MBRB3030CTG [ONSEMI]
SWITCHMODE Power Rectifier; 开关模式电源整流器![MBRB3030CTG](http://pdffile.icpdf.com/pdf1/p00179/img/icpdf/MBRB3_1005775_icpdf.jpg)
型号: | MBRB3030CTG |
厂家: | ![]() |
描述: | SWITCHMODE Power Rectifier |
文件: | 总6页 (文件大小:60K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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MBRB3030CT
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices use the Schottky Barrier principle
with a proprietary barrier metal.
Features
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• Guardring for Stress Protection
• Maximum Die Size
• 175°C Operating Junction Temperature
• Short Heat Sink Tab Manufactured − Not Sheared
• Pb−Free Packages are Available
SCHOTTKY BARRIER
RECTIFIER
30 AMPERES, 30 VOLTS
Mechanical Characteristics:
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
1
4
3
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
4
• Device Meets MSL1 Requirements
• ESD Ratings: Machine Model, C (>400 V)
1
Human Body Model, 3B (>8000 V)
3
MAXIMUM RATINGS
2
D PAK
Rating
Symbol
Value
Unit
CASE 418B
STYLE 3
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
30
V
RRM
RWM
R
Average Rectified Forward Current
I
A
MARKING DIAGRAM
F(AV)
30
15
(At Rated V , T = 134°C)
Per Device
Per Leg
R
C
Peak Repetitive Forward Current
I
30
200
2.0
A
A
A
FRM
(At Rated V , Square Wave,
AY WW
R
20 kHz, T = +137°C) Per Leg
C
B3030CTG
AKA
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions,
Halfwave, Single Phase, 60 Hz)
I
FSM
RRM
Peak Repetitive Reverse Surge Current
I
(2.0 ms, 1.0 kHz)
Storage Temperature Range
T
−55 to +175
−55 to +175
10,000
°C
°C
stg
A
Y
WW
= Assembly Location
= Year
= Work Week
Operating Junction Temperature (Note 1)
T
J
Voltage Rate of Change (Rated V )
dv/dt
V/ms
mJ
R
B3030CT = Device Code
G
AKA
Reverse Energy
(Unclamped Inductive Surge)
W
100
= Pb−Free Package
= Diode Polarity
(Inductance = 3 mH, T = 25°C)
C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1. The heat generated must be less than the thermal conductivity from
Preferred devices are recommended choices for future use
Junction−to−Ambient: dP /dT < 1/R .
q
JA
and best overall value.
D
J
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 6
MBRB3030CT/D
MBRB3030CT
THERMAL CHARACTERISTICS (Per Leg)
Characteristic
Thermal Resistance, − Junction−to−Case
− Junction−to−Ambient (Note 2)
Symbol
Value
Unit
R
1.0
50
°C/W
q
JC
q
R
JA
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage (Note 3), Per Leg
V
F
V
(I = 15 Amps, T = +25°C)
0.54
0.47
0.67
0.66
F
C
(I = 15 Amps, T = +150°C)
F
C
(I = 30 Amps, T = +25°C)
F
C
(I = 30 Amps, T = +150°C)
F
C
Maximum Instantaneous Reverse Current (Note 3), Per Leg
(Rated dc Voltage, T = +25°C)
I
R
mA
0.6
46
C
(Reverse Voltage = 10 V, T = +150°C)
C
(Rated dc Voltage, T = +150°C)
145
C
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
ORDERING INFORMATION
Device
†
Package
Shipping
2
MBRB3030CT
D PAK
50 Units / Rail
50 Units / Rail
2
MBRB3030CTG
D PAK
(Pb−Free)
2
MBRB3030CTT4
D PAK
800 Units / Tape & Reel
800 Units / Tape & Reel
2
MBRB3030CTT4G
D PAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MBRB3030CT
ELECTRICAL CHARACTERISTICS
100
10
1
100
10
T = 150°C
J
T = 150°C
J
25°C
25°C
1
100°C
100°C
0.1
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
V , INSTANTANEOUS VOLTAGE (VOLTS)
F
V , INSTANTANEOUS VOLTAGE (V)
F
Figure 1. Maximum Forward Voltage, Per Leg
Figure 2. Typical Forward Voltage, Per Leg
1.0
0.1
1.0
0.1
T = 150°C
J
T = 150°C
J
0.01
0.001
0.01
0.001
100°C
100°C
−4
−4
10
10
25°C
25°C
−5
−5
10
10
−6
−6
10
10
0
5
10
15
20
25
30
0
5
10
15
20
25
30
V , REVERSE VOLTAGE (V)
R
V , REVERSE VOLTAGE (V)
R
Figure 3. Maximum Reverse Current, Per Leg
Figure 4. Typical Reverse Current, Per Leg
T = 25°C
J
5000
3000
MAXIMUM
TYPICAL
1000
800
600
1
10
V , REVERSE VOLTAGE (V)
R
Figure 5. Capacitance
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3
MBRB3030CT
TYPICAL CHARACTERISTICS
30
R
q
= 25°C/W
JA
R
q
= 1°C/W
JC
DC
SQUARE WAVE
15
10
5
DC
I
I
PK
= 5.0 (CAPACITIVE
LOAD)
20
AV
SQUARE WAVE
π (RESISTIVE LOAD)
I
I
π (RESISTIVE LOAD)
PK
= 5.0 (CAPACITIVE
LOAD)
AV
10
10
20
10
20
0
0
150
0
50
100
120
125
130
135
140
145
150
155
T , AMBIENT TEMPERATURE (°C)
A
T , CASE TEMPERATURE (°C)
C
Figure 7. Current Derating
Figure 6. Current Derating, Infinite Heatsink
10
8
R
= 50°C/W
q
JA
T = 150°C
J
15
10
5
π (RESISTIVE LOAD)
DC
π (RESISTIVE LOAD)
I
I
PK
= 5.0 (CAPACITIVE
LOAD)
SQUARE WAVE
AV
DC
6
I
I
PK
= 5.0 (CAPACITIVE
LOAD)
10
AV
4
20
SQUARE WAVE
10
20
2
0
0
0
50
100
150
0
5
I
10
15
20
25
T , AMBIENT TEMPERATURE (°C)
, AVERAGE FORWARD CURRENT (A)
A
F(AV)
Figure 8. Current Derating, Free Air
Figure 9. Forward Power Dissipation
1.0
SINGLE PULSE
P
pk
P
pk
DUTY CYCLE, D = t /t
p
PEAK POWER, P , is peak of an
pk
equivalent square power pulse.
1
0.1
t
p
TIME
t
1
JL
DT = P • R [D + (1 − D) • r(t + t ) + r(t ) − r(t )]
q
JL
where
DT = the increase in junction temperature above the lead temperature
pk
1
p
p
1
JL
r(t) = normalized value of transient thermal resistance at time, t, for example,
r(t) = r(t + t ) = normalized value of transient thermal resistance at time, t + t .
1
1
p
p
0.01
0.1
1.0
10
100
1000
t, TIME (ms)
Figure 10. Thermal Response
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4
MBRB3030CT
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE J
NOTES:
C
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
E
V
W
−B−
4
INCHES
DIM MIN MAX
MILLIMETERS
MIN
MAX
A
B
C
D
E
F
G
H
J
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
8.64
9.65 10.29
4.06
0.51
1.14
7.87
9.65
A
4.83
0.89
1.40
8.89
S
1
2
3
2.54 BSC
−T−
SEATING
PLANE
0.080
0.018 0.025
0.090 0.110
0.110
2.03
0.46
2.29
1.32
7.11
5.00 REF
2.00 REF
0.99 REF
2.79
0.64
2.79
1.83
8.13
K
W
J
K
L
G
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
M
N
P
R
S
V
H
D 3 PL
M
M
B
0.13 (0.005)
T
0.575 0.625 14.60 15.88
0.045 0.055 1.14 1.40
STYLE 3:
VARIABLE
CONFIGURATION
ZONE
PIN 1. ANODE
2. CATHODE
3. ANODE
N
P
R
4. CATHODE
U
L
L
L
M
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MBRB3030CT
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
MBRB3030CT/D
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