FSA3031UMX [ONSEMI]
带 Mobile High-Definition Link (MHL™) 的双高速 USB2.0;
| 型号： | FSA3031UMX |
| 厂家： | 
ONSEMI |
| 描述： | 带 Mobile High-Definition Link (MHL™) 的双高速 USB2.0 |
| 文件： | 总15页 (文件大小：1583K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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November 2012
FSA3031 — Dual High-Speed USB2.0 with Mobile
High-Definition Link (MHL™)
Description
Features
The FSA3031 is a bi-directional, low-power, high-speed,
3:1, dual USB2.0 and MHL switch. Configured as a
double-pole, triple-throw (DP3T) switch; it is optimized
for switching between dual high- or full-speed USB and
Mobile High-Definition Link sources (MHL™ Rev. 2.0
specification).
.
Low On Capacitance: 4.6 pF/6.75 pF MHL/USB
(Typical)
.
.
.
Low Power Consumption: 30 μA Maximum
Supports MHL Rev. 2.0
Passes 1080 p/60 fps (3 Gbps) MHL Data Eye
Diagram Mask Compliance
The FSA3031 contains special circuitry on the switch
I/O pins, for applications where the VCC supply is
powered off (VCC=0), that allows the device to withstand
an over-voltage condition. This switch is designed to
minimize current consumption even when the control
voltage applied to the control pins is lower than the
supply voltage (VCC). This feature is especially valuable
to mobile applications, such as cell phones; allowing
direct interface with the general-purpose I/Os of the
baseband processor. Other applications include
switching and connector sharing in portable cell phones,
digital cameras, and notebook computers.
.
.
.
MHL Data Rate: ≥4.7Gbps with Ideal Input Source
Packaged in 12-Lead UMLP (1.8 x 1.8 mm)
Over-Voltage Tolerance (OVT) on all USB Ports
Up to 5.25 V without External Components
Applications
.
Cell Phones and Digital Cameras
IMPORTANT NOTE:
For additional performance information, please contact
interface@fairchildsemi.com.
Ordering Information
Part Number Top Mark Operating Temperature Range
Package
12-Lead, Ultrathin Molded Leadless Package
(UMLP), 1.8 mm x 1.8 mm
FSA3031UMX
LX
-40 to +85°C
Figure 1. Typical Application
All trademarks are the property of their respective owners.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
Analog Symbol
Figure 2. Analog Symbol
Table 1. Data Switch Select Truth Table
SEL1(1)
SEL0(1)
Function
0
0
1
1
0
1
0
1
D+/D- connected to USB1+/USB1-
D+/D- connected to USB2+/USB2-
D+/D- connected to MHL+/MHL
D+/D- high impedance
Note:
1. Control inputs should never be left floating or unconnected. To guarantee default switch closure to the USB
position, the SEL[0:1] pins should be tied to GND with a weak pull-down resistor (3 MΩ) to minimize static
current draw.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
2
Pin Configuration
1
2
VCC
12
11
10
3
4
USB1+
USB1-
USB2+
USB2-
D+
D-
Bottom View
5
6
9
GND
8
7
Figure 3. Pin Asignments
Figure 4. Top Through View
Pin Definitions
Pin#
1
Name
SEL0
SEL1
USB1+
USB1-
USB2+
USB2-
MHL+
MHL-
GND
D-
Description
Data Switch Select
Data Switch Select
2
3
USB Differential Data (Positive) – Source 1
USB Differential Data (Negative) – Source 1
USB Differential Data (Positive) – Source 2
USB Differential Data (Negative) – Source 2
MHL Differential Data (Positive)
MHL Differential Data (Negative)
Ground
4
5
6
7
8
9
10
11
12
Data Switch Output (Positive)
D+
Data Switch Output (Negative)
Device Power from System
VCC
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.5
Max.
6.0
Unit
V
Supply Voltage
VCNTRL
DC Input Voltage (SEL[1:0])(2)
-0.5
VCC
VCC
VCC
V
USB
MHL
-0.50
-0.50
-50
(3)
VSW
DC Switch I/O Voltage(2)
DC Input Diode Current
V
IIK
mA
mA
mA
mA
mA
°C
USB
MHL
USB
MHL
60
60
150
150
+150
1
IOUT
Switch DC Output Current (Continuous)
Switch DC Output Peak Current
(Pulsed at 1m Duration, <10% Duty Cycle)
IOUTPEAK
TSTG
MSL
Storage Temperature
-65
Moisture Sensitivity Level (JEDEC J-STD-020A)
Human Body Model, JEDEC: JESD22-A114
IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(4)
IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(4)
Charged Device Model, JESD22-C101
All Pins
Contact
Air
4
8
ESD
kV
15
2
Notes:
2. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.
