NCP13992 [ONSEMI]

High Performance Current Mode Resonant Controller;
NCP13992
型号: NCP13992
厂家: ONSEMI    ONSEMI
描述:

High Performance Current Mode Resonant Controller

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中文:  中文翻译
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NCP13992  
High Performance Current  
Mode Resonant Controller  
with Integrated High-  
Voltage Drivers  
www.onsemi.com  
The NCP13992 is a high performance current mode controller for  
half bridge resonant converters. This controller implements 600 V  
gate drivers, simplifying layout and reducing external component  
count. The built−in Brown−Out input function eases implementation  
of the controller in all applications. In applications where a PFC front  
stage is needed, the NCP13992 features a dedicated output to drive the  
PFC controller. This feature together with quiet skip mode technique  
further improves light load efficiency of the whole application. The  
NCP13992 provides a suite of protection features allowing safe  
operation in any application. This includes: overload protection,  
over−current protection to prevent hard switching cycles, brown−out  
detection, open optocoupler detection, automatic dead−time adjust,  
over−voltage (OVP) and over−temperature (OTP) protections.  
16  
1
SOIC−16 NB  
(LESS PINS 2 AND 13)  
D SUFFIX  
CASE 751DU  
MARKING DIAGRAM  
16  
NCP13992xy  
AWLYWWG  
Features  
High−Frequency Operation from 20 kHz up to 750 kHz  
Current Mode Control Scheme  
1
NCP13992 = Specific Device Code  
Automatic Dead−time with Maximum Dead−time Clamp  
Dedicated Startup Sequence for Fast Resonant Tank Stabilization  
Light Load Operation Mode for Improved Efficiency  
Quiet Skip Operation Mode for Minimize Transformer Acoustic Noise  
Latched or Auto−Recovery Overload Protection  
Latched or Auto−Recovery Output Short Circuit Protection  
Latched Input for Severe Fault Conditions, e.g. OVP or OTP  
Out of Resonance Switching Protection  
x
y
A
WL  
Y
= A  
= A  
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= Pb−Free Package  
WW  
G
PIN CONNECTIONS  
Open Feedback Loop Protection  
1
HV  
16 VBOOT  
15 HB  
Precise Brown−out Protection  
PFC Stage Operation Control According to Load Conditions  
Startup Current Source with Extremely Low Leakage Current  
Dynamic Self−Supply (DSS) Operation in Off−mode or Fault Modes  
Pin to Adjacent Pin / Open Pin Fail Safe  
14  
3
4
5
6
VBULK/PFCFB  
SKIP  
MUPPER  
LLCFB  
12 MLOWER  
11  
LLCCS  
GND  
10 VCC  
PFCMODE  
These are Pb−Free Devices  
OVP/OTP  
FBFREEZE  
7
8
Typical Applications  
9
Adapters and Offline Battery Chargers  
Flat Panel Display Power Converters  
Computing Power Supplies  
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 8 of  
Industrial and Medical Power Sources  
this data sheet.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
January, 2018 − Rev. 0  
NCP13992/D  
NCP13992  
Figure 1. Typical Application Example without PFC Stage − WLLC Design  
Figure 2. Typical Application Example with PFC Stage  
www.onsemi.com  
2
NCP13992  
PIN FUNCTION DESCRIPTION  
Pin No.  
Pin Name  
Function  
Pin Description  
1
HV  
High−voltage startup  
current source input  
Connects to rectified AC line or to bulk capacitor to perform functions of Start−  
up Current Source and Dynamic Self−Supply  
2
3
NC  
Not connected  
Increases the creepage distance  
VBULK /  
PFC FB  
Bulk voltage monitoring input Receives divided bulk voltage to perform Brown−out protection.  
4
5
SKIP  
Skip threshold adjust  
LLC feedback input  
Sets the skip in threshold via a resistor connected to ground  
LLC FB  
Defines operating frequency based on given load conditions. Activates skip  
mode operation under light load conditions.  
6
LLC CS  
LLC current sense input  
Senses divided resonant capacitor voltage to perform on−time modulation, out  
of resonant switching protection, over−current protection and secondary side  
short circuit protection.  
7
8
9
OTP / OVP  
FB FREEZE  
PFC MODE  
Over−temperature and  
over−voltage protection input  
Implements over−temperature and over−voltage protection on single pin.  
Minimum internal FB level  
Adjusts minimum internal FB level that can be reached during light load oper-  
ation.  
PFC and external HV  
switch control output  
Provides supply voltage for PFC front stage controller and/or enables Vbulk  
sensing network HV switch.  
10  
11  
VCC  
GND  
Supplies the controller  
Analog ground  
The controller accepts up to 20 V on VCC pin  
Common ground connection for adjust components, sensing networks and  
DRV outputs.  
12  
13  
14  
15  
16  
MLOWER  
NC  
Low side driver output  
Not connected  
Drives the lower side MOSFET  
Increases the creepage distance  
Drives the higher side MOSFET  
Connects to the half−bridge output.  
The floating VCC supply for the upper stage  
MUPPER  
HB  
High side driver output  
Half−bridge connection  
Bootstrap pin  
VBOOT  
Figure 3. Internal Circuit Architecture  
www.onsemi.com  
3
NCP13992  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
−0.3 to 600  
−0.3 to 5.5  
Unit  
V
HV Startup Current Source HV Pin Voltage (Pin 1)  
VBULK/PFC FB Pin Voltage (Pin3)  
SKIP Pin Voltage (Pin 4)  
V
HV  
BULK/PFC FB  
V
V
V
SKIP  
−0.3 to 5.5  
V
LLC FB Pin Voltage (Pin 5)  
V
−0.3 to 5.5  
V
FB  
CS  
LLC CS Pin Voltage (Pin 6)  
V
−5 to 5  
V
PFC MODE Pin Output Voltage (Pin 9)  
VCC Pin Voltage (Pin 10)  
V
−0.3 to VCC+0.3  
−0.3 to 20  
V
PFC MODE  
V
V
CC  
DRV_MLOWER  
Low Side Driver Output Voltage (Pin 12)  
High Side Driver Output Voltage (Pin 14)  
High Side Offset Voltage (Pin 15)  
High Side Floating Supply Voltage (Pin 16)  
High Side Floating Supply Voltage (Pin 15 and 16)  
Allowable Output Slew Rate on HB Pin (Pin 15)  
OVP/OTP Pin Voltage (Pin 7)  
V
−0.3 to VCC + 0.3  
V
V
V
– 0.3 to V  
BOOT  
+ 0.3  
+0.3  
V
DRV_MUPPER  
HB  
V
HB  
V
−20 to V  
Boot  
V
Boot  
V
BOOT  
−0.3 to 620  
−0.3 to 20.0  
50  
V
V
V
Boot–VHB  
dV/dt  
V/ns  
V
max  
V
−0.3 to 5.5  
−0.3 to 5.5  
−50 to 150  
−55 to 150  
130  
OVP/OTP  
P ON/OFF  
FB FREEZE Pin Voltage (Pin 8)  
Junction Temperature  
V
V
T
J
°C  
°C  
°C/W  
kV  
Storage Temperature  
T
STG  
Thermal Resistance Junction−to−air  
R
θ
JA  
Human Body Model ESD Capability per JEDEC JESD22−A114F  
(except HV Pin – Pin 1)  
4.5  
Machine Model ESD Capability per JEDEC JESD22−A115C  
250  
1
V
Charged−Device Model ESD Capability per JEDEC JESD22−C101E  
kV  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
1. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78  
ELECTRICAL CHARACTERISTICS  
(For typical values Tj = 25°C, for min/max values Tj = −40°C to +125°C, Vcc = 12 V unless otherwise noted)  
Symbol  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
HV STARTUP CURRENT SOURCE  
V
Minimum voltage for current source operation  
(V = V −0.5 V, I drops to 95%)  
1
1
60  
60  
V
V
HV_MIN1  
CC  
CC_ON  
START2  
V
Minimum voltage for current source operation  
(V = V −0.5 V, I drops to 5 mA)  
HV_MIN2  
CC  
CC_ON  
START2  
I
I
Current flowing out of V pin (V = 0 V)  
1, 10  
1, 10  
1
0.2  
6
0.5  
9
0.8  
13  
10  
mA  
mA  
mA  
START1  
CC  
CC  
Current flowing out of V pin (V = V −0.5 V)  
CC_ON  
