MC74LCX16374DTR2 [ONSEMI]

Low−Voltage CMOS 16−Bit D−Type Flip−Flop With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting); 低电压CMOS 16位D型触发器,具有5 V容限输入和输出(三态,非反相)
MC74LCX16374DTR2
型号: MC74LCX16374DTR2
厂家: ONSEMI    ONSEMI
描述:

Low−Voltage CMOS 16−Bit D−Type Flip−Flop With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting)
低电压CMOS 16位D型触发器,具有5 V容限输入和输出(三态,非反相)

总线驱动器 总线收发器 触发器 逻辑集成电路 光电二极管
文件: 总8页 (文件大小:99K)
中文:  中文翻译
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MC74LCX16374  
Low−Voltage CMOS 16−Bit  
D−Type Flip−Flop  
With 5 V−Tolerant Inputs and Outputs  
(3−State, Non−Inverting)  
http://onsemi.com  
The MC74LCX16374 is a high performance, non−inverting 16−bit  
D−type flip−flop operating from a 2.3 V to 3.6 V supply. The device is  
byte controlled. Each byte has separate Output Enable and Clock Pulse  
inputs. These control pins can be tied together for full 16−bit operation.  
High impedance TTL compatible inputs significantly reduce current  
loading to input drivers while TTL compatible outputs offer improved  
TSSOP−48  
DT SUFFIX  
CASE 1201  
48  
switching noise performance. A V specification of 5.5 V allows  
I
1
MC74LCX16374 inputs to be safely driven from 5.0 V devices.  
The MC74LCX16374 consists of 16 edge−triggered flip−flops with  
individual D−type inputs and 5.0 V−tolerant 3−state true outputs. The  
buffered clocks (CPn) and buffered Output Enables (OEn) are common  
to all flip−flops within the respective byte. The flip−flops will store the  
state of individual D inputs that meet the setup and hold time  
requirements on the LOW−to−HIGH Clock (CP) transition. With the  
OE LOW, the contents of the flip−flops are available at the outputs.  
When the OE is HIGH, the outputs go to the high impedance state. The  
OE input level does not affect the operation of the flip−flops.  
MARKING DIAGRAM  
48  
Features  
Designed for 2.3 to 3.6 V V Operation  
LCX16374G  
AWLYYWW  
CC  
6.2 ns Maximum t  
pd  
5.0 V Tolerant − Interface Capability With 5.0 V TTL Logic  
Supports Live Insertion and Withdrawal  
1
I  
Specification Guarantees High Impedance When V = 0 V  
CC  
OFF  
LVTTL Compatible  
LVCMOS Compatible  
24 mA Balanced Output Sink and Source Capability  
A
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= Pb−Free Package  
WL  
YY  
WW  
G
Near Zero Static Supply Current in All Three Logic States (20 mA)  
Substantially Reduces System Power Requirements  
Latchup Performance Exceeds 500 mA  
ESD Performance: Human Body Model >2000 V;  
Machine Model >200 V  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
These are Pb−Free Devices*  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 6  
MC74LCX16374/D  
MC74LCX16374  
1
24  
25  
OE1  
CP1  
OE2  
CP2  
OE1  
O0  
CP1  
D0  
1
2
48  
47  
46  
45  
48  
O1  
D1  
3
2
13  
14  
16  
17  
19  
20  
22  
23  
nCP  
D
nCP  
D
O0  
O1  
O2  
O3  
O4  
O5  
O6  
O7  
O8  
47  
Q
Q
Q
Q
Q
36  
Q
Q
Q
Q
Q
GND  
O2  
GND  
4
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
5
44 D2  
3
O3  
D3  
V
6
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
nCP  
D
nCP  
D
O9  
46  
44  
43  
41  
40  
38  
37  
35  
33  
32  
30  
29  
27  
26  
V
CC  
7
CC  
O4  
O5  
D4  
8
5
nCP  
D
nCP  
D
D5  
9
O10  
O11  
O12  
O13  
O14  
O15  
D10  
D11  
D12  
D13  
D14  
D15  
GND  
O6  
GND  
D6  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
6
nCP  
D
nCP  
D
O7  
D7  
O8  
D8  
O9  
D9  
8
nCP  
D
nCP  
D
GND  
O10  
O11  
GND  
D10  
D11  
9
nCP  
D
nCP  
D
V
CC  
V
CC  
Q
Q
Q
Q
Q
Q
O12  
O13  
GND  
O14  
O15  
OE2  
D12  
D13  
GND  
D14  
D15  
CP2  
11  
12  
nCP  
D
nCP  
D
nCP  
D
nCP  
D
Figure 2. Logic Diagram  
Figure 1. Pinout: 48−Lead  
(Top View)  
Table 1. PIN NAMES  
Pins  
Function  
OEn  
CPn  
D0−D15  
O0−O15  
Output Enable Inputs  
Clock Pulse Inputs  
Inputs  
Outputs  
TRUTH TABLE  
Inputs  
Outputs  
Inputs  
Outputs  
CP1  
OE1  
L
D0:7  
H
O0:7  
H
CP2  
OE2  
L
D8:15  
O8:15  
H
L
H
L
L
L
L
L
L
L
X
O0  
Z
L
L
X
X
O0  
Z
X
H
X
X
H
H
L
Z
X
=
=
=
=
=
High Voltage Level  
Low Voltage Level  
High Impedance State  
Low−to−High Transition  
High or Low Voltage Level and Transitions Are Acceptable; for I reasons, DO NOT FLOAT Inputs  
CC  
http://onsemi.com  
2
MC74LCX16374  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74LCX16374DT  
MC74LCX16374DTG  
MC74LCX16374DTR2  
M74LCX16374DTR2G  
TSSOP−48*  
TSSOP−48*  
TSSOP−48*  
TSSOP−48*  
39 Units / Rail  
39 Units / Rail  
2500 / Tape & Reel  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently Pb−Free.  
MAXIMUM RATINGS  
Symbol  
Parameter  
DC Supply Voltage  
Value  
Condition  
Unit  
V
V
CC  
−0.5 to +7.0  
V
I
DC Input Voltage  
−0.5 V +7.0  
V
I
V
O
DC Output Voltage  
−0.5 V +7.0  
Output in 3−State  
V
O
−0.5 V V + 0.5  
Output in HIGH or LOW State. (Note 1)  
V
O
CC  
I
DC Input Diode Current  
DC Output Diode Current  
−50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
I
−50  
+50  
50  
V < GND  
O
OK  
V
O
> V  
CC  
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
O
I
100  
100  
CC  
I
GND  
T
−65 to +150  
STG  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. I absolute maximum rating must be observed.  
O
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
2.0  
1.5  
2.5, 3.3  
2.5, 3.3  
3.6  
3.6  
V
V
Input Voltage  
0
5.5  
V
V
I
V
O
Output Voltage  
(HIGH or LOW State)  
(3−State)  
0
0
V
CC  
5.5  
I
HIGH Level Output Current  
LOW Level Output Current  
V
V
V
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
= 2.3 V − 2.7 V  
− 24  
− 12  
− 8  
mA  
mA  
OH  
CC  
CC  
CC  
I
V
CC  
V
CC  
V
CC  
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
= 2.3 V − 2.7 V  
+ 24  
+ 12  
+ 8  
OL  
T
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V,  
−40  
0
+85  
10  
°C  
A
Dt/DV  
ns/V  
IN  
V
CC  
= 3.0 V  
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3
 
