MC10EP57DTR2 [ONSEMI]
4:1 Differential Multiplexer; 4 ： 1复用器差
| 型号： | MC10EP57DTR2 |
| 厂家： | 
ONSEMI |
| 描述： | 4:1 Differential Multiplexer |
| 文件： | 总8页 (文件大小：103K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The MC10EP57 is a fully differential 4:1 multiplexer. By leaving
the SEL1 line open (pulled LOW via the input pulldown resistors) the
device can also be used as a differential 2:1 multiplexer with SEL0
input selecting between D0 and D1. The fully differential architecture
of the EP57 makes it ideal for use in low skew applications such as
clock distribution.
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The SEL1 is the most significant select line. The binary number
applied to the select inputs will select the same numbered data input
(i.e., 00 selects D0).
20
1
Multiple V
interfaces. In these scenarios, the V
BB
outputs are provided for single-ended or AC coupled
output should be connected to
BB
TSSOP–20
DT SUFFIX
CASE 948E
the data bar inputs and bypassed via a 0.01µF capacitor to ground.
Note that the V output can source/sink up to 0.5mA of current
BB
without upsetting the voltage level. All V
MARKING DIAGRAM
and V
pins must be
CC
EE
externally connected to power supply to guarantee proper operation
• 350ps Typical Propagation Delays
• Typical Frequency 3.0GHz
• 20–Lead TSSOP Package
A = Assembly Location
L = Wafer Lot
Y = Year
MC10
EP57
ALYW
W = Work Week
• PECL mode: 3.0V to 5.5V V
with V = 0V
CC
EE
• ECL mode: 0V V
CC
with V = –3.0V to –5.5V
EE
*For additional information, see Application Note
AND8002/D
• Internal Input Resistors: Pulldown on D, D
• Q Output will default LOW with inputs open or at V
• ESD Protection: >2KV HBM, >100V MM
EE
PIN DESCRIPTION
• V Outputs
BB
PIN
FUNCTION
ECL Diff. Data Inputs
ECL Mux Select Inputs
ECL Reference Output Voltage
ECL Data Outputs
• New Differential Input Common Mode Range
D0–3, D0–3
SEL0, 1
• Moisture Sensitivity Level 1, Indefinite Time Out of Drypack.
For Additional Information, See Application Note AND8003/D
• Useful as Either 4:1 or 2:1 Multiplexer
• Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
V
, V
BB1 BB2
Q, Q
V
CC
Positive Supply
V
EE
Negative, 0 Supply
• Transistor Count = 584 devices
V
CC
SEL1 SEL0
V
CC
Q
V
V
V
V
EE
Q
CC BB1 BB2
FUNCTION TABLE
20
19
18
17
16
15
14
13
12
11
SEL1
SEL0
DATA OUT
L
L
H
L
H
L
D0, D0
D1, D1
D2, D2
D3, D3
4:1
H
H
ORDERING INFORMATION
Device
Package
TSSOP
TSSOP
Shipping
MC10EP57DT
75 Units/Rail
1
2
3
4
5
6
7
8
9
10
MC10EP57DTR2
2500 Tape & Reel
V
CC
D0
D0
D1
D1
D2
D2
D3
D3
V
EE
Figure 1. 20–Lead TSSOP (Top View) and Logic Diagram
Semiconductor Components Industries, LLC, 2000
1
Publication Order Number:
April, 2000 – Rev. 2
MC10EP57/D
MC10EP57
MAXIMUM RATINGS*
Symbol
Parameter
Value
–6.0 to 0
6.0 to 0
–6.0 to 0
6.0 to 0
Unit
VDC
VDC
VDC
VDC
mA
V
V
V
V
Power Supply (V
Power Supply (V
= 0V)
= 0V)
EE
CC
CC
EE
Input Voltage (V
Input Voltage (V
Output Current
= 0V, V not more negative than V )
EE
I
I
CC
I
= 0V, V not more positive than V
)
CC
EE
I
I
Continuous
Surge
50
100
out
I
V
Sink/Source Current
± 0.5
mA
°C
BB
BB
T
Operating Temperature Range
Storage Temperature
–40 to +85
–65 to +150
A
T
°C
stg
θ
Thermal Resistance (Junction–to–Ambient)
Still Air
500lfpm
140
100
°C/W
JA
θ
Thermal Resistance (Junction–to–Case)
23 to 41 ±5%
°C/W
°C
JC
T
Solder Temperature (<2 to 3 Seconds: 245°C desired)
265
sol
* Maximum Ratings are those values beyond which damage to the device may occur.
Use for inputs of same package only.
DC CHARACTERISTICS, ECL/LVECL (V
= 0V; V
= –5.5V to –3.0V) (Note 4.)
CC
EE
–40°C
Typ
52
25°C
Typ
52
85°C
Typ
52
Symbol
Characteristic
Power Supply Current
Min
Max
Min
Max
65
Min
Max
Unit
40
65
40
40
65
mA
IEE
(Note 1.)
V
V
V
V
Output HIGH Voltage
(Note 2.)
–1135 –1060 –885 –1070 –945
–820 –1010 –885
–760
mV
mV
mV
mV
OH
OL
IH
Output LOW Voltage
(Note 2.)
–1995 –1810 –1685 –1995 –1745 –1620 –1995 –1685 –1560
Input HIGH Voltage
Single Ended
–1210
–1935
–885 –1145
–1610 –1870
–820 –1085
–1545 –1810
–760
Input LOW Voltage
Single Ended
–1485
IL
V
V
Output Voltage Reference
–1550 –1450 –1350 –1500 –1400 –1300 –1450 –1350 –1250
mV
V
BB
Input HIGH Voltage Common Mode
Range (Note 3.)
