FJP2160DTU [ONSEMI]

ESBC 额定 NPN 硅晶体管;
FJP2160DTU
型号: FJP2160DTU
厂家: ONSEMI    ONSEMI
描述:

ESBC 额定 NPN 硅晶体管

晶体管
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中文:  中文翻译
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January 2016  
FJP2160D  
ESBCRated NPN Silicon Transistor  
Applications  
Description  
The FJP2160D is a low-cost, high performance power  
switch designed to provide the best performance when  
used in an ESBCconfiguration in applications such as:  
power supplies, motor drivers, Smart Grid, or ignition  
switches. The power switch is designed to operate up to  
1600 volts and up to 3 amps while providing exceptionally  
low on-resistance and very low switching losses.  
• High Voltage and High Speed Power Switch  
Application  
• Emitter-Switched Bipolar/MOSFET Cascode  
Application (ESBC)  
• Smart Meter, Smart Breakers,  
HV Industrial Power Supplies  
• Motor Driver and Ignition Driver  
The ESBCswitch is designed to be easy to drive using  
off-the-shelf power supply controllers or drivers. The  
ESBCMOSFET is a low-voltage, low-cost, surface  
mount device that combines low-input capacitance and  
fast switching, The ESBCconfiguration further mini-  
mizes the required driving power because it does not  
have Miller capacitance.  
ESBC Features (FDC655 MOSFET)  
VCS(ON)  
IC  
Equiv RCS(ON)  
0.131 V  
0.5 A  
0.261 Ω(1)  
• Low Equivalent On Resistance  
• Very Fast Switch: 150 KHz  
• Squared RBSOA: Up to 1600 V  
• Avalanche Rated  
The FJP2160D provides exceptional reliability and a  
large operating range due to its square reverse-bias-safe-  
operating-area (RBSOA) and rugged design. The device  
is avalanche rated and has no parasitic transistors so is  
not prone to static dv/dt failures.  
• Low Driving Capacitance, no Miller Capacitance  
(Typ. 12 pF Capacitance at 200 V)  
• Low Switching Losses  
• Reliable HV switch: No False Triggering due to  
High dv/dt Transients.  
C
2
C
FJP2160D  
FDC655  
B
1
B
TO-220  
1
G
3
E
1.Base 2.Collector 3.Emitter  
S
Figure 2. Internal Schematic Diagram Figure 3. ESBC Configuration(2)  
Figure 1. Pin Configuration  
Ordering Information  
Part Number  
Marking  
Package  
Packing Method  
FJP2160DTU  
J2160D  
TO-220 3L  
Tube  
Notes:  
1. Figure of Merit.  
2. Other Fairchild MOSFETs can be used in this ESBC application.  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
Absolute Maximum Ratings(3)  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Parameter  
Value  
Unit  
V
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Collector Current  
1600  
800  
V
12  
V
2
A
ICP  
Collector Current (Pulse)  
Base Current  
3
A
IB  
1
A
IBP  
Base Current (Pulse)  
2
A
PD  
Power Dissipation (TC = 25°C)  
100  
W
°C  
°C  
mJ  
TJ  
Operating and Junction Temperature Range  
Storage Temperature Range  
- 55 to +125  
- 65 to +150  
3.5  
TSTG  
EAS  
Avalanche Energy (TJ = 25°C, 8 mH)  
Note:  
3. Pulse test: pulse width = 20 μs, duty cycle 10%  
Thermal Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Rθjc  
Parameter  
Max.  
