NCN3411MTTWG [ONSEMI]
数据开关，4 沟道差分，1:2 Mux/Demux，用于 PCI Express Gen3;
| 型号： | NCN3411MTTWG |
| 厂家： | 
ONSEMI |
| 描述： | 数据开关，4 沟道差分，1:2 Mux/Demux，用于 PCI Express Gen3 开关 PC |
| 文件： | 总11页 (文件大小：579K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCN3411
4-Differential Channel 1:2
Mux/Demux Switch for
PCI Express Gen3
The NCN3411 is a 4−Channel differential SPDT switch designed to
route PCI Express Gen3 signals. When used in a PCI Express
application, the switch can handle up to two PCIe lanes. Due to the
ultra−low ON−state capacitance (2 pF typ) and resistance (7.5 W typ),
these switches are ideal for switching high frequency data signals up to
a signal bit rate of 8 Gbps. This switch pinout is designed to be used in
BTX form factor desktop PCs and is available in a space−saving 3.5 x
9 x 0.75 mm WQFN42 package.
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MARKING
DIAGRAM
NCN3411
AWLYYWWG
1
Features
WQFN42
CASE 510AP
• V Power Supply from 1.5 V to 2.0 V
DD
• 4 Differential Channels 2:1 MUX/DEMUX
• Compatible with PCIe 3.0
XXXXX = Specific Device Code
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
• Data Rate: Supports 8 Gbps
WL
YY
WW
G
• Low Crosstalk −30 dB @ 4 GHz
• Low Bit−to−Bit Skew: 5 ps
• Low R Resistance: 13 W max
ON
• Low C Capacitance: 2 pF
ON
• Low Supply Current: 200 mA
• Off Isolation: −20 dB @ 4 GHz
• Space Saving Small WQFN−42 Package
• This is a Pb−Free Device
ORDERING INFORMATION
†
Device
Package
Shipping
NCN3411MTTWG WQFN42 2000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Typical Applications
• Notebook Computer
• Desktop computer
• Server/Storage Area Network
B0 +/−
B1 +/−
A0 +/−
A1 +/−
A2 +/−
A3 +/−
B2 +/−
B3 +/−
C0 +/−
C1 +/−
C2 +/−
C3 +/−
PCI Express
Controller
NCN3411
Figure 1. Application Schematic
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
September, 2011 − Rev. 0
NCN3411/D
NCN3411
A0+
A0−
A1+
A1−
B0+
B0−
B1+
B1−
C0+
C0−
C1+
C1−
A2+
A2−
A3+
A3−
B2+
B2−
B3+
B3−
C2+
C2−
C3+
C3−
SEL
Figure 2. NCN3411 Functional Block Diagram
(Top View)
TRUTH TABLE
Function
SEL
L
A
N
N
to B
N
A
to C
H
N
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2
NCN3411
GND
A0+
1
2
38 B0+
37 B0−
A0−
3
36 B1+
4
5
35 B1−
GND
VDD
34 C0+
A1+
A1−
VDD
SEL
6
7
8
9
33 C0−
32 C1+
31 C1−
30 VDD
Exposed Pad
on
Underside
(Connect to Gnd)
GND
A2+
10
11
29 B2+
28 B2−
27 B3+
26 B3−
25 C2+
24 C2−
A2− 12
VDD
GND
A3+
13
14
15
A3− 16
23 C3+
GND
17
22 C3−
Figure 3. Pin Description
(Top View)
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3
NCN3411
PIN FUNCTION AND DESCRIPTION
Pin
Pin Name
Description
2
3
A0+
Signal I/0, Channel 0, Port A
Signal I/0, Channel 1, Port A
Signal I/0, Channel 2, Port A
Signal I/0, Channel 3, Port A
Signal I/0, Channel 0, Port B
Signal I/0, Channel 1, Port B
Signal I/0, Channel 2, Port B
Signal I/0, Channel 3, Port B
Signal I/0, Channel 0, Port C
Signal I/0, Channel 1, Port C
Signal I/0, Channel 2, Port C
Signal I/0, Channel 3, Port C
A0−
6
7
A1+
A1−
11
12
A2+
A2−
15
16
A3+
A3−
38
37
B0+
B0−
36
35
B1+
B1−
29
28
B2+
B2−
27
26
B3+
B3−
34
33
C0+
C0−
32
31
C1+
C1−
25
24
C2+
C2−
23
22
C3+
C3−
9
SEL
VDD
GND
−
Operational Mode Select (When SEL = 0: A → B,
When SEL = 1: A → C)
5, 8, 13, 18, 20, 30,
40, 42
DC Supply: 1.5 V to 2.0 V
1, 4, 10, 14, 17, 19,
21, 39, 41
Power Ground
Exposed Pad
The exposed pad on the backside of package is internally connected to GND. Externally
the pad should also be user−connected to GND.
