MBRB3030CTG [ONSEMI]

SWITCHMODE Power Rectifier; 开关模式电源整流器
MBRB3030CTG
型号: MBRB3030CTG
厂家: ONSEMI    ONSEMI
描述:

SWITCHMODE Power Rectifier
开关模式电源整流器

开关
文件: 总6页 (文件大小:60K)
中文:  中文翻译
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MBRB3030CT  
Preferred Device  
SWITCHMODEt  
Power Rectifier  
These state−of−the−art devices use the Schottky Barrier principle  
with a proprietary barrier metal.  
Features  
http://onsemi.com  
Guardring for Stress Protection  
Maximum Die Size  
175°C Operating Junction Temperature  
Short Heat Sink Tab Manufactured − Not Sheared  
Pb−Free Packages are Available  
SCHOTTKY BARRIER  
RECTIFIER  
30 AMPERES, 30 VOLTS  
Mechanical Characteristics:  
Case: Epoxy, Molded, Epoxy Meets UL 94 V−0  
Weight: 1.7 Grams (Approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
1
4
3
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
4
Device Meets MSL1 Requirements  
ESD Ratings: Machine Model, C (>400 V)  
1
Human Body Model, 3B (>8000 V)  
3
MAXIMUM RATINGS  
2
D PAK  
Rating  
Symbol  
Value  
Unit  
CASE 418B  
STYLE 3  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
V
30  
V
RRM  
RWM  
R
Average Rectified Forward Current  
I
A
MARKING DIAGRAM  
F(AV)  
30  
15  
(At Rated V , T = 134°C)  
Per Device  
Per Leg  
R
C
Peak Repetitive Forward Current  
I
30  
200  
2.0  
A
A
A
FRM  
(At Rated V , Square Wave,  
AY WW  
R
20 kHz, T = +137°C) Per Leg  
C
B3030CTG  
AKA  
Non−Repetitive Peak Surge Current  
(Surge Applied at Rated Load Conditions,  
Halfwave, Single Phase, 60 Hz)  
I
FSM  
RRM  
Peak Repetitive Reverse Surge Current  
I
(2.0 ms, 1.0 kHz)  
Storage Temperature Range  
T
−55 to +175  
−55 to +175  
10,000  
°C  
°C  
stg  
A
Y
WW  
= Assembly Location  
= Year  
= Work Week  
Operating Junction Temperature (Note 1)  
T
J
Voltage Rate of Change (Rated V )  
dv/dt  
V/ms  
mJ  
R
B3030CT = Device Code  
G
AKA  
Reverse Energy  
(Unclamped Inductive Surge)  
W
100  
= Pb−Free Package  
= Diode Polarity  
(Inductance = 3 mH, T = 25°C)  
C
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
1. The heat generated must be less than the thermal conductivity from  
Preferred devices are recommended choices for future use  
Junction−to−Ambient: dP /dT < 1/R .  
q
JA  
and best overall value.  
D
J
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 6  
MBRB3030CT/D  
 
MBRB3030CT  
THERMAL CHARACTERISTICS (Per Leg)  
Characteristic  
Thermal Resistance, − Junction−to−Case  
Junction−to−Ambient (Note 2)  
Symbol  
Value  
Unit  
R
1.0  
50  
°C/W  
q
JC  
q
R
JA  
2. When mounted using minimum recommended pad size on FR−4 board.  
ELECTRICAL CHARACTERISTICS (Per Leg)  
Characteristic  
Symbol  
Value  
Unit  
Maximum Instantaneous Forward Voltage (Note 3), Per Leg  
V
F
V
(I = 15 Amps, T = +25°C)  
0.54  
0.47  
0.67  
0.66  
F
C
(I = 15 Amps, T = +150°C)  
F
C
(I = 30 Amps, T = +25°C)  
F
C
(I = 30 Amps, T = +150°C)  
F
C
Maximum Instantaneous Reverse Current (Note 3), Per Leg  
(Rated dc Voltage, T = +25°C)  
I
R
mA  
0.6  
46  
C
(Reverse Voltage = 10 V, T = +150°C)  
C
(Rated dc Voltage, T = +150°C)  
145  
C
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
2
MBRB3030CT  
D PAK  
50 Units / Rail  
50 Units / Rail  
2
MBRB3030CTG  
D PAK  
(Pb−Free)  
2
MBRB3030CTT4  
D PAK  
800 Units / Tape & Reel  
800 Units / Tape & Reel  
2
MBRB3030CTT4G  
D PAK  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
2
 