1.25  
80  
Unit  
°C/W  
°C/W  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
Rθja  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
2
Electrical Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
BVCBO  
BVCEO  
BVEBO  
ICES  
Parameter  
Conditions  
IC = 0.5 mA, IE = 0  
Min. Typ. Max. Unit  
Collector-Base Breakdown Voltage  
1600 1689  
800 870  
V
V
Collector-Emitter Breakdown Voltage IC = 5 mA, IB = 0  
Emitter-Base Breakdown Voltage  
Collector Cut-Off Current  
Collector Cut-Off Current  
Emitter Cut-Off Current  
IE = 0.5 mA, IC = 0  
12.0 14.8  
0.01  
V
VCE = 1600 V, VBE = 0  
VCE = 800 V, IB = 0  
VEB = 12 V, IC = 0  
100  
100  
500  
35  
μA  
μA  
μA  
ICEO  
0.01  
IEBO  
0.05  
VCE = 3 V, IC = 0.4 A  
VCE = 10 V, IC = 5 mA  
IC = 0.25 A, IB = 0.05 A  
IC = 0.5 A, IB = 0.167 A  
IC = 1 A, IB = 0.33 A  
IC = 500 mA, IB = 50 mA  
IC = 2 A, IB = 0.4 A  
VEB = 10 V, IC = 0, f = 1 MHz  
VCB = 200 V, IE = 0, f = 1 MHz  
IC = 0.1 A,VCE = 10 V  
IF = 0.4 A  
20  
20  
29  
43  
hFE  
DC Current Gain  
0.16 0.45  
0.12 0.35  
0.25 0.75  
0.74 1.20  
0.85 1.20  
745 1000  
15  
VCE(sat) Collector-Emitter Saturation Voltage  
V
V
VBE(sat) Base-Emitter Saturation Voltage  
Cib  
Cob  
fT  
Input Capacitance  
pF  
pF  
Output Capacitance  
Current Gain Bandwidth Product  
5
MHz  
0.76 1.20  
0.83 1.50  
VF  
Diode Forward Voltage  
V
IF = 1 A  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
3
ESBC Configured Electrical Characteristics(4)  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
fT  
Itf  
Current Gain Bandwidth Product IC = 0.1 A,VCE = 10 V  
25  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Inductive Current Fall Time  
137  
350  
120  
100  
137  
35  
V
GS = 10 V, RG = 47 Ω,  
ts  
Inductive Storage Time  
VClamp = 500 V,  
Vtf  
Vtr  
tc  
Inductive Voltage Fall Time  
Inductive Voltage Rise Time  
Inductive Crossover Time  
Inductive Current Fall Time  
Inductive Storage Time  
tp = 3.1 μs, IC = 0.3 A,  
IB = 0.03 A, LC = 1 mH,  
SRF = 480 kHz  
Itf  
VGS = 10 V, RG = 47 Ω,  
ts  
980  
30  
VClamp = 500 V,  
Vtf  
Vtr  
tc  
Inductive Voltage Fall Time  
Inductive Voltage Rise Time  
Inductive Crossover Time  
tp = 10 μs, IC = 1 A,  
IB = 0.2 A, LC = 1 mH,  
SRF = 480 kHz  
195  
210  
Maximum Collector Source Volt-  
age at Turn-off without Snubber  
hFE = 5, IC = 2 A  
VGS = ±20 V  
VCSW  
1600  
V
IGS(OS)  
Gate-Source Leakage Current  
Collector-Source On Voltage  
Gate Threshold Voltage  
1.0  
nA  
VGS = 10 V, IC = 2 A, IB = 0.67 A,  
2.210  
hFE = 3  
VGS = 10 V, IC = 1 A, IB = 0.33 A,  
0.321  
0.131  
hFE = 3  
VCS(ON)  
V
VGS = 10 V, IC = 0.5 A, IB = 0.17 A,  
hFE = 3  
VGS = 10 V, IC = 0.3 A, IB = 0.06 A,  
hFE = 5  
0.166  
1.9  
VBS = VGS, IB = 250 μA  
VGS(th)  
Ciss  
QGS(tot)  
V
Input Capacitance  
(VGS = VCB = 0)  
VCS = 25 V, f = 1 MHz  
470  
pF  
Gate-Source Charge  
VCB = 0  
VGS = 10 V, IC = 8 A, VCS = 25 V  
9
nC  
VGS = 10 V, ID = 6.3 A  
21  
26  
30  
Static Drain-Source  
On Resistance  
VGS = 4.5 V, ID = 5.5 A  
rDS(ON)  
mΩ  
VGS = 10 V, ID = 6.3 A, TJ = 125°C  
Note:  