START2  
CC  
CC  
I
Off−state leakage current (V = 500 V, V = 15 V)  
START_OFF  
HV  
CC  
SUPPLY SECTION  
V
Turn−on threshold level, V going up  
10  
10  
15.3  
9.0  
15.8  
9.5  
16.3  
10  
V
V
CC_ON  
CC  
V
Minimum operating voltage after turn−on  
CC_OFF  
V
V
V
level at which the internal logic gets reset  
10  
5.8  
6.6  
7.2  
V
CC_RESET  
CC_INHIBIT  
CC  
CC  
V
level for I  
to I  
transition  
10  
0.40  
500  
0.80  
780  
1.25  
950  
V
START1  
START2  
I
Controller supply current in skip−mode, V = 15 V,  
10, 11  
mA  
CC_SKIP−MODE  
CC  
OVP/OTP block debiased during skip mode  
www.onsemi.com  
4
NCP13992  
ELECTRICAL CHARACTERISTICS  
(For typical values Tj = 25°C, for min/max values Tj = −40°C to +125°C, Vcc = 12 V unless otherwise noted)  
Symbol  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
SUPPLY SECTION  
I
Controller supply current in latch−off mode,  
10, 11  
10, 11  
10, 11  
350  
400  
4.0  
570  
580  
5.4  
700  
700  
7.0  
mA  
mA  
CC_LATCH  
V
CC  
= V  
− 0.2 V  
CC_ON  
I
Controller supply current in auto−recovery mode,  
= V − 0.2 V  
CC_AUTOREC  
V
CC  
CC_ON  
I
Controller supply current in normal operation,  
= 100 kHz, C = 1 nF, V = 15 V  
mA  
CC_OPERATION  
f
sw  
load  
CC  
BOOTSTRAP SECTION  
V
Startup voltage on the floating section (Note 3)  
Cutoff voltage on the floating section  
16, 15  
16, 15  
16, 15  
16, 15  
7.5  
7.0  
30  
9.0  
8.2  
75  
10.0  
9.1  
V
V
BOOT_ON  
V
BOOT_OFF  
I
I
Upper driver consumption, no DRV pulses  
130  
2.00  
mA  
mA  
BOOT1  
Upper driver consumption, C  
= 1 nF between Pins 13 &  
1.30  
1.65  
BOOT2  
load  
15 f = 100 kHz, HB connected to GND  
sw  
HB DISCHARGER  
I
I
HB sink current capability V = 30 V  
15  
15  
15  
7
1
9.6  
4.1  
12  
8
mA  
mA  
V
DISCHARGE1  
DISCHARGE2  
HB  
HB sink current capability V = V  
HB  
HB_MIN  
V
HB voltage @ I  
changes from 2 to 0 mA  
10  
HB_MIN  
DISCHARGE  
DRIVER OUTPUTS  
t
Output voltage rise−time @ C = 1 nF, 10−90% of output  
signal  
12, 14  
12, 14  
20  
5
45  
30  
80  
50  
ns  
ns  
r
L
t
Output voltage fall−time @ C = 1 nF, 10−90% of output  
f
L
signal  
R
Source resistance  
Sink resistance  
12, 14  
12, 14  
12, 14  
4
1
16  
5
32  
11  
W
W
A
OH  
R
OL  
DRVSOURCE  
I
Output high short circuit pulsed current  
0.5  
V
DRV  
= 0 V, PW v 10 ms  
I
Output high short circuit pulsed current  
= VCC, PW v 10 ms  
12, 14  
1
5
A
DRVSINK  
V
DRV  
I
Leakage current on high voltage pins to GND  
14, 15, 16  
mA  
HV_LEAK  
DEAD−TIME GENERATION  
t
Maximum Dead−time value if no dV/dt falling/rising edge is  
received  
12, 14  
720  
800  
8
880  
ns  
DEAD_TIME_MAX  
N
Number of DT_MAX events to enters IC into fault  
12, 14, 16  
DT_MAX  
dV/dt DETECTOR  
P
Positive slew rate on V  
sensor triggered, VHB rising from 0 to 100 V linearly (Note 2)  
pin above which is dV/dt_P  
16  
16  
178  
226  
200  
250  
V/ms  
V/ms  
dV/dt_th_1  
BOOT  
P
Positive slew rate on V pin above which is dV/dt_P  
dV/dt_th_2  
BOOT  
sensor triggered, VHB rising from 100 to 200 V linearly  
(Note 2)  
P
Positive slew rate on V  
sensor triggered, VHB rising from 200 to 400 V linearly  
(Note 2)  
pin above which is dV/dt_P  
16  
246  
280  
V/ms  
dV/dt_th_3  
BOOT  
N
N
N
Negative slew rate on V  
sensor triggered, VHB falling from 100 to 0 V linearly  
pin above which is dV/dt_N  
16  
16  
16  
163  
290  
250  
V/ms  
V/ms  
V/ms  
dV/dt_th_1  
dV/dt_th_2  
dV/dt_th_3  
BOOT  
Negative slew rate on V pin above which is dV/dt_N  
BOOT  
sensor triggered, VHB falling from 200 to 100 V linearly  
Negative slew rate on V pin above which is dV/dt_N  
BOOT  
sensor triggered, VHB falling from 400 to 200 V linearly  
www.onsemi.com  
5
NCP13992  
ELECTRICAL CHARACTERISTICS  
(For typical values Tj = 25°C, for min/max values Tj = −40°C to +125°C, Vcc = 12 V unless otherwise noted)  
Symbol  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
PFC MODE OUTPUT AND P ON/OFF ADJUST  
V
PFC MODE output voltage when application enters skip  
mode (inject 1 mA into the PFC MODE output)  
9
9
9
9
6.00  
0.1  
6.25  
V
V
PFC_M_OFF  
V
PFC MODE output voltage when V < V  
P ON/OFF  
5.75  
PFC_M_BO  
PFC_M_ON  
PFC_M_LIM  
FB  
(sink 1 mA current from PFC MODE output)  
V
PFC MODE output voltage when V > V  
V
V
FB  
P ON/OFF  
CC  
0.4  
(sink 20 mA current from PFC MODE output)  
I
PFC MODE output current limit (V  
< 2 V)  
0.7  
1.2  
1.85  
mA  
PFC MODE  
OVP/OTP  
V
V
OVP threshold voltage (V  
OTP threshold voltage (V  
going up)  
7
7
7
2.35  
0.76  
90  
2.50  
0.80  
95  
2.65  
0.84  
100  
V
V
OVP  
OTP  
OTP  
OVP/OTP  
going down)  
OVP/OTP  
I
OTP/OVP pin source current for external NTC – during  
normal operation  
mA  
I
OTP/OVP pin source current for external NTC – during  
startup  
7
180  
190  
200  
mA  
OTP_BOOST  
t
Internal filter for OVP comparator  
Internal filter for OTP comparator  
Blanking time for OTP input during startup  
7
7
7
7
7
32  
200  
14  
37  
330  
16  
44  
500  
18  
ms  
ms  
ms  
V
OVP_FILTER  
t
OTP_FILTER  
t
BLANK_OTP  
V
V
OVP/OTP pin clamping voltage @ I  
OVP/OTP pin clamping voltage @ I  
= 0 mA  
= 1 mA  
1.0  
1.8  
1.2  
2.4  
1.4  
3.0  
CLAMP_OVP/OTP_1  
CLAMP_OVP/OTP_2  
OVP/OTP  
OVP/OTP  
V
START−UP SEQUENCE PARAMETERS  
Initial Mlower DRV on−time duration  
t
12  
4.7  
0.72  
17  
4.9  
0.79  
20  
5.4  
0.88  
22  
ms  
ms  
ns  
1st_MLOWER_TON  
t
Initial Mupper DRV on−time duration  
On−time period increment during soft−start  
Soft−Start increment division ratio  
14  
1st_MUPPER_TON  
t
12, 14  
12, 14  
12, 14  
SS_INCREMENT  
K
4
SS_INCREMENT  
t
Time duration to restart IC if start−up phase is not finished  
0.45  
0.50  
0.55  
ms  
WATCHDOG  
FEEDBACK SECTION  
R
Internal pull−up resistor on FB pin  
5
5
5
5
15  
18  
25  
kW  
FB  
FB  
K
V
FB  
to internal current set point division ratio  
1.92  
4.60  
4.4  
2.00  
4.95  
4.6  
2.08  
5.30  
4.8  
V
Internal voltage reference on the FB pin  
V
FB_REF  
V
Internal clamp on FB input of On−time comparator referred  
to external FB pin voltage  
V
FB_CLAMP  
V
Skip comparator hysteresis  
5
5
148  
0.468  
0.595  
0.95  
174  
0.508  
0.635  
1.05  
222  
0.548  
0.675  
1.15  
mV  
V
FB_SKIP_HYST  
V
Feedback voltage thresholds to enter Light load mode  
Feedback voltage thresholds to exit Light load mode  
FB_LL_IN  
V
5
V
FB_LL_OUT  
1st_MLOWER_SKIP  
st  
t
On−time duration of 1 Mlower pulse when FB cross  
5, 12  
ms  
V
+ V  
threshold  
FB_SKIP_IN  
FB_SKIP_HYST  
st  
V
Internal FB level reduction during 1 Mupper pulse when  
5, 6, 14  
150  
mV  
1st_MUPPER_SKIP  
FB cross V  
+ V  
threshold (Note 2)  
FB_SKIP_IN  
FB_SKIP_HYST  
SKIP INPUT  
I
Internal Skip pin current source  
4
4
48  
50  
52  
10  
mA  
SKIP  
SKIP_LOAD_MAX  
C
Maximum loading capacitance for skip pin voltage filtering  
(Note 2)  
nF  
www.onsemi.com  
6
NCP13992  
ELECTRICAL CHARACTERISTICS  
(For typical values Tj = 25°C, for min/max values Tj = −40°C to +125°C, Vcc = 12 V unless otherwise noted)  
Symbol  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
QUIET−SKIP PARAMETERS  
t
The portion of previous MU on−time that is place for last ML  
pulse in pattern  
12  
50  
50  
5
%
%