MC74LCX16374  
DC ELECTRICAL CHARACTERISTICS  
T
A
= −40°C to +85°C  
Min  
1.7  
2.0  
Max  
Symbol  
Characteristic  
Condition  
Unit  
V
IH  
HIGH Level Input Voltage (Note 2)  
2.3 V V 2.7 V  
V
CC  
2.7 V V 3.6 V  
CC  
V
LOW Level Input Voltage (Note 2)  
HIGH Level Output Voltage  
2.3 V V 2.7 V  
0.7  
0.8  
V
V
IL  
CC  
2.7 V V 3.6 V  
CC  
V
OH  
V
CC  
− 0.2  
2.3 V V 3.6 V; I = 100 mA  
CC  
OL  
V
= 2.3 V; I = −8 mA  
1.8  
2.2  
2.4  
2.2  
CC  
OH  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = −12 mA  
OH  
= 3.0 V; I = −18 mA  
OH  
= 3.0 V; I = −24 mA  
OH  
V
LOW Level Output Voltage  
0.2  
0.6  
0.4  
0.4  
0.55  
5.0  
5.0  
V
2.3 V V 3.6 V; I = 100 mA  
OL  
CC  
OL  
V
CC  
= 2.3 V; I = 8 mA  
OL  
V
= 2.7 V; I = 12 mA  
OL  
CC  
CC  
CC  
V
V
= 3.0 V; I = 16 mA  
OL  
= 3.0 V; I = 24 mA  
OL  
I
Input Leakage Current  
3−State Output Current  
2.3 V V 3.6 V; 0 V V 5.5 V  
mA  
mA  
I
CC  
I
I
2.3 V 3.6 V; 0V V 5.5 V;  
CC O  
OZ  
V = V or V  
IL  
I
IH  
I
Power−Off Leakage Current  
Quiescent Supply Current  
V
= 0 V; V or V = 5.5 V  
10  
20  
mA  
mA  
mA  
mA  
OFF  
CC  
I
O
I
2.3 V 3.6 V; V = GND or V  
CC I CC  
CC  
2.3 V 3.6 V; 3.6 V or V 5.5 V  
20  
CC  
I
O
DI  
Increase in I per Input  
2.3 V 3.6 V; V = V − 0.6 V  
500  
CC  
CC  
CC  
IH  
CC  
2. These values of V are used to test DC electrical characteristics only.  
I
AC CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 W  
R
F
L
L
T
A
= −40°C to +85°C  
V
CC  
= 3.3 V 0.3 V  
V
CC  
= 2.7 V  
V = 2.5 V 0.2 V  
CC  
C = 50 pF  
L
C = 50 pF  
L
C = 30 pF  
L
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Clock Pulse Frequency  
Propagation Delay  
Waveform  
Unit  
MHz  
ns  
f
1
1
170  
max  
t
t
1.5  
1.5  
6.2  
6.2  
1.5  
1.5  
6.5  
6.5  
1.5  
1.5  
7.4  
7.4  
PLH  
PHL  
CP to O  
n
t
t
Output Enable Time to  
High and Low Level  
2
2
1
1.5  
1.5  
6.1  
6.1  
1.5  
1.5  
6.3  
6.3  
1.5  
1.5  
7.9  
7.9  
ns  
ns  
ns  
PZH  
PZL  
t
Output Disable Time From  
High and Low Level  
1.5  
1.5  
6.0  
6.0  
1.5  
1.5  
6.2  
6.2  
1.5  
1.5  
7.2  
7.2  
PHZ  
t
PLZ  
n
t
s
Setup Time, HIGH or LOW D to  
CP  
2.5  
2.5  
3.0  
n
t
Hold Time, HIGH or LOW D to CP  
1
3
1.5  
3.0  
1.5  
3.0  
2.0  
3.5  
ns  
ns  
ns  
h
t
w
CP Pulse Width, HIGH  
t
t
Output−to−Output Skew  
(Note 3)  
1.0  
1.0  
OSHL  
OSLH  
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t  
) or LOW−to−HIGH (t  
); parameter  
OSHL  
OSLH  
guaranteed by design.  
http://onsemi.com  
4
 