3. VSW refers to analog data switch paths (USB1, MHL, and USB2).
4. Testing performed in a system environment using TVS diodes.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
2.5
Max.
4.5
Unit
V
VCC
tRAMP(VCC)
ΘJA
Supply Voltage
Power Supply Slew Rate
Thermal Resistance
100
1000
230
4.5
µs/V
C°/W
V
VCNTRL
VSW(USB)
VSW(MHL)
TA
Control Input Voltage (SEL[1:0])(5)
Switch I/O Voltage (USB1/USB2 Switch Paths)
Switch I/O Voltage (MHL Switch Path)
Operating Temperature
0
-0.5
1.65
-40
3.6
V
3.45
+85
V
°C
Note:
5. The control inputs must be held HIGH or LOW; they must not float.
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA3031 • Rev. 1.0.4
4
DC Electrical Characteristics
All typical values are at TA=25°C unless otherwise specified.
TA=- 40°C to +85°C
Symbol
Parameter
Condition
VCC (V)
Unit
Min. Typ. Max.
VIK
VIH
Clamp Diode Voltage
IIN=-18 mA
2.5
-1.2
V
V
Control Input Voltage,
High SEL[1:0]
2.5 to 4.5
1.0
Control Input Voltage,
Low SEL[1:0]
VIL
IIN
2.5 to 4.5
4.5
0.5
V
Control Input Leakage,
SEL[1:0]
VSW=0 to 3.6 V,
VCNTRL=0 to VCC
-0.5
-0.5
-0.5
0.5
0.5
0.5
µA
µA
µA
Off-State Leakage for Open
MHL Data Paths
VSW=1.65≤ MHL
IOZ(MHL)
IOZ(USB)
4.5
≤ 3.45 V,SEL[1:0]=VCC
Off-State Leakage for Open
USB Data Paths
V
SW=0 ≤ USB≤ 3.6 V,
4.5
SEL[1:0]=VCC
V
SW=1.65≤ MHL ≤ 3.45 V,
On-State Leakage for
ICL(MHL)
4.5
4.5
-0.5
0.5
0.5
µA
µA
SEL0=GND, SEL1=VCC, Other
Side of Switch Float
Closed MHL Data Paths(6)
VSW=0 ≤ USB ≤ 3.6 V
SEL[1:0]=GND or SEL1=GND,
SEL0=VCC, Other Side of
Switch Float
On-State Leakage for
ICL(USB)
-0.5
-0.5
Closed USB Data Paths(6)
Power-Off Leakage Current
(All I/O Ports)
IOFF
VSW=0 V or 3.6 V, Figure 5
0
0.5
6.5
µA
VSW=0.4 V, ION=-8 mA
SEL[1:0]=GND or SEL1=GND,
SEL0=VCC, Figure 6
HS Switch On Resistance
(USB to D Path)
RON(USB)
2.5
3.9
5
Ω
VSW=VCC-1050 mV,
HS Switch On Resistance
(MHL to D Path)
RON(MHL)
∆RON(MHL)
∆RON(USB)
SEL0=GND, SEL1=VCC
,
2.5
2.5
2.5
2.5
Ω
Ω
Ω
Ω
ION=-8 mA, Figure 6
VSW=VCC-1050 mV,
Difference in RON Between
MHL Positive-Negative
SEL0=GND, SEL1=VCC
,
0.03
0.22
1
I
ON=-8 mA, Figure 6,
VSW=0.4 V, ION=-8 mA,
Difference in RON Between
USB Positive-Negative
SEL[1:0]=GND or SEL1=GND,
SEL0=VCC Figure 6
VSW=1.65 to 3.45 V,
RONF(MHL) Flatness for RON MHL Path
SEL0=GND, SEL1=VCC
,
ION=-8 mA, Figure 6
ICC
Quiescent Current
VCNTRL=0 or 4.5 V, IOUT=0
VCNTRL= 1.65 V, IOUT=0
VCNTRL= 2.5 V, IOUT=0
4.5
4.5
4.5
30
18
10
µA
µA
Delta Increase in Quiescent
Current per Control Pin
ICCT
Note:
6. For this test, the data switch is closed with the respective switch pin floating.
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA3031 • Rev. 1.0.4
5
AC Electrical Characteristics
All typical values are for VCC=3.3 V and TA=25°C unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
Symbol
Parameter
Condition
VCC (V)
Unit
USB Turn-On Time,
SEL[1:0] to Output
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
tONUSB
tOFFUSB
tONMHL
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
445
445
445
600
600
600
600
ns
ns
ns
V
SW(MHL)=3.3 V, Figure 7, Figure 8
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
SW(MHL)=3.3 V, Figure 7, Figure 8
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
SW(MHL)=3.3 V, Figure 7, Figure 8
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
SW(MHL)=3.3 V, Figure 7, Figure 8
USB Turn-Off Time,
SEL[1:0] to Output
V
MHL Turn-On Time,
SEL[1:0] to Output
V
MHL Turn-Off Time,
SEL[1:0] to Output
Propagation Delay(7)
tOFFMHL
tPD
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
445
0.25
85
ns
ns
ns
V
CL=5 pF, RL=50 Ω, Figure 7, Figure 9
Break-Before-Make
Time(7)
RL=50 Ω, CL=5 pF, VID=VMHL=3.3 V,
VUSB=0.8 V, Figure 11
tBBM
VS=1 Vpk-pk, RL=50 Ω, f=240 MHz,
Figure 12
OIRR(MHL)
OIRR(USB)
XtalkMHL
XtalkUSB
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
-41
-36
-41
-37
dB
dB
dB
dB
Off Isolation(7)
VS=400 mVpk-pk, RL=50 Ω,
f=240 MHz, Figure 12
VS=1 Vpk-pk, RL=50 Ω, f=240 MHz,
Figure 13
Non-Adjacent
Channel(7) Crosstalk
VS=400 mVpk-pk, RL=50 Ω,
f=240 MHz, Figure 13
VIN=1 Vpk-pk, MHL Path, Common
Mode Voltage = VCC – 1.1 V,
RL=50 Ω, CL=0 pF, Figure 14
1.87
1.47
Differential -3db
Bandwidth(7)
BW
2.5 to 3.6
GHz
VIN=400 mVpk-pk, USB Path, Common
Mode Voltage = 0.2 V, RL=50 Ω,
CL=0 pF, Figure 14
Note:
7. Guaranteed by characterization.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
6
USB High-Speed AC Electrical Characteristics
Typical values are at TA= -40ºC to +85ºC.
Symbol
Parameter
Condition
VCC(V)
Typ. Unit
Skew of Opposite Transitions of the
Same Output(8)
tSK(P)
CL=5 pF, RL=50 Ω, Figure 9
3.0 to 3.6
3.0 to 3.6
7
ps
ps
RL=50 ꢀ, CL=5 pF, tR=tF=500 ps
(10-90%) at 480 Mbps, PN7
tJ
Total Jitter(8)
18
Note:
8. Guaranteed by characterization.
MHL AC Electrical Characteristics
Typical values are at TA= -40ºC to +85ºC.
Symbol
Parameter
Condition
VCC(V)
Typ. Unit
Skew of Opposite Transitions of the
Same Output(9)
tSK(P)
3.0 to 3.6
3
ps
ps
RPU=50 Ω to VCC, CL=0 pF
f=2.25 Gbps, PN7, RPU=50 Ω to
VCC, CL=0 pF
tJ
Total Jitter(9)
3.0 to 3.6
23
Note:
9. Guaranteed by characterization.
Capacitance
Typical values are at TA= -40ºC to +85ºC.
Symbol
Parameter
Control Pin Input Capacitance(10)
Condition
Typ.
2.5
Max.
