LC898262XHTBG [ONSEMI]
New Closed Loop Auto Focus Driver;
| 型号： | LC898262XHTBG |
| 厂家： | 
ONSEMI |
| 描述： | New Closed Loop Auto Focus Driver |
| 文件： | 总12页 (文件大小：201K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
New Closed Loop Auto
Focus (AF) Driver
LC898262XHTBG
WLCSP10 0.77x2.27x0.33
CASE 567YK
Overview
MARKING DIAGRAM
This LSI is New Closed Loop Auto Focus control LSI. It consists of
sensorless damping control function, temperature compensation
function, and bi−direction constant current driver.
898262XH
AWLYYWW
Features
• Built−in Equalizer Circuit Using Digital Operation
♦ Sensorless Damping Control Function
♦ Any Coefficient can be Specified by 2−wire Serial I/F (TWIF)
• Temperature Compensation Function
A
= Assembly Location
= Wafer Lot
= Year
WL
YY
WW
= Work Week
• 2−wire Serial Interface (The Communication Protocol is Compatible
2
with I C.)
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
♦ 8 Selectable Slave Addresses
− 50h (W) / 51h (R)
− 74h (W) / 75h (R)
− E8h (W) / E9h (R)
− E4h (W) / E5h (R) [Factory−configured]
− Other 4 Addresses can be Selected
• Digital Gyro I/F (SPI Master / Slave)
• Built−in A/D Converter
• Built−in D/A Converter
• Built−in Amplifier
• Built−in EEPROM
♦ 64 byte (16 byte/Page)
• Built−in OSC
• Built−in Bi−Direction Constant Current Driver
♦ 130 mA
♦ 150 mA (High Current Mode)
• Package
♦ WL−CSP 10−pin (2 x 5 Pin), Thickness Max 0.35 mm, with
Backside Coat
♦ Pb−Free, Halogen Free/BFR Free and RoHS Compliant
• Supply Voltage
♦ VDD (2.6 V to 3.3 V)
♦ IOVDD (1.7 V to 3.3 V)
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
August, 2021 − Rev. 1
LC898262XHTBG/D
LC898262XHTBG
PIN DESCRIPTION
Table 1. PIN DESCRIPTION
Symbol
Description
I
O
Input
Output
P
Power supply, GND
Not connect
Bidirection
NC
B
• 2−wire serial interface
SCL
SDA
I
B
2−wire serial interface clock pin
2−wire serial interface data pin
• Digital gyro interface
SSB
SCLK
SDIO
B
B
B
Digital Gyro Data I/F Chip Select
Digital Gyro Data I/F Clock
Digital Gyro Data I/F Data InOut
• Driver interface
OUT1
OUT2
O
O
Driver output (to Actuator)
Driver output (to Actuator)
• Power supply pin
VDD
VSS
P
P
Power Supply
GND
IOVDD P
I/O Power of Digital Gyro Data I/F (1.7 V to 3.3 V)
*Process When Pins Are Not Used
PIN TYPE “O” – Ensure that it is set to OPEN.
PIN TYPE “I” – OPEN is inhibited. Ensure that it is connected to the VDD or VSS even when it is unused.
(Please contact onsemi for more information about selection of VDD or VSS)
PIN TYPE “B” – If you are unsure about processing method on the pin description of pin layout table, please contact us
Note that incorrect processing of unused pins may result in defects.
www.onsemi.com
2
LC898262XHTBG
PIN LAYOUT
Circuit Name
Number of PINs
Driver
Power
2
3
2
I/O (VDD)
I/O (IOVDD)
3
B
A
A
B
5
4
3
2
1
SCLK
SDIO
5
4
3
2
1
SDIO
SCLK
IOVDD
SDA
SSB
SCL
SSB
SCL
IOVDD
SDA
OUT2
VSS
OUT1
VDD
OUT1
VDD
OUT2
VSS
Bottom View
Top View
Figure 1. Pin Layout
www.onsemi.com
3
LC898262XHTBG
BLOCK DIAGRAM
VDD
SDA
SCL
2−Wire Serial I/F
EEPROM
SSB
SCLK
SDIO
SPI
(Digital Gyro I /F)
Control Logic
IOVDD
OUT1
OUT2
Constant Current
Driver
Damping Control,
Fast Settling Time Function
And Correction Functions
VDD
VSS
more than or
equal to 0.1 mF (*)
Temperature
Sensor
OSC
POR
LDO
*Consider capacitance of capacitor between VDD and VSS. According to power source environment, attach an additional capacitor in camera
module.
