MC74LCX16500DT [ONSEMI]
IC LVC/LCX/Z SERIES, 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56, Bus Driver/Transceiver;
| 型号： | MC74LCX16500DT |
| 厂家： | 
ONSEMI |
| 描述： | IC LVC/LCX/Z SERIES, 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56, Bus Driver/Transceiver 光电二极管 输出元件 逻辑集成电路 触发器 |
| 文件： | 总21页 (文件大小：540K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC74LCX16500 is a high performance, non–inverting 18–bit
universal bus transceiver operating from a 2.7 to 3.6V supply. This part is
not byte controlled; it is “18–bit” controlled. High impedance TTL
compatible inputs significantly reduce current loading to input drivers
while TTL compatible outputs offer improved switching noise
LOW–VOLTAGE CMOS
18–BIT UNIVERSAL BUS
TRANSCEIVER
performance. A V specification of 5.5V allows MC74LCX16500 inputs to
I
be safely driven from 5V devices. The MC74LCX16500 is suitable for
memory address driving and all TTL level bus oriented transceiver
applications.
Data flow in each direction is controlled by Output Enable (OEAB,
OEBA), Latch Enable (LEAB, LEBA) and Clock inputs (CAB, CBA). When
LEAB is HIGH, the A–to–B dataflow is transparent. When LEAB is LOW,
and CAB is held at LOW or HIGH, the data A is latched; on the
HIGH–to–LOW transition of CAB the A–data is stored in the
latch/flip–flop. The outputs are active when OEAB is HIGH. When OEAB
is LOW the B–outputs are in 3–state. Similarly, the LEBA, OEBA and CBA
control the B–to–A dataflow. Please note that the output enables are
complementary; OEAB is active HIGH, OEBA is active LOW.
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
• Designed for 2.7 to 3.6V V
CC
Operation
• 6ns Maximum t
pd
• 5V Tolerant — Interface Capability With 5V TTL Logic
• Supports Live Insertion and Withdrawal
• I
OFF
Specification Guarantees High Impedance When V
= 0V
CC
• LVTTL Compatible
• LVCMOS Compatible
PIN NAMES
• 24mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current in All Three Logic States (20µA)
Pins
Function
Substantially Reduces System Power Requirements
OEAB, OEBA
CAB, CBA
LEAB, LEBA
A0–A17
Output Enable Inputs
Clock Pulse Inputs
Latch Enable Inputs
Side A Inputs/Outputs
Side B Inputs/Outputs
• Latchup Performance Exceeds 500mA
• ESD Performance: Human Body Model >2000V; Machine
Model >200V
B0–B17
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
11/96
REV 0.2
181
Motorola, Inc. 1996
MC74LCX16500
Pinout: 56-Lead TSSOP
(Top View)
OEAB
LEAB
A0
GND
CAB
B0
1
2
56
55
54
53
52
LOGIC DIAGRAM
3
1
GND
A1
GND
B1
4
OEAB
30
5
CBA
A2
6
51 B2
28
LEBA
V
V
CC
7
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
CC
27
A3
A4
B3
8
OEBA
55
B4
9
CAB
A5
B5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
2
LEAB
GND
A6
GND
B6
C1
1D
C1
1D
A7
B7
54
B0
3
A8
B8
A0
A9
B9
A10
A11
GND
A12
A13
A14
B10
B11
GND
B12
B13
B14
C1
1D
C1
1D
V
CC
V
CC
A15
A16
B15
B16
GND
GND
To 17 Other Channels
A17 26
31 B17
OEBA
CBA
GND
27
28
30
29
LEBA
MOTOROLA
182
LCX DATA
BR1339 — REV 3
MC74LCX16500
FUNCTION TABLE
Inputs
Data Ports
Operating Mode
OEAB
OEBA
LEAB
LEBA
CAB
CBA
An
Bn
Input
X
L
H
Input
X
H or L
H or L
Hold Data; A and B Outputs Disabled
L
L
l
h
l
h
↓
↓
Clock A and/or B Data; A and B Outputs Disabled
H
H
L
L
Input
X
Output
QA
H or L
X*
X*
Hold and Display B Data
L
X
X
l
h
L
H
↓
Clock A Data to B Bus; Store A Data
L
H
L
H
H
X
X*
A Data to B Bus; (Transparent)
L
Output
QB
Input
X
X*
X*
H or L
Hold and Display A Data
X
X
L
L
H
l
h
↓
Clock B Data to A Bus; Store B Data
L
H
L
H
H
X*
X
B Data to A Bus; (Transparent)
H
Output Output
QB QA
L
L
H or L
H or L
Stored A Data to B Bus; Stored B Data to A Bus
H = High Voltage Level; L = Low Voltage Level; h = High Voltage Level One Setup Time Prior to the Latch Enable or Clock High–to–Low Transition; l = Low Voltage
Level One Setup Time Prior to the Latch Enable or Clock High–to–Low Transition; X = Don’t Care; ↓ = High–to–Low Clock Transition; QA = A Input Storage Register;
QB = B Input Storage Register; * = The clocks are not internally gated with either the Output Enables or the Source Inputs. Therefore, data at the A or B ports may be
clocked into the storage registers, at any time. For I
reasons, Do Not Float Inputs.
