FQI27N25TU-F085 [ONSEMI]

N 沟道,MOSFET,250V,25.5A,131mΩ;
FQI27N25TU-F085
型号: FQI27N25TU-F085
厂家: ONSEMI    ONSEMI
描述:

N 沟道,MOSFET,250V,25.5A,131mΩ

开关 脉冲 晶体管
文件: 总8页 (文件大小:511K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ON Semiconductor  
Is Now  
To learn more about onsemi™, please visit our website at  
www.onsemi.com  
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi  
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without  
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,  
or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all  
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,  
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/  
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application  
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized  
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for  
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees,  
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative  
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.  
FQB27N25TM-F085/FQI27N25TU-F085  
N-Channel MOSFET  
250 V, 25.5 A, 131 mΩ  
Features  
D
„ Typ R  
= 108mΩ at V = 10V, I = 25.5A  
DS(on)  
GS D  
„ Typ Q  
= 45nC at V = 10V, I = 27A  
g(tot)  
GS  
D
„ UIS Capability  
„ RoHS Compliant  
„ Qualified to AEC Q101  
G
S
Applications  
D
TO-263AB  
TO-262AB  
„ Automotive Engine Control  
„ Powertrain Management  
„ Solenoid and Motor Drivers  
„ Electronic Steering  
G
„ Integrated Starter/Alternator  
„ Distributed Power Architectures and VRM  
„ Primary Switch for 12V Systems  
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted  
Symbol  
VDSS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
250  
±30  
25.5  
V
V
VGS  
Drain Current - Continuous (VGS=10) (Note 1)  
Pulsed Drain Current  
TC = 25°C  
TC = 25°C  
ID  
A
See Figure 4  
EAS  
PD  
Single Pulse Avalanche Energy  
(Note 2)  
(Note 3)  
972  
417  
mJ  
W
W/oC  
oC  
oC/W  
oC/W  
Power Dissipation  
Derate above 25oC  
3.3  
TJ, TSTG Operating and Storage Temperature  
-55 to + 150  
0.3  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Maximum Thermal Resistance, Junction to Ambient  
43  
Package Marking and Ordering Information  
Device Marking  
FQB27N25TM  
FQI27N25TU  
Device  
Package  
TO-263AB  
TO-262AB  
Reel Size  
330mm  
Tube  
Tape Width  
Quantity  
FQB27N25TM-F085  
FQI27N25TU-F085  
24mm  
N/A  
800 units  
50 units  
Notes:  
1: Current is limited by bondwire configuration.  
2: Starting T = 25°C, L = 4.67mH, I = 20.4A, V = 100V during inductor charging and V = 0V during time in avalanche.  
J
AS  
DD  
DD  
3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder  
mounting surface of the drain pins. RθJC is guaranteed by design while RθJAis determined by the user's board design. The maximum  
2
rating presented here is based on mounting on a 1 in pad of 2oz copper.  
Publication Order Number:  
FQB27N25TM-F085/D  
©2014Semiconductor Components Industries, LLC.  
December-2017,Rev. 3  
Electrical Characteristics TJ = 25°C unless otherwise noted.  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BVDSS  
IDSS  
Drain to Source Breakdown Voltage  
Drain to Source Leakage Current  
Gate to Source Leakage Current  
ID = 250μA, VGS = 0V  
250  
-
-
-
-
-
1
V
V
DS=250V, TJ = 25oC  
-
-
-
μA  
uA  
nA  
VGS = 0V  
TJ = 150oC(Note 4)  
250  
±100  
IGSS  
VGS = ±30V  
On Characteristics  
VGS(th)  
RDS(on)  
Gate to Source Threshold Voltage  
Drain to Source On Resistance  
VGS = VDS, ID = 250μA  
3.0  
4.1  
108  
265  
5.0  
131  
310  
V
TJ = 25oC  
-
-
mΩ  
mΩ  
ID = 25.5A,  
TJ = 150oC(Note 4)  
V
GS= 10V  
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
-
-
1800  
350  
45  
-
-
pF  
pF  
pF  
Ω
V
DS = 25V, VGS = 0V,  
Coss  
Crss  
Rg  
Output Capacitance  
f = 1MHz  
Reverse Transfer Capacitance  
Gate Resistance  
-
f = 1MHz  
0.82  
45  
-
Qg(ToT)  
Qg(th)  
Qgs  
Total Gate Charge at 10V  
Threshold Gate Charge  
Gate to Source Gate Charge  
Gate to Drain “Miller“ Charge  
VGS = 0 to 10V  
VGS = 0 to 2V  
49  
4
-
nC  
nC  
nC  
nC  
VDD = 125V  
ID = 27A  
3.3  
12  
Qgd  
23  
-
Switching Characteristics  
