LB11685AV-W-AH [ONSEMI]

Monolithic Digital IC 3‐phase Sensor Less Motor Driver;
LB11685AV-W-AH
型号: LB11685AV-W-AH
厂家: ONSEMI    ONSEMI
描述:

Monolithic Digital IC 3‐phase Sensor Less Motor Driver

电动机控制 光电二极管
文件: 总9页 (文件大小:120K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LB11685AV  
Monolithic Digital IC  
3‐phase Sensor Less Motor  
Driver  
Overview  
The LB11685AV is a three-phase full-wave current-linear-drive  
motor driver IC. It adopts a sensor less control system without the use  
of a Hall Effect device. For quieter operation, the LB11685AV  
features a current soft switching circuit and be optimal for driving the  
cooling fan motors used in refrigerators, etc.  
www.onsemi.com  
Functions  
Three-phase Full-wave Linear Drive (Hall Sensor-less Method)  
Built-in Current Limiter Circuit  
SSOP24J  
CASE 565AS  
Built-in Three-phase Output Voltage Control Circuit  
Built-in Motor Lock Protection Circuit  
Motor Lock Protection Detection Output  
FG Output Made by Back EMF  
Built-in Thermal Shut Down Circuit  
Beat Lock Prevention Circuit  
MARKING DIAGRAM  
XXXXXXXXXX  
YMDDD  
Specifications  
MAXIMUM RATINGS (T = 25°C)  
XXXXX = Specific Device Code  
Y = Year  
M = Month  
A
Parameter  
Symbol  
Conditions  
Ratings  
Unit  
Maximum Supply  
Voltage  
V
max  
max  
max  
19  
V
DDD = Additional Traceability Data  
CC  
Input Applied  
Voltage  
V
−0.3 to V + 0.3  
V
A
IN  
CC  
PIN ASSIGNMENT  
Maximum Output  
Current  
I
1.2  
1.05  
UOUT  
(NC)  
(NC)  
PGND  
MCOM  
(NC)  
1
2
3
4
5
6
7
8
9
24 VOUT  
O
(Note 1)  
23 WOUT  
22 (NC)  
21 (NC)  
20 RF  
Allowable Power  
Dissipation  
P max  
Mounted on  
a board (Note 2)  
W
°C  
°C  
°C  
d
19  
V
Operating  
Temperature  
T
opr  
−40 to +85  
−55 to +150  
150  
CC  
SGND  
18 REG  
17 VOH  
16 FC1  
15 FC2  
14 C2  
FG  
RD  
Storage  
Temperature  
T
stg  
(NC) 10  
11  
CX 12  
V
Junction  
Temperature  
T max  
CO  
j
13 C1  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 7 of  
1. The I is a peak value of motor-current.  
O
2. Specified board: 76.1 mm × 114.3 mm × 1.6 mm, glass epoxy board.  
this data sheet.  
CAUTION: Absolute maximum ratings represent the value which cannot be  
exceeded for any length of time.  
CAUTION: Even when the device is used within the range of absolute  
maximum ratings, as a result of continuous usage under high  
temperature, high current, high voltage, or drastic temperature  
change, the reliability of the IC may be degraded. Please  
contact us for the further details.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
January, 2018 − Rev. 1  
LB11685AV/D  
 