Figure 2. Block Diagram
www.onsemi.com
4
LC898262XHTBG
ELECTRICAL CHARACTERISTICS
Table 2. ABSOLUTE MAXIMUM RATINGS (VSS = 0 V)
Symbol Parameter
max
Condition
Ta ≤ 25°C
Rating
Unit
V
V
DD
Supply Voltage (VDD)
−0.3 to 4.6
V 1 max, V 1 max
Input/Output Voltage (SCL,SDA)
Supply Voltage (IOVDD)
Ta ≤ 25°C
Ta ≤ 25°C
Ta ≤ 25°C
−0.3 to V + 0.3
V
I
O
DD
V
IO
max
−0.3 to 4.6
V
V 2 max, V 2 max
Input/Output Voltage (SSB,SCLK,SDIO)
Storage Ambient Temperature
Operating Ambient Temperature
−0.3 to V + 0.3
V
I
O
IO
Tstg
Topr
−55 to +125
−30 to +70
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. RECOMMENDED OPERATING CONDITIONS (TA = −30 to +70°C, VSS = 0 V)
Symbol
Parameter
Min
2.6
0
Max
2.8
−
Max
Unit
V
V
DD
Supply Voltage (VDD)
3.3
V 1
I
Input Voltage Range (SCL,SDA)
Supply Voltage (IOVDD)
V
DD
V
V
IO
1.7
0
1.8
−
3.3
V
V 2
I
Input Voltage Range (SSB,SCLK,SDIO)
V
IO
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 4. DC CHARACTERISTICS (VSS = 0 V, VDD = 2.6 V to 3.3 V, TA = −30 to +70°C)
Symbol
Parameter
Condition
Min
Max
−
Max
−
Unit
V
Applicable Pins
V
IH
1
High−level Input Voltage
Low−level Input Voltage
Low−level Output Voltage
High−level Input Voltage
Low−level Input Voltage
High−level Output Voltage
Low−level Output Voltage
Pull Up Resistor
CMOS schmitt
1.4
SCL, SDA
V 1
IL
−
−
0.4
V
V
OL
1
IOL= 3 mA
−
0.7 x V
−
−
0.2
V
SDA
V
IH
2
CMOS schmitt
−
−
V
SSB, SCLK,
SDIO
IO
V 2
IL
−
0.3 x V
−
V
IO
V
OH
2
IOH= −3 mA
V
− 0.2
−
V
IO
V
OL
2
IOL= 3 mA
−
−
0.2
V
R
V
V
= 1.8 V
= 1.8 V
50
50
−
250
250
kW
kW
UP
DN
IO
IO
R
Pull Down Resistor
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 5. DRIVER OUTPUT (OUT1, OUT2) (VSS = 0 V, VDD = 2.8 V, TA = 25°C)
Symbol
Ifull
Parameter
Maximum Current
Maximum Current (High Current Mode)
Condition
Min
123.5
138
Max
130
150
Max
136.5
162
Unit
mA
mA
Applicable Pins
OUT1, OUT2
OUT1, OUT2
IfullHC
Table 6. NON−VOLATILE MEMORY CHARACTERISICS
Symbol
EN
Parameter
Condition
(Note 1)
Min
−
Max
Max
Unit
Applicable Circuits
Endurance
−
−
−
1000
−
Cycles
Years
ms
EEPROM
RT
Data Retention
Write Time
10
−
tWT
20
1. The number of write access executable times per page
www.onsemi.com
5
LC898262XHTBG
AC CHARACTERISTICS
VDD Supply Timing
t2
t3
VDD
Vbot
t1
SCL/SDA
Figure 3. VDD Supply Timing
It is available to use 2−wire serial interface 5ms later for Power On Reset of VDD.
Table 7. VDD SUPPLY TIMING
Symbol
Item
Min
−
Typ
−
Max
3
Unit
ms
ms
ms
V
t1
t2
VDD Turn On Time
2−wire Serial Interface Start Time from VDD On
VDD Off Time
5
−
−
t3
100
−
−
−
Vbot
Bottom Voltage
−
0.1
Injection order between IOVDD and VDD is below.
IOVDD
tIOVD
tVDIO
VDD
Figure 4. IOVDD Supply Timing
Table 8. IOVDD SUPPLY TIMING
Symbol
Item
Min
0
Typ
−
Max
−
Unit
ms
tIOVD
tVDIO
IOVDD ON to VDD ON
VDD OFF to IOVDD OFF
0
−
−
ms
At the time of power off, SCL, SDA, SCLK and SDIO tolerate 3.3 V input, and SSB pin needs to be low level.