LAST_ML_PATTERN  
t
The portion of previous MU on−time that is place for last ML  
pulse before the LL or skip mode is activated  
12  
LAST_ML_SKIP  
t
Skip burst off−time duration that is needed to increase num-  
ber of skipped valleys between following patterns  
12, 14  
12, 14  
12, 14  
ms  
ms  
ms  
GEAR_UP  
t
Skip burst on−time duration that is needed to decrease  
number of skipped valleys between following patterns  
15  
5
GEAR_DOWN  
t
Time duration to force valley count logic if valley is not de-  
tected  
4.5  
5.5  
VALLEY_WD  
t
Quiet Timer duration  
12, 14  
12, 14  
5
2
ms  
QS_timer  
N
N
N
N
Number of patterns adjustment when bust period is shorter  
than ¼ of QS_timer duration  
QS_1/4  
QS_2/4  
QS_3/4  
QS_4/4  
QS_INF  
Number of patterns adjustment when bust period is longer  
than ¼ and shorter than 2/4 of QS_timer duration  
12, 14  
12, 14  
12, 14  
12, 14  
12, 14  
14  
1
0
Number of patterns adjustment when bust period is longer  
than 2/4 and shorter than 3/4 of QS_timer duration  
Number of patterns adjustment when bust period is longer  
than 3/4 and shorter than 4/4 of QS_timer duration  
0
N
Number of patterns adjustment when bust period is longer  
than QS_timer duration  
−1  
1
N
Initial number of patterns placed when LL or skip mode is  
activated  
PATTERN_INIT  
N
Number of MU pulses during which FB_LL_IN cmp is  
blanked once VFB > VFB_LL_OUT  
60  
LL_blank  
FB FREEZE INPUT  
I
FB Freeze pin current source  
4
4
18  
20  
22  
10  
mA  
FB_Freeze  
FB_Freeze_LOAD_MAX  
C
Maximum loading capacitance for FB Freeze pin voltage  
filtering (Note 2)  
nF  
CURRENT SENSE INPUT SECTION  
On−time comparator delay to Mupper driver turn off  
t
5, 6  
250  
ns  
pd_CS  
V
FB  
= 2.5 V, V goes up from –2.5 V to 2.5 V with rising  
CS  
edge of 100 ns  
I
Current sense input leakage current for V  
=
CS  
3 V  
6
6
1
mA  
mV  
ns  
CS_LEAKAGE  
V
Current sense input offset voltage  
160  
360  
200  
440  
240  
540  
CS_OFFSET  
t
Leading edge blanking time of the on−time comparator  
output  
5, 6, 14  
LEB  
LFFGAIN  
Line Feed Forward current source transconductance  
3, 6  
0
mA/V  
(V  
> V )  
BO  
VBULK/PFC_FB  
FAULTS AND AUTO−RECOVERY TIMER  
t
Maximum on−time clamp  
12, 14  
7.3  
7.7  
1
8.4  
ms  
TON_MAX  
TON_MAX_COUNTER  
N
Number of TON_MAX events to confirm fault  
FB fault timer duration  
12,14  
t
5
6
160  
4.5  
200  
4.7  
5
240  
4.9  
ms  
V
FB_FAULT_TIMER  
V
FB voltage when FB fault is detected  
Number of CS_fault cmp. pulses to confirm CS fault  
CS voltage when CS fault is detected (NCP13992xA)  
FB_FAULT  
CS_FAULT_COUNTER  
N
V
2.5  
2.7  
2.9  
V
CS_FAULT  
www.onsemi.com  
7
NCP13992  
ELECTRICAL CHARACTERISTICS  
(For typical values Tj = 25°C, for min/max values Tj = −40°C to +125°C, Vcc = 12 V unless otherwise noted)  
Symbol  
Rating  
Pin  
Min  
Typ  
Max  
Unit  
FAULTS AND AUTO−RECOVERY TIMER  
t
Auto−recovery duration (common timer for all fault condition)  
0.8  
1
1.2  
s
A−REC_TIMER  
BROWN−OUT PROTECTION  
V
Brown−out turn−off threshold  
3
3
3
3
3
0.965  
4.1  
5
1.000  
5.0  
12  
1.035  
5.7  
V
BO  
I
Brown−out hysteresis current, V  
< V  
mA  
mV  
mA  
ms  
BO  
VBULK/PFC_FB  
BO  
V
Brown−Out comparator hysteresis  
Brown−Out input bias current  
BO filter duration  
25  
BO_HYST  
BO_BIAS  
I
0.05  
30  
t
10  
20  
BO_FILTR  
RAMP COMPENSATION  
RC  
Ramp compensation gain  
58  
82  
108  
mV/ms  
ms  
GAIN  
RC_SHIFT  
t
Ramp compensation time shift  
0.4  
TEMPERATURE SHUTDOWN PROTECTION  
T
Temperature shutdown T going up  
124  
30  
°C  
°C  
TSD  
TSD_HYST  
J
T
Temperature shutdown hysteresis  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. Guaranteed by design.  
3. Minimal resistance connected in series with bootstrap diode is 3.3 W  
IC OPTIONS  
Cumulative  
FB fault  
source  
OVP/OTP bias  
during skip  
FB fault timer/  
counter  
Option  
FB fault  
CS_FAULT  
TON_MAX  
OVP  
OTP  
NCP13992AA Auto−recovery  
Timer  
NO  
Auto−recovery Auto−recovery Latch Auto−recovery  
ON  
Dedicated  
Soft_start_-  
seq  
PFC_MODE  
skip status  
Option  
Dead time  
control  
Ramp comp  
status  
Skip mode  
Dead time fault BO status  
Active OFF ON  
NCP13992AA  
ON  
Quiet Skip  
Auto−recovery  
Without ramp  
shift  
ON  
ORDERING INFORMATION  
Device  
Package Marking  
Package  
SOIC−16, Less Pin 2 and 13 (Pb−free)  
Shipping  
NCP13992AADR2G  
NCP13992AA  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
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8
NCP13992  
VCC Management with High−voltage Startup Current  
Source  
The NCP13992 controller features a HV startup current  
source that allows fast startup time and extremely low  
standby power consumption. Two startup current levels  
over−temperature protection to prevent IC damage for any  
failure mode that may occur in the application. The HV  
startup current source is primarily enabled or disabled based  
on V level. The startup HV current source can be also  
CC  
enabled by BO_OK rising edge, auto−recovery timer end  
and TSD end event. The HV startup current source charges  
the VCC capacitor before IC start−up.  
(I  
and I  
) are provided by the system for safety in  
start1  
start2  
case of short circuit between VCC and GND pins. In  
addition, the HV startup current source features a dedicated  
Figure 4. Internal Connection of the VCC Management Block  
The NCP13992 controller disables the HV startup current  
when the die temperature reaches 130°C. At this  
temperature, I will be progressively to prevent the die  
source once the VCC pin voltage level reaches V  
CC_ON  
start2  
threshold – refer to Figure 4. The application then starts  
operation and the auxiliary winding maintains the voltage  
bias for the controller during normal and skip−mode  
operating modes. The IC operates in so called Dynamic Self  
Supply (DSS) mode when the bias from auxiliary winding  
temperature from rising above 130°C.  
Brown−out Protection − VBULK/PFC FB Input  
Resonant tank of an LLC converter is always designed to  
operate within a specific bulk voltage range. Operation  
below minimum bulk voltage level would result in current  
and temperature overstress of the converter power stage.  
The NCP13992 controller features a VBULK/PFC FB input  
in order to precisely adjust the bulk voltage turn−ON and  
turn−OFF levels. This Brown−Out protection (BO) greatly  
simplifies application level design.  
is not sufficient to keep the V voltage above V  
CC  
CC_OFF  
threshold (i.e. V voltage is cycling between V  
and  
CC  
CC_ON  
V
thresholds with no driver pulses on the output  
CC_OFF  
during positive V ramp). Please refer to Figure 23 through  
CC  
Figure 25 to find an illustration of the NCP13992 VCC  
management system under all operating conditions/modes.  
The HV startup current source features an independent  
over–temperature protection system to limit I  
current  
start2  
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9
 
NCP13992  
Figure 5. Internal Connection of the Brown−out Protection Block  
The internal circuitry shown in Figure 5 allows  
Vbulk_OFF * VBO  
Rupper + Rlower  
@
(eq. 4)  
monitoring the high−voltage input rail (V ).  
