FSA2866UMX [ONSEMI]
交点模拟开关;
| 型号： | FSA2866UMX |
| 厂家： | 
ONSEMI |
| 描述： | 交点模拟开关 开关 |
| 文件： | 总11页 (文件大小：888K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
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May 2011
FSA2866
Dual-Host / Dual-SIM Card Crosspoint Analog Switch
Description
Features
The FSA2866 is a dual-host, dual-SIM card analog switch
designed specifically for cell phones that support two specific
carrier services (for example, CDMA and GSM/3G).
Switch Type
Input Type
Input Signal Range
VCC
2x2 Crosspoint Switch
Data
0 to VCC
1.65V to 4.30V
Related Resources
Data 2Ω (Typical)
VSIM 2Ω (Typical)
RON
. For samples and questions, please contact:
Analog.Switch@fairchildsemi.com.
RFLAT
ESD
0.6Ω (Typical)
. FSA2866 Evaluation Board
IEC 61000-4-2 System
Air 15kV, Contact 8kV
CON
28pF (Typical)
12pF (Typical)
COFF
20-Lead UMLP, 3 x 3 x
0.55mm, 0.40mm Pitch
with Exposed DAP
Package
Ordering Information
FSA2866UMX
Applications
. MP3 Portable Media Players
. Cellular Phones, Smart Phones
FSA2866
Processor
#1
SIM
Dual host /
dual SIM card
switch
Processor
#2
SIM
Figure 1. Typical Mobile Phone Application
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
Pin Descriptions
Pin # Name
Type Description
0
Active
Output
Enable
1
/OE
Input
1
Switch Disabled
2
3
VSIMH1
RSTH1
CLKH1
DATAH1
VSIMH2
RSTH2
CLKH2
DATAH2
VCC
I / O
I / O
Common Ports for Host #1
4
I / O
I / O
I / O
I / O
I / O
I / O
5
6
7
Common Ports for Host #2
8
9
10
11
12
13
14
15
16
17
18
19
Supply Power
Ground Ground
I / O
GND
DATA2
CLK2
I / O
SIM Card Ports for Card #2
RST2
I / O
I / O
I / O
I / O
I / O
I / O
VSIM2
DATA1
CLK1
SIM Card Ports for Card #1
RST1
VSIM1
Host #1 connected to
Card #1
[VSIMH1=VSIM1;
DATAH1=DATA1;
CLKH1=CLK1;
RSTH1=RST1]
SEL=0
Host #2 connected to
Card #2
Figure 2. Functional Diagram
[VSIMH2=VSIM2;
DATAH2=DATA2;
CLKH2=CLK2;
SEL
20
VSIM1
19
RST1
18
CLK1
17
DATA1
16
RSTH2=RST2]
Control
Pin
20
SEL
Input
/OE
VSIM2
1
2
3
4
5
15
14
13
12
11
Host #1 connected to
Card #2
[VSIMH1=VSIM2;
DATAH1=DATA2;
CLKH1=CLK1;
VSIMH1
RST2
CLK2
RSTH1=RST1]
Exposed DAP
RSTH1
CLKH1
SEL=1
Host #2 connected to
Card #1
DATA2
GND
[VSIMH2=VSIM1;
DATAH2=DATA1;
CLKH2=CLK1;
DATAH1
RSTH2=RST1]
6
7
8
9
10
Exposed die attach paddle (DAP) not
electrically connected to any pin.
DAP
DAP
N/C
VSIMH2 RSTH2 CLKH2 DATAH2
VCC
Figure 3. Pin Assignments (Top Through View)
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol Parameter
Min.
-0.50
-0.5
-0.5
-50
Max.
