NCP338_16 [ONSEMI]
2A Ultra-Small Controlled Load Switch;
| 型号： | NCP338_16 |
| 厂家： | 
ONSEMI |
| 描述： | 2A Ultra-Small Controlled Load Switch |
| 文件： | 总8页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP338
2A Ultra-Small Controlled
Load Switch with
Auto-discharge Path
The NCP338 is very low Ron MOSFET controlled by external logic
pin, allowing optimization of battery life, and portable device
autonomy.
Indeed, due to a current consumption optimization with PMOS
structure, leakage currents are eliminated by isolating connected IC on
the battery when not used.
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MARKING
DIAGRAM
Output discharge path is also embedded to eliminate residual
voltages on the output rail.
Proposed in a wide input voltage range from 1.0 V to 3.6 V, in a
small 0.8 x 1.2 mm WLCSP6, pitch 0.4 mm.
AM
AYW
WLCSP6
CASE 567FY
AM = Specific Device Code
A
Y
= Assembly Location
= Year
Features
• 1.0 V − 3.6 V Operating Range
• 16 mW P MOSFET at 3.6 V
• DC Current Up to 2 A
• Output Auto−discharge
• Active High EN Pin
W
= Work Week
PIN DIAGRAM
1
2
• WLCSP6 0.8 x 1.2 mm
• ESD Ratings: 6 kV HBM, 250 V MM
• This is a Pb−Free Device
A
OUT
IN
B
C
OUT
GND
IN
Typical Applications
• Mobile Phones
• Tablets
• Digital Cameras
• GPS
• Portable Devices
EN
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
V+
LS
NCP338
DCDC Converter
A2
B2
A1
B1
Platform IC’n
IN OUT
IN OUT
or
LDO
C2
EN
ENx
EN
0
Figure 1. Typical Application Circuit
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
August, 2016 − Rev. 3
NCP338/D
NCP338
PIN FUNCTION DESCRIPTION
Pin
Number
Pin Name
Type
Description
IN
A2, B2
POWER
Load−switch input voltage; connect a 1 mF or greater ceramic capacitor from IN to GND as
close as possible to the IC.
GND
EN
C1
C2
POWER
INPUT
Ground connection.
Enable input, logic high turns on power switch.
OUT
A1, B1
OUTPUT
Load−switch output; connect a 1 mF ceramic capacitor from OUT to GND as close as pos-
sible to the IC is recommended.
BLOCK DIAGRAM
IN: Pin A2, B2
OUT: Pin A1, B1
Gate driver and soft
start control
Control
logic
EN: Pin C2
EN block
GND: Pin C1
Figure 2. Block Diagram
MAXIMUM RATINGS
Rating
Symbol
Value
−0.3 to + 4.0
0 to + 4.0
−40 to + 125
−40 to + 150
6000
Unit
V
IN, OUT, EN, Pins
V
V
V
EN , IN , OUT
From IN to OUT Pins: Input/Output
Maximum Junction Temperature
V
V
V
IN , OUT
T
J
°C
°C
V
Storage Temperature Range
T
STG
Human Body Model (HBM) ESD Rating are (Note 1 and 2)
Machine Model (MM) ESD Rating are (Note 1 and 2)
Moisture Sensitivity (Note 3)
ESD HBM
ESD MM
MSL
250
V
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) 200 V per JEDEC standard: JESD22−A115 for all pins.
3. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
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2
NCP338
OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
Operational Power Supply
Enable Voltage
1.0
3.6
V
IN
V
EN
0
−40
−40
1
3.6
+85
T
Ambient Temperature Range
Junction Temperature Range
Decoupling input capacitor
Decoupling output capacitor
25
25
°C
°C
mF
mF
A
T
+125
J
C
IN
C
1
OUT
R
Thermal Resistance Junction to Air
Maximum DC current
WLCSP package (Note 5)
100
°C/W
q
JA
I
2
A
OUT
P
D
Power Dissipation Rating (Note 6)
T
≤ 25°C
WLCSP package
WLCSP package
1
W
W
A
T = 85°C
A
0.4
4. Latch up Current Maximum Rating: 100 mA per JEDEC standard: JESD78 class II.
5. The R is dependent of the PCB heat dissipation and thermal via.
q
JA
6. The maximum power dissipation ( ) is given by the following formula:
PD
TJMAX * TA
PD
+
RqJA
ELECTRICAL CHARACTERISTICS Min and Max Limits apply for between −40°C to +85°C for
between 1.0 V to 3.6 V
VIN
TA
(Unless otherwise noted). Typical values are referenced to T = +25°C and V = 3.6 V (Unless otherwise noted).
A
IN
Symbol
Parameter
Conditions
Min
Typ
16
Max
Unit
POWER SWITCH
V
IN
V
IN
V
IN
V
IN
= 3.6 V
= 2.5 V
= 1.8 V
= 1.2 V
T = 25°C
A
27
30
36
40
40
45
87
99
−40°C < T < 85°C
A
T = 25°C
A
21
−40°C < T < 85°C
A
Static drain−source on−state resist-
ance at −200 mA
mW
T = 25°C
A
27
R
DS(on)
−40°C < T < 85°C
A
T = 25 °C
A
52
−40°C < T < 85°C
A
Static drain−source on−state resist-
ance at −100 mA
V
= 1.1 V
T = 25°C
67
65
IN
A
Rdis
Output discharge path
High−level input voltage
Low−level input voltage
EN leakage current
EN = low
Vin = 3.3 V
90
W
V
V
IH
0.95
Vin = 1.8 V
V
IL
0.5
V
I
20
nA
EN
CURRENT CONSUMPTION
V
V
= open, EN = low, V = 3.6 V
20
4
OUT
IN
Istd
Iq
Standby current
300
= open, EN = low, V = 1.8 V
OUT
IN
nA
V
= open, EN = high, V = 3.6 V
200
80
600
300
OUT
OUT
IN
Quiescent current
V
= open, EN = high, V = 1.8 V
IN
7. Parameters are guaranteed for C
and R
connected to the OUT pin with respect to the ground.
LOAD
LOAD
8. Guaranteed by design and characterization.
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3
NCP338
ELECTRICAL CHARACTERISTICS Min and Max Limits apply for between −40°C to +85°C for
between 1.0 V to 3.6 V
VIN
TA
(Unless otherwise noted). Typical values are referenced to T = +25°C and V = 3.6 V (Unless otherwise noted).
A
IN
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TIMINGS
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
40
40
20
25
10
10
20
200
(Note 7)
T
ON
Turn on time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
R
V
OUT
rise time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
V
IN
= 1.2 V
ms
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
OFF
Turn off time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
FALL
V
OUT
fall time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
TIMINGS
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
40
40
30
35
10
10
15
150
(Note 7)
T
ON
Turn on time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
R
V
OUT
rise time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
V
IN
= 1.8 V
ms
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
OFF
Turn off time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
FALL
V
OUT
fall time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
7. Parameters are guaranteed for C
and R
connected to the OUT pin with respect to the ground.
LOAD
LOAD
8. Guaranteed by design and characterization.
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4
NCP338
ELECTRICAL CHARACTERISTICS Min and Max Limits apply for between −40°C to +85°C for
between 1.0 V to 3.6 V
VIN
TA
(Unless otherwise noted). Typical values are referenced to T = +25°C and V = 3.6 V (Unless otherwise noted).
A
IN
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TIMINGS
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
30
32
20
20
10
10
10
100
(Note 7)
T
ON
Turn on time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
0
0
0
0
80
50
(Note 7)
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
R
V
OUT
rise time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
(Note 7)
V
IN
= 3.6 V
ms
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
OFF
Turn off time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
40
(Note 7)
C
R
= 0.1 mF,
= 500 W
LOAD
LOAD
(Note 7)
T
FALL
V
OUT
fall time
C
R
= 1 mF,
= 500 W
LOAD
LOAD
300
(Note 7)
7. Parameters are guaranteed for C
and R
connected to the OUT pin with respect to the ground.