A
bulk  
VBO  
high−impedance resistive divider made of R  
and R  
upper  
lower  
Note that the VBULK/PFC FB pin is pulled down by an  
internal switch when the controller is in startup phase − i.e.  
when the V voltage ramps up from V < V  
resistors brings a portion of the V  
rail to the  
bulk  
VBULK/PFC FB pin. The Current sink (I ) is active below  
BO  
CC  
CC  
CC_RESET  
the bulk voltage turn−on level (V  
). Therefore, the  
bulk_ON  
towards the V  
level on the VCC pin. This feature  
CC_ON  
bulk voltage turn−on level is higher than defined by the  
division ratio of the resistive divider. To the contrary, when  
the internal BO_OK signal is high, i.e. the application is  
assures that the VBULK/PFC FB pin voltage will not ramp  
up before the IC operation starts. The I hysteresis current  
sink is activated and BO discharge switch is disabled once  
BO  
running, the I sink is disabled. The bulk voltage turn−off  
BO  
the  
V
CC  
voltage crosses  
V
CC_ON  
threshold. The  
threshold (V ) is then given by BO comparator  
bulk_OFF  
VBULK/PFC FB pin voltage then ramps up naturally  
according to the BO divider information. The BO  
comparator then authorizes or disables the LLC stage  
reference voltage directly on the resistor divider. The  
advantage of this solution is that the V threshold  
bulk_OFF  
precision is not affected by I  
tolerance.  
hysteresis current sink  
BO  
operation based on the actual V  
level.  
bulk  
The low I hysteresis current of the NCP13992 brown  
BO  
The V  
and V  
levels can be calculated  
bulk_ON  
bulk_OFF  
out protection system allows increasing the bulk voltage  
divider resistance and thus reduces the application power  
consumption during light load operation. On the other hand,  
the high impedance divider can be noise sensitive due to  
capacitive coupling to HV switching traces in the  
using equations below:  
The I is ON:  
BO  
(eq. 1)  
VBO ) VBOhyst  
+
Rlower  
Rlower ) Rupper  
Rlower @ Rupper  
Rlower ) Rupper  
@ ǒ  
Ǔ
Vbulk_ON  
@
* IBO  
application. This is why a filter (t  
) is added after the  
BO_FILTR  
BO comparator in order to increase the system noise  
immunity. Despite the internal filtering, it is also  
recommended to keep a good layout for BO divider resistors  
and use a small external filtering capacitor on the  
VBULK/PFC pin if precise BO detection wants to be  
achieved.  
The bulk voltage HV divider can be also used by a PFC  
front stage controller as a feedback sensing network (refer  
again to Figure 5). The shared bulk voltage resistor divider  
between PFC and LLC stage offers a way how to further  
reduce power losses during no−load operation. The  
NCP13992 features a PFC MODE pin that disconnects bias  
The I is OFF:  
BO  
Rlower  
Rlower ) Rupper  
VBO + Vbulk_OFF  
@
(eq. 2)  
One can extract R  
term from equation 2 and use it in  
lower  
equation 1 to get needed R  
value:  
upper  
Vbulk_ON@V  
BO * VBO * VBOhyst  
Vbulk_OFF  
Rlower  
+
(eq. 3)  
VBO  
IBO  
@
ǒ
1 *  
Ǔ
Vbulk_OFF  
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10  
 
NCP13992  
of the PFC stage during light load or fault mode operation.  
The controller is allowed to run when OVP/OTP input  
voltage is within this working window. The controller stops  
the operation, after filter time delay, when the OVP/OTP  
input voltage is out of the no−fault window. The controller  
then either latches−off or or starts an auto−recovery timer −  
depending on the IC version − and triggered the protection  
This technique further reduces the no−load power  
consumption down again since the power losses of voltage  
divider are not affected by the bulk voltage at all.  
Please refer to Figure 23 through Figure 25 for an  
illustration of NCP13992 Brown−out protection system in  
all operating conditions/modes.  
threshold (V  
or V ).  
OVP  
OTP  
The VBULK/PFC FB pin voltage is also used by Line  
Feed Forward block (LFF). Please refer to ON−time  
modulation and feedback loop block description for more  
information about LFF function.  
The internal current source I  
implementation by using a single negative temperature  
coefficient (NTC) thermistor. An active soft clamp  
allows a simple OTP  
OTP  
composed from V  
and R  
components prevents the  
clamp  
clamp  
OVP/OTP pin voltage from reaching the V  
threshold  
OVP  
Over−voltage and Over−temperature Protection  
when the pin is pulled up by the I  
current. An external  
OTP  
The OVP/OTP pin is a dedicated input to allow for a  
simple and cost effective implementation of two key  
protection features that are needed in adapter applications:  
over−voltage (OVP) and over−temperature (OTP)  
protections. Both of these protections can be either latched  
or auto−recovery– depending on the version of NCP13992.  
The OVP/OTP pin has two voltage threshold levels of  
pull*up current, higher than the pull*down capability of  
the internal clamp (V  
pull the OVP/OTP pin above V  
), has to be applied to  
threshold to activate the  
CLAMP_OVP/OTP  
OVP  
OVP protection. The t  
and t  
filters  
OVP_FILTER  
OTP_FILTER  
are implemented in the system to avoid any false triggering  
of the protections due to application noise and/or poor  
layout.  
detection (V  
and V ) that define a no−fault window.  
OTP  
OVP  
Figure 6. Internal Connection of OVP/OTP Input  
The OTP protection could be falsely triggered during  
controller startup due to the external filtering capacitor  
V falls below V  
threshold  
CC  
CC_OFF  
BO OK signal goes to low state (i.e. Brown−out  
charging current. Thus the t  
period has been  
BLANK_OTP  
condition occurs on the mains)  
implemented in the system to overcome such behavior. The  
OTP comparator output is ignored during t  
Fault signal is activated (Auto−recovery timer starts  
counting or Latch fault is present)  
BLANK_OTP  
period. In order to speed up the charging of the external  
filtering capacitor C connected to OVP/OTP pin,  
IC goes into the skip−mode operation (V  
FB_SKIP_IN  
OVP_OTP  
threshold was reached)  
the I  
current has been doubled to I . The  
OTP_BOOST  
OTP  
maximum value of filtering capacitor is 100 nF.  
The OVP/OTP ON signal is set after the following events:  
the V voltage exceeds the V threshold during  
IC option that keeps OVP/OTP block working during skip  
mode is also available. The IC consumption is increased for  
this version by OVP/OTP block bias.  
CC  
CC_ON  
The latched OVP or OTP versions of NCP13992 enters  
first start−up phase (after VCC pin voltage was below  
threshold)  
latched protection mode when V voltage cycles between  
CC  
V
CC_RESET  
V
CC_ON  
and V  
thresholds and no pulses are provided  
CC_OFF  
BO OK signal is received from BO block  
by drivers. The controller VCC pin voltage has to be cycled  
down below V threshold in order to restart  
Auto−recovery timer elapsed and a new restart occurs  
CC_RESET  
IC returns to operation from skip−mode (V  
+
operation. This would happen when the power supply is  
unplugged from the mains.  
FB_SKIP_IN  
V
threshold was reached)  
FB_SKIP_HYST  
The I  
current source is disabled when:  
OTP  
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11  
NCP13992  
st  
PFC MODE Output  
1 to control the external small signal HV MOSFET switch  
that connects the bulk voltage divider to the VBULK/PFC  
FB input  
The NCP13992 has PFC MODE pin that can be used to  
disable or enable PFC stage operation based on actual  
application operating state – please refer to Figure 7. The  
PFC MODE output pin can be used for two purposes:  
nd  
2
to control the PFC front stage controller operation via  
PFC controller supply pin  
Figure 7. Internal Connection of the PFC MODE Block  
ON−time Modulation and Feedback Loop Block  
There are two possible states of the PFC MODE output  
that can be placed by the controller based on the application  
operating conditions:  
Frequency modulation of today’s commercially available  
resonant mode controllers is based on the output voltage  
regulator feedback only. The feedback voltage (or current)  
of output regulator drives voltage (or current) controlled  
oscillator (VCO or CCO) in the controller. This method  
presents three main disadvantages:  
a) The PFC MODE output pin is pulled−down by an internal  
MOSFET switch before controller startup. This technique  
ensures minimum VCC pin current consumption in order to  
ramp V voltage in a short time from the HV startup  
CC  
st  
nd  
1
− The 2 order pole is present in small signal gain−phase  
current source. This approach speeds up the startup and  
restart time of an SMPS. The PFC MODE output pin is also  
pulled−down in protection mode during which the HV  
startup current source is operated in DSS mode. Application  
power consumption is reduced in both above cases.  
characteristics => the lower cross over frequency and worse  
transient response is imposed by the system when voltage  
mode control is used. There is no direct link to the actual  
primary current – i.e. no line feed forward mechanism which  
results in poor line transient response.  
b) The pull−down switch is disabled and controller connects  
VCC pin voltage to PFC MODE output with minimum  
nd  
2
– Precise VCO (or CCO) is needed to assure frequency  
clamps  
modulation with good reproducibility, f and f  
dropout (V  
).  
min  
max  
PFC_M_ON  
need to be adjusted for each design => need for an  
adjustment pin(s).  
The PFC MODE pin output current is limited when the  
VCC to PFC MODE bypass switch is activated. The current  
limitation avoids bypass switch damage during PFC VCC  
decoupling capacitor charging process or short circuit. A  
minimum value PFC VCC decoupling capacitance should  
be used in order to speed up PFC stage startup after it is  
enabled by the NCP13992 controller.  
rd  
3
– Dedicated overload protection system, requiring an  
additional pin, is needed to assure application safety during  
overload and/or secondary short circuit events.  
The NCP13992 resolves all disadvantages mentioned  
above by implementing a current mode control scheme that  
ensures best transient response performance and provides  
inherent cycle−by−cycle over−current protection feature in  
the same time. The current mode control principle used in  
this device can be seen in Figure 8.  
Please refer to Figure 23 through Figure 25 for an  
illustration of NCP13992 PFC operation control.  