CC
LCX DATA
183
MOTOROLA
BR1339 — REV 3
MC74LCX16500
BUS APPLICATIONS
Real Time Transfer – Bus B to
Real Time Transfer – Bus A to
Bus B
Bus A
OEAB OEBA CAB CBA LEAB LEBA
OEAB OEBA CAB CBA LEAB LEBA
L
L
X
X
X
H
H
H
X
X
H
X
Transfer A Stored Data to Bus B
or B Stored Data to Bus A or
Both at the Same Time
Store Data from Bus A, Bus B or
Bus A and Bus B
OEAB OEBA CAB CBA LEAB LEBA
OEAB OEBA CAB CBA LEAB LEBA
X
L
L
H
X
H
↓
X
X
X
↓
X
L
X
L
X
L
L
H
L
H
H
L
L
↓
X
X
↓
L
X
L
X
L
L
H or L H or L
Store Bus A in Both Registers or
Store Bus B in Both Registers
Isolation
OEAB OEBA CAB CBA LEAB LEBA
OEAB OEBA CAB CBA LEAB LEBA
H or L H or L
H
L
H
L
X
X
X
X
L
L
L
L
L
H
L
L
MOTOROLA
184
LCX DATA
BR1339 — REV 3
MC74LCX16500
ABSOLUTE MAXIMUM RATINGS*
Symbol
CC
Parameter
Value
Condition
Unit
V
V
V
V
DC Supply Voltage
DC Input Voltage
DC Output Voltage
–0.5 to +7.0
–0.5 ≤ V ≤ +7.0
V
I
I
–0.5 ≤ V ≤ +7.0
Output in 3–State
Note 1.
V
O
O
–0.5 ≤ V ≤ V
+ 0.5
V
O
CC
I
I
DC Input Diode Current
DC Output Diode Current
–50
–50
V < GND
mA
mA
mA
mA
mA
mA
°C
IK
I
V
O
< GND
OK
+50
V > V
O CC
I
I
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
±50
O
±100
±100
CC
GND
T
–65 to +150
STG
* Absolutemaximumcontinuousratingsarethosevaluesbeyondwhichdamagetothedevicemayoccur. Exposuretotheseconditionsorconditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
1. Output in HIGH or LOW State. I absolute maximum rating must be observed.
O
RECOMMENDED OPERATING CONDITIONS
Symbol
CC
Parameter
Min
Typ
Max
Unit
V
Supply Voltage
Operating
Data Retention Only
2.0
1.5
3.3
3.3
3.6
3.6
V
V
V
Input Voltage
0
5.5
V
V
I
Output Voltage
(HIGH or LOW State)
(3–State)
0
0
V
CC
O
5.5
–24
24
I
I
I
I
HIGH Level Output Current, V
= 3.0V – 3.6V
mA
mA
mA
mA
°C
OH
OL
OH
OL
CC
LOW Level Output Current, V
= 3.0V – 3.6V
= 2.7V – 3.0V
= 2.7V – 3.0V
CC
HIGH Level Output Current, V
–12
12
CC
LOW Level Output Current, V
CC
T
A
Operating Free–Air Temperature
Input Transition Rise or Fall Rate, V from 0.8V to 2.0V,
–40
0
+85
10
∆t/∆V
ns/V
IN
V
CC
= 3.0V
DC ELECTRICAL CHARACTERISTICS
T
A
= –40°C to +85°C
Symbol
Characteristic
HIGH Level Input Voltage (Note 2.)