+5.5
Unit
V
VCC
VCNTRL
VSW
IIK
Supply Voltage
DC Input Voltage (SEL,/OE)
VCC
V
DC Switch I/O Voltage - DATAHn, CLKHn, CLKn, RSTHn, RSTn
DC Input Diode Current
VCC + 0.3
V
mA
mA
mA
°C
ISIM
DC Output Current – VSIMHn, VSIMn
DC Output Current – DATAHn, CLKHn, CLKn, RSTHn, RSTn
Storage Temperature
100
35
IOUT
TSTG
-65
8
+150
All Pins
Human Body Model, JEDEC: JESD22-A114
I/O to GND, Card Side Pins
16
9
Power to GND
ESD
kV
Charged Device Model, JEDEC: JESD22-C101
IEC 61000-4-2 System-Level
2
Contact
Air Gap
8
15
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding these ratings or designing to Absolute Maximum Ratings.
Symbol Parameter
Min.
1.65
0
Typ.
Max.
4.3
Unit
V
VCC
VCNTRL
VSW
ISIM
Supply Voltage
Control Input Voltage (SEL, /OE)
VCC
VCC
30
V
Switch I/O Voltage - DATAHn, CLKHn, CLKn, RSTHn, RSTn
DC Output Current – VSIMHn, VSIMn
0
V
mA
mA
°C
IOUT
TA
DC Output Current – DATAHn, CLKHn, CLKn, RSTHn, RSTn
Operating Temperature
10
-40
+85
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
3
DC Electrical Characteristics
TA=25°C and VCC=3.0V unless otherwise noted.
TA=- 40ºC to
+85ºC
Symbol Parameter
Conditions
VCC (V)
Unit
V
Min. Ty p. Max.
VIK
VIH
Clamp Diode Voltage
Input Voltage High
IIN=-18mA
2.7
-1.2
1.65 to 2.30 1.1
2.7 to 3.6
4.3
1.3
1.7
V
1.65 to 2.30
2.7 to 3.6
4.3
0.4
0.5
0.7
VIL
Input Voltage Low
V
Control Input Leakage
(SEL,/OE)
IIN
VSW=0 to VCC
4.3
-1
1
µA
nA
VSIMHn=DATAHn=CLKHn=RSTHn=0.3
V, VCC-0.3V; RSTn, CLKn, DATAn, or
VSIMn=VCC-0.3V, 0.3V, or Floating
INO(OFF) Off Leakage Current of Ports
INC(OFF) RSTn, DATAn, CLKn, VSIMn
4.3
-100
100
On Leakage Current of
Common=0.3V, VCC-0.3V;
IA(ON)
Common Ports – RSTHn,
DATAHn, CLKHn, VSIMHn
VSIMHn=DATAHn=CLKHn=RSTHn=
VCC-0.3V, 0.3V, or Floating
4.3
-100
100
nA
VSIMHn or DATAHn or CLKHn or
RSTHn VIN=0V to 4.3V, VCC=0V
IOFF
IOZ
Power-Off Leakage Current
Off-State Leakage
0
-2
-5
2
5
µA
µA
VSIMHn or DATAHn or CLKHn or
RSTHn VIN=0.3V to 4.3V, /OE=VCC
4.3
I
ON=-20mA; /OE=0V; SEL=VCC or 0V;
Switch On Resistance for
Data Paths
RON_DATA
RSTn, CLKn, DATAn, or VSIMn=0
or 2.7V
2.7
2.7
2.0
2.0
3.5
3.5
ION=- 50mA; /OE=0V; SEL=VCC or 0V;
RSTn, CLKn, DATAn, or VSIMn=0
or 2.7V
Switch On Resistance for
VSIM Paths
RON_VSIM
On Resistance Matching
Between Data Channels
ION=-20mA; /OE=0V; SEL=VCC or 0V;
RSTn, CLKn, or DATAn=0V
∆RON_DATA
2.7
2.7
0.10 0.25
On Resistance Flatness Data ION=-20mA, /OE=0V,SEL=VCC or 0V,
Path Signals
RON_FLAT
0.6
7
0.8
RSTn, CLKn or DATAn=0 to VCC
ICC
Quiescent Supply Current
VIN=0 or VCC, IOUT=0
VIN=1.65V, VCC=4.3V
4.3
4.3
1
µA
µA
Increase in ICC Current Per
Control Voltage and VCC
ICCT
9.5
Notes:
1. Guaranteed by characterization; not production tested.
2. On resistance is determined by the voltage drop between the D+/D- and D+/R, D-/L pins at the indicated current through
the switch.