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12  
 
NCP13992  
Figure 8. Internal Connection of the NCP13992 Current Mode Control Scheme  
The basic principle of current mode control scheme  
detection – please refer to chapter dedicated to short circuit  
implementation lies in the use of an ON−time comparator  
that defines upper switch on−time by comparing voltage  
ramp, derived from the current sense input voltage, to the  
divided feedback pin voltage. The upper switch on−time is  
then re−used for low side switch conduction period. The  
switching frequency is thus defined by the actual primary  
current and output load conditions. Digital processing with  
10 ns minimum on−time resolution is implemented to  
ensure high noise immunity. The ON−time comparator  
protection.  
The second input signal for the on−time comparator is  
derived from the FB pin voltage. This internal FB pin signal  
is also used for the following purposes: skip mode operation  
detection, PFC MODE control and overload / open FB pin  
fault detection. The detailed description of these functions  
can be found in each dedicated chapters. The internal  
pull−up resistor assures that the FB pin voltage increases  
when the optocoupler LED becomes less biased – i.e. when  
output load is increased. The higher FB pin voltage implies  
a higher reference level for on−time comparator i.e. longer  
Mupper switch on−time and thus also higher output power.  
The FB pin features a precise voltage clamp which limits the  
internal FB signal during overload and startup. The FB pin  
signal passes through the FB processing block before it is  
brought to the ON−time comparator input. The FB  
output is blanked by the leading edge blanking (t  
) after  
LEB  
the Mupper switch is turned−on. The ON−time comparator  
LEB period helps to avoid false triggering of the on−time  
modulation due to noise generated by the HB pin voltage  
transition.  
The voltage signal for current sense input is prepared  
externally via natural primary current integration by the  
resonant tank capacitor Cs. The resonant capacitor voltage  
is divided down by capacitive divider (Ccs1, Ccs2, Rcs1,  
Rcs2) before it is provided to the CS input. The capacitive  
divider division ratio, which is fully externally adjustable,  
defines the maximum primary current level that is reached  
in case of maximum feedback voltage – i.e. the capacitive  
divider division ration defines the maximum output power  
of the converter for given bulk voltage. The CS is a bipolar  
input pin which an input voltage swing is restricted to 5 V.  
A fixed voltage offset is internally added to the CS pin signal  
in order to assure enough voltage margin for operation the  
feedback optocoupler − the FB optocoupler saturation  
voltage is ~ 0.15 V (depending on type). However, the CS  
pin useful signal for frequency modulation swings from 0 V,  
so current mode regulation would not work under light load  
conditions if no offset would be added to the CS pin before  
it is stabilized to the level of the on−time comparator input.  
The CS pin signal is also used for secondary side short circuit  
processing block scales the FB signal down by a K ratio  
FB  
in order to limit the CS input dynamic voltage range. The  
scaled FB signal is then further processed by subtraction of  
a ramp compensation generator signal in order to ensure  
stability of the current mode control scheme. The divided  
internal FB signal is overridden by a Soft−start generator  
output voltage during device starts−up.  
The actual operating frequency of the converter is defined  
based on the CS pin and FB pin input signals. The maximum  
output power of the converter, under given input voltage, is  
limited by maximum internal FB voltage clamp that is  
reached when optocoupler provides no current. The  
maximum output power limit is bulk voltage dependent due  
to changing ratio between magnetizing and load primary  
current components. Line Feed Forward (LFF) system is  
implemented in the controller to compensate for maximum  
output power clamp variation. The I  
out from the Cs pin is BO/PFC FB pin voltage proportional  
current that flows  
LFF  
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13  
 
NCP13992  
and creates voltage offset on the resistor connected to the Cs  
only when BO pin voltage exceeds BO_OK threshold  
voltage.  
Please refer to Figure 9 and below description for better  
understanding of the NCP13992 frequency modulation  
system.  
pin. The higher input voltage, the higher drop is created on  
external resistor. The Mupper switch on−time is thus  
reduced for given maximum internal FB voltage clamp  
when input voltage increases. The I  
current is provided  
LFF  
Figure 9. NCP13992 On−time Modulation Principle  
Overload and Open FB Protections  
The Mupper switch is activated by the controller after  
dead−time (DT) period lapses in point A. The frequency  
processing block increments the ON−time counter with  
10 ns resolution until the internal CS signal crosses the  
internal FB set point for the ON−time comparator in point B.  
A DT period is then introduced by the controller to avoid any  
shoot−through current through the power stage switches.  
The DT period ends in point C and the controller activates  
the Mlower switch. The ON−time processing block  
decrements the ON_time counter down until it reaches zero.  
The Mlower switch is then turned−OFF at point D and the  
DT period is started. This approach results in perfect duty  
cycle symmetry for Mlower and Mupper switches. The  
Mupper switch on−time naturally increases and the  
operating frequency drops when the FB pin voltage is  
increased, i.e. when higher current is delivered by the  
converter output – sequence E.  
The resonant capacitor voltage and thus also CS pin  
voltage can be out of balance in some cases – this is the case  
during transition from full load to no−load operation when  
skip mode is not used or adjusted correctly. The current  
mode operation is not possible in such case because the  
ON−time comparator output stays active for several  
switching cycles. Thus a special logic has been implemented  
in NCP13992 in order to repeat the last valid on−time until  
the current mode operation recovers – i.e. until the CS pin  
signal balance is restored by the system.  
The overload protection and open FB pin detection are  
implemented via FB pin voltage monitoring in this  
controller. The FB fault comparator is triggered once the FB  
pin voltage reaches its maximum level and the V  
FB_FAULT  
threshold is exceeded. The fault timer or counter (depending  
on IC option) is then enabled – refer to Figure 10. The time  
period to the FB fault event confirmation is defined by the  
preselected t  
parameter when the fault  
FB_FAULT_TIMER  
timer option is used. The FB fault counter, once selected as  
a FB fault confirmation period source, defines the fault  
confirmation period via Mupper DRV pulses counting. The  
FB fault confirmation time is thus dependent on switching  
frequency. The fault timer/counter is reset once the FB fault  
condition diminishes. A digital noise filter has been added  
after the FB fault comparator to overcome false triggering of  
the FB fault timer/counter due to possible noise on the FB  
input. The noise filter has a period of 2 ms for FB fault  
timer/counter activation and 20 µs for reset/deactivation to  
assure high noise immunity. A cumulative timer/counter IC  
option is also available on request. The FB fault  
timer/counter is not reset when the FB fault condition  
diminishes in this case. The FB fault timer/counter is  
disabled and memorizes the fault period information. The  
cumulative FB fault timer/counter integrates all the FB fault  
events over the IC operation time. The Fault timer/counter  
can be reset via skip mode or VCC UVLO event.  
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14  
 
NCP13992  
Figure 10. Internal FB Fault Management  
The controller disables driver pulses and enters protection  
primary current is naturally limited by the NCP13992  
on−time modulation principle in this case. But the primary  
current increases when the output terminals are shorted. The  
NCP13992 controller will maintain zero voltage switching  
operation in such case, however high currents will flow  
through the power MOSFETS, transformer winding and  
secondary side rectification. The NCP13992 implements a  
dedicated secondary side short circuit protection system that  
will shut down the controller much faster than the regular FB  
fault event in order to limit the stress of the power stage  
components. The CS pin signal is monitored by the  
dedicated CS fault comparator − refer to Figure 8. The CS  
fault counter is incremented each time the CS fault  
comparator is triggered. The controller enters  
auto−recovery or latched protection mode (depending on IC  
option) in case the CS fault counter overflows refer to  
Figure 11. The CS fault counter is then reset once the CS  
fault comparator is inactive for at least 50 Mupper upcoming  
pulses. This digital filtering improves CS fault protection  
system noise immunity.  
mode once the FB fault event is confirmed by the FB fault  
timer or counter. Latched or auto−recovery operation is then  
triggered – depends on selected IC option. The controller  
adds an auto−recovery off−time period (t ) and  
A−REC_TIMER  
restarts the operation via soft start in case of auto−recovery  
option. The application temperature runaway is thus  
avoided in case of overload while the automatic restart is still  
possible once the overload condition disappears. The IC  
with latched FB fault option stays latched−off, supplied by  
the HV startup current source working in DSS mode, until  
the V  
threshold is reached on the VCC pin – i.e.  
CC_RESET  
until user re−connects power supply mains.  
Please refer to Figure 23 and Figure 24 for an illustration  
of the NCP13992 FB fault detection block.  
Secondary Short Circuit Detection  
The protection system described previously, implemented  
via FB pin voltage level detection, prevents continuous  
overload operation and/or open FB pin conditions. The  
Figure 11. NCP13992 CS Fault Principle  
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15  
 
NCP13992  
Dedicated Startup Sequence and Soft−Start  
Hard switching conditions can occur in a resonant SMPS  
application when the resonant tank operation is started with  
50% duty cycle symmetry – refer to Figure 12. This hard  
switching appears because the resonant tank initial  
conditions are not optimal for the clean startup.  
Figure 12. Hard Switching Cycle Appears in the LLC Application  
when Resonant Tank is Excited by 50% Duty Cycle during Startup  
The initial resonant capacitor voltage level can differ  
These facts show that a clean, hard switching free and  
parasitic oscillation free, startup of an LLC converter is not  
an easy task, and cannot be achieved by duty cycle  
imbalance and/or simple resonant capacitor pre−charge to  
Vbulk/2 level. These methods only work in specific startup  
conditions.  