LOW Level Input Voltage (Note 2.)
HIGH Level Output Voltage
Condition
Min
2.0
Max
Unit
V
V
V
V
2.7V ≤ V
≤ 3.6V
IH
CC
2.7V ≤ V
2.7V ≤ V
≤ 3.6V
= –100µA
0.8
V
IL
CC
≤ 3.6V; I
V
– 0.2
V
OH
CC
OH
CC
V
CC
V
CC
V
CC
= 2.7V; I
= 3.0V; I
= 3.0V; I
= –12mA
= –18mA
= –24mA
2.2
OH
OH
OH
2.4
2.2
V
OL
LOW Level Output Voltage
2.7V ≤ V
CC
≤ 3.6V; I
= 100µA
OL
0.2
0.4
V
V
= 2.7V; I = 12mA
OL
CC
CC
CC
V
V
= 3.0V; I
= 3.0V; I
= 16mA
= 24mA
0.4
OL
OL
0.55
2. These values of V are used to test DC electrical characteristics only.
I
LCX DATA
185
MOTOROLA
BR1339 — REV 3
MC74LCX16500
DC ELECTRICAL CHARACTERISTICS (continued)
T
A
= –40°C to +85°C
Symbol
Characteristic
Input Leakage Current
Condition
≤ 3.6V; 0V ≤ V ≤ 5.5V
Min
Max
±5.0
±5.0
Unit
µA
I
I
2.7V ≤ V
CC
I
I
3–State Output Current
2.7 ≤ V
CC
≤ 3.6V; 0V ≤ V ≤ 5.5V;
µA
OZ
O
IL
V = V or V
IH
I
I
I
Power–Off Leakage Current
Quiescent Supply Current
V
= 0V; V or V = 5.5V
10
20
µA
µA
µA
µA
OFF
CC
I
O
2.7 ≤ V
≤ 3.6V; V = GND or V
CC
CC
I
CC
2.7 ≤ V
CC
≤ 3.6V; 3.6 ≤ V or V ≤ 5.5V
±20
500
I
O
∆I
CC
Increase in I
CC
per Input
2.7 ≤ V
CC
≤ 3.6V; V = V
IH
– 0.6V
CC
AC CHARACTERISTICS (Note 3.; t = t = 2.5ns; C = 50pF; R = 500Ω)
R
F
L
L
Limits
= –40°C to +85°C
T
A
V
= 3.0V to 3.6V
Max
V
= 2.7V
CC
CC
Symbol
Parameter
Waveform
Min
Min
Max
Unit
MHz
ns
f
Maximum Clock Frequency
3
1
170
max
t
t
Propagation Delay
Input to Output
1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
PHL
PLH
t
t
Propagation Delay
Clock to Output
3
4
2
2
1.5
1.5
6.7
6.7
1.5
1.5
8.0
8.0
ns
ns
ns
ns
PHL
PLH
t
t
Propagation Delay
LExx to Output
1.5
1.5
7.0
7.0
1.5
1.5
8.0
8.0
PHL
PLH
t
t
Output Enable Time to
High and Low Level
1.5
1.5
7.2
7.2
1.5
1.5
8.2
8.2
PZH
PZL
t
t
Output Disable Time From
High and Low Level
1.5
1.5
7.0
7.0
1.5
1.5
8.0
8.0
PHZ
PLZ
t
t
t
Setup Time
3,4
3,4
3,4
2.5
1.5
3.0
2.5
1.5
3.0
ns
ns
ns
ns
s
Hold Time
h
w
Pulse Width Time
t
t
Output–to–Output Skew
(Note 4.)
1.0
1.0
OSHL
OSLH
3. These AC parameters are preliminary and may be modified prior to release.
4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
guaranteed by design.
) or LOW–to–HIGH (t
OSHL
); parameter
OSLH
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25°C
Symbol
Characteristic
Condition
Min
Typ
0.8
0.8
Max
Unit
V
V
Dynamic LOW Peak Voltage (Note 5.)
Dynamic LOW Valley Voltage (Note 5.)