ton  
td(on)  
tr  
Turn-On Time  
Turn-On Delay  
Rise Time  
-
-
-
-
-
-
-
36  
122  
81  
60  
-
196  
ns  
ns  
ns  
ns  
ns  
ns  
-
-
V
DD = 125V, ID = 27A,  
VGS = 10V, RGEN = 25Ω  
td(off)  
tf  
Turn-Off Delay  
Fall Time  
-
-
toff  
Turn-Off Time  
164  
Drain-Source Diode Characteristics  
I
SD = 25.5A, VGS = 0V  
-
-
-
-
-
-
1.5  
1.25  
238  
2.3  
V
VSD  
Source to Drain Diode Voltage  
ISD = 12.75A, VGS = 0V  
V
trr  
Reverse--Recovery Time  
Reverse--Recovery Charge  
205  
1.8  
ns  
nC  
IF = 27A, dISD/dt = 100A/μs,  
VDD=200V  
Qrr  
Notes:  
4: The maximum value is specified by design at T = 150°C. Product is not tested to this condition in production.  
J
www.onsemi.com  
2
Typical Characteristics  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
25  
50  
75  
100  
125  
150  
TC, CASE TEMPERATURE(oC)  
Figure 1. Normalized Power Dissipation vs. Case  
Temperature  
10  
1
DUTY CYCLE - DESCENDING ORDER  
D = 0.50  
0.20  
0.10  
0.05  
P
DM  
0.02  
0.01  
0.1  
t
1
t
2
0.01  
1E-3  
NOTES:  
DUTY FACTOR: D = t /t  
SINGLE PULSE  
1
2
PEAK T = P  
x Z  
x R  
+ T  
θJA C  
J
DM  
θJA  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 2. Normalized Maximum Transient Thermal Impedance  
www.onsemi.com  
3
Typical Characteristics  
1000  
TC = 25oC  
VGS = 10V  
FOR TEMPERATURES  
ABOVE 25oC DERATE PEAK  
CURRENT AS FOLLOWS:  
150 - TC  
I = I2  
100  
10  
125  
SINGLE PULSE  
1
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 3. Peak Current Capability  
100  
If R = 0  
AV  
t
= (L)(I )/(1.3*RATED BV  
- V  
)
AS  
DSS  
DD  
100  
10  
1
If R  
AV  
0  
t
= (L/R)ln[(I *R)/(1.3*RATED BV  
- V ) +1]  
DSS DD  
AS  
100us  
1ms  
STARTING TJ = 25oC  
10  
STARTING TJ = 125oC  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY r  
DS(on)  
SINGLE PULSE  
10ms  
T
J
= MAX RATED  
100ms  
o
T
C
= 25 C  
1
0.1  
1E-3  
0.01  
0.1  
1
10  
100  
1000  
1
10  
100  
1000  
tAV, TIME IN AVALANCHE (ms)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
NOTE: Refer to ON Semiconductor Application Notes AN7514  
and AN7515  
Figure 4. Forward Bias Safe Operating Area  
Figure 5. Unclamped Inductive Switching  
Capability  
100  
200  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
100  
VDD = 20V  
10  
TJ = 150 o  
C
TJ = 150oC  
TJ = 25 oC  
10  
1
TJ = 25oC  
1
TJ = -55oC  
0.1  
2
4
6
8
10  
12  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 6. Transfer Characteristics  
Figure 7. Forward Diode Characteristics  
www.onsemi.com  
4
Typical Characteristics  
80  
60  
40  
20  
0
80μs PULSE WIDTH  
Tj=150oC  
80μs PULSE WIDTH  
Tj=25oC  
60  
VGS  
15V Top  
10V  
8V  
VGS  
15V Top  
10V  
8V  
7V  
6V  
5.5V  
5V Bottom  
40  
20  
0
7V  
6V Bottom  
6V  
5V  
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 8. Saturation Characteristics  
Figure 9. Saturation Characteristics  
550  
440  
330  
220  
110  
0
2.8  
ID = 25.5A  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
2.4  
2.0  
1.6  
1.2  
0.8  
0.6  
TJ = 25oC  
TJ = 150oC  
ID = 25.5A  
VGS = 10V  
5
6
7
8
9
10  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE(oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 10. RDSON vs. Gate Voltage  
Figure 11. Normalized RDSON vs. Junction  
Temperature  
1.4  
1.2  
VGS = VDS  
ID = 1mA  
I
= 250μA  
D
1.2  
1.0  
0.8  
0.6  
0.4  
1.1  
1.0  
0.9  
0.8  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE (oC)  
TJ, JUNCTION TEMPERATURE(oC)  
Figure 12. Normalized Gate Threshold Voltage vs.  
Temperature  
Figure 13. Normalized Drain to Source  
Breakdown Voltage vs. Junction Temperature  
www.onsemi.com  
5
Typical Characteristics  
10000  
10  
8
ID = 27A  
VDD = 80V  
VDD = 100V  
Ciss  
VDD = 120V  
1000  
100  
6
Coss  
4
Crss  
2
f = 1MHz  
VGS = 0V  
10  
0.1  
0
1
10  
100  
0
10  
20  
30  
40  
50  
Qg, GATE CHARGE(nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 14. Capacitance vs. Drain to Source  
Voltage  
Figure 15. Gate Charge vs. Gate to Source  
Voltage  
www.onsemi.com  
6
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
© Semiconductor Components Industries, LLC  
www.onsemi.com  

