MC74LCX541DTG [ONSEMI]

Low-Voltage CMOS Octal Buffer Flow Through Pinout;
MC74LCX541DTG
型号: MC74LCX541DTG
厂家: ONSEMI    ONSEMI
描述:

Low-Voltage CMOS Octal Buffer Flow Through Pinout

驱动 光电二极管 逻辑集成电路
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MC74LCX541  
Low-Voltage CMOS Octal  
Buffer Flow Through Pinout  
With 5 V−Tolerant Inputs and Outputs  
(3−State, Non−Inverting)  
http://onsemi.com  
The MC74LCX541 is a high performance, non−inverting octal  
buffer operating from a 2.3 to 3.6 V supply. This device is similar in  
function to the MC74LCX244, while providing flow through  
architecture. High impedance TTL compatible inputs significantly  
reduce current loading to input drivers while TTL compatible outputs  
SOIC−20 WB  
DW SUFFIX  
CASE 751D  
TSSOP−20  
DT SUFFIX  
CASE 948E  
offer improved switching noise performance. A V specification of  
I
5.5 V allows MC74LCX541 inputs to be safely driven from 5 V  
devices. The MC74LCX541 is suitable for memory address driving  
and all TTL level bus oriented transceiver applications.  
Current drive capability is 24 mA at the outputs. The Output Enable  
(OE1. OE2) inputs, when HIGH, disables the output by placing them  
in a HIGH Z condition.  
MARKING DIAGRAMS  
20  
1
LCX541  
AWLYYWWG  
Features  
Designed for 2.3 to 3.6 V V Operation  
CC  
5 V Tolerant − Interface Capability With 5 V TTL Logic  
Supports Live Insertion and Withdrawal  
SOIC−20 WB  
I  
Specification Guarantees High Impedance When V = 0 V  
CC  
OFF  
20  
LVTTL Compatible  
LCX  
541  
LVCMOS Compatible  
24 mA Balanced Output Sink and Source Capability  
ALYW G  
G
Near Zero Static Supply Current in All Three Logic States (10 mA)  
Substantially Reduces System Power Requirements  
Latchup Performance Exceeds 500 mA  
1
TSSOP−20  
ESD Performance:  
A
L, WL  
Y, YY  
=
=
=
Assembly Location  
Wafer Lot  
Year  
Human Body Model > 2000 V  
Machine Model > 200 V  
W, WW = Work Week  
NLV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q100  
Qualified and PPAP Capable  
G or G  
= Pb−Free Package  
(Note: Microdot may be in either location)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
Compliant  
dimensions section on page 6 of this data sheet.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
August, 2014 − Rev. 9  
MC74LCX541/D  
MC74LCX541  
1
OE1  
OE2  
19  
V
OE2 O0  
O1  
17  
O2  
16  
O3  
15  
O4  
14  
O5  
13  
O6  
12  
O7  
11  
CC  
2
3
4
5
6
7
8
9
18  
17  
16  
15  
14  
13  
12  
11  
20  
19  
18  
D0  
O0  
O1  
O2  
O3  
O4  
O5  
O6  
O7  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
1
2
3
4
5
6
7
9
8
10  
OE1 D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7 GND  
Figure 1. Pinout: 20−Lead (Top View)  
PIN NAMES  
Pins  
OEn  
Dn  
Function  
Output Enable Inputs  
Data Inputs  
On  
3−State Outputs  
Figure 2. Logic Diagram  
TRUTH TABLE  
Inputs  
Outputs  
OE1  
L
OE2  
L
Dn  
L
On  
L
L
L
H
X
H
Z
X
H
H
X
X
Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State;  
X = High or Low Voltage Level and Transitions are Acceptable, for I reasons,  
CC  
DO NOT FLOAT Inputs  
MAXIMUM RATINGS  
Symbol  
Parameter  
DC Supply Voltage  
Value  
Condition  
Units  
V
V
CC  
−0.5 to +7.0  
V
I
DC Input Voltage  
−0.5 V +7.0  
V
I
V
O
DC Output Voltage  
−0.5 V +7.0  
Output in 3−State  
(Note 1)  
V
O
−0.5 V V + 0.5  
V
O
CC  
I
DC Input Diode Current  
DC Output Diode Current  
−50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
I
−50  
+50  
50  
V < GND  
O
OK  
V
O
> V  
CC  
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
Moisture Sensitivity  
O
I
100  
100  
CC  
I
GND  
T
−65 to +150  
STG  
MSL  
Level 1  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Output in HIGH or LOW State. I absolute maximum rating must be observed.  
O
http://onsemi.com  
2
 