MBRB3030CT  
ELECTRICAL CHARACTERISTICS  
100  
10  
1
100  
10  
T = 150°C  
J
T = 150°C  
J
25°C  
25°C  
1
100°C  
100°C  
0.1  
0.1  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
V , INSTANTANEOUS VOLTAGE (VOLTS)  
F
V , INSTANTANEOUS VOLTAGE (V)  
F
Figure 1. Maximum Forward Voltage, Per Leg  
Figure 2. Typical Forward Voltage, Per Leg  
1.0  
0.1  
1.0  
0.1  
T = 150°C  
J
T = 150°C  
J
0.01  
0.001  
0.01  
0.001  
100°C  
100°C  
−4  
−4  
10  
10  
25°C  
25°C  
−5  
−5  
10  
10  
−6  
−6  
10  
10  
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
V , REVERSE VOLTAGE (V)  
R
V , REVERSE VOLTAGE (V)  
R
Figure 3. Maximum Reverse Current, Per Leg  
Figure 4. Typical Reverse Current, Per Leg  
T = 25°C  
J
5000  
3000  
MAXIMUM  
TYPICAL  
1000  
800  
600  
1
10  
V , REVERSE VOLTAGE (V)  
R
Figure 5. Capacitance  
http://onsemi.com  
3
MBRB3030CT  
TYPICAL CHARACTERISTICS  
30  
R
q
= 25°C/W  
JA  
R
q
= 1°C/W  
JC  
DC  
SQUARE WAVE  
15  
10  
5
DC  
I
I
PK  
= 5.0 (CAPACITIVE  
LOAD)  
20  
AV  
SQUARE WAVE  
π (RESISTIVE LOAD)  
I
I
π (RESISTIVE LOAD)  
PK  
= 5.0 (CAPACITIVE  
LOAD)  
AV  
10  
10  
20  
10  
20  
0
0
150  
0
50  
100  
120  
125  
130  
135  
140  
145  
150  
155  
T , AMBIENT TEMPERATURE (°C)  
A
T , CASE TEMPERATURE (°C)  
C
Figure 7. Current Derating  
Figure 6. Current Derating, Infinite Heatsink  
10  
8
R
= 50°C/W  
q
JA  
T = 150°C  
J
15  
10  
5
π (RESISTIVE LOAD)  
DC  
π (RESISTIVE LOAD)  
I
I
PK  
= 5.0 (CAPACITIVE  
LOAD)  
SQUARE WAVE  
AV  
DC  
6
I
I
PK  
= 5.0 (CAPACITIVE  
LOAD)  
10  
AV  
4
20  
SQUARE WAVE  
10  
20  
2
0
0
0
50  
100  
150  
0
5
I
10  
15  
20  
25  
T , AMBIENT TEMPERATURE (°C)  
, AVERAGE FORWARD CURRENT (A)  
A
F(AV)  
Figure 8. Current Derating, Free Air  
Figure 9. Forward Power Dissipation  
1.0  
SINGLE PULSE  
P
pk  
P
pk  
DUTY CYCLE, D = t /t  
p
PEAK POWER, P , is peak of an  
pk  
equivalent square power pulse.  
1
0.1  
t
p
TIME  
t
1
JL  
DT = P R [D + (1 − D) r(t + t ) + r(t ) − r(t )]  
q
JL  
where  
DT = the increase in junction temperature above the lead temperature  
pk  
1
p
p
1
JL  
r(t) = normalized value of transient thermal resistance at time, t, for example,  
r(t) = r(t + t ) = normalized value of transient thermal resistance at time, t + t .  
1
1
p
p
0.01  
0.1  
1.0  
10  
100  
1000  
t, TIME (ms)  
Figure 10. Thermal Response  
http://onsemi.com  
4
MBRB3030CT  
PACKAGE DIMENSIONS  
D2PAK 3  
CASE 418B−04  
ISSUE J  
NOTES:  
C
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. 418B−01 THRU 418B−03 OBSOLETE,  
NEW STANDARD 418B−04.  
E
V
W
−B−  
4
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
MAX  
A
B
C
D
E
F
G
H
J
0.340 0.380  
0.380 0.405  
0.160 0.190  
0.020 0.035  
0.045 0.055  
0.310 0.350  
0.100 BSC  
8.64  
9.65 10.29  
4.06  
0.51  
1.14  
7.87  
9.65  
A
4.83  
0.89  
1.40  
8.89  
S
1
2
3
2.54 BSC  
−T−  
SEATING  
PLANE  
0.080  
0.018 0.025  
0.090 0.110  
0.110  
2.03  
0.46  
2.29  
1.32  
7.11  
5.00 REF  
2.00 REF  
0.99 REF  
2.79  
0.64  
2.79  
1.83  
8.13  
K
W
J
K
L
G
0.052 0.072  
0.280 0.320  
0.197 REF  
0.079 REF  
0.039 REF  
M
N
P
R
S
V
H
D 3 PL  
M
M
B
0.13 (0.005)  
T
0.575 0.625 14.60 15.88  
0.045 0.055 1.14 1.40  
STYLE 3:  
VARIABLE  
CONFIGURATION  
ZONE  
PIN 1. ANODE  
2. CATHODE  
3. ANODE  
N
P
R
4. CATHODE  
U
L
L
L
M
M
M
F
F
F
VIEW W−W  
1
VIEW W−W  
2
VIEW W−W  
3
SOLDERING FOOTPRINT*  
8.38  
0.33  
1.016  
0.04  
10.66  
0.42  
5.08  
0.20  
3.05  
0.12  
17.02  
0.67  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
5
MBRB3030CT  
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MBRB3030CT/D  

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