This explains why the NCP13992 implements a  
proprietary startup sequence − see Figure 13 and Figure 14.  
The resonant capacitor is discharged down to 0 V before any  
application restart − except when restarting from skip mode.  
depending on how long delay was placed before application  
operation restart. The resonant capacitor voltage is close to  
zero level when application restarts after very long delay –  
for example several seconds, when the resonant capacitor is  
discharged by leakage to the power stage. However, the  
resonant capacitor voltage value can be anywhere between  
Vbulk and 0 V when the application restarts operation after  
a short period of time – like during periodical SMPS  
turn−on/off. Another factor that plays significant role during  
resonant power supply startup is the actual load impedance  
seen by the power stage during the first pulses of startup  
sequence. This impedance is not only defined by resonant  
tank components but also by the output loading conditions  
and actual output voltage level. The load impedance of  
resonant tank is low when the output is loaded and/or the  
output voltage is low enough to made secondary rectifies  
conducting during first switching cycles of startup phase.  
The resonant frequency of the resonant tank is given by the  
resonant capacitor capacitance and resonant inductance  
−note that the magnetizing inductance does not participate  
in resonance in this case. However, if the application  
starts−up when the output capacitors is charged and there is  
no load connected to the output, the secondary rectification  
diodes is not conducting during each switching cycle of  
startup sequence and thus the resonant frequency of resonant  
tank is affected also by the magnetizing inductance. In this  
case, the resonant frequency is much lower than in case of  
startup into loaded/discharged output.  
Figure 13. Initial Resonant Capacitor Discharge  
before Dedicated Startup Sequence is Placed  
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16  
 
NCP13992  
Figure 14. Dedicated Startup Sequence Detail  
The resonant capacitor discharging process is simply  
The startup period then depends on the previous condition.  
Another blank Mlower switch period is placed by the  
controller in case condition a) occurred. A normal Mlower  
driver pulse, with DC of 50% to previous Mupper DRV  
pulse, is placed in case condition b) is fulfilled.  
implemented by activating an internal current limited switch  
connected between the HB pin and IC ground – refer to  
Figure 13. This technique assures that the resonant capacitor  
energy is dissipated in the controller without ringing or  
oscillations that could swing the resonant capacitor voltage  
to a positive or negative level. The controller detects that the  
discharge process is complete via HB pin voltage level  
monitoring. The discharge switch is disabled once the HB  
The dedicated startup sequence is placed after the  
resonant capacitor is discharged (refer to Figure 13 and  
Figure 14) in order to exclude any hard switching cycles  
during the startup sequence. The first Mupper switch cycle  
in startup phase is always non−ZVS cycle because there is  
no energy in the resonant tank to prepare ZVS condition.  
However, there is no energy in the resonant tank at this time,  
there is also no possibility that the power stage MOSFET  
body diodes conducts any current. Thus the hard  
commutation of the body diode cannot occur in this case.  
The IC will not start and provide regular driver output  
pulses until it is placed into the target application, because  
the startup sequence cannot be finished until HB pin signal  
is detected by the system. The IC features a startup watchdog  
pin voltage drops below the V  
threshold.  
HB_MIN  
The dedicated startup sequence continues by activation of  
the Mlower driver output for Tl1 period (refer to Figure 14).  
This technique ensures that the bootstrap capacitor is fully  
charged before the first high−side driver pulse is introduced  
by the controller. The first Mupper switch on−time Tup1  
period is fixed and depends on the application parameters.  
This period can be adjusted internally – various IC options  
are available. The Mupper switch is released after T  
up1  
period and it is not followed by the Mlower switch  
activation. The controller waits for a new ZVS condition for  
Mupper switch instead and measures actual resonant tank  
conditions this way. The Mupper switch is then activated  
again after the Mlower blank period is used for measurement  
purposes. The second Mupper driver conduction period is  
then dependent on the previously measured conditions:  
1. The Mupper switch is activated for 3/2 of previous  
Mupper conduction period in case the measured  
timer (t ) which activates a dedicated startup  
WATCHDOG  
sequence periodically in case the IC is powered without  
application (during bench testing) or in case the startup  
sequence is not finished correctly. The IC will provide the  
first Mlower and first Mupper DRV pulses with a  
t
off−time in−between startup attempts.  
WATCHDOG  
Soft−start  
The dedicated startup sequence is complete when  
condition b) from previous chapter is fulfilled and the  
controller continues operation with the soft−start sequence.  
A fully digital non−linear soft−start sequence has been  
implemented in NCP13992 using a soft−start counter and  
D/A converter that are gradually incremented by the Mlower  
driver pulses. A block diagram of the NCP13992 soft−start  
system is shown in Figure 15.  
time between previous Mupper turn−off event and  
upper ZVS condition detection is twice higher than  
the the previous Mupper pulse conduction period  
2. The Mupper switch is activated for previous  
Mupper conduction period in case the measured  
time between previous Mupper turn−off event and  
upper ZVS condition detection is twice lower than  
the previous Mupper pulse conduction period  
www.onsemi.com  
17  
 
NCP13992  
Figure 15. Soft−start Block Internal Implementation  
The soft−start block subsystems and operation are  
4. The Maximum ON−time comparator compares the  
described below:  
actual ON−time counter value with the maximum on−time  
value (t  
) and activates the latch (or auto−recovery)  
TON_MAX  
1. The Soft−Start counter is a unidirectional counter that is  
loaded with the last Mupper on−time value that is reached at  
the dedicated startup sequence end (i.e. during condition b  
occurrence explained in previous chapter). The on−time  
period used in the initial period of the soft−start sequence is  
affected by the first Mupper on−time period selection and  
the dedicated startup sequence processing. The Soft−Start  
counter counts up from this initial on time period to its  
maximum value which corresponds to the IC maximum  
on−time. The Soft−Start counter is incremented by the  
protection mode once IC detect requested number of  
TON_MAX events. The minimum operating frequency of  
the controller is defined the same way. The Maximum  
ON−time comparator reference is loaded by the Soft−Start  
counter value on each switching cycle during soft−start. The  
Maximum ON−time fault signal is ignored during  
Soft−Start operation. The converter Mupper switch on−time  
(and thus operating frequency) is thus defined by the  
Soft−Start counter value indirectly – via Maximum  
ON−time comparator. The Mupper switch on−time is  
soft−start increment number (t  
) during each  
SS_INCREMENT  
increased until the Soft−Start counter reaches t  
TON_MAX  
Mlower switch on−time period. The soft−start start  
increment, selectable via IC option, thus affects the  
soft−start time duration. The Mlower clock signal for the  
Soft−Start counter can be divided down by the SS clock  
period and Maximum on−time protection is activated, or  
until ON−time comparator takes action and overrides the  
Maximum ON−time comparator.  
divider (K  
) in case the soft−start period needs  
5. The Soft−Start D/A converter generates a soft−start  
voltage ramp for ON−time comparator input synchronously  
with Soft−Start counter incrementing. The internal FB  
signal for ON−time comparator input is artificially  
pulled−down and then ramped−up gradually when soft−start  
period is placed by the system – refer to Figure 16. The FB  
loop is supposed to take over at certain point when  
regulation loop is closed and output gets regulated so that  
soft−start has no other effect on the on−time modulation.  
The Soft−Start counter continues counting−up until it  
reaches its maximum value which corresponds to the IC  
maximum on−time value – i.e. the IC minimum operating  
frequency. The Soft−Start period is terminated (i.e. counter  
is loaded to its maximum) when the FB pin voltage drops  
SS_INCREMENT  
to be prolonged further – this can be also done via IC option  
selection. The Soft−Start period is terminated (i.e. the  
counter is loaded to its maximum) when the FB pin voltage  
drops below V  
level.  
FB_SKIP_IN  
2. The ON−time counter is a bidirectional counter that is  
used as a main system counter for on−time modulation  
during soft−start, normal operation or overload conditions.  
The ON−time counter counts−up during Mupper switch  
conduction period and then counts down to zero – defining  
Mlower switch conduction period. This technique assures  
perfect 50% duty cycle symmetry for both power switches  
as afore mentioned. The ON−time counter count−up mode  
can be switched to the count−down mode by either of two  
st  
below V  
level. The D/A converter output evolve  
FB_SKIP_IN  
events: 1 when the ON−time counter value reaches the  
nd  
accordingly to the Soft−Start counter as it is loaded from its  
output data bus.  
maximum on−time value (t  
Mupper on−time is terminated based on the current sense  
input information.  
) or 2 when the actual  
TON_MAX  
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18  
NCP13992  
Figure 16. Soft Start Behavior  
The Controller Operation during Soft−start Sequence  
Evolves as Follows:  
and saturates at its maximum possible value which  
corresponds to IC minimum operating frequency. The  
maximum on−time fault detection system is enabled when  
The Soft−Start counter is loaded by last Mupper on−time  
value at the end of the dedicated startup sequence. The  
ON−time counter is released and starts count−up from zero  
until the value that is equal to the actual Soft−Start counter  
state. The Mupper switch is active during the time when  
ON−time counter counts−up. The Maximum ON−time  
comparator then changes counting mode of the ON−time  
comparator from count−up to count−down. A dead−time is  
placed and the Mlower switch is activated till the ON−time  
counter reaches zero value. The Soft−Start counter is  
incremented by selected increment during corresponding  
Mlower on−time period so that the following Mupper switch  
on−time is prolonged automatically – the frequency thus  
drops naturally. Because the operating frequency of the  
controller drops and Mlower DRV signal is used as a clock  
source for the Soft−start counter, the soft−start speed starts  
to decrease on each (or on each N−th) Mlower driver pulse  
Soft−Start counter value is equal to t  
value.  