4. Used typical FDC655 MOSFET values in table. Values can vary if other Fairchild MOSFETs are used.  
© 2012 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FJP2160D Rev. 1.1  
4
Typical Performance Characteristics  
3
1A  
VCE=10V  
900m A  
800m A  
100  
10  
1
700m A  
600m A  
500m A  
TJ=125o  
C
2
400m A  
300m A  
TJ=25o  
C
200m A  
IB=100m A  
1
0
0
1
2
3
4
5
6
7
1
10  
100  
1000  
VCE[V], COLLECTOR EMITTER VOLTAGE  
IC[mA], COLLECTOR CURRENT  
Figure 4. Static Characteristic  
Figure 5. DC Current Gain  
100  
10  
100  
10  
1
IC = 3 IB  
IC = 5 IB  
Ta = 125 o  
C
Ta = 125 o  
C
1
Ta = 25 o  
C
Ta = 25 o  
C
0.1  
0.01  
Ta = -25 o  
C
Ta = - 25 o  
C
0.1  
1E-3  
0.01  
0.1  
1
10  
1E-3  
0.01  
0.1  
1
10  
IC [A], COLLECTOR CURRENT  
IC [A], COLLECTOR CURRENT  
Figure 6. Collector-Emitter Saturation Voltage  
hFE=3  
Figure 7. Collector-Emitter Saturation Voltage  
hFE=5  
100  
100  
IC = 20 IB  
IC = 10 IB  
10  
10  
Ta = 125 o  
C
Ta = 125 o  
Ta = 25 o  
C
C
Ta = 25 o  
C
1
1
Ta = -25 o  
C
Ta = -25 o  
C
0.1  
1E-3  
0.1  
1E-3  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
IC [A], COLLECTOR CURRENT  
IC [A], COLLECTOR CURRENT  
Figure 8. Collector-Emitter Saturation Voltage  
FE=10  
Figure 9. Collector-Emitter Saturation Voltage  
hFE=20  
h
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
5
Typical Performance Characteristics (Continued)  
2
1
0
1000  
100  
10  
TJ=25oC  
3.0A  
2.0A  
Cob (Emitter Open)  
1.0A  
0.4A  
IC=0.2A  
Cob (Emitter Grounded)  
1
1
10  
100  
1k  
1
10  
100  
1000  
10000  
IB[mA], BASE CURRENT  
COLLECTOR-BASE VOLTAGE[V]  
Figure 10. Typical Collector Saturation Voltage  
Figure 11. Capacitance  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
250  
ta = 25oC L=1mH SRF=480KHz  
ta = 25oC L=1mH SRF=480KHz  
225  
hfe=10 common emitter  
200  
175  
150  
125  
hfe=5 common emitter  
hfe=5 common emitter  
100  
hfe=5 ESBC  
hfe=10 common emitter  
75  
50  
hfe=10 ESBC  
hfe=5 ESBC  
25  
hfe=10 ESBC  
0
0.2  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
IC [A], COLLECTOR CURRENT  
IC [A], COLLECTOR CURRENT  
Figure 12. Inductive Load  
Collector Current Fall-time (tf)  
Figure 13. Inductive Load  
Collector Current Storage time (tstg  
)
300  
200  
ta = 25oC L=1mH SRF=480KHz  
ta = 25oC L=1mH SRF=480KHz  
280  
260  
240  
220  
200  
180  
160  
140  
120  
100  
80  
180  
160  
140  
120  
100  
80  
hfe=5 ESBC  
hfe=10 common emitter  
hfe=5 common emitter  
hfe=10 common emitter  
hfe=10 ESBC  
60  
40  
hfe=5 common emitter  
20  
hfe=5 ESBC  
1.0 1.2  
hfe=10 ESBC  
1.4 1.6  
60  
0
0.2  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.8  
2.0  
0.4  
0.6  
0.8  
1.4  
1.6  
1.8  
2.0  
IC [A], COLLECTOR CURRENT  
IC [A], COLLECTOR CURRENT  
Figure 14. Inductive Load  
Figure 15. Inductive Load  
Collector Voltage Fall-time (tf)  
Collector Voltage Rise-time (tr)  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
6
Typical Performance Characteristics (Continued)  
300  
3
2
1
0
ta = 25oC L=1mH SRF=480KHz  
280  
VDD = +/-50V, RLOAD = 500KΩ  
VBE(off)= 5V  
260  
240  
hfe=5 ESBC  
220  
200  
hfe=10 common emitter  
180  
hfe=5 common emitter  
160  
140  
hfe=10 ESBC  
120  
100  
80  
0
200  
400  
600  
800  
1000 1200 1400 1600 1800  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
VCE [V], COLLECTOR-EMITTER VOLTAGE  
IC [A], COLLECTOR CURRENT  
Figure 16. Inductive Load  
Figure 17. BJT Reverse Bias Safe Operating Area  
Collector Current/Voltage Crossover (tc)  
3
TC = 25oC  
