LC898219XI-MH [ONSEMI]
自动对焦 (AF) 控制器;
| 型号： | LC898219XI-MH |
| 厂家： | 
ONSEMI |
| 描述： | 自动对焦 (AF) 控制器 控制器 |
| 文件： | 总9页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
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Auto Focus (AF) Controller
LC898219XI
Overview
This LSI is Closed−Auto Focus control LSI equipped with hall
sensor. It consists of 1 system feedback circuit and constant current
driver. It has also a built−in EEPROM and temperature sensor.
WLCSP8, 0.97x2.25x0.265
CASE 567TE
Features
MARKING DIAGRAM
• Built−in Equalizer Circuit Using Digital Operation
♦ AF Control Equalizer Circuit
8219XI
YMAZZ
♦ Any Coefficient can be Specified by 2−wire Serial I/F (TWIF)
• 2−wire Serial Interface
2
8219XI = Specific Device Code
(The Communication Protocol is Compatible with I C)
Y
M
A
= Year
= Month
= Assembly Site
= Lot Number
• Built−in A/D Converter
• Built−in D/A Converter
ZZ
♦ Hall Offset
♦ Constant Current Bias
• Built−in Hall Sensor
♦ Si Hall Sensor
ORDERING INFORMATION
†
Device
LC898219XI−MH
Package
Shipping
4000 /
Tape & Reel
• Built−in VGA
WLCSP8
♦ Hall Amp
• Built−in EEPROM
♦ 128 Byte (16 Byte/Page)
• Built−in OSC
• Built−in Constant Current Driver
♦ 140 mA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
• Package
♦ WLCSP 8−pin
• Supply Voltage
♦ V (2.6 V to 3.3 V)
DD
• This Device is Pb−Free, Halogen Free/BFR Free and is RoHS
Compliant
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
May, 2022 − Rev. 0
LC898219XI/D
LC898219XI
PIN DESCRIPTION
Table 1. PIN DESCRIPTION
Pin Name
Description
I
P
Input
Power Supply, GND
NC
O
Not Connect
Output
B
Bidirection
*Process when pins are not used
• 2−wire serial interface
PIN TYPE “O” – Ensure that it is set to OPEN.
PIN TYPE “I” – OPEN is inhibited. Ensure that it is
SCL
SDA
I
2−wire serial interface clock pin
2−wire serial interface data pin
B
connected to the V or V even when it is unused.
DD
SS
• Driver interface
(Please contact onsemi for more information about
OUT1
OUT2
O
O
Driver output (to Actuator)
Driver output (to Actuator)
selection of V or V .)
DD
SS
PIN TYPE “B” – If you are unsure about processing
method on the pin description of pin layout table, please
contact us.
• Power supply pin
VDD
VSS
P
P
Power Supply
GND
Note that incorrect processing of unused pins may result in
defects.
• Port pin
*In case of connecting PORT pin with HOST CPU
When LC898219XI is power off and HOST CPU is power
on, a HOST CPU pin connected with PORT pin have to be
fixed “L” level.
PORT
B
O
Convergence detection monitor output
VSYNC input
Test pin
• Test pin
TEST
Test pin
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2
LC898219XI
PIN LAYOUT
1
2
3
4
OUT1
VDD
SCL
SDA
B
A
OUT2
VSS
TEST
PORT
BOTTOM VIEW
Figure 1. Pin Layout
BLOCK DIAGRAM
SDA
SCL
2−Wire
Serial I/F
EEPROM
Hall
Offset
/Bias
Control
logic
OUT1
OUT2
Constant
Current
Driver
AD
EQ
Hall
VGA
Temperature
OUT1
OUT2
VDD
VSS
PORT
TEST
more than or
equal to 0.1 mF*
OSC
POR
LDO
*Consider capacitance of capacitor between V and V . According to power source environment,
DD
SS
attach an additional capacitor in camera module.
Figure 2. Block Diagram
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3
LC898219XI
HALL ELEMENT POSITION
Please refer to package diagram for each dimension.