V
V
= 3.3V, C = 50pF, V = 3.3V, V = 0V
L IH IL
OLP
OLV
CC
V
= 3.3V, C = 50pF, V = 3.3V, V = 0V
IH IL
V
CC
L
5. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.
MOTOROLA
186
LCX DATA
BR1339 — REV 3
MC74LCX16500
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
= 3.3V, V = 0V or V
Typical
Unit
pF
C
C
C
Input Capacitance
V
V
7
8
IN
CC
I
CC
CC
Input/Output Capacitance
Power Dissipation Capacitance
= 3.3V, V = 0V or V
pF
I/O
PD
CC
I
10MHz, V
CC
= 3.3V, V = 0V or V
CC
20
pF
I
2.7V
An, Bn
Bn, An
1.5V
0V
t
, t
PLH PHL
V
OH
1.5V
V
OL
WAVEFORM 1 – An to Bn PROPAGATION DELAYS
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns
F
W
2.7V
OEBA
1.5V
1.5V
0V
OEAB
t
t
PHZ
PZH
V
OH
– 0.3V
1.5V
1.5V
An, Bn
≈ 0V
t
t
PLZ
PZL
≈ 3.0V
An, Bn
V
OL
+ 0.3V
WAVEFORM 2 – OEBA/OEAB to An/Bn OUTPUT ENABLE AND DISABLE TIMES
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns
F
W
Figure 1. AC Waveforms
LCX DATA
187
MOTOROLA
BR1339 — REV 3
MC74LCX16500
2.7V
An, Bn
1.5V
0V
t
s
t
h
2.7V
CAB,
CBA
t
w
1.5V
1.5V
0V
f
max
t
, t
PLH PHL
V
OH
Bn, An
1.5V
V
OL
WAVEFORM 3 – CLOCK to Bn/An PROPAGATION DELAYS, CLOCK MINIMUM PULSE WIDTH,
An/Bn to CLOCK SETUP AND HOLD TIMES
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns except when noted
F W
2.7V
1.5V
An, Bn
0V
t
s
t
h
2.7V
LEAB,
LEBA
t
w
1.5V
1.5V
0V
t
, t
PLH PHL
V
OH
Bn, An
1.5V
V
OL
WAVEFORM 4 – LExx to An, Bn PROPAGATION DELAYS, LExx MINIMUM
PULSE WIDTH, An, Bn to LExx SETUP AND HOLD TIMES
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns except when noted
F W
t
w
NEGATIVE
PULSE
1.5V
1.5V
1.5V
1.5V
POSITIVE
PULSE
t
w
WAVEFORM 5 – INPUT PULSE DEFINITION
= t = 2.5ns, 10% to 90% of 0V to 2.7V
t
R
F
Figure 1. AC Waveforms (continued)
MOTOROLA
188
LCX DATA
BR1339 — REV 3
MC74LCX16500
V
CC
6V
OPEN
GND
R
1
PULSE
GENERATOR
DUT
R
T
C
L
R
L
TEST
SWITCH
Open
6V
t , t
PLH PHL
t , t
PZL PLZ
Open Collector/Drain t
PLH
and t
PHL
6V
t
, t
GND
PZH PHZ
C
R
R
= 50pF or equivalent (Includes jig and probe capacitance)
L
L
T
= R = 500Ω or equivalent
1
OUT
= Z
of pulse generator (typically 50Ω)
Figure 2. Test Circuit
LCX DATA
189
MOTOROLA
BR1339 — REV 3
SEMICONDUCTOR TECHNICAL DATA
Device Nomenclature
MC 74 XXXX YYYYYY ZZ
Motorola
Package Type
Circuit Identifier
• D
= Plastic Narrow JECDEC SOIC
• DW = Plastic Wide JEDEC SOIC
• M = Plastic EIAJ SOIC
• SD = Plastic SSOP
• DT = Plastic TSSOP
Temperature Range
• 74 = –40 to +85°C
Family Identifier
• LCX = 5V–Tolerant Low–Voltage CMOS
• LVX = Low–Voltage CMOS
• LVXC = Configurable Low–Voltage CMOS
Function Type
• A = Modified LCX Spec
251
MOTOROLA
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
14
1
8
7
P 7 PL
–B–
M
M
0.25 (0.010)
B
MILLIMETERS
INCHES
MIN MAX
G
F
R X 45°
DIM MIN
MAX
8.75
4.00
1.75
0.49
1.25
C
A
B
C
D
F
G
J
K
M
P
8.55
3.80
1.35
0.35
0.40
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
J
M
SEATING
PLANE
K
D 14 PL
1.27 BSC
0.19
0.10
0°
0.25
0.25
7°
0.008 0.009
0.004 0.009
M
S
S
0.25 (0.010)
T
B
A
0°
7°
5.80
0.25
6.20
0.50
0.228 0.244
0.010 0.019
R
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
14
8
7
Q
1
E H
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
A
DIM MIN
MAX
MIN
---
MAX
0.081
c
A
---
2.05
A
0.05
0.35
0.18
0.20 0.002 0.008
0.50 0.014 0.020
0.27 0.007
1
b
c
0.011
D
E
e
9.90 10.50 0.390 0.413
b
A
1
5.10
5.45 0.201 0.215
M
1.27 BSC
0.050 BSC
8.20 0.291 0.323
0.85 0.020 0.033
1.50 0.043 0.059
0.13 (0.005)
0.10 (0.004)
H
7.40
0.50
1.10
0
0.70
---
E
L
L
E
M
Q
10
0.90 0.028 0.035
1.42 --- 0.056
0
10
1
Z
MOTOROLA
252
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940A–03