TON_MAX  
The previous on−time repetition feature, described above  
in the ON−time modulation and feedback loop chapter, is  
disabled in the beginning of soft start period. This is because  
the ON−time comparator output stays high for several cycles  
of soft start period – until the current mode regulation takes  
over. The previous on−time repetition feature is enabled  
once the current modulation starts to work fully, i.e. in the  
time when the ON−time comparator output periodically  
drops to low state within actual Mupper switch on−time  
period. Typical startup waveform of the LLC application  
driven by NCP13992 controller can be seen in Figure 17.  
(where N is defined by K ) of switching cycle.  
SS_INCREMENT  
So we have non−linear soft−start that helps to speed up  
output charging in the beginning of the soft−start operation  
and reduces the output voltage slope when the output is close  
to the regulation level. The output bus of the Soft−Start  
counter addresses the D/A converter that defines the  
ON−time comparator reference voltage. This reference  
voltage thus also increases non−linearly from initial zero  
level until the level at which the current mode regulation  
starts to work. The on−time of the Mupper and Mlower  
switch is then defined by the ON−time comparator action  
instead of the Maximum ON−time comparator. The  
soft−start then continues until the regulation loop is closed  
and the on−time is fully controlled by the secondary  
regulator. The Soft−Start counter then continues in counting  
Figure 17. Application Startup with NCP13992 −  
Primary Current − Green, Vout − Magenta  
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19  
 
NCP13992  
Skip Mode Operation  
preselected level. Zero voltage switching technique is still  
present for the power switches to achieve high light load  
efficiency. Quiet skip mode operation is initiated when load  
drops further and FB voltage drops below another FB  
threshold that is user adjustable on the skip pin. The  
frequency of skip burst is regulated by internal digital  
controller around preselected quiet skip frequency clamp in  
order to reduce acoustic noise. The skip frequency then  
drops to very low values during no−load conditions. Refer  
to Figure 18, Figure 19 and Figure 20 for typical application  
waveforms during light load and quiet skip mode operating  
modes.  
Then NCP13992 implements proprietary light load and  
quiet skip mode operating techniques that improve light load  
efficiency, reduce no−load power consumption and  
significantly reduce acoustic noise. Controller uses 50%  
duty cycle symmetry under full and medium load  
conditions. Normal current mode frequency modulation  
takes place during this operating mode – refer to on−time  
processing section of this datasheet. The 50% duty cycle  
symmetry operating mode is replaced by continues  
operation with minimum switching patterns repeated after  
controlled amount of off−time when load is decreased below  
Figure 18. No−load Operation  
Figure 19. Quiet Skip Mode Operation  
Figure 20. Light−load Operation  
The High Voltage Half−bridge Driver  
resistor Rboot value is 3.3 W. Figure 21 shows the internal  
The driver features a traditional bootstrap circuitry,  
requiring an external high voltage diode with resistor in  
series for the capacitor refueling path. Minimum series  
architecture of the drivers section. The device incorporates  
an upper UVLO circuitry that makes sure enough V is  
GS  
available for the upper side MOSFET.  
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20  
 
NCP13992  
HV  
Vboot  
Cboot  
Internal Mupper  
Pulse  
Trigger  
Level  
Shifter  
S
Mupper  
Q
Q
R
HB  
dV/dt_P signal  
dV/dt_N signal  
dV/dt  
detector  
UVLO  
Rboot  
HB  
discharger  
HB disch. activation  
Dboot  
V
CC  
aux  
V
CC  
Fault  
Mlower  
GND  
Internal Mlower  
Delay  
+
Figure 21. The NCP13992 Internal DRVs Structure  
The internal dV/dt sensor, connected to the VBOOT pin,  
detects the HB pin voltage transitions in order to setup the  
optimum DT period – please refer to Dead−Time chapter.  
The internal HV discharge switch is connected to the HB pin  
and discharges resonant capacitor before application  
startup. The current through the switch is regulated to  
I
level until the V  
threshold voltage is  
DISCHARGE  
HB_MIN  
reached on the HB pin. The discharge system assures always  
the same startup conditions for application – regardless of  
previous operating state.  
As stated in the maximum ratings section, the floating  
portion can go up to 620 VDC on the BOOT pin. This  
voltage range makes the IC perfectly suitable for offline  
applications featuring a 400 V PFC front stage.  
Automatic Dead−time Adjust  
The dead−time period between the Mupper and Mlower  
drivers is always needed in half bridge topologies to prevent  
any cross conduction through the power stage MOSFETs  
that would result in excessive current, high EMI noise  
generation or total destruction of the application. Fixed  
dead−time period is often used in the resonant converters  
because this approach is simple to implement. However, this  
method does not ensure optimum operating conditions in  
resonant topologies because the magnetizing current is  
changing with line and load conditions. The optimum  
dead−time, under a given operating conditions, is equal to  
the time that is needed for bridge voltage to transition  
between upper and lower states and vice versa – refer to  
Figure 22.  
Figure 22. Optimum Dead−time Period Adjust  
The MOSFET body diode conduction time is minimized  
when optimum dead−time period is used which results in  
maximum efficiency of a resonant converter power stage.  
There are several methods to determine the optimum  
dead−time period or to approximate it (for example using  
auxiliary winding on main transformer or modulating  
dead−time period with operating frequency of the  
converter). These approaches however require a dedicated  
pin for nominal dead−time adjust or auxiliary winding  
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21  
 
NCP13992  
voltage sensing. The NCP13992 uses a dedicated method  
2. The controller is latched−off in case the ZSV  
condition is not detected within selected  
that senses the VBOOT pin voltage internally and adjusts the  
optimum dead−time period with respect to the actual  
operating conditions of the converter. The high−voltage  
dV/dt detector, connected to the VBOOT pin, delivers two  
internal digital signals that are indicating Mupper to Mlower  
and Mlower to Mupper transitions that occur on the HB and  
VBOOT pins after the corresponding MOSFET switch is  
turned−off. The controller enables the opposite MOSFET in  
the power stage once the corresponding dV/dt sensor output  
provides information about HB (or VBOOT) pin transition  
ends.  
t
period  
DEAD_TIME_MAX  
3. The controller stops operation and restarts  
operation after auto−recovery period in case the  
ZSV condition has not been detected within the  
selected t  
period  
DEAD_TIME_MAX  
A DT fault counter option is available. Selected number  
(N ) or DT fault events have to occur in order to  
DT_MAX  
confirm DT fault in this case.  
A fixed DT option is also available for this device. The  
internal dV/dt sensor signal is not used for this device option  
The ZVS transition on the bridge pin (HB) could take a  
longer time or even does not finish in some cases – for  
example with extremely low bulk voltage or when some  
critical failure occurs. This situation should not occur  
normally in correctly designed application because several  
other protections would prevent such a situation. The  
NCP13992 implements maximum DT period clamp that  
and the t  
period is used as a regular DT  
DEAD_TIME_MAX  
period instead. The DT fault detection is disabled in this  
case.  
Temperature Shutdown  
The NCP13992 includes a temperature shutdown  
protection. The typical TSD hysteresis is 30°C. When the  
temperature rises above the upper threshold, the controller  
stops switching instantaneously, and goes into the off−mode  
limits driver’s off−time period to the t  
DEAD_TIME_MAX  
value. The corresponding MOSFET driver is forced to  
turn−on by the internal logic regardless of missing dV/dt  
sensor signal. This situation does not occur during normal  
operation and will be considered a fault state by the device.  
There are several possibilities on how the controller  
continues operation after this event occurrence – depending  
on the IC option:  
with extremely low power consumption. The V supply is  
CC  
maintained (by operating the HV start−up in DSS mode) in  
order to memorize the TSD event information. When the  
temperature falls below the lower threshold, the full restart  
(including soft−start) is initiated by the controller. The HV  
startup current source features an independent  
over−temperature protection which limits its output current  
in case the DIE temperature exceeds TSD to avoid damage  
to the HV startup silicon structure.  
1. The opposite MOSFET switch is forced to turn−on  
when t  
period elapses and no  
DEAD_TIME_MAX  
fault is generated  
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22  
NCP13992  
APPLICATION INFORMATION  
Controller Operation Sequencing of NCP13992 LLC  
Controller  
The paragraphs below describe controller operation  
sequencing under several typical cases as well as transitions  
between them.  
for the feedback block. The VCC management controls the  
HV startup in DSS mode in order to keep enough VCC level  
to hold the latch−up state memorized while the application  
remains plugged−in to the mains.  
