
t, TIME (ms)  
60  
80  
Figure 14. 8 X 20 ms Pulse Waveform  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
X2DFN2 1.0x0.6, 0.65P  
CASE 714AB  
ISSUE B  
DATE 21 NOV 2017  
SCALE 8:1  
NOTES:  
0.10  
C
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
A B  
E
D
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. EXPOSED COPPER ALLOWED AS SHOWN.  
PIN 1  
INDICATOR  
MILLIMETERS  
DIM MIN  
NOM MAX  
A
A1  
b
D
E
e
L
0.34  
−−−  
0.45  
0.95  
0.55  
0.37  
0.03  
0.50  
1.00  
0.60  
0.65 BSC  
0.25  
0.40  
0.05  
0.55  
1.05  
0.65  
0.05  
C
TOP VIEW  
NOTE 3  
A
0.10  
0.10  
C
0.20  
0.30  
C
GENERIC  
MARKING DIAGRAM*  
A1  
SEATING  
PLANE  
C
SIDE VIEW  
XX M  
e
b
XX = Specific Device Code  
e/2  
M
0.05  
C A B  
M
= Date Code  
1
RECOMMENDED  
2X  
L
0.05  
SOLDER FOOTPRINT*  
M
C A B  
1.20  
2X  
BOTTOM VIEW  
2X  
0.47  
0.60  
PIN 1  
DIMENSIONS: MILLIMETERS  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON98172F  
X2DFN2 1.0X0.6, 0.65P  
PAGE 1 OF 1  
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© Semiconductor Components Industries, LLC, 2019  
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