NOTES:
ISSUE B
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14X K REF
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
M
S
S
0.12 (0.005)
T U
V
0.25 (0.010)
N
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
14
8
L/2
M
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
B
L
F
PIN 1
IDENT
1
7
DETAIL E
–U–
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
A
–V–
K
J
J1
M
S
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
0.20 (0.008)
T U
A
B
C
D
F
6.07
5.20
1.73
0.05
0.63
6.33 0.238 0.249
5.38 0.205 0.212
1.99 0.068 0.078
0.21 0.002 0.008
0.95 0.024 0.037
K1
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
1.22 0.042 0.048
0.20 0.003 0.008
0.16 0.003 0.006
0.38 0.010 0.015
0.33 0.010 0.013
1.08
0.09
0.09
0.25
0.25
7.65
0
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
7.90 0.301
0.311
8
D
G
M
8
0
DETAIL E
H
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
NOTES:
1
14X K REF
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4
5
8
7
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
K
S
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
–V–
A
B
4.90
4.30
–––
5.10 0.193 0.200
4.50 0.169 0.177
J J1
C
1.20
––– 0.047
D
F
G
H
J
J1
K
K1
L
0.05
0.50
0.65 BSC
0.50
0.09
0.09
0.19
0.19
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N–N
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
–W–
C
0.10 (0.004)
6.40 BSC
0.252 BSC
SEATING
PLANE
–T–
H
G
M
0
8
0
8
DETAIL E
D
253
MOTOROLA
Case Outlines
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
1
9
8
–B–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.25 (0.010)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
INCHES
MIN MAX
DIM MIN
MAX
A
B
C
D
F
G
J
K
M
P
9.80 10.00
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
F
K
R X 45°
3.80
1.35
0.35
0.40
4.00
1.75
0.49
1.25
C
1.27 BSC
–T–
SEATING
0.19
0.10
0°
0.25
0.25
7°
0.008 0.009
0.004 0.009
J
M
PLANE
D 16 PL
0°
7°
5.80
0.25
6.20
0.50
0.229 0.244
0.010 0.019
M
S
S
0.25 (0.010)
T
B
A
R
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
16
9
8
Q
1
E H
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
A
DIM MIN
MAX
MIN
---
MAX
0.081
0.008
0.020
0.011
0.413
0.215
c
A
---
2.05
A
0.05
0.35
0.18
9.90
5.10
0.20 0.002
0.50 0.014
0.27 0.007
10.50 0.390
5.45 0.201
1
b
c
D
E
e
A
1
b
0.13 (0.005)
1.27 BSC
0.050 BSC
M
0.10 (0.004)
H
7.40
0.50
1.10
0
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
10
E
L
L
E
M
Q
10
0
0.70
---
0.90 0.028
0.78
0.035
0.031
1
Z
---
MOTOROLA
254
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940B–03
NOTES:
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
ISSUE B
16X K REF
M
S
S
0.12 (0.005)
T U
V
0.25 (0.010)
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
16
9
L/2
M
N
B
L
F
PIN 1
IDENT
1
8
DETAIL E
K
–U–
A
–V–
MILLIMETERS
DIM MIN MAX
INCHES
J
J1
MIN
MAX
0.249
0.212
0.078
0.008
0.037
A
B
6.07
5.20
1.73
0.05
0.63
6.33 0.238
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
M
S
0.20 (0.008)
T U
K1
C
D
F
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.73
0.09
0.09
0.25
0.25
7.65
0
0.90 0.028
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.035
0.008
0.006
0.015
0.013
0.311
8
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
D
G
M
8
0
DETAIL E
H
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ISSUE O
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
16X KREF
M
S
S
0.10 (0.004)
T U
V
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
0.15 (0.006) T U
K
K1
16
9
2X L/2
J1
B
–U–
SECTION N–N
6
7
L
J
PIN 1
IDENT.