V +2.0
EE
0.0
V +2.0
EE
0.0
V +2.0
EE
0.0
IHCMR
I
I
Input HIGH Current
150
150
150
µA
µA
IH
Input LOW Current
IL
SEL, D
D
0.5
–150
0.5
–150
0.5
–150
NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.
1. V
= 0V, V
= V
to V
, all other pins floating.
CC
EE
EEmin
EEmax
2. All loading with 50 ohms to V –2.0 volts.
CC
3. V
min varies 1:1 with V , max varies 1:1 with V .
EE CC
IHCMR
4. Input and output parameters vary 1:1 with V
.
CC
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2
MC10EP57
DC CHARACTERISTICS, LVPECL (V
= 3.3V ± 0.3V, V
= 0V) (Note 8.)
EE
CC
–40°C
25°C
Typ
52
85°C
Typ
52
Symbol
Characteristic
Power Supply Current
Min
Typ
Max
Min
Max
Min
Max
Unit
40
52
65
40
65
40
65
mA
IEE
(Note 5.)
V
V
V
V
Output HIGH Voltage
(Note 6.)
2165
1305
2090
1365
2240
1490
2415
1615
2415
1690
2230
1305
2155
1430
2355
1555
2480
1680
2480
1755
2290
1305
2215
1490
2415
1615
2540
1740
2540
1815
mV
mV
mV
mV
OH
OL
IH
Output LOW Voltage
(Note 6.)
Input HIGH Voltage
Single Ended
Input LOW Voltage
Single Ended
IL
V
V
Output Voltage Reference
1750
2.0
1850
1950
3.3
1800
2.0
1900
2000
3.3
1850
2.0
1950
2050
3.3
mV
V
BB
Input HIGH Voltage Common Mode
Range (Note 7.)
IHCMR
I
I
Input HIGH Current
150
150
150
µA
µA
IH
Input LOW Current
IL
SEL, D
D
0.5
–150
0.5
–150
0.5
–150
NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.
5. V
= 3.3V, V = 0V, all other pins floating.
CC
EE
6. All loading with 50 ohms to V –2.0 volts.
CC
7. V
min varies 1:1 with V , max varies 1:1 with V .
EE CC
IHCMR
8. Input and output parameters vary 1:1 with V
.
CC
DC CHARACTERISTICS, PECL (V
= 5.0V ± 0.5V, V
= 0V) (Note 12.)
EE
CC
–40°C
25°C
85°C
Symbol
Characteristic
Power Supply Current
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
40
52
65
40
52
65
40
52
65
mA
IEE
(Note 9.)
V
V
V
V
Output HIGH Voltage
(Note 10.)
3865
3005
3790
3065
3940
3190
4115
3315
4115
3390
3930
3005
3855
3130
4055
3255
4180
3380
4180
3455
3990
3005
3915
3190
4115
3315
4240
3440
4240
3515
mV
mV
mV
mV
OH
OL
IH
Output LOW Voltage
(Note 10.)
Input HIGH Voltage
Single Ended
Input LOW Voltage
Single Ended
IL
V
V
Output Voltage Reference
3450
2.0
3550
3650
5.0
3500
2.0
3600
3700
5.0
3550
2.0
3650
3750
5.0
mV
V
BB
Input HIGH Voltage Common Mode
Range (Note 11.)
IHCMR
I
I
Input HIGH Current
150
150
150
µA
µA
IH
Input LOW Current
IL
SEL, D
D
0.5
–150
0.5
–150
0.5
–150
NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.
9. V
= 5.0V, V = 0V, all other pins floating.
CC
EE
10.All loading with 50 ohms to V –2.0 volts.
CC
11. V
min varies 1:1 with V , max varies 1:1 with V .
EE CC
IHCMR
12.Input and output parameters vary 1:1 with V
.
CC
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3
MC10EP57
AC CHARACTERISTICS (V
= 0V; V
EE
= –3.0V to –5.5V) or (V
CC
= 3.0V to 5.5V; V
CC
EE = 0V)
–40°C
25°C
85°C
Symbol
Characteristic
Maximum Toggle
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
f
3.0
GHz
max
Frequency (Note 13.)
t
t
,
Propagation Delay to
Output Differential
ps
ps
PLH
PHL
D–>Q, Q
250
300
350
400
450
500
275
320
375
420
475
520
320
320
420
450
520
575
COM_SEL, SEL–>Q, Q
t
Within–Device Skew (Note 14.)
Duty Cycle Skew (Note 15.)
100
100
100
SKEW
t
Cycle–to–Cycle Jitter
TBD
800
120
TBD
800
140
TBD
800
150
ps
mV
ps
JITTER
V
Input Voltage Swing (Diff.)
150
70
1200
170
150
70
1200
200
150
70
1200
220
PP
t , t
r f
Output Rise/Fall Times
(20% – 80%)
Q, Q
13.F
guaranteed for functionality only.
max
14.Within–Device Skew is defined as identical transitions on similar paths through a device.
15.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.
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4
MC10EP57
PACKAGE DIMENSIONS
TSSOP–20
DT SUFFIX
20 PIN PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X K REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
M
S
S
0.10 (0.004)
T U
V
S
Y14.5M, 1982.
0.15 (0.006) T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
K1
20
11
2X L/2
J J1
B
L
–U–
PIN 1
IDENT
SECTION N–N
1
10
0.25 (0.010)
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
N
S
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
0.15 (0.006) T U
M
A
–V–
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
N
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
DETAIL E
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
–W–
C
6.40 BSC
0.252 BSC
G
D
M
0
8
0
8
H
DETAIL E
0.100 (0.004)
–T– SEATING
PLANE
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5
MC10EP57
Notes
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6
MC10EP57
Notes
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7
MC10EP57
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MC10EP57/D
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