NGB8206NSL3G [ONSEMI]

20A, 390V, N-CHANNEL IGBT, LEAD FREE, CASE 418B-04, D2PAK-3;
NGB8206NSL3G
型号: NGB8206NSL3G
厂家: ONSEMI    ONSEMI
描述:

20A, 390V, N-CHANNEL IGBT, LEAD FREE, CASE 418B-04, D2PAK-3

汽车点火 双极性晶体管
文件: 总7页 (文件大小:74K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NGB8206N  
Ignition IGBT  
20 A, 350 V, N−Channel D2PAK  
This Logic Level Insulated Gate Bipolar Transistor (IGBT) features  
monolithic circuitry integrating ESD and Overvoltage clamped  
protection for use in inductive coil drivers applications. Primary uses  
include Ignition, Direct Fuel Injection, or wherever high voltage and  
high current switching is required.  
http://onsemi.com  
20 AMPS  
350 VOLTS  
VCE(on) = 1.3 V @  
IC = 10 A, VGE . 4.5 V  
Features  
Ideal for Coil−on−Plug and Driver−on−Coil Applications  
Gate−Emitter ESD Protection  
Temperature Compensated Gate−Collector Voltage Clamp Limits  
Stress Applied to Load  
C
Integrated ESD Diode Protection  
Low Threshold Voltage for Interfacing Power Loads to Logic or  
Microprocessor Devices  
R
G
G
Low Saturation Voltage  
High Pulsed Current Capability  
R
GE  
Optional Gate Resistor (R ) and Gate−Emitter Resistor (R  
)
G
GE  
Pb−Free Packages are Available  
E
Applications  
MARKING  
DIAGRAM  
Ignition Systems  
4
NGB  
8206NG  
AYWW  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
2
1
Rating  
Collector−Emitter Voltage  
Collector−Gate Voltage  
Gate−Emitter Voltage  
Symbol  
Value  
390  
Unit  
V
3
V
2
CES  
CER  
D PAK  
CASE 418B  
STYLE 4  
V
390  
V
V
$15  
V
GE  
NGB8206N= Device Code  
Collector Current−Continuous  
I
20  
50  
A
A
C
DC  
AC  
@ T = 25°C − Pulsed  
G
A
Y
= Pb−Free Device  
= Assembly Location  
= Year  
C
Continuous Gate Current  
I
I
1.0  
20  
mA  
mA  
kV  
G
G
WW  
= Work Week  
Transient Gate Current (t 2 ms, f 100 Hz)  
ESD (Charged−Device Model)  
ESD  
ESD  
2.0  
ESD (Human Body Model)  
R = 1500 W, C = 100 pF  
kV  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
8.0  
ESD (Machine Model) R = 0 W, C = 200 pF  
ESD  
500  
V
Total Power Dissipation @ T = 25°C  
P
150  
1.0  
W
W/°C  
C
D
Derate above 25°C  
Operating & Storage Temperature Range  
T , T  
−55 to  
+175  
°C  
J
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 5  
NGB8206N/D  
NGB8206N  
UNCLAMPED COLLECTOR−TO−EMITTER AVALANCHE CHARACTERISTICS (−55° ≤ T 175°C)  
J
Characteristic  
Symbol  
Value  
Unit  
Single Pulse Collector−to−Emitter Avalanche Energy  
E
mJ  
AS  
V
V
V
= 50 V, V = 5.0 V, Pk I = 16.7 A, L = 1.8 mH, R = 1 kW Starting T = 25°C  
250  
200  
180  
CC  
CC  
CC  
GE  
L
g
J
= 50 V, V = 5.0 V, Pk I = 14.9 A, L = 1.8 mH, R = 1 kW Starting T = 150°C  
GE  
L
g
J
= 50 V, V = 5.0 V, Pk I = 14.1 A, L = 1.8 mH, R = 1 kW Starting T = 175°C  
GE  
L
g
J
Reverse Avalanche Energy  
= 100 V, V = 20 V, Pk I = 25.8 A, L = 6.0 mH, Starting T = 25°C  
E
mJ  
AS(R)  
V
2000  
CC  
GE  
L
J
THERMAL CHARACTERISTICS  
Thermal Resistance, Junction−to−Case  
R
1.0  
62.5  
275  
°C/W  
°C/W  
°C  
q
JC  
JA  
L
Thermal Resistance, Junction−to−Ambient (Note 1)  
R
q
Maximum Temperature for Soldering Purposes, 0.125 in from case for 5 seconds (Note 2)  