LOAD
LOAD
8. Guaranteed by design and characterization.
TIMINGS
V
IN
EN
V
OUT
T
ON
T
T
OFF
T
F
R
Figure 3. Enable, Rise and Fall Time
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5
NCP338
TYPICAL CHARACTERISTICS
Figure 4. RDS(on) (mW) vs. Vin (V) in
Figure 5. RDS(on) (mW) vs. Iload at
Temperature
Different Input Voltage
Figure 6. Standby Current (mA) vs. Vin
Figure 7. Quiescent Current (mA) vs. Vin
(V)
(V)
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6
NCP338
FUNCTIONAL DESCRIPTION
Overview
The auto−discharge is activated when EN pin is set to low
level (disable state).
The discharge path ( Pull down NMOS) stays activated as
The NCP338 is a high side P channel MOSFET power
distribution switch designed to isolate ICs connected on the
battery in order to save energy. The part can be turned on,
with a wide range of battery from 1.0 V to 3.6 V.
long as EN pin is set at low level and V > 1.0 V.
IN
In order to limit the current across the internal discharge
N−MOSFET, the typical value is set at 65 W.
Enable Input
Enable pin is an active high. The path is opened when EN
pin is tied low (disable), forcing P−MOS switch off.
The IN/OUT path is activated with a minimum of Vin of
1.2 V and EN forced to high level.
CIN and COUT Capacitors
IN and OUT, 1 mF, at least, capacitors must be placed as
close as possible the part to for stability improvement.
Auto Discharge
N−MOSFET is placed between the output pin and GND,
in order to discharge the application capacitor connected on
OUT pin.
APPLICATION INFORMATION
Power Dissipation
TJ + PD RqJA ) TA
Main contributor in term of junction temperature is the
power dissipation of the power MOSFET. Assuming this,
the power dissipation and the junction temperature in
normal mode can be calculated with the following
equations:
T
= Junction temperature (°C)
= Package thermal resistance (°C/W)
= Ambient temperature (°C)
J
R
T
qJA
A
PCB Recommendations
Ǔ2
The NCP338 integrates an up to 2 A rated PMOS FET, and
the PCB design rules must be respected to properly evacuate
the heat out of the silicon. By increasing PCB area,
ǒ
PD + RDS(on) IOUT
P
D
= Power dissipation (W)
especially around IN and OUT pins, the R
can be decreased, allowing higher power dissipation.
of the package
R
I
= Power MOSFET on resistance (W)
= Output current (A)
qJA
DS(on)
OUT
ORDERING INFORMATION
Device
†
Marking
Autodischarge
Package
Shipping
NCP338FCCT2G
AM
Yes
WLCSP 0.8 x 1.2 mm
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
NCP338
PACKAGE DIMENSIONS
WLCSP6, 0.80x1.20
CASE 567FY
ISSUE A
D
A
NOTES:
B
E
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
PIN A1
REFERENCE
MILLIMETERS
2X
0.05
0.05
C
DIM
A
A1
A2
A3
b
MIN
−−−
0.17
0.28 REF
0.04 REF
0.21 0.25
MAX
0.60
0.23
A3
DIE COAT
2X
C
TOP VIEW
D
E
e
0.80 BSC
1.20 BSC
0.40 BSC
A2
A2
DETAIL A
0.05
C
DETAIL A
RECOMMENDED
SOLDERING FOOTPRINT*
A
0.05
C
PACKAGE
OUTLINE
SEATING
PLANE
0.40
PITCH
NOTE 3
C
A1
SIDE VIEW
6X
b
e
e
0.05
0.03
C
C
A B
C
6X
A1
0.229
B
A
0.40
PITCH
DIMENSIONS: MILLIMETERS
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
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NCP338/D
相关型号：
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