FGY75T120SWD [ONSEMI]

1200V 75A 场截止型VII分立式IGBT,Power TO247-3L封装;
FGY75T120SWD
型号: FGY75T120SWD
厂家: ONSEMI    ONSEMI
描述:

1200V 75A 场截止型VII分立式IGBT,Power TO247-3L封装

双极性晶体管
文件: 总9页 (文件大小:284K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
IGBT – Power, Co-PAK  
N-Channel, Field Stop VII (FS7),  
Non SCR, Power TO247-3L,  
1200ꢀV, 1.7ꢀV, 75ꢀA  
BV  
V
I
CES  
CE(SAT)  
C
1200 V  
1.7 V  
75.0 A  
PIN CONNECTIONS  
FGY75T120SWD  
C
Description  
th  
Using the novel field stop 7 generation IGBT technology and the  
G
Gen7 Diode in TO247 3lead package, FGY75T120SWD offers the  
optimum performance with low switching and conduction losses for  
highefficiency operations in various applications like Solar, UPS and  
ESS.  
E
Features  
Maximum Junction Temperature T = 175°C  
J
Positive Temperature Coefficient for Easy Parallel Operation  
High Current Capability  
G
C
E
Smooth and Optimized Switching  
Low Switching Loss  
TO2473LD  
CASE 340CD  
RoHS Compliant  
MARKING DIAGRAM  
Applications  
Boost and Inverter in Solar System  
UPS  
Energy Storage System  
$Y&Z&3&K  
FGY75T  
120SWD  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Collector to Emitter Voltage  
Gate to Emitter Voltage  
Symbol  
Value  
1200  
20  
Unit  
V
CES  
V
GES  
V
Transient Gate to Emitter Voltage  
30  
Collector Current  
Power Dissipation  
T
T
T
T
T
= 25°C  
= 100°C  
= 25°C  
= 100°C  
= 25°C,  
I
150  
75  
C
C
C
C
C
C
$Y  
&Z  
&3  
&K  
= onsemi Logo  
= Assembly Plant Code  
= 3Digit Date Code  
A
P
503  
251  
300  
W
D
= 2Digit Lot Traceability Code  
FGY75T120SWD = Specific Device code  
Pulsed Collector  
Current  
I
A
CM  
t = 10 s  
p
ORDERING INFORMATION  
(Note 1)  
Diode Forward  
Current  
T
T
T
= 25°C  
= 100°C  
= 25°C,  
I
150  
75  
C
C
C
F
Device  
Package  
Shipping  
FGY75T120SWD  
TO2473LD  
(PbFree)  
30 Units /  
Tube  
Pulsed Diode  
Maximum Forward  
Current  
I
300  
FM  
t = 10 s  
p
(Note 1)  
Operating Junction and Storage  
Temperature  
T , T  
55 to 175  
°C  
J
STG  
Lead Temperature for Soldering Purposes  
T
L
260  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulse width limited by max. Junction temperature.  
© Semiconductor Components Industries, LLC, 2022  
1
Publication Order Number:  
March, 2023 Rev. 3  
FGY75T120SWD/D  
 
FGY75T120SWD  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Max Value  
Unit  
Thermal Resistance, Junction to Case for IGBT  
Thermal Resistance, Junction to Case for Diode  
Thermal Resistance, Junction to Ambient  
R
0.3  
0.4  
40  
°C/W  
JC  
R
JA  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector to Emitter Breakdown  
Voltage  
BV  
V
GE  
V
GE  
V
GE  
V
GE  
= 0 V, I = 5 mA  
1200  
666  
V
mV/°C  
A  
CES  
C
Breakdown Voltage Temperature  
Coefficient  
BV  
/
T
= 0 V, I = 5 mA  
CES  
J
C
Collector to Emitter CutOff  
Current  
I
= 0 V, V = V  
CES  
40  
400  
CES  
CE  
Gate to Emitter Leakage Current  
ON CHARACTERISTICS  
I
= 20 V, V = 0 V  
nA  
GES  
CE  
Gate to Emitter Threshold Voltage  
V
V
GE  
V
GE  
V
GE  
= V , I = 75 mA  
5.6  
1.35  
6.55  
1.68  
2.24  
7.4  
2.0  
V
V
GE(TH)  
CE  
C
Collector to Emitter Saturation  
Voltage  
V
= 15 V, I = 75 A, T = 25°C  
C J  
CE(SAT)  
= 15 V, I = 75 A, T = 175°C  
C
J
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
V
= 30 V, V = 0 V, f = 1 MHz  
6331  
234  
pF  
nC  
IES  
CE  
CE  
GE  
Output Capacitance  
C
OES  
C
RES  
Reverse Transfer Capacitance  
Total Gate Charge  