3. ∆RON=RON_max – RON_min measured at identical VCC, temperature, and voltage.
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
4
AC Electrical Characteristics
TA=25°C and VCC=3.0V unless otherwise noted.
TA=- 40ºC to +85ºC
Min. Ty p. Max.
Symbol Parameter
Conditions
VCC (V)
Unit
2.8 to 4.3
1.8
55
75
110
75
RL=50Ω, CL=30pF, VSW=0.8V
Figure 4
tON
Turn-On Time, /OE to Output
ns
2.8 to 4.3
1.8
24
RL=50Ω, CL=30pF, VSW=0.8V
Figure 4
tOFF
tBBM
Turn-Off Time, /OE to Output
Break-Before-Make Time
ns
ns
110
RL=50Ω, CL=30pF, VSW=0.8V
Figure 5
2
35
90
RL=50Ω, f=100KHz, /OE=VCC
,
OIRR
Off Isolation
Crosstalk
V
SW=13dBm (3Vpp)
1.8 to 4.3
1.8 to 4.3
dB
dB
Figure 6
RL=50Ω, f=100KHz,
XTALK
VSW=13dBm (3Vpp)
85
Figure 6
RL=50Ω, CL=0pF, Figure 8
RL=50Ω, CL=5pF, Figure 8
RL=50Ω, CL=30pF, Figure 8
RL=50Ω, CL=50pF, Figure 8
210
198
120
78
BW
-3db Bandwidth
3.0
MHz
Note:
4. Guaranteed by characterization; not production tested.
Capacitance
TA=25°C unless otherwise noted.
TA=- 40ºC to +85ºC
Min. Ty p. Max.
Symbol Parameter
Conditions
Unit
CIN
CON
COFF
Control Pin Input Capacitance
On Capacitance
VCC=0V, f=1MHz
2
pF
pF
pF
VCC=3.3V, /OE=0V, f=1MHz, Figure 7
VCC and /OE=3.3V, f=1MHz, Figure 7
28
12
Off Capacitance
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
5
AC Loadings and Waveforms
Figure 4. Turn-On / Turn-Off Timing
Figure 5. Break-Before-Make Timing
Figure 6. Off Isolation and Crosstalk
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
6
AC Loadings and Waveforms (Continued)
Figure 7.
On / Off Capacitance Measurement Setup
Figure 8.
Bandwidth
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
7
Physical Dimensions
0.10
C
3.00
A
2X
3.00
1.80
B
PIN1
IDENT
3.00
3.00
1.80
0.10
C
2X
0.80 20X
TOP VIEW
0.40
0.20 20X
0.08
C
0.55 MAX
0.10
C
RECOMMENDED LAND PATTERN
(0.15)
0.05
0.00
C
SEATING
PLANE
SIDE VIEW
NOTES:
1.75
1.65
A. PACKAGE CONFORMS TO JEDEC MO-248
VARIATION UEEE.
6
10
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
5
1
0.25
20X
11
15
0.15
D. LAND PATTERN RECOMMENDATION IS
FROM PCB MATRIX CALCULATOR V2009.
1.75
1.65
E. DRAWING FILENAME: MKT-UMLP20Brev1.
PIN 1
IDENT
20
0.40
16
0.45
0.35
20X
0.10
0.05
C
C
A B
BOTTOM VIEW
Figure 9. 20-Pin Ultrathin Molded Leadless Package (UMLP)
Operating
Temperature Range
Packing
Method
Order Number
Package Description
FSA2866UMX
-40 to 85°C
20-Lead Ultrathin Molded Leadless Package (UMLP)
Tape & Reel
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
8
© 2010 Fairchild Semiconductor Corporation
FSA2866 • Rev. 1.0.0
www.fairchildsemi.com
9
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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