VDD = +/-50V, RLOAD = 500Kohms  
HFE = 4  
Single 80us Pulse  
10  
2
1
0
1
0.1  
0
500  
1000  
1500  
2000  
0
200  
400  
600  
800 1000 1200 1400 1600 1800 2000  
VCE [V], COLLECTOR-EMITTER VOLTAGE  
VCE [V], COLLECTOR-EMITTER VOLTAGE  
Figure 18. ESBC RBSOA  
Figure 19. Crossover Forward Bias Safe Operating  
Area  
140  
120  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
TC [oC], CASE TEMPERATURE  
Figure 20. Power Derating  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
7
Test Circuits  
Figure 21. Test Circuit For Inductive Load and Reverse Bias Safe Operating  
}ŠŠ  
}ŠŠ  
sT“–ˆ‹  
sT“–ˆ‹  
}•  
A
pj  
pi  
A
pj  
k|{  
A
k|{  
R\G}  
Figure 22. Energy Rating Test Circuit  
VCE  
Figure 24. FBSOA  
Figure 23. Ft Measurement  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
8
Test Circuits (Continued)  
Figure 25. Simplified Saturated Switch Driver Circuit  
Functional Test Waveforms  
Figure 26. Crossover Time Measurement  
90% Vce  
90% Ic  
10% Vce  
10% Ic  
Figure 27. Saturated Switching Waveform  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
9
Functional Test Waveforms (Continued)  
Figure 29. Storage Time - ESBC FET  
Gate (off) to Ic Fall-time  
Figure 28. Storage Time - Common Emitter  
Base turn off (Ib2) to Ic Fall-time  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
10  
Very Wide Input Voltage Range Supply  
- 8watt; SecReg: 3 cap input; Quasi Resonant  
Y[}gWUZZh  
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X
Y
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xœˆšGyŒš–•ˆ•›GXYWro¡  
[^Wr  
^
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Y
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Z
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Z
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ZZœm  
[\W}  
twX]W_i[^Xh  
ttZYY}i  
YY}  
YL  
[^Wr  
FJP  
YX]Wk{t  
Xu[X[_  
[^Wr  
[^Wr  
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z  
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mi  
kl{  
X
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ZZœm  
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[^Wr  
WUZ\hG“”›  
QGtˆ’ŒGš–™›GˆšG—–šš‰“Œ  
Figure 30. Very Wide Input Voltage Range Supply  
Driving ESBC Switches  
Fairchild  
Proprietary  
Figure 32. Vbias Supply Derived  
Figure 31. Vcc Derived  
Figure 33. Proportional Drive  
© 2012 Fairchild Semiconductor Corporation  
FJP2160D Rev. 1.1  
www.fairchildsemi.com  
11  
SUPPLIER "B" PACKAGE  
SHAPE  
‘ꢀꢁꢂꢂ  
3.50  
10.67  
9.65  
SUPPLIER "A" PACKAGE  
SHAPE  
E
3.40  
2.50  
16.30  
13.90  
IF PRESENT, SEE NOTE "D"  
E
16.51  
15.42  
9.40  
8.13  
E
1
2
3
4.10  
2.70  
[2.46]  
C
14.04  
12.70  
2.13  
2.06  
FRONT VIEWS  
H
4.70  
4.00  
1.62  
1.42  
1.62  
1.10  
2.67  
2.40  
"A1"  
8.65  
7.59  
1.00  
0.55  
SEE NOTE "F"  
ꢃƒ  
ꢄƒ  
ꢃƒ  
ꢄƒ  
6.69  
6.06  
OPTIONAL  
CHAMFER  
E
14.30  
11.50  
NOTE "I"  
BOTTOM VIEW  
NOTES:  
A) REFERENCE JEDEC, TO-220, VARIATION AB  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS COMMON TO ALL PACKAGE  
SUPPLIERS EXCEPT WHERE NOTED [ ].  
D) LOCATION OF MOLDED FEATURE MAY VARY  
(LOWER LEFT CORNER, LOWER CENTER  
AND CENTER OF THE PACKAGE)  
3
2
1
E DOES NOT COMPLY JEDEC STANDARD VALUE.  
F) "A1" DIMENSIONS AS BELOW:  
SINGLE GAUGE = 0.51 - 0.61  
DUAL GAUGE = 1.10 - 1.45  
G) DRAWING FILE NAME: TO220B03REV9  
H
PRESENCE IS SUPPLIER DEPENDENT  
I) SUPPLIER DEPENDENT MOLD LOCKING HOLES  
IN HEATSINK.  
0.60  
0.36  
2.85  
2.10  
BACK VIEW  
SIDE VIEW  
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