LB11685AV  
RECOMMENDED OPERATING CONDITIONS (T = 25°C)  
A
Symbol  
Parameter  
Recommended Supply Voltage  
Operating Supply Voltage  
Conditions  
Ratings  
12.0  
Unit  
V
V
CC  
V
CC  
op  
4.5 to 18.0  
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Conditions  
FC1 = FC2 = 0 V  
Min  
5
Typ  
10  
Max  
20  
Unit  
mA  
V
I
Supply Current  
CC  
VREG  
VOSOUR  
VOSINK  
VOLIM  
Internal Regulate Voltage  
Output Voltage (Source)  
Output Voltage (Sink)  
Current Limiter  
3.0  
3.3  
3.6  
I
I
= 0.8 A (Note 5)  
1.3  
1.7  
V
O
= 0.8 A (Note 5)  
0.5  
1.3  
V
O
0.268  
0
0.300  
0.332  
V
VINCOM  
MCOM Pin  
V
− 2  
V
CC  
Common-input Voltage Range  
ICOM+  
ICOM−  
RTCOM  
MCOM Pin  
Source Current for Hysteresis  
MCOM = 7 V  
30  
30  
80  
mA  
mA  
MCOM Pin  
Sink Current for Hysteresis  
MCOM = 7 V  
80  
1.4  
0.2  
MCOM Pin  
Hysteresis Current Ratio  
RTCOM = ICOM+ / ICOM−  
0.6  
I
VCO Input Bias Current  
V
V
= 2.3 V  
mA  
VCO  
CO  
f min  
VCO  
VCO Oscillation Minimum Frequency  
= 2.1 V, CX = 0.015 mF  
930  
8.6  
Hz  
CO  
Design target (Note 4)  
f max  
VCO  
VCO Oscillation Maximum Frequency  
V
CO  
= 2.7 V, CX = 0.015 mF  
kHz  
Design target (Note 4)  
I
CX Charge/Discharge Current  
CX Hysteresis Voltage  
V
= 2.5 V, CX = 1.6 V  
70  
0.35  
12  
100  
0.55  
20  
140  
0.75  
28  
mA  
CX  
CO  
DVCX  
IC1(2)+  
IC1(2)−  
C1 (C2) Charge Current  
V
V
= 2.5 V, C1(2) = 1.3 V  
= 2.5 V, C1(2) = 1.3 V  
mA  
mA  
CO  
C1 (C2) Discharge Current  
C1 (C2) Charge/Discharge Current Ratio  
C1/C2 Charge Current Ratio  
C1/C2 Discharge Current Ratio  
C1 (C2) Cramp Voltage Width  
FG Output Low Level Voltage  
RD Output Low Level Voltage  
12  
20  
28  
CO  
RTC1(2)  
RTCCHG  
RTCDIS  
VCW1(2)  
VFGL  
RTC1(2) = IC1(2)+ / IC1(2)−  
RTCCHG = IC1+ / IC2+  
RTCDIS = IC1− / IC2−  
0.8  
0.8  
0.8  
1.0  
1.0  
1.0  
1.0  
1.3  
1.2  
1.2  
1.2  
1.6  
0.5  
0.5  
V
V
IFG = 3 mA  
IRD = 3 mA  
VRDL  
V
TTSD  
Thermal Shut Down Operating Temperature  
(Note 3)  
Junction temperature  
Design target (Note 4)  
150  
180  
15  
°C  
DTTSD  
Thermal Shut Down Hysteresis Temperature  
(Note 3)  
Junction temperature  
Design target (Note 4)  
°C  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. The thermal shut down circuit is built-in for protection from damage of IC. But its operation is out of T . Design thermal calculation at normal  
opr  
operation.  
4. Design target value and no measurement is made.  
5. The I is a peak value of motor-current.  
O
www.onsemi.com  
2
 