The power supply is removed from the mains at point H  
and the VCC voltage drops down below V  
level  
CC_RESET  
1. Application start, Brown−out off and restart,  
OVP/OTP latch and then restart – Figure 23  
Application is connected to the mains at point A thus the  
HV input of the controller becomes biased. The HV startup  
thus the low voltage controller is released from latch. A new  
application start occurs when the user plugs the application  
the mains again.  
current source starts charged VCC capacitor until V  
CC  
2. Application start, Brown−out off and restart, output  
short fault with auto−recovery restart – Figure 24  
Operating waveforms descriptions for this figure is  
similar to one for Figure 23 from point A till point G – with  
reaches V  
threshold.  
CC_ON  
The VCC pin voltage reached V  
threshold in point  
CC_ON  
B. The BO, FB, OVP/OTP and PFC MODE blocks are  
enabled. The VBULK/PFC FB pin starts to receive divided  
bulk voltage as the external HV switch is activated by PFC  
one difference. The skip mode operation (FB  
<
V
) blocks the IC startup after first V event  
FB_SKIP_IN  
CC_ON  
MODE output. The V blank is activated during each  
CC  
instead of BO_fault.  
V
CC_ON  
event to ensure that the internal logic ignores all  
The LLC converter operation is stopped in point G  
because the controller detects an overload condition (short  
circuit event in this case as the Vout drops abruptly). The  
controller disables all blocks except for the FB block and the  
fault logic. The HV startup DSS operation is initiated in  
order to keep enough VCC level for all internal blocks that  
need to be biased. Internal auto−recovery timer counts down  
fault inputs until the internal blocks are fully biased and  
stabilized after a V event. The IC DRVs were not  
CC_ON  
enabled after first V blank period in this case as the  
CC  
voltage on VBULK/PFC FB is below V level. The IC  
BO  
keeps all internal blocks biased and operates in the DSS  
(Dynamic Self−Supply) mode as long as the fault conditions  
is still present.  
the recovery delay period t  
.
A−REC_TIMER  
The BO_OK condition is received (voltage on  
The auto−recovery restart delay period lapses at point H.  
The HV startup current source is activated to recharge VCC  
capacitor before a new restart.  
VBULK/PFC FB reach V  
level) at point C. The IC  
BO  
activates the startup current source to refill VCC capacitor  
in order to assure sufficient energy for a new startup. The  
The V  
threshold is reached in point I and all the  
CC_ON  
VCC capacitor voltage reaches V  
level again and the  
CC_ON  
internal blocks are biased. The V blank and OVP/OTP  
CC  
VCC blank period is started. The DRVs are enabled and the  
blank period are started at the same time. The LLC converter  
operation is enabled, including a dedicated startup and  
soft−start period. The output short circuit is removed in  
between thus the Vout ramped−up and the FB loop took over  
during the LLC converter soft−start period.  
application is started after V blank period lapses because  
CC  
there is no faults condition at that time.  
Line and also bulk voltage drops at point D so the BO_OK  
signal become low (voltage on VBULK/PFC FB drops  
below V level). The LLC DRVs are disabled as well as  
BO  
3. Startup, skip−mode operation, low line detection  
and restart into skip−mode – Figure 25  
The application is plugged into the mains at point A thus  
the HV input of the controller becomes biased. The HV  
startup current source starts charging the VCC capacitor  
OVP/OTP block bias. The PFC MODE output stay high to  
keep the bulk voltage divider connected, so the BO block  
still monitors the bulk voltage. The controller activates the  
HV startup current source into DSS mode to keep enough  
VCC voltage for operation of all blocks that are active while  
the IC is waiting for BO_OK condition.  
until V reaches the V  
threshold.  
CC  
CC_ON  
The VCC pin voltage reaches the V  
threshold at  
CC_ON  
The line voltage and thus also bulk voltage increase at  
point E so the Brown−out block provide the BO_OK signal  
point B. The BO, FB, OVP/OTP and PFC MODE blocks are  
enabled. The VBULK/PFC FB pin begins to receive divided  
bulk voltage as the external HV switch is activated by the  
once the V level is reached. The startup current source is  
BO  
activated after BO_OK signal is received to charge the VCC  
capacitor for a new restart.  
PFC MODE output. The V  
blank period is activated  
CC  
during each V  
events. This blank ensures that the  
CC_ON  
The V  
level is reached in point F. The OVP/OTP  
CC_ON  
internal logic ignores all fault inputs until the internal blocks  
are fully biased and stabilized after V event. The IC  
block is biased and the VCC blank period is started at the  
same time. The controller restores operation via the regular  
startup sequence and soft−start after VCC blank period  
lapses since there is no fault condition detected.  
The application then operates normally until the  
OVP/OTP input is pulled−up at point G. The controller then  
enters latch−off mode in which all blocks are disabled except  
CC_ON  
DRVs are not enabled even after V blank period ends  
CC  
because the OVP fault condition is present. The OVP fault  
condition disappears after some time so the HV startup  
current source is enabled to prepare enough V for a new  
CC  
startup attempt. The new V blank and OTP blank periods  
CC  
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23  
NCP13992  
are placed after the V  
event is detected. The controller  
V
level during skip mode. The device would enters  
CC_ON  
CC_OFF  
authorizes DRVs at point C as there are no faults conditions  
into off−mode.  
present after the V blank period elapses. The load current  
is reduced thus the FB loop reduces the primary controller  
FB pin voltage.  
The line voltage drops in point F, but the bulk voltage is  
dropping slowly as there is nearly no consumption from the  
bulk capacitor during skip mode – only some refilling bursts  
are provided by the controller. The application thus  
continues in skip mode operation for several skip burst  
cycles.  
CC  
The load diminished further and the FB skip threshold is  
reached in point D. The controller turns−off all the blocks  
that are not essential for the controller operation during  
skip−mode – i.e. all blocks except FB block and VCC  
management. This technique is used to minimize the device  
consumption when there are no driver pulses during  
skip−mode operation. The output voltage then drops  
naturally and the FB loop reflects this change into the  
primary FB pin voltage that increases accordingly. The  
auxiliary winding is refilling VCC capacitor during each  
skip burst thus the controller is supplied from the application  
during the skip mode operation.  
The controller FB skip−out threshold is reached in point  
E; the controller enables all blocks and LLC DRVs to refill  
the output capacitor. The controller did not activate the HV  
startup current source because there is enough voltage  
present on the VCC pin during skip mode. The OTP blank  
periods is activated at the beginning of the skip burst to mask  
possible OTP faults.  
The bulk voltage level less than V threshold is detected  
BO  
by the controller in point G during one of the skip burst  
pulses. The controller thus disabled DRVs and enters DSS  
mode of operation in which the OVP/OTP block is disabled  
and the controller is waiting for BO_OK event. The PFC  
MODE provides the V  
voltage in this case to  
PFC_M_ON  
allow the PFC stage to refill bulk capacitors.  
The line voltage is increased at point H thus the controller  
receives the BO_OK signal. The BO_OK signal is received  
during the period in which the HV startup current source is  
active and refills the VCC capacitor.  
This V  
threshold is reached by the VCC pin at point  
CC_ON  
I. The V blank period and OVP/OTP blank period are  
CC  
started at the same time. The full startup sequence is enabled  
at the end of the V blank period as no fault is detected. The  
CC  
application then enters skip mode again as the load current  
is low.  
Note: The VCC capacitor needs to be chosen with a value  
high enough to ensure that V will not drop below the  
CC  
www.onsemi.com  
24  
NCP13992  
Figure 23. Application Start, Brown−out Off and Restart, OVP/OTP Latch and then Restart  
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25  
NCP13992  
Figure 24. Application Start, Brown−out Off and Restart, Output Short Fault with Auto−recovery Restart  
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26  
NCP13992  
Figure 25. Startup, Skip−mode Operation, Low Line Detection and Restart into Skip  
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27  
NCP13992  
PACKAGE DIMENSIONS  
SOIC−16 NB MISSING PINS 2 AND 13  
CASE 751DU  
ISSUE O  
NOTE 5  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
D
A
2X  
16  
9
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.  
ALLOWABLE PROTRUSION SHALL BE 0.10 mm IN EXCESS OF  
MAXIMUM MATERIAL CONDITION.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS  
OR GATE BURRS SHALL NOT EXCEED 0.25 mm PER SIDE.  
DIMENSIONS D AND E ARE DETERMINED AT DATUM F.  
5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F.  
6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING  
PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.  
0.10 C D  
F
NOTE 4  
E
E1  
NOTE 6  
A1  
L
L2  
1
8
0.20 C  
SEATING  
PLANE  
C
MILLIMETERS  
B
NOTE 5  
14X b  
DETAIL A  
2X 4 TIPS  
DIM MIN  
MAX  
1.75  
0.25  
0.49  
0.25  
10.00  
M
0.25  
C A-B D  
A
A1  
b
1.35  
0.10  
0.35  
0.17  
9.80  
TOP VIEW  
2X  
c
0.10 C A-B  
0.10 C  
DETAIL A  
D
D
E
6.00 BSC  
0.10 C  
E1  
e
3.90 BSC  
1.27 BSC  
L
0.40  
1.27  
0.203 BSC  
L2  
e
END VIEW  
A
SEATING  
C
PLANE  
SIDE VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT  
14X  
1.52  
16  
1
9
7.00  
8
14X  
0.60  
1.27  
PITCH  
DIMENSIONS: MILLIMETERS  
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