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4
NCN3411
MAXIMUM RATINGS
Parameter
Symbol
Rating
Units
Power Supply Voltage
V
−0.5 to 2.5
V
V
V
DD
DC
DC
DC
Input/Output Voltage Range of the Switch (A , B , C )
V
−0.5 to V
−0.5 to V
120
N
N
N
IS
DD
DD
Selection Pin Voltages
V
SEL
Continuous Current Through One Switch
Maximum Junction Temperature (Note 1)
Operating Ambient Temperature
Storage Temperature Range
I
cc
mA
°C
°C
°C
°C/W
mA
V
T
150
J
T
−40 to +85
−65 to +150
75
A
T
stg
Thermal Resistance, Junction−to−Air
Latch−up Current (Note 2)
R
q
JA
I
LU
100
Human Body Model (HBM) ESD Rating (Note 3)
Machine Model (MM) ESD Rating (Note 3)
Moisture Sensitivity (Note 4)
ESD HBM
ESD MM
MSL
7000
400
V
Level 1
−
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Power dissipation must be considered to ensure maximum junction temperature (T ) is not exceeded.
J
2. Latch up Current Maximum Rating: 100 mA per JEDEC standard: JESD78.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) 7.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) 400 V per JEDEC standard: JESD22−A115 for all pins.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
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5
NCN3411
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE (T = −40°C to +85°C, V = 1.5 V to 2.0 V, GND = 0V)
A
DD
Symbol
Pins
Parameters
Conditions (Note 5)
Min.
Typ
Max.
Units
(Note 6)
POWER SUPPLY
V
V
DD
V
DD
, GND
, GND
Supply Voltage Range
With respect to GND
1.5
1.8
2.0
V
DD
DD
I
Quiescent Supply Current
V
DD
= 2 V, V
= GND or V
DD
200
300
mA
SEL
DATA SWITCH PERFORMANCE
V
A , B , C
Data Input/Output
Voltage Range
0
1.2
13
V
W
IS
N
N
N
R
R
B
N
On Resistance (B )
V
DD
V
DD
V
DD
V
DD
= 1.5 V, V = 0 V to 1.2 V,
7.5
8.0
0.1
0.1
ON
ON
N
IS
I
= 15 mA
IS
C
N
B
N
C
N
B
N
C
N
On Resistance (C )
= 1.5 V, V = 0 V to 1.2 V,
13
W
N
IS
I
IS
= 15 mA
R
R
On Resistance Flatness
On Resistance Flatness
On Resistance
= 1.5 V, V = 0 V to 1.2 V,
1.24
1.24
0.35
0.35
W
ON(flat)
ON(flat)
IS
I
IS
= 15 mA (Note 7)
= 1.5 V, V = 0 V to 1.2 V,
W
IS
I
IS
= 15 mA (Note 7)
DR
DR
V
= 1.5 V, V = 0 V,
W
ON
ON
DD
IS
IS
Matching(B )
I
= 15 mA (Note 7)
N
On Resistance
V
= 1.5 V, V = 0 V,
W
DD
IS
IS
Matching(C )
I
= 15 mA (Note 7)
N
C
A
to B ,
On Capacitance
f = 1 MHz, Switch On, Open
Output
2.0
1.5
pF
pF
mA
ON
N
N
N
A
to C
N
C
A
to B ,
Off Capacitance
f = 1 MHz, Switch Off
OFF
ON
N
N
A
to C
N
N
I
A
to B ,
On Leakage Current
V
V
= 2 V, V = 0 V, 1.2 V, Switch
−1
−1
+1
+1
N
N
DD
AN
A
to C
On to B /C , B /C pins are
N
N
N N N N
unconnected
= 2 V, V = 0 V, 1.2 V, Switch
I
A
to B ,
Off Leakage Current
mA
OFF
N
N
DD
AN
A
to C
Off to B /C , V /V = 1.2 V, 0 V
N
N
N N BN CN
LOGIC INPUT CHARACTERISTICS (SEL Pin)
V
SEL
Input HIGH Voltage
(Note 7)
(Note 7)