N
MILLIMETERS
DIM MIN MAX
INCHES
8
1
0.25 (0.010)
MIN
MAX
0.200
0.177
0.047
0.006
0.030
A
B
C
4.90
4.30
–––
5.10 0.193
4.50 0.169
1.20
M
–––
S
0.15 (0.006) T U
D
F
0.05
0.50
0.15 0.002
0.75 0.020
A
N
–V–
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.011
0.008
0.006
0.012
0.010
F
DETAIL E
6.40 BSC
0.252 BSC
0
–W–
M
0
8
8
C
0.10 (0.004)
DETAIL E
H
SEATING
PLANE
–T–
D
G
255
MOTOROLA
Case Outlines
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
20
11
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
-B-
P 10 PL
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
1
10
D 20 PL
J
MILLIMETERS
DIM MIN MAX
12.65 12.95 0.499 0.510
INCHES
M
S
S
0.010 (0.25)
T
A
B
MIN MAX
A
B
C
D
F
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
F
R X 45°
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
0.25
0.10
0°
C
7°
0°
7°
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
-T-
R
M
SEATING
PLANE
K
G 18 PL
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
NOTES:
ISSUE O
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E H
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
10
1
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
e
A
DIM MIN
MAX
MIN
---
MAX
0.081
0.008
0.020
0.011
0.504
0.215
c
A
---
0.05
0.35
0.18
12.35
5.10
2.05
A
0.20 0.002
0.50 0.014
0.27 0.007
12.80 0.486
5.45 0.201
1
b
c
D
E
e
A
b
1
1.27 BSC
0.050 BSC
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
10
E
L
L
E
M
Q
10
0
0.70
---
0.90 0.028
0.81
0.035
0.032
1
Z
---
MOTOROLA
256
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
ISSUE B
20X K REF
NOTES:
6
M
S
S
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
0.12 (0.005)
T U
V
0.25 (0.010)
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
N
20
11
10
L/2
M
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
B
N
L
F
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
PIN 1
IDENT
1
DETAIL E
–U–
A
K
–V–
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
M
S
J
0.20 (0.008)
T U
J1
MILLIMETERS
DIM MIN MAX
INCHES
K1
MIN
MAX
0.288
0.212
0.078
0.008
0.037
A
B
C
D
F
7.07
5.20
1.73
0.05
0.63
7.33 0.278
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
SECTION N–N
–W–
C
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.076 (0.003)
0.59
0.09
0.09
0.25
0.25
7.65
0
0.75 0.023
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.030
0.008
0.006
0.015
0.013
0.311
8
SEATING
PLANE
–T–
D
G
DETAIL E
H
M
8
0
257
MOTOROLA
Case Outlines
(continued)
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X K REF
NOTES:
13 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
14 CONTROLLING DIMENSION: MILLIMETER.
15 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
16 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
17 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
K1
20
11
2X L/2
J J1
B
L
–U–
PIN 1
IDENT
SECTION N–N
1
10
0.25 (0.010)
18 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
N
S
19 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
0.15 (0.006) T U
M
A
–V–
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
N
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
DETAIL E
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
–W–
C
6.40 BSC
0.252 BSC
G
D
M
0
8
0
8
H
DETAIL E
0.100 (0.004)
–T– SEATING
PLANE
MOTOROLA
258
Case Outlines
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
13
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
-B-
P 12 PL
M
M
0.010 (0.25)
B
1
12
D 24 PL
MILLIMETERS
INCHES
MIN MAX
J
F
DIM MIN
MAX
M
S
S
0.010 (0.25)
T
A
B
A
B
C
D
F
G
J
K
M
P
15.25 15.54
0.601 0.612
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
7.40
2.35
0.35
0.41
7.60
2.65
0.49
0.90
R X 45°
1.27 BSC
0.23
0.13
0°
0.32
0.29
8°
0.009 0.013
0.005 0.011
C
0°
8°
10.05 10.55
0.25 0.75
0.395 0.415
0.010 0.029
-T-
SEATING
PLANE
R
M
K
G 22 PL
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940D–03
ISSUE B
NOTES:
24X K REF
20 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.12 (0.005)
T U
V
21 CONTROLLING DIMENSION: MILLIMETER.
22 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
23 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
K
J
J1
L/2
24
13
K1
B
L
24 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
SECTION N–N
PIN 1
IDENT
1
12
0.25 (0.010)
–U–
A
–V–
N
25 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
26 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
M
S
0.20 (0.008)
T U
M
N
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.328
0.212
0.078
0.008
0.037
F
A
B
8.07
5.20
1.73
0.05
0.63
8.33 0.317
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
DETAIL E
C
D
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.44
0.09
0.09
0.25
0.25
7.65
0
0.60 0.017
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.024
0.008
0.006
0.015
0.013
0.311
8
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
G
D
DETAIL E
H
M
8
0
259
MOTOROLA
Case Outlines
(continued)
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948H–01
ISSUE O
24X KREF
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
13
2X L/2
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B
–U–
L
4
5
PIN 1
IDENT.
12
1
S
0.15 (0.006) T U
A
–V–
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.311
0.177
0.047
0.006
0.030
C
A
B
C
7.70
4.30
–––
7.90 0.303
4.50 0.169
1.20
–––
0.10 (0.004)
D
F
0.05
0.50
0.15 0.002
0.75 0.020
SEATING
PLANE
–T–
G
H
D
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
–W–
6.40 BSC
0.252 BSC
M
0
8
0
8
DETAIL E
N
0.25 (0.010)
K
K1
M
N
J1
F
SECTION N–N
DETAIL E
J
MOTOROLA
260
Case Outlines
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1201–01
ISSUE A
48X K REF
K
K1
NOTES:
M
S
S
0.12 (0.005)
T U
V
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
J
J1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
48
25
SECTION N–N
B
–U–
L
N
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
1
24
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
12.40 12.60 0.488 0.496
INCHES
MIN MAX
A
–V–
PIN 1
IDENT.
A
B
N
6.00
–––
6.20 0.236 0.244
1.10 ––– 0.043
C
M
F
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
0.25 (0.010)
DETAIL E
G
H
J
J1
K
K1
L
0.50 BSC
0.0197 BSC
0.37
0.09
0.09
0.17
0.17
7.95
0
––– 0.015 –––
0.20 0.004 0.008
0.16 0.004 0.006
0.27 0.007
0.23 0.007 0.009
8.25 0.313 0.325
D
0.011
C
–W–
0.076 (0.003)
M
8
0
8
DETAIL E
–T–
SEATING
PLANE
H
G
261
MOTOROLA
Case Outlines
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
ISSUE A
56X K REF
K
K1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
0.12 (0.005)
T U
V
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
J
J1
56
29
28
SECTION N–N
B
L
–U–
N
1
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.555
0.244
0.043
0.006
0.030
A
–V–
PIN 1
A
B
C
13.90
6.00
–––
14.10 0.547
6.20 0.236
1.10
IDENT.
N
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
F
M
G
H
J
J1
K
K1
L
0.50 BSC
0.0197 BSC
0.12
0.09
0.09
0.17
0.17
7.95
0
––– 0.005
0.20 0.004
0.16 0.004
0.27 0.007
0.23 0.007
8.25 0.313
–––
0.008
0.006
0.011
0.009
0.325
8
0.25 (0.010)
DETAIL E
D
C
–W–
M
8
0
0.076 (0.003)
DETAIL E
–T–
SEATING
PLANE
H
G
MOTOROLA
262
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