T
1. When surface mounted to an FR4 board using the minimum recommended pad size.  
2. For further details, see Soldering and Mounting Techniques Reference Manual: SOLDERRM/D.  
ELECTRICAL CHARACTERISTICS  
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Test Conditions  
Temperature  
Min  
Typ  
Max  
Unit  
Collector−Emitter Clamp Voltage  
BV  
I
= 2.0 mA  
= 10 mA  
T = −40°C to 175°C  
325  
340  
350  
365  
375  
390  
V
CES  
C
J
I
T = −40°C to 175°C  
J
C
Zero Gate Voltage Collector Current  
I
V
V
= 15 V,  
CE  
mA  
CES  
T = 25°C  
J
0.1  
1.0  
= 0 V  
GE  
T = 25°C  
0.5  
1.0  
0.4  
30  
1.5  
25  
10  
100*  
5.0  
39  
J
V
V
= 175 V,  
CE  
T = 175°C  
J
= 0 V  
GE  
T = −40°C  
J
0.8  
35  
Reverse Collector−Emitter Clamp Voltage  
Reverse Collector−Emitter Leakage Current  
B
T = 25°C  
J
V
VCES(R)  
T = 175°C  
35  
39  
45*  
37  
I
= −75 mA  
J
C
T = −40°C  
J
30  
33  
I
T = 25°C  
J
0.05  
1.0  
0.005  
12  
0.25  
12.5  
0.03  
12.5  
300  
70  
0.5  
25  
mA  
CES(R)  
T = 175°C  
J
V
= −24 V  
CE  
T = −40°C  
J
0.25  
14  
Gate−Emitter Clamp Voltage  
Gate−Emitter Leakage Current  
Gate Resistor (Optional)  
BV  
I
I
= $5.0 mA  
= $5.0 V  
T = −40°C to 175°C  
V
mA  
W
GES  
G
J
V
T = −40°C to 175°C  
200  
350*  
GES  
GE  
J
R
G
T = −40°C to 175°C  
J
Gate−Emitter Resistor  
R
GE  
T = −40°C to 175°C 14.25  
J
16  
25  
kW  
ON CHARACTERISTICS (Note 3)  
Gate Threshold Voltage  
V
T = 25°C  
1.5  
0.7  
1.7  
3.8  
1.8  
1.0  
2.0  
4.6  
2.1  
1.3  
V
GE(th)  
J
I
= 1.0 mA,  
C
V
T = 175°C  
J
= V  
GE  
CE  
T = −40°C  
J
2.3*  
6.0  
Threshold Temperature Coefficient (Negative)  
mV/°C  
*Maximum Value of Characteristic across Temperature Range.  
3. Pulse Test: Pulse Width v 300 mS, Duty Cycle v 2%.  
http://onsemi.com  
2
 
NGB8206N  
ELECTRICAL CHARACTERISTICS  
Characteristic  
Symbol  
Test Conditions  
Temperature  
Min  
Typ  
Max  
Unit  
ON CHARACTERISTICS (Note 3)  
Collector−to−Emitter On−Voltage  
V
T = 25°C  
0.95  
0.70  
1.0  
1.15  
0.95  
1.30  
1.25  
1.05  
1.4  
1.35  
1.15  
1.40  
1.45  
1.25  
1.50  
1.4  
V
CE(on)  
J
I
V
= 6.5 A,  
C
T = 175°C  
J
= 3.7 V  
GE  
T = −40°C  
J
T = 25°C  
J
0.95  
0.8  
I
V
= 9.0 A,  
C
T = 175°C  
J
= 3.9 V  
GE  
T = −40°C  
J
1.1  
T = 25°C  
J
0.85  
0.7  
1.15  
0.95  
1.3  
I
V
= 7.5 A,  
C
T = 175°C  
J
1.2  
= 4.5 V  
GE  
T = −40°C  
J
1.0  
1.6*  
1.6  
T = 25°C  
J
1.0  
1.3  
I
= 10 A,  
= 4.5 V  
C
T = 175°C  
0.8  
1.05  
1.4  
1.4  
J
V
GE  
T = −40°C  
J
1.1  
1.7*  
1.7  
T = 25°C  
J
1.15  
1.0  
1.45  
1.3  
I
= 15 A,  
= 4.5 V  
C
T = 175°C  
J
1.55  
1.8*  
1.9  
V
GE  
T = −40°C  
J
1.25  
1.3  
1.55  
1.6  
T = 25°C  
J
I
= 20 A,  
= 4.5 V  
C
T = 175°C  
J
1.2  
1.5  
1.8  
V
GE  
T = −40°C  