0.65 x
DD
V
V
V
IH
DD
V
V
SEL
Input LOW Voltage
0
0.35 x
IL
V
DD
V
SEL
SEL
SEL
Clamp Diode Voltage
Input HIGH Current
Input LOW Current
V
= Max, I = −18mA
SEL
−0.7
−1.2
5
V
IK
DD
I
IH
V
= Max, V
= V
DD
mA
mA
DD
SEL
SEL
I
IL
V
= Max, V
= GND
5
DD
SWITCHING CHARACTERISTICS
t
SEL, A ,
Line Enable Time
Line Disable Time
SEL to A , B , C
N
L L
8.0
5.0
ns
ns
SELON
N
N
N
B /C
R = 50 W, C = 20 pF
N
N
t
SEL, A ,
SEL to A , B , C
N N N
SELOFF
N
N
B /C
N
R = 50 W, C = 20 pF
L L
t
A , B /C
N
Bit−to−bit skew
Within the same differential pair
5.0
50
ps
ps
b−b
N
N
t
A , B
N N
Channel−to channel skew
Maximum skew between all
channels
ch−ch
5. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
6. Typical values are at V = 1.8 V, T = 25°C ambient and maximum loading.
DD
A
7. Guaranteed by design and/or characterization.
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6
NCN3411
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE (T = −40°C to +85°C, V = 1.5 V to 2.0 V, GND = 0V)
A
DD
Symbol
Pins
Parameters
Conditions (Note 5)
Min.
Typ
Max.
Units
(Note 6)
DYNAMIC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
BR
A
to B ,
Signal Bit Rate
8.0
Gbps
N
N
N
A
to C
N
D
A
to B ,
Differential Insertion Loss
f = 4 GHz
f = 100 MHz
f = 4 GHz
−2.0
−0.7
−30
−58
−20
−58
−9.0
−22
dB
dB
dB
dB
dB
dB
dB
dB
IL
N
N
N
A
to C
N
D
A , B , C
N N
Differential Crosstalk
Differential Off Isolation
Differential Return Loss
CTK
N
f = 100 MHz
f = 4 GHz
D
A to B ,
N N
A
ISO
to C
N
N
f = 100 MHz
f = 4 GHz
D
A
to B ,
RL
N
N
A
to C
N
N
f = 100 MHz
5. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
6. Typical values are at V = 1.8 V, T = 25°C ambient and maximum loading.
DD
A
7. Guaranteed by design and/or characterization.
TYPICAL OPERATING CHARACTERISTICS
Figure 4. Reference PCIe 3.0 Eye Diagram
without Switch at 8 Gbps, 800 mVpp
Differential Swing
Figure 5. PCIe 3.0 Eye Diagram through
NCN3411 at 8 Gbps, 800 mVpp Differential
Swing
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7
NCN3411
TYPICAL OPERATING CHARACTERISTICS
0
−2
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−4
−6
−8
−10
−12
−14
−16
−100
100000000
1E+09
1E+10
100000000
1E+09
1E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6. Differential Insertion Loss
Figure 7. Differential Crosstalk
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
0
−5
−10
−15
−20
−25
100000000
1E+09
1E+10 100000000
1E+09
1E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 8. Differential Off Isolation
Figure 9. Differential Return Loss
9
8.5
8
7.5
7
6.5
6
0
0.2
0.4
0.6
0.8
(V)
1
1.2
1.4
V
IS
Figure 10. RON vs. VIS
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8
NCN3411
PARAMETER MEASUREMENT INFORMATION
Figure 11. Differential Insertion Loss (SDD21) and
Differential Return Loss (SDD11
Figure 12. Differential Off Isolation (SDD21)
)
t
= |t
-t
| or |t
-t
|
skew
PLH1 PLH2
PHL1 PHL2
Figure 13. Differential Crosstalk (SDD21
)
Figure 14. Bit−to−Bit and Channel−to−Channel Skew
Figure 15. tON and tOFF
Figure 16. Off State Leakage
Figure 17. On State Leakage
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9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN42 3.5x9, 0.5P
CASE 510AP−01
ISSUE O
DATE 15 FEB 2010
1
SCALE 2:1
NOTES:
A B
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
L
L
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
L1
DETAIL A
MILLIMETERS
ALTERNATE TERMINAL
CONSTRUCTIONS
E
DIM MIN
MAX
0.80
0.05
A
A1
A3
b
0.70
0.00
0.20 REF
EXPOSED Cu
MOLD CMPD
0.20
0.30
D
D2
E
3.50 BSC
0.15
C
1.95
2.15
9.00 BSC
E2
e
K
L
L1
7.45
0.50 BSC
0.20
0.30
0.00
7.65
0.15
C
DETAIL B
TOP VIEW
ALTERNATE
−−−
0.50
0.15
CONSTRUCTION
A
0.10
0.08
C
C
A3
GENERIC
MARKING DIAGRAM*
DETAIL B
NOTE 4
A1
K
XXXXXXXX
XXXXXXXX
AWLYYWWG
SEATING
PLANE
C
SIDE VIEW
0.10
C
A
B
XXXXX = Specific Device Code
D2
DETAIL A
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
WL
YY
WW
G
22
17
42X
L
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
42X
b
E2
0.10
0.05
C
C
A
B
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT
1
38
0.10
C A
B
9.30
42X
0.63
e
e/2
0.50
PITCH
BOTTOM VIEW
2.16
3.80
1
42X
0.35
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON48316E
WQFN42 3.5X9, 0.5P
PAGE 1 OF 1
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