LB11685AV  
1.5  
Specified circuit board:  
3
114.3 × 76.1 × 1.6 mm  
glass epoxy board  
1.05  
1.0  
0.5  
0
0.55  
−40  
−20  
0
20  
40  
60  
80  
100  
Ambient Temperature, T (5C)  
A
Figure 1. Pd max − TA  
www.onsemi.com  
3
LB11685AV  
BLOCK DIAGRAM  
1
2
3
4
24  
23  
22  
21  
Pre Drive  
Distributor  
Output Switching  
Control  
Reference  
Voltage  
5
6
7
20  
19  
18  
Start Up  
&
Mask Timing  
Bandgap  
Power On Reset  
TSD  
Motor Lock  
Detector  
8
9
17  
16  
15  
Torque Ripple  
Rejection &  
Current Limit  
FG  
10  
PLL  
Low Voltage  
Control  
11  
12  
14  
13  
Soft  
Switching  
VCO  
Figure 2. Block Diagram  
www.onsemi.com  
4
LB11685AV  
PIN FUNCTION  
PIN FUNCTION  
Pin No.  
Pin Name  
Function  
Equivalent Circuit  
1
UOUT  
WOUT  
VOUT  
Each output pin of three phases.  
Pin No. 20  
23  
24  
4
PGND  
GND pin in the output part.  
Pin No. 1, 23, 24  
This pin is connected to GND. The SGND pin is  
also connected to GND  
20  
RF  
Pin to detect output current.  
By connecting a resistor between this pin and  
Pin No. 4  
V
CC  
, the output current is detected as a voltage.  
The current limiter is operated by this voltage.  
5
MCOM  
Motor coil midpoint input pin.  
The coil voltage waveform is detected based on  
this voltage.  
SGND SGND SGND  
V
CC  
V
CC  
Pin No. 5  
SGND  
SGND  
7
8
9
SGND  
FG  
Ground pin (except the output part)  
This pin is connected to GND.  
The PGND pin is also connected to GND.  
FG out made by back EMF pin.  
Pin No. 8, 9  
It synchronizes FG out with inverted V-phase.  
When don’t use this function, open this pin.  
SGND  
SGND  
RD  
Motor lock protection detection output pin.  
Output with L during rotation of motor.  
Open during lock protection of motor  
(High-impedance).  
When don’t use this function, open this pin.  
11  
VCO  
PLL output pin and VCO input pin.  
VREG  
To stabilize PLL output, connect a capacitor  
between this pin and GND.  
V
CC  
Pin No. 11  
VREG  
VREG  
SGND  
500 kW  
SGND  
www.onsemi.com  
5
LB11685AV  
PIN FUNCTION (continued)  
Pin No.  
Pin Name  
Function  
VCO oscillation output pin.  
Equivalent Circuit  
12  
CX  
VREG  
Operation frequency range and minimum  
frequency are determined by the capacity of the  
capacitor connected to this pin.  
V
CC  
Pin No. 12  
SGND  
SGND  
13  
14  
C1  
C2  
Soft switching adjustment pin.  
The triangular wave from is form formed by  
connecting a capacitor with this pin.  
V
CC  
And, the switching of three-phase output is  
adjusted by the slope.  
Pin No. 13, 14  
SGND  
SGND  
VREG  
15  
FC2  
Frequency characteristic correction pin 2.  
To suppress the oscillation of control system  
closed loop of sink-side, connect a capacitor  
between this pin and GND.  
V
CC  
Pin No. 15  
SGND  
SGND  
CC  
16  
17  
18  
FC1  
Frequency characteristic correction pin 1.  
V
To suppress the oscillation of control system  
closed loop of source-side, connect a capacitor  
between this pin and GND.  
Pin No. 16  
SGND  
SGND  
VOH  
Three-phase output high level output pin.  
V
V
CC  
To stabilize the output voltage of this pin,  
connect a capacitor between this pin and the  
V
CC  
pin.  
CC  
SGND  
Pin No. 17  
SGND  
VREG  
DC voltage (3.3 V) output pin.  
V
CC  
Connect a capacitor between this pin and GND  
for stabilization.  
V
CC  
Pin No. 18  
SGND  
SGND  
19  
VCC  
Pin to supply power-supply voltage.  
To curb the influence of ripple and noise.  
The voltage should be stabilized.  
www.onsemi.com  
6
LB11685AV  
APPLICATION CIRCUIT EXAMPLE  
* Each fixed number in the following Figure 3, is the referential value.  
0.1 mF  
0.1 mF  
0.1 mF  
FAN MOTOR  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
1
2
3
4
5
6
0.1 mF  
0.1 mF  
V
CC  
7
10 mF  
8
1 mF  
9
1 mF  
10  
11  
12  
0.1 mF  
0.01 mF  
0.01 mF  
14  
13  
1 mF  
0.015 mF  
Figure 3. Application Circuit Example  
ORDERING INFORMATION  
Device  
Package  
Wire Bond  
Shipping (Qty / Packing)  
LB11685AV−TLM−H  
SSOP24J (275mil)  
(Pb-Free / Halogen Free)  
Au-wire  
2000 / Tape & Reel  
LB11685AV−W−AH  
SSOP24J (275mil)  
(Pb-Free / Halogen Free)  
Cu-wire  
2000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
7
 
LB11685AV  
PACKAGE DIMENSIONS  
SSOP24J (275mil)  
CASE 565AS  
ISSUE A  
SOLDERING FOOTPRINT*  
(Unit: mm)  
0.80  
0.42  
NOTE: The measurements are not to guarantee but for reference only.  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
8
LB11685AV  
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
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PUBLICATION ORDERING INFORMATION  
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USA/Canada  
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For additional information, please contact your local  
Sales Representative  
LB11685AV/D  

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