MC74LCX541  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
V
2.0  
1.5  
3.3  
3.3  
3.6  
3.6  
V
Input Voltage  
0
5.5  
V
V
I
V
O
Output Voltage  
(HIGH or LOW State)  
(3−State)  
0
0
V
CC  
5.5  
−24  
24  
I
I
HIGH Level Output Current, V = 3.0 V − 3.6 V  
mA  
mA  
mA  
mA  
°C  
OH  
CC  
I
OL  
LOW Level Output Current, V = 3.0 V − 3.6 V  
CC  
HIGH Level Output Current, V = 2.7 V − 3.0 V  
−12  
12  
OH  
CC  
I
OL  
LOW Level Output Current, V = 2.7 V − 3.0 V  
CC  
T
A
Operating Free−Air Temperature  
−40  
0
+85  
10  
Dt/DV  
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V  
ns/V  
IN  
CC  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
DC ELECTRICAL CHARACTERISTICS  
T
A
= −40°C to +85°C  
Symbol  
Characteristic  
Condition  
Min  
2.0  
Max  
Units  
V
IH  
HIGH Level Input Voltage (Note 2)  
LOW Level Input Voltage (Note 2)  
HIGH Level Output Voltage  
2.7 V V 3.6 V  
V
V
V
CC  
V
IL  
2.7 V V 3.6 V  
0.8  
CC  
V
OH  
2.7 V V 3.6 V; I = −100 mA  
V
− 0.2  
CC  
OH  
CC  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = −12 mA  
2.2  
OH  
= 3.0 V; I = −18 mA  
2.4  
2.2  
OH  
= 3.0 V; I = −24 mA  
OH  
V
LOW Level Output Voltage  
3−State Output Current  
2.7 V V 3.6 V; I = 100 mA  
0.2  
0.4  
0.4  
0.55  
5
V
OL  
CC  
OL  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = 12 mA  
OL  
= 3.0 V; I = 16 mA  
OL  
= 3.0 V; I = 24 mA  
OL  
I
V
CC  
= 3.6 V, V = V or V ,  
mA  
OZ  
IN  
IH  
IL  
V
OUT  
= 0 to 5.5 V  
I
Power Off Leakage Current  
Input Leakage Current  
V
= 0, V = 5.5 V or V = 5.5 V  
OUT  
10  
5
mA  
mA  
mA  
mA  
OFF  
CC  
IN  
I
IN  
V
V
= 3.6 V, V = 5.5 V or GND  
IN  
CC  
CC  
I
Quiescent Supply Current  
= 3.6 V, V = 5.5 V or GND  
10  
500  
CC  
IN  
DI  
Increase in I per Input  
2.3 V 3.6 V; V = V − 0.6 V  
CC IH CC  
CC  
CC  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. These values of V are used to test DC electrical characteristics only.  
I
http://onsemi.com  
3
 
MC74LCX541  
AC ELECTRICAL CHARACTERISTICS (t = t = 2.5 ns; C = 50 pF; R = 500 W)  
R
F
L
L
Limits  
T
A
= −40°C to +85°C  
V
CC  
= 3.0 V to 3.6 V  
V
CC  
= 2.7 V  
Symbol  
Parameter  
Waveform  
Min  
Max  
Max  
Units  
t
t
Propagation Delay  
Input to Output  
1
1.5  
1.5  
6.5  
6.5  
7.5  
7.5  
ns  
PLH  
PHL  
t
t
Output Enable Time to  
High and Low Level  
2
2
1.5  
1.5  
8.5  
8.5  
9.5  
9.5  
ns  
ns  
ns  
PZH  
PZL  
t
Output Disable Time From  
High and Low Level  
1.5  
1.5  
7.5  
7.5  
8.5  
8.5  
PHZ  
t
PLZ  
t
t
Output−to−Output Skew (Note 3)  
1.0  
1.0  
OSHL  
OSLH  
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t  
guaranteed by design.  
) or LOW−to−HIGH (t  
); parameter  
OSHL  
OSLH  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Typ  
Symbol  
Characteristic  
Condition  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
Min  
Max  
Units  
V
OLP  
V
OLV  
Dynamic LOW Peak Voltage (Note 4)  
Dynamic LOW Valley Voltage (Note 4)  
V
V
0.8  
V
V
CC  
L
IH  
IL  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
0.8  
CC  
L
IH  
IL  
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is  
measured in the LOW state.  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
Units  
pF  
C
V
V
7
8
IN  
CC  
I
CC  
CC  
C
Output Capacitance  
= 3.3 V, V = 0 V or V  
pF  
OUT  
CC  
I
C
Power Dissipation Capacitance  
10 MHz, V = 3.3 V, V = 0 V or V  
CC  
25  
pF  
PD  
CC  
I
http://onsemi.com  
4
 