Figure 3. Hall Element Position
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4
LC898219XI
ELECTRICAL CHARACTERISTICS
Table 2. ABSOLUTE MAXIMUM RATINGS (V = 0 V)
SS
Symbol
33 max
Item
Condition
Rating
Unit
V
V
Supply voltage
Ta ≤ 25°C
Ta ≤ 25°C
−0.3 to 4.6
DD
V 33, V 33
Input/output voltage
−0.3 to V 33 + 0.3
V
I
O
DD
Tstg
Topr
Storage ambient temperature
Operating ambient temperature
−55 to 125
−30 to 70
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. ACCEPTABLE OPERATING RANGES (Ta = −30 to 70°C, VSS = 0 V, 3 V power supply (V ))
DD
Symbol
33
Item
Min
2.6
0
Typ
Max
Unit
V
V
Supply voltage
2.8
3.3
DD
V
IN
Input voltage range
V
DD
33
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 4. DC CHARACTERISTICS (Input / output level at V = 0 V, V = 2.6 to 3.3 V, Ta = −30 to 70°C)
SS
DD
Symbol
Item
Condition
Min
Typ
Max
Unit
V
Applicable Pins
V
IH
High−level input voltage
Low−level input voltage
High−level output voltage
Low−level output voltage
Pulldown resistor
CMOS compliant Schmitt
1.4
SCL, SDA,
PORT
V
IL
0.4
V
V
OH
IOH = −2 mA
V
−0.4
V
PORT
SDA, PORT
PORT
DD
V
OL
IOL = 2 mA
0.2
V
Rdn
50
220
kW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 5. DRIVER OUTPUT (OUT1, OUT2) (V = 0 V, V = 2.8 V, Ta = 25°C)
SS
DD
Symbol
Item
Condition
Min
Typ
Max
Unit
Applicable Pins
Ifull
Maximum current
133
140
147
mA
OUT1, OUT2
Table 6. NON−VOLATILE MEMORY CHARACTERISTICS
Symbol
EN
Item
Condition
Min
Typ
Max
Unit
Applicable Circuit
Endurance
Data retention
Write time
1000
Cycles
Years
ms
EEPROM
RT
10
tWT
20
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5
LC898219XI
AC CHARACTERISTICS
VDD Supply Timing
t2
t3
VDD
VSS
Vbot
t1
SCL / SDA
Figure 4. VDD Supply Timing
It is available to use 2−wire serial interface 5 ms later for Power On Reset of V
.
DD
Table 7. VDD SUPPLY TIMING
Symbol
Item
Min
Typ
Max
Unit
ms
ms
ms
V
t1
t2
V
turn on time
3
DD
2−wire serial interface start time from V on
5
DD
t3
V
DD
off time
100
Vbot
Bottom Voltage
0.1
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6
LC898219XI
AC Specification
Figure 5 shows interface timing definition and Table 8 shows electric characteristics.
VIHmin
SDA
VILmax
tBUF
tHD,DAT tSU,DAT
tSU,STA tHD,STA
tf
tLOW
tr
VIHmin
SCL
VILmax
tHD,STA
tr
tf
tSU,STO
Stop
Start
Condition
Repeated
Condition
Start
Condition Condition
Figure 5. 2−wire Serial Interface Timing Definition
Table 8. ELECTRICAL CHARACTERISTICS FOR 2−WIRE SERIAL INTERFACE (AC CHARACTERISTICS)
Fast−mode
Fast−mode Plus
Pin
Symbol
Item
SCL clock frequency
Name
Min
Typ
Max
Min
Typ
Max
Unit
kHz
ms
FSCL
SCL
400
1000
tHD,STA START condition hold time
SCL
SDA
0.6
0.26
tLOW
tHIGH
SCL clock Low period
SCL clock High period
SCL
SCL
1.3
0.6
0.6
0.5
ms
ms
ms
0.26
0.26
tSU,STA Setup time for repetition START condition
SCL
SDA
tHD,DAT Data hold time
SCL
0
0.9
0
ms
ns
ns
ns
ms
ms
SDA (Note 1)
(Note 1)
tSU,DAT Data setup time
SCL
SDA
100
50
tr
tf
SDA, SCL rising time
SDA, SCL falling time
SCL
SDA
300
300
120
120
SCL
SDA
tSU,STO STOP condition setup time
tBUF Bus free time between STOP and START
SCL
SDA
0.6
1.3
0.26
0.5
SCL
SDA
1. LC898219XI is designed for a condition with typ. 20 ns of hold time. If SDA signal is unstable around falling point of SCL signal, please
implement an appropriate treatment on board, such as inserting a resistor.
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7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP8, 0.97x2.25X0.265
CASE 567TE
ISSUE A
DATE 10 MAR 2017
SCALE 4:1
NOTES:
B
D
E
A
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
PIN A1
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
4. DIMENSION b IS MEASURED AT THE MAXIMUM
BALL DIAMETER PARALLEL TO DATUM C.
5. DIMENSION A3 IS AN OPTIONAL BACKSIDE
COATING LAYER.
REFERENCE
TOP VIEW
MILLIMETERS
DIM
A
A1
A3
b
D
E
MIN
0.24
NOM
0.265
MAX
0.29
A3
0.04 REF
0.025 REF
0.17
0.97
2.25
A
C
NOTE 5
0.12
0.92
2.20
0.22
1.02
2.30
0.03
C
A1
SEATING
PLANE
e
0.50 BSC
NOTE 3
SIDE VIEW
GENERIC
MARKING DIAGRAM*
e
8X
b
e/2
0.05 C A B
e
XXXXXXG
0.03 C NOTE 4
e/2
AWLYWW
B
A
A
= Assembly Location
WL = Wafer Lot
= Year
WW = Work Week
1
2
3
4
Y
BOTTOM VIEW
G
= Pb−Free Package
RECOMMENDED
SOLDERING FOOTPRINT*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
8X
0.17
A1
0.50
PITCH
0.50
PITCH
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON19152G
WLCSP8, 0.97X2.25X0.265
PAGE 1 OF 1
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