Unit
pF
CIN
VCC=0 V, f=1 MHz
CON(USB) USB Path On Capacitance(10)
COFF(USB) USB Path Off Capacitance(10)
CON(MHL) MHL Path On Capacitance(10)
COFF(MHL) MHL Path Off Capacitance(10)
VCC=3.3 V, f=240 MHz, Figure 15
VCC=3.3 V, f=240 MHz, Figure 13
VCC=3.3 V, f=240 MHz, Figure 15
VCC=3.3 V, f=240 MHz, Figure 13
6.75
2.5
pF
pF
4.6
pF
2.5
pF
Note:
10. Guaranteed by characterization.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
7
Test Diagrams
IDn(OFF)
NC
A
V
SW
Select
GND
V
Sel= 0 orVcc
**Each switch port is tested separately
Figure 5. Off Leakage
iguOResistance
tRISE= 2.5ns
tFALL = 2.5ns
V
CC
90%
90%
V
GND
Input– V , V
SEL1
SEL
V
CNTRL-HI
CNTRL-HI
10%
10%
90%
GND
V
OH
90%
Output- V
OUT
VOL
tON
tOFF
Figure 7. AC Test Circuit Load
Figure 8. Turn-On / Turn-Off Waveforms
tRISE
tFALL
= 500ps
= 500ps
+400mV
-400mV
400mV
90%
0V
90%
50%
50%
Input
0V
10%
10%
tPLH
tPHL
VOH
Output
50%
50%
Output
VOL
tPHL
tPLH
Figure 9. Propagation Delay (tRtF – 500ps)
Figure 10. Intra-Pair Skew Test tSK(P)
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
8
Test Diagrams
tRISE = 2.5ns
Vcc
HSD
V
90%
Vcc/2
n
Dn
C
Input -
V
V
Sel
SW1
10%
0V
VOUT
GND
L
R
L
SW2
VOUT
GND
0.9*Vout
GND
0.9*Vout
R
S
tBBM
V
Sel
RL , R and CL are function of application
GND
S
environment (see AC Tables for specific values)
CL includes test fixture and stray capacitance
Figure 11. Break-Before-Make Interval Timing
Figure 12. Channel Off Isolation (SDD21)
Figure 13. Non-Adjacent Channel-to-Channel Crosstalk (SDD21)
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
9
Test Diagrams
RS
VIN
D+
VS
RT
VOUT
Control
VNA
VNA
Source
Return
RS
VIN
D-
VS
RT
VOUT
VS, RS and RT are functions of the application environment (see AC/DC Tables for values).
Figure 14. Insertion Loss (SDD21)
HSD
HSD
n
Capacitance
Meter
n
S
V
S
V
Capacitance
Meter
= 0 or V
cc
Sel
= 0 or V
cc
Sel
HSD
HSD
n
n
Figure 15. Channel Off Capacitance
Figure 16. Channel On Capacitance
Note:
11. HSDn refers to the high-speed data USB or MHL paths.
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA3031 • Rev. 1.0.4
10
Functional Description
Insertion Loss
One of the key advantages of using the FSA3031 in
mobile digital video applications is the small amount of
insertion loss experienced by the received signal as it
passes through the switch.
Typical Application
Figure 19 shows utilizing the VBAT connection from the
micro-USB connector. The 3M resistors are used to
ensure, for manufacturing test via the micro-USB
connector, that the FSA3031 configures for connectivity
to the baseband or application processor.
This results in minimal degradation of the received eye.
One of the ways to measure the quality of the high data
rate channels is using balanced ports and four-port
differential S-parameter analysis, particularly SDD21.
Bandwidth is measured using the S-parameter SDD21
methodology. Figure 17 exhibits the 1.87 GHz (-3 db)
BW of the MHL path, while Figure 18 exhibits the
1.47 GHz (-3 db) BW of the USB paths.
Figure 19. Typical Application
Figure 17. MHL Path SDD21 Insertion Loss Curve
Figure 18. USB Path SDD21 Insertion Loss Curve
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
11
Physical Dimensions
(11X)
0.563
2.10
1.80
A
B
0.10 C
0.588
0.40
2X
1
1.80
2.10
PIN#1 IDENT
0.10 C
(12X)
0.20
TOP VIEW
2X
RECOMMENDED
LAND PATTERN
0.55 MAX.
0.152
0.10 C
0.08 C
0.45
0.35
0.10
0.05
0.00
SEATING
PLANE
C
0.10
0.10
SIDE VIEW
DETAIL A
SCALE : 2X
0.35
(11X)
NOTES:
0.45
3
6
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
0.40
B. DIMENSIONS ARE IN MILLIMETERS.
DETAIL A
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
1
PIN#1 IDENT
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
12
9
0.25
0.15
(12X)
BOTTOM VIEW
0.10 C A B
E. DRAWING FILENAME: MKT-UMLP12Arev4.
0.05 C
PACKAGE
EDGE
LEAD
LEAD
OPTION 2
SCALE : 2X
OPTION 1
SCALE : 2X
Figure 20. 12-Lead, Ultrathin Molded Leadless Package (UMLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
12
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
13
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
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Order Literature: http://www.onsemi.com/orderlit
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
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