MC74LCX541  
2.7 V  
0 V  
1.5 V  
1.5 V  
Dn  
t
t
PHL  
PLH  
V
OH  
OL  
1.5 V  
1.5 V  
On  
V
WAVEFORM 1 - PROPAGATION DELAYS  
t = t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
W
R
F
2.7 V  
0 V  
1.5 V  
OEn  
t
t
PHZ  
PZH  
V
V
CC  
- 0.3 V  
OH  
1.5 V  
On  
0 V  
t
t
PLZ  
PZL  
3.0 V  
1.5 V  
On  
V + 0.3 V  
OL  
GND  
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES  
t = t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
W
R
F
Figure 3. AC Waveforms  
V
CC  
6 V  
OPEN  
GND  
R
1
PULSE  
GENERATOR  
DUT  
R
T
C
R
L
L
Test  
, t  
Switch  
Open  
6 V  
t
PLH PHL  
t
, t  
PZL PLZ  
Open Collector/Drain t  
and t  
6 V  
PLH  
PZH PHZ  
PHL  
t
, t  
GND  
C = 50 pF or equivalent (Includes jig and probe capacitance)  
L
R = R = 500 W or equivalent  
L
1
R = Z  
of pulse generator (typically 50 W)  
T
OUT  
Figure 4. Test Circuit  
http://onsemi.com  
5
MC74LCX541  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74LCX541DWR2G  
SOIC−20  
(Pb−Free)  
1000 Tape & Reel  
1000 Tape & Reel  
38 Units / Rail  
NLV74LCX541DWR2G* (In Development)  
MC74LCX541DWG  
SOIC−20  
(Pb−Free)  
SOIC−20  
(Pb−Free)  
NLV74LCX541DWG* (In Development)  
MC74LCX541DTG  
SOIC−20  
(Pb−Free)  
38 Units / Rail  
TSSOP−20  
(Pb−Free)  
75 Units / Rail  
NLV74LCX541DTG* (In Development)  
MC74LCX541DTR2G  
TSSOP−20  
(Pb−Free)  
75 Units / Rail  
TSSOP−20  
(Pb−Free)  
2500 Tape & Reel  
2500 Tape & Reel  
NLV74LCX541DTR2G* (In Development)  
TSSOP−20  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP  
Capable.  
http://onsemi.com  
6
MC74LCX541  
PACKAGE DIMENSIONS  
TSSOP−20  
CASE 948E−02  
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION:  
MILLIMETER.  
20X K REF  
K
M
S
S
V
0.10 (0.004)  
T U  
S
K1  
0.15 (0.006) T U  
3. DIMENSION A DOES NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH OR GATE BURRS  
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION  
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
J J1  
20  
11  
2X L/2  
B
SECTION N−N  
L
−U−  
PIN 1  
IDENT  
0.25 (0.010)  
N
1
10  
M
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
S
0.15 (0.006) T U  
A
−V−  
N
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
6.60  
4.50  
1.20  
0.15  
0.75  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
F
A
B
6.40  
4.30  
---  
0.252  
0.169  
---  
DETAIL E  
C
D
0.05  
0.50  
0.002  
0.020  
F
G
H
0.65 BSC  
0.026 BSC  
−W−  
C
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.20  
0.16  
0.30  
0.25  
0.011  
0.004  
0.004  
0.007  
0.007  
0.015  
0.008  
0.006  
0.012  
0.010  
J
J1  
K
G
D
H
DETAIL E  
K1  
L
0.100 (0.004)  
−T− SEATING  
6.40 BSC  
0.252 BSC  
0
M
0
8
8
_
_
_
_
PLANE  
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
16X  
0.36  
16X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
MC74LCX541  
PACKAGE DIMENSIONS  
SOIC−20 WB  
CASE 751D−05  
ISSUE G  
D
A
q
NOTES:  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M, 1994.  
20  
11  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
PROTRUSION.  
E
B
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF B  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
1
10  
MILLIMETERS  
20X B  
DIM MIN  
MAX  
2.65  
0.25  
0.49  
0.32  
12.95  
7.60  
A
A1  
B
C
D
E
2.35  
0.10  
0.35  
0.23  
12.65  
7.40  
M
S
S
B
T
0.25  
A
A
e
1.27 BSC  
H
h
10.05  
0.25  
0.50  
0
10.55  
0.75  
0.90  
7
SEATING  
PLANE  
L
18X e  
A1  
C
q
T
_
_
ON Semiconductor and the  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed  
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets  
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each  
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For additional information, please contact your local  
Sales Representative  
MC74LCX541/D  

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