1.4  
1.75  
18  
2.0*  
25  
J
Forward Transconductance  
gfs  
I
V
= 6.0 A,  
T = 25°C  
J
10  
Mhos  
pF  
C
= 5.0 V  
CE  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
ISS  
1100  
70  
1300  
80  
1500  
90  
f = 10 kHz, V  
25 V  
=
=
CE  
Output Capacitance  
C
OSS  
C
RSS  
T = 25°C  
J
Transfer Capacitance  
18  
20  
22  
SWITCHING CHARACTERISTICS  
Turn−Off Delay Time (Resistive)  
t
T = 25°C  
J
6.0  
6.0  
4.0  
8.0  
3.0  
5.0  
1.5  
5.0  
1.0  
1.0  
4.0  
3.0  
8.0  
8.0  
6.0  
10.5  
5.0  
7.0  
3.0  
7.0  
1.5  
1.5  
6.0  
5.0  
10  
10  
mSec  
d(off)  
V
= 300 V, I  
C
9.0 A  
= 1.0 kW, R  
= 33 W  
CC  
T = 175°C  
J
R
G
L
Fall Time (Resistive)  
Turn−Off Delay Time (Inductive)  
Fall Time (Inductive)  
Turn−On Delay Time  
Rise Time  
t
T = 25°C  
J
8.0  
14  
f
V
= 5 V  
GE  
T = 175°C  
J
t
t
T = 25°C  
J
7.0  
9.0  
4.5  
10  
d(off)  
V
= 300 V, I  
9.0 A  
=
C
CC  
T = 175°C  
J
R
= 1.0 kW, L =  
300 mH  
V
G
t
T = 25°C  
J
f
= 5 V  
GE  
T = 175°C  
J
T = 25°C  
J
2.0  
2.0  
8.0  
7.0  
d(on)  
V
= 14 V, I  
9.0 A  
=
C
CC  
T = 175°C  
J
R
= 1.0 kW, R  
= 1.5 W  
G
L
t
T = 25°C  
J
r
V
= 5 V  
GE  
T = 175°C  
J
*Maximum Value of Characteristic across Temperature Range.  
3. Pulse Test: Pulse Width v 300 mS, Duty Cycle v 2%.  
http://onsemi.com  
3
 
NGB8206N  
TYPICAL ELECTRICAL CHARACTERISTICS  
400  
350  
300  
250  
200  
150  
100  
50  
30  
25  
V
V
R
= 14 V  
= 5.0 V  
= 1000 W  
CC  
GE  
T = 25°C  
J
G
L = 1.8 mH  
20  
15  
10  
5
T = 175°C  
J
L = 3.0 mH  
L = 10 mH  
V
V
R
= 14 V  
= 5.0 V  
= 1000 W  
CC  
GE  
G
0
0
0
2
6
8
10  
−50 −25  
0
25  
50  
75 100  
150 175  
125  
4
INDUCTOR (mH)  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 1. Self Clamped Inductive Switching  
Figure 2. Open Secondary Avalanche Current  
vs. Temperature  
2.0  
60  
50  
40  
30  
20  
10  
0
V
= 10 V  
4.5 V  
4 V  
GE  
I
= 25 A  
C
1.75  
5 V  
I
I
I
= 20 A  
= 15 A  
= 10 A  
C
C
C
1.5  
1.25  
1.0  
T = 175°C  
J
3.5 V  
I
= 7.5 A  
C
3 V  
0.75  
0.5  
2.5 V  
0.25  
V
= 4.5 V  
GE  
0.0  
−50 −25  
0
1
2
3
4
5
6
7
8
0
25  
50  
75 100 125 150 175  
T , JUNCTION TEMPERATURE (°C)  
J
V
, COLLECTOR TO EMITTER VOLTAGE (V)  
CE  
Figure 3. Collector−to−Emitter Voltage vs.  
Junction Temperature  
Figure 4. Collector Current vs.  
Collector−to−Emitter Voltage  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
V
= 10 V  
V
= 10 V  
GE  
4.5 V  
4.5 V  
GE  
4 V  
4 V  
5 V  
5 V  
T = 25°C  
3.5 V  
3 V  
T = −40°C  
J
J
3.5 V  
3 V  
2.5 V  
7
2.5 V  
0
1
2
3
4
5
6
8
0
1
2
3
4
5
6
7
8
V
, COLLECTOR TO EMITTER VOLTAGE (V)  
CE  
V
, COLLECTOR TO EMITTER VOLTAGE (V)  
CE  
Figure 5. Collector Current vs.  
Collector−to−Emitter Voltage  
Figure 6. Collector Current vs.  