www.onsemi.com
6
LC898262XHTBG
AC Specification of TWIF
Figure 5 shows interface timing definition and Table 9 shows electric characteristics
VIH1min
SDA
VIL1max
tBUF
tHD,DAT tSU,DAT
tSU,STA
tHD,STA
tf
tLOW
tr
VIH1min
SCL
VIL1max
tHD,STA
tSU,STO
Stop
tr
tf
Start
Condition
Repeated
Condition
Start
Condition Condition
Figure 5. 2−wire Serial Interface Timing Definition
Table 9. 2−WIRE SERIAL INTERFACE AC CHARACTERISTICS
Fast−mode
Fast−mode Plus
Min Typ Max
Pin
Name
Min
−
Typ
−
Max
400
−
Symbol
FSCL
Item
SCL Clock Frequency
Unit
kHz
ms
SCL
−
−
−
1000
tHD,STA
START Condition Hold Time
SCL
SDA
0.6
−
0.26
−
tLOW
tHIGH
SCL Clock Low Period
SCL
SCL
1.3
0.6
0.6
−
−
−
−
−
−
0.5
−
−
−
−
−
−
ms
ms
ms
SCL Clock High Period
0.26
0.26
tSU,STA
Setup Time for Repetition START Condition
SCL
SDA
tHD,DAT
tSU,DAT
tr
Data Hold Time
SCL
SDA
0
−
−
−
−
−
−
0.9
−
0
−
−
−
−
−
−
−
−
ms
ns
ns
ns
ms
ms
(Note 2)
(Note 2)
Data Setup Time
SCL
SDA
100
50
SDA, SCL Rising Time
SDA, SCL Falling Time
STOP Condition Setup Time
Bus Free Time between STOP and START
SCL
SDA
−
300
300
−
−
120
120
−
tf
SCL
SDA
−
−
tSU,STO
tBUF
SCL
SDA
0.6
1.3
0.26
0.5
SCL
SDA
−
−
2. This LSI is designed for a condition with typ. 20ns of hold time. If SDA signal is unstable around falling point of SCL signal, please implement
an appropriate treatment on board, such as inserting a resistor.
www.onsemi.com
7
LC898262XHTBG
AC Specification of Digital Gyro I/F (Master)
Figure 6 shows interface timing definition and Table 10 shows electric characteristics.
VIH2min
VIL2max
SSB
tSSBhw
tSSBs
tSSBh
VIH2min
SCLK
VIL2max
tSDIs
tSDIh
tSDOd
tSDOz
VIH2min
VIL2max
SDIO
OUT
IN
OUT
Data
Direction
Figure 6. Digital Gyro interface (Master) Timing Definition
Table 10. DIGITAL GYRO INTERFACE(MASTER) AC CHARACTERISTICS
Symbol
FSCLK
fSCLKdu
tSSBhw
tSSBs
Item
SCLK Clock Frequency
Pin Name
SCLK
Min
3.8
40
Typ
4
Max
Unit
4.2
60
−
MHz
%
SCLK Duty
SCLK
−
SSB High Period
SSB
1.35
50
−
ms
Setup Time for SCLK (F) of SSB
SSB
SCLK
−
−
ns
tSSBh
tSDIs
tSDIh
tSDOz
tSDOd
Cld
Hold Time for SCLK (R) of SSB
Setup Time for SCLK (R) of SDIO
Hold Time for SCLK (R) of SDIO
Delay Time from SCLK (F) to SDIO Invalid
Delay Time from SSB (R) to SDIO Update
Load Capacitance
SCLK
SSB
160
50
50
−
−
−
−
−
−
−
−
−
ns
ns
ns
ns
ns
pF
SCLK
SDIO
SCLK
SDIO
−
SCLK
SDIO
20
20
10
SSB
SDIO
−
all
−
www.onsemi.com
8
LC898262XHTBG
AC Specification of Digital Gyro I/F (Slave)
Figure 7 shows interface timing definition and Table 11 shows electric characteristics.
VIH2min
VIL2max
SSB
tSSBhw
tSSBs
tSSBh
VIH2min
SCLK
VIL2max
tSDIs
tSDIh
tSDOz
tSDOd
VIH2min
VIL2max
SDIO
IN
OUT
IN
Data
Direction
Figure 7. Digital Gyro Interface (Slave) Timing Definition
Table 11. DIGITAL GYRO INTERFACE(SLAVE) AC CHARACTERISTICS
Symbol
FSCLK
fSCLKdu
tSSBhw
tSSBs
Item
SCLK Clock Frequency
Pin Name
SCLK
Min
−
Typ
−
Max
Unit
MHz
%
10
70
−
SCLK Duty
SCLK
30
−
SSB High Period
SSB
100
10
−
ns
Setup Time for SCLK (F) of SSB
SSB
SCLK
−
−
ns
tSSBh
tSDIs
tSDIh
tSDOd
tSDOz
Cld
Hold Time for SCLK (R) of SSB
Setup Time for SCLK (R) of SDIO
Hold Time for SCLK (R) of SDIO
Delay Time from SCLK (F) to SDIO Update
Delay Time from SSB (R) to SDIO Invalid
Load Capacitance
SCLK
SSB
10
10
10
−
−
−
−
−
−
−
−
−
ns
ns
ns
ns
ns
pF
SCLK
SDIO
SCLK
SDIO
−
SCLK
SDIO
20
20
10
SSB
SDIO
−
all
−
www.onsemi.com
9
LC898262XHTBG
ORDERING INFORMATION
Device
†
Package Type
Shipping
LC898262XHTBG
WLCSP10 0.77x2.27x0.33
4000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP10 0.77x2.27x0.33
CASE 567YK
ISSUE A
DATE 14 SEP 2020
GENERIC
MARKING DIAGRAM*
XXXXXXX
AWLYYWW
XXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON12407H
WLCSP10 0.77x2.27x0.33
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
www.onsemi.com/support/sales
相关型号：
©2020 ICPDF网 联系我们和版权申明