29.6  
214  
Q
V
= 600 V, V = 15 V, I = 75 A  
GE C  
G
Gate to Emitter Charge  
Gate to Collector Charge  
Q
53.9  
77.7  
GE  
GC  
Q
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
TurnOn Delay Time  
Turn-Off Delay Time  
Rise Time  
t
V
C
= 600 V, V = 15 V,  
42  
221  
27  
ns  
ns  
ns  
d(on)  
d(off)  
CE  
GE  
I
= 37.5 A, R = 4.7 ,  
G
t
T = 25°C  
J
t
r
Fall Time  
t
f
77  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Turn-Off Delay Time  
Rise Time  
E
on  
E
off  
2.12  
1.43  
3.55  
42  
mJ  
E
ts  
t
t
V
C
= 600 VV = 15 V,  
ns  
ns  
ns  
d(on)  
d(off)  
CE  
GE  
I
= 75 A, R = 4.7 ,  
G
171  
56  
T = 25°C  
J
t
r
Fall Time  
t
f
66  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
E
on  
E
off  
5.00  
2.32  
7.32  
mJ  
E
ts  
www.onsemi.com  
2
FGY75T120SWD  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted) (continued)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Turn-On Delay Time  
TurnOff Delay Time  
Rise Time  
t
t
V
C
= 600 VV = 15 V,  
38  
276  
26  
ns  
ns  
ns  
d(on)  
CE  
GE  
I
= 37.5 A, R = 4.7 ,  
G
d(off)  
T = 175°C  
J
t
r
Fall Time  
t
f
132  
3.50  
2.31  
5.81  
38  
Turn-On Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
TurnOn Delay Time  
TurnOff Delay Time  
Rise Time  
E
on  
E
off  
mJ  
E
ts  
t
t
V
C
= 600 VV = 15 V,  
ns  
ns  
ns  
d(on)  
d(off)  
CE  
GE  
I
= 75 A, R = 4.7 ,  
G
210  
53  
T = 175°C  
J
t
r
Fall Time  
t
f
115  
7.29  
3.50  
10.79  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
DIODE CHARACTERISTIC  
Diode Forward Voltage  
E
on  
E
off  
mJ  
E
ts  
V
F
I = 75 A, T = 25°C  
F
1.62  
1.84  
1.91  
2.22  
V
J
I = 75 A, T = 175°C  
F
J
DIODE SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Reverse Recovery Time  
t
V
= 600 V, I = 37.5 A,  
233  
2343  
0.8  
ns  
nC  
mJ  
A
rr  
R
F
F
dI /dt = 500 A/s,  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Reverse Recovery Time  
Q
rr  
T = 25°C  
J
E
rec  
I
20.2  
307  
3285  
1
RRM  
t
rr  
V
R
= 600 V, I = 75 A,  
nS  
nC  
mJ  
A
F
dI /dt = 500 A/s,  
F
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Reverse Recovery Time  
Q
rr  
T = 25°C  
J
E
rec  
I
21.4  
407  
5965  
2
RRM  
t
rr  
V
R
= 600 V, I = 37.5 A,  
ns  
nC  
mJ  
A
F
dI /dt = 500 A/s,  
F
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Reverse Recovery Time  
Q
rr  
T = 175°C  
J
E
rec  
I
29.4  
541  
8974  
4
RRM  
t
rr  
V
R
= 600 V, I = 75 A,  
ns  
nC  
mJ  
A
F
dI /dt = 500 A/s,  
F
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Q
rr  
T = 175°C  
J
E
rec  
I
33.2  
RRM  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGY75T120SWD  
TYPICAL CHARACTERISTICS  
300  
250  
200  
150  
300  
V
= 8 V  
V
= 8 V  
GE  
GE  
T = 25°C  
J
T = 55°C  
J
V
= 10 V  
= 12 V  
= 15 V  
= 20 V  
V
= 10 V  
= 12 V  
= 15 V  
= 20 V  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
250  
200  
150  
V
V
V
V
V
V
100  
50  
0
100  
50  
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
V
CE  
, Collector to Emitter Voltage (V)  
V
CE  
, Collector to Emitter Voltage (V)  
Figure 1. Output Characteristics  
Figure 2. Output Characteristics  
300  
250  
200  
150  
140  
120  
100  
T = 175°C  
Common Emitter  
= 20 V  
J
V
CE  
V
= 8 V  
T = 25°C  
GE  
J
V
V
V
V
= 10 V  
= 12 V  
= 15 V  
= 20 V  
GE  
GE  
GE  
GE  
T = 175°C  
J
80  
60  
40  
20  
0
100  
50  
0
0
2
4
6
8
10  
12  
0
1
2
3
4
5
6
7
V
GE  
, Gate to Emitter Voltage (V)  
V
CE  