MC74LCX16374  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Min  
Typ  
Max  
Symbol  
Characteristic  
Condition  
Unit  
V
OLP  
Dynamic LOW Peak Voltage  
(Note 4)  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
0.8  
0.6  
V
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
V
OLV  
Dynamic LOW Valley Voltage  
(Note 4)  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
−0.8  
−0.6  
V
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is  
measured in the LOW state.  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
Unit  
pF  
C
V
V
7
8
IN  
CC  
I
CC  
CC  
C
Output Capacitance  
= 3.3 V, V = 0 V or V  
pF  
OUT  
CC  
I
C
Power Dissipation Capacitance  
10 MHz, V = 3.3 V, V = 0 V or V  
CC  
20  
pF  
PD  
CC  
I
V
CC  
V
CC  
Vmi  
Vmi  
OEn  
Dn  
Vmi  
0 V  
0 V  
V
t
t
PHZ  
PZH  
t
h
t
s
V
OH  
V
HZ  
CC  
Vmo  
On  
Vmo  
CPn  
0 V  
f
max  
t
t
PLZ  
PZL  
t
, t  
PLH PHL  
V
OH  
Vmo  
On  
On  
Vmo  
V
HZ  
V
OL  
V
OL  
WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES  
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
WAVEFORM 1 − PROPAGATION DELAYS, SETUP AND HOLD TIMES  
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
t
R
t
R
F
W
F
W
V
CC  
CPn  
Vmi  
Vmi  
t
t
0 V  
w
V
CC  
w
Vmo  
Vmo  
CPn  
0 V  
WAVEFORM 3 − PULSE WIDTH  
t
R
= t = 2.5 ns (or fast as required) from 10% to 90%;  
F
Output requirements: V 0.8 V, V 2.0 V  
OL  
OH  
Figure 3. AC Waveforms  
Table 2. AC WAVEFORMS  
V
CC  
3.3 V 0.3 V  
1.5 V  
2.7 V  
1.5 V  
1.5 V  
2.5 V + 0.2 V  
Symbol  
Vmi  
V
/ 2  
/ 2  
CC  
CC  
Vmo  
1.5 V  
V
V
V
+ 0.3 V  
− 0.3 V  
V
+ 0.3 V  
V
OL  
+ 0.15 V  
− 0.15 V  
HZ  
OL  
OL  
V
V
OH  
V
OH  
− 0.3 V  
V
OH  
LZ  
http://onsemi.com  
5
 