相关型号:

FQI27N25TU_F085

Power Field-Effect Transistor, 25.5A I(D), 250V, 0.11ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, I2PAK-3
FAIRCHILD

FQI27P06

60V P-Channel MOSFET
FAIRCHILD

FQI27P06TU

Power Field-Effect Transistor, 27A I(D), 60V, 0.07ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-262AA, I2PAK-3
FAIRCHILD

FQI28N15

150V N-Channel MOSFET
FAIRCHILD

FQI28N15TU

Power Field-Effect Transistor, 28A I(D), 150V, 0.09ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-262AA, I2PAK-3
FAIRCHILD

FQI2N30

300V N-Channel MOSFET
FAIRCHILD

FQI2N30TU

2.1A, 300V, 3.7ohm, N-CHANNEL, Si, POWER, MOSFET, TO-262AA, I2PAK-3
ROCHESTER

FQI2N50

500V N-Channel MOSFET
FAIRCHILD

FQI2N50TU

Power Field-Effect Transistor, 2.1A I(D), 500V, 5.3ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-262AA, I2PAK-3
FAIRCHILD

FQI2N60

600V N-Channel MOSFET
FAIRCHILD

FQI2N60TU

Power Field-Effect Transistor, 2.4A I(D), 600V, 4.7ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-262AA, I2PAK-3
FAIRCHILD

FQI2N80

800V N-Channel MOSFET
FAIRCHILD