MSB710-RT1 [ONSEMI]
PNP General Purpose Amplifier Transistor Surface Mount; PNP通用放大器晶体管表面贴装
| 型号： | MSB710-RT1 |
| 厂家： | 
ONSEMI |
| 描述： | PNP General Purpose Amplifier Transistor Surface Mount |
| 文件： | 总6页 (文件大小：84K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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by MSB710–RT1/D
SEMICONDUCTOR TECHNICAL DATA
Motorola Preferred Device
COLLECTOR
3
3
2
1
2
1
BASE
EMITTER
CASE 318D–04, STYLE 1
SC–59
MAXIMUM RATINGS (T = 25°C)
A
Rating
Symbol
Value
–60
Unit
Vdc
Collector–Base Voltage
Collector–Emitter Voltage
Emitter–Base Voltage
V
V
V
(BR)CBO
(BR)CEO
(BR)EBO
–50
Vdc
–7.0
–500
–1.0
Vdc
Collector Current — Continuous
Collector Current — Peak
I
C
mAdc
Adc
I
C(P)
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
200
Unit
mW
°C
Power Dissipation
P
D
Junction Temperature
Storage Temperature
T
J
150
T
stg
–55 ~ +150
°C
DEVICE MARKING
CRX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Preferred devices are Motorola recommended choices for future use and best overall value.
Thermal Clad is a trademark of the Bergquist Company
replaces MSB710–QT1/D
Motorola, Inc. 1997
ELECTRICAL CHARACTERISTICS (T = 25°C)
A
Characteristic
Symbol
Min
Max
Unit
Collector–Emitter Breakdown Voltage
V
–50
—
Vdc
(BR)CEO
(I = –10 mAdc, I = 0)
C
B
Collector–Base Breakdown Voltage
(I = –10 µAdc, I = 0)
V
–60
–7.0
—
—
—
Vdc
Vdc
µAdc
—
(BR)CBO
C
E
Emitter–Base Breakdown Voltage
(I = –10 µAdc, I = 0)
V
(BR)EBO
E
C
Collector–Base Cutoff Current
(V = –20 Vdc, I = 0)
I
–0.1
CBO
CB
DC Current Gain
E
(1)
= –10 Vdc, I = –150 mAdc)
(V
CE
(V
CE
h
FE1
h
FE2
120
40
240
—
C
C
= –10 Vdc, I = 500 mAdc)
Collector–Emitter Saturation Voltage
(I = –300 mAdc, I = –30 mAdc)
V
—
—
—
–0.6
–1.5
15
Vdc
Vdc
pF
CE(sat)
C
B
Collector–Base Saturation Voltage
V
BE(sat)
(I = –300 mAdc, I = –30 mAdc)
C
B
Output Capacitance
C
ob
(V
CB
= –10 Vdc, I = 0, f = 1.0 MHz)
E
1. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.098–0.118
2.5–3.0
0.094
2.4
0.039
1.0
0.031
0.8
inches
mm
SC–59 POWER DISSIPATION
The power dissipation of the SC–59 is a function of the pad
size. This can vary from the minimum pad size for soldering
to the pad size given for maximum power dissipation. Power
dissipation for a surface mount device is determined by
the equation for an ambient temperature T of 25°C, one can
calculate the power dissipation of the device which in this
case is 200 milliwatts.
A
150°C – 25°C
T
R
, the maximum rated junction temperature of the die,
, the thermal resistance from the device junction to
J(max)
θJA
P
=
= 200 milliwatts
D
625°C/W
ambient; and the operating temperature, T . Using the
values provided on the data sheet, P can be calculated as
D
follows:
A
The 625°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 200 milliwatts. Another alternative would
be to use a ceramic substrate or an aluminum core board
such as Thermal Clad . Using a board material such as
Thermal Clad, a power dissipation of 400 milliwatts can be
achieved using the same footprint.
T
– T
A
J(max)
P
=
D
R
θJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•
•
•
The soldering temperature and time should not exceed
260°C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
•
•
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100°C or less.*
•
Mechanical stress or shock should not be applied during
cooling
•
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SC–59 package should be
the same as the pad size on the printed circuit board, i.e., a
1:1 registration.
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 1 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177–189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK” ZONES 2 & 5
“RAMP”
STEP 3
HEATING
STEP 4
HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK” “SPIKE”
STEP 5
HEATING
STEP 6
VENT COOLING
STEP 7
205
PEAK AT
SOLDER JOINT
° TO 219°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
170°C
200
°C
160°C
150°C
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
140°C
100°C
MASS OF ASSEMBLY)
100°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
T
TIME (3 TO 7 MINUTES TOTAL)
MAX
Figure 1. Typical Solder Heating Profile
4
Motorola Small–Signal Transistors, FETs and Diodes Device Data
PACKAGE DIMENSIONS
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
L
MILLIMETERS
INCHES
MIN MAX
3
DIM
A
B
C
D
G
H
J
K
L
MIN
2.70
1.30
1.00
0.35
1.70
0.013
0.09
0.20
1.25
2.50
MAX
S
B
3.10 0.1063 0.1220
1.70 0.0512 0.0669
1.30 0.0394 0.0511
0.50 0.0138 0.0196
2.10 0.0670 0.0826
0.100 0.0005 0.0040
0.18 0.0034 0.0070
0.60 0.0079 0.0236
1.65 0.0493 0.0649
3.00 0.0985 0.1181
2
1
D
G
S
J
C
STYLE 1:
PIN 1. EMITTER
K
2. BASE
H
3. COLLECTOR
CASE 318D–04
ISSUE F
SC–59
Motorola Small–Signal Transistors, FETs and Diodes Device Data
5
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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