MC74LCX16374  
V
CC  
6 V or V × 2  
CC  
OPEN  
R
1
PULSE  
GENERATOR  
GND  
DUT  
R
T
C
L
R
L
Figure 4. Test Circuit  
Table 3. TEST CIRCUIT  
TEST  
SWITCH  
t
, t  
Open  
PLH PHL  
t
, t  
6 V at V = 3.3 0.3 V  
CC  
PZL PLZ  
6 V at V = 2.5 0.2 V  
CC  
Open Collector/Drain t  
and t  
6 V  
PLH  
PHL  
t
, t  
GND  
PZH PHZ  
C = 50 pF at V = 3.3 0.3 V or equivalent (includes jig and probe capacitance)  
L
CC  
C = 30 pF at V = 2.5 0.2 V or equivalent (includes jig and probe capacitance)  
L
CC  
R = R = 500 W or equivalent  
L
1
R = Z  
of pulse generator (typically 50 W)  
T
OUT  
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6
MC74LCX16374  
PACKAGE DIMENSIONS  
TSSOP−48  
DT SUFFIX  
CASE 1201−01  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
48X K REF  
K
K1  
M
S
S
V
0.12 (0.005)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH OR GATE BURRS  
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
J
J1  
48  
25  
SECTION N−N  
B
−U−  
L
5. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
N
6. DIMENSIONS A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
1
24  
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
12.60  
6.20  
1.10  
0.15  
0.75  
MAX  
0.496  
0.244  
0.043  
0.006  
0.030  
A
B
12.40  
6.00  
−−−  
0.488  
0.236  
−−−  
A
−V−  
PIN 1  
IDENT.  
N
C
D
0.05  
0.50  
0.002  
0.020  
M
F
F
G
H
0.50 BSC  
0.0197 BSC  
0.37  
0.09  
0.09  
0.17  
0.17  
7.95  
0
−−−  
0.20  
0.16  
0.27  
0.23  
8.25  
8
0.015  
0.004  
0.004  
0.007  
0.007  
0.313  
0
−−−  
0.008  
0.006  
0.011  
0.009  
0.325  
8
0.25 (0.010)  
DETAIL E  
J
J1  
K
K1  
L
D
C
M
_
_
_
_
−W−  
0.076 (0.003)  
DETAIL E  
−T−  
SEATING  
PLANE  
H
G
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7
MC74LCX16374  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
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PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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MC74LCX16374/D  

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