Collector−to−Emitter Voltage  
http://onsemi.com  
4
NGB8206N  
TYPICAL ELECTRICAL CHARACTERISTICS  
100000  
10000  
45  
40  
35  
30  
25  
20  
15  
10  
5
V
= 5 V  
CE  
V
= −24 V  
CE  
1000  
100  
10  
T = 25°C  
J
V
= 175 V  
CE  
1.0  
0.1  
T = 175°C  
J
T = −40°C  
J
0
−50 −25  
0
25  
50  
75 100 125 150 175  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V
, GATE TO EMITTER VOLTAGE (V)  
GE  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 7. Transfer Characteristics  
Figure 8. Collector−to−Emitter Leakage  
Current vs. Temperature  
10000  
1000  
100  
2.50  
2.25  
2.00  
1.75  
1.50  
Mean  
C
iss  
Mean + 4 s  
C
oss  
C
rss  
Mean − 4 s  
1.25  
1.00  
0.75  
0.50  
10  
1.0  
0.1  
0.25  
0
−50 −25  
0
25  
50  
75 100 125 150 175  
0
5
10  
15  
20  
25  
T , JUNCTION TEMPERATURE (°C)  
J
V
, COLLECTOR TO EMITTER VOLTAGE (V)  
CE  
Figure 9. Gate Threshold Voltage vs.  
Temperature  
Figure 10. Capacitance vs.  
Collector−to−Emitter Voltage  
12  
10  
8
12  
10  
8
V
V
R
= 300 V  
= 5.0 V  
= 1000 W  
CC  
GE  
t
fall  
G
I
= 9.0 A  
C
t
L = 300 mH  
delay  
t
delay  
6
4
2
0
6
4
2
0
t
fall  
V
V
R
= 300 V  
= 5.0 V  
= 1000 W  
CC  
GE  
G
I
= 9.0 A  
C
R = 33 W  
L
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 11. Resistive Switching Fall Time vs.  
Temperature  
Figure 12. Inductive Switching Fall Time vs.  
Temperature  
http://onsemi.com  
5
NGB8206N  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
D CURVES APPLY FOR POWER  
PULSE TRAIN SHOWN  
0.05  
P
(pk)  
READ TIME AT t  
1
0.02  
0.01  
t
1
t
T
− T = P  
R
(t)  
2
J(pk)  
A
(pk) qJC  
DUTY CYCLE, D = t /t  
1
2
Single Pulse  
0.00001  
0.01  
0.000001  
0.0001  
0.001  
0.01  
0.1  
1
t,TIME (S)  
Figure 13. Best Case Transient Thermal Resistance  
(Non−normalized Junction−to−Case Mounted on Cold Plate)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
2
NGB8206N  
50 Units / Rail  
50 Units / Rail  
D PAK  
2
NGB8206NG  
D PAK  
(Pb−Free)  
2
NGB8206NSL3  
50 Units / Rail  
50 Units / Rail  
D PAK  
2
NGB8206NSL3G  
D PAK  
(Pb−Free)  
2
NGB8206NT4  
800 Units / Tape & Reel  
800 Units / Tape & Reel  
D PAK  
2
NGB8206NT4G  
D PAK  
(Pb−Free)  
2
NGB8206NTF4  
800 Units / Tape & Reel  
800 Units / Tape & Reel  
D PAK  
2
NGB8206NTF4G  
D PAK  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
6
NGB8206N  
PACKAGE DIMENSIONS  
D2PAK 3  
CASE 418B−04  
ISSUE J  
NOTES:  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
C
2. CONTROLLING DIMENSION: INCH.  
3. 418B−01 THRU 418B−03 OBSOLETE,  
NEW STANDARD 418B−04.  
E
V
W
−B−  
INCHES  
DIM MIN MAX  
MILLIMETERS  
4
MIN  
MAX  
A
B
C
D
E
F
G
H
J
0.340 0.380  
0.380 0.405  
0.160 0.190  
0.020 0.035  
0.045 0.055  
0.310 0.350  
0.100 BSC  
8.64  
9.65 10.29  
4.06  
0.51  
1.14  
7.87  
9.65  
4.83  
0.89  
1.40  
8.89  
A
S
1
2
3
2.54 BSC  
0.080  
0.018 0.025  
0.090 0.110  
0.110  
2.03  
0.46  
2.29  
1.32  
7.11  
5.00 REF  
2.00 REF  
0.99 REF  
2.79  
0.64  
2.79  
1.83  
8.13  
−T−  
SEATING  
PLANE  
K
W
J
K
L
G
0.052 0.072  
0.280 0.320  
0.197 REF  
0.079 REF  
0.039 REF  
M
N
P
R
S
V
H
D 3 PL  
M
M
T B  
0.13 (0.005)  
0.575 0.625 14.60 15.88  
0.045 0.055 1.14 1.40  
STYLE 4:  
PIN 1. GATE  
P
L
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
U
SOLDERING FOOTPRINT*  
M
8.38  
0.33  
1.016  
0.04  
F
10.66  
0.42  
5.08  
0.20  
VIEW W−W  
3.05  
0.12  
17.02  
0.67  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
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NGB8206N/D  

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