, Collector to Emitter Voltage (V)  
Figure 4. Transfer Characteristics  
Figure 3. Output Characteristics  
300  
250  
200  
150  
3.5  
3.0  
2.5  
2.0  
1.5  
Common Emitter  
V
GE  
= 15 V  
100  
1.0  
0.5  
0.0  
I
= 50 A  
= 100 A  
= 200 A  
C
V
= 15 V  
GE  
I
I
C
C
T = 25°C  
50  
0
J
T = 175°C  
J
0
1
2
3
4
5
6
7
100  
50  
0
50  
100  
150  
200  
V
CE  
, Collector to Emitter Voltage (V)  
T , Collector to Emitter Junction Temperature (5C)  
J
Figure 6. Saturation Voltage vs Junction  
Temperature  
Figure 5. Saturation Voltage Characteristics  
www.onsemi.com  
4
FGY75T120SWD  
TYPICAL CHARACTERISTICS (CONTINUED)  
100K  
10K  
1K  
14  
Common Emitter  
= 75 A  
I
C
12  
10  
8
6
100  
10  
V
CC  
V
CC  
V
CC  
= 200 A  
= 400 A  
= 600 A  
4
Common Emitter  
= 0 V, f = 1 MHz  
T = 25°C  
J
C
IES  
V
C
GE  
OES  
2
C
RES  
1
0.1  
0
1
10  
30  
0
50  
100  
150  
200  
250  
V
CE  
, Collector to Emitter Voltage (V)  
Q , Gate Charge (nC)  
G
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge Characteristics  
1000  
100  
10  
1000  
100  
10  
Common Emitter  
V
CE  
= 600 V, V = 15 V  
GE  
I
C
= 75 A  
*Note:  
T
T
= 25°C  
= 175°C  
C
J
Single Pulse  
Pulse Duration = 10 s  
Pulse Duration = 100 s  
Pulse Duration = 1 ms  
Pulse Duration = 10 ms  
Pulse Duration = DC  
t
T = 25°C  
J
d(on)  
1
t
T = 175°C  
d(on)  
J
t
r
T = 25°C  
J
T = 175°C  
J
t
r
0.1  
0
10  
20  
30  
40  
50  
1
10  
100  
1000  
R , Gate Resistance (W)  
G
V
CE  
, Collector to Emitter Voltage (V)  
Figure 10. TurnOn Time vs Gate Resistance  
Figure 9. SOA Characteristics  
50.0  
10.0  
10000  
1000  
100  
Common Emitter  
t
T = 25°C  
J
d(off)  
t
T = 175°C  
V
CE  
V
GE  
= 600 V,  
= 15 V  
d(off)  
J
t T = 25°C  
f
J
t T = 175°C  
f
J
I
C
= 75 A  
1.0  
0.1  
Common Emitter  
E
E
on  
E
T = 25°C  
J
on  
V
V
I
= 600 V,  
= 15 V  
= 75 A  
CE  
T = 175°C  
J
T = 25°C  
GE  
off  
J
E
T = 175°C  
J
off  
C
10  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
R , Gate Resistance (W)  
G
R , Gate Resistance (W)  
G
Figure 12. Switching Loss vs Gate Resistance  
Figure 11. TurnOff Time vs Gate Resistance  
www.onsemi.com  
5
FGY75T120SWD  
TYPICAL CHARACTERISTICS (CONTINUED)  
1000  
500  
100  
Common Emitter  
= 600 V, V = 15 V  
V
CE  
GE  
R
= 4.7 ꢃ  
G
100  
Common Emitter  
t
T = 25°C  
J
t
T = 25°C  
J
d(on)  
d(off)  
V
V
= 600 V,  
= 15 V  
CE  
t
T = 175°C  
t
T = 175°C  
d(on)  
J
d(off)  
J
t
r
T = 25°C  
J
T = 175°C  
J
GE  
t T = 25°C  
f
J
t
r
t T = 175°C  
R
= 4.7 ꢃ  
f
J
G
10  
10  
0
50  
100  
150  
200  
0
50  
100  
150  
200  
I , Collector Current (A)  
C
I , Collector Current (A)  
C
Figure 13. TurnOn Time vs Collector Current  
Figure 14. TurnOff Time vs Collector Current  
300  
50.0  
10.0  
V
GE  
= 0 V  
250  
200  
150  
100  
1.0  
0.1  
Common Emitter  
E
E
on  
E
T = 25°C  
J
on  
T = 175°C  
V
V
= 600 V,  
= 15 V  
J
CE  
T = 175°C  
J
T = 25°C  
J
GE  
T = 25°C  
50  
0
off  
J
T = 55°C  
J
E
T = 175°C  
J
R = 4.7 ꢃ  
G
off  
0
1
2
3
4
5
6
0
50  
100  
150  
200  
V , Forward Voltage (V)  
F
I , Collector Current (A)  
C
Figure 16. Diode Forward Characteristics  
Figure 15. Switching Loss vs Collector Current  
60  
50  
40  
30  
20  
10  
0
600  
V
R
= 600 V, I = 75 A  
F
500  
400  
300  
200  
100  
0
V
= 600 V, I = 75 A  
F
R
T = 25°C  
T = 25°C  
T = 175°C  
J
J
J
T = 175°C  
J
400  
600  
800  
1000  
1200  
1400  
1600  
400  
600  
800  
1000  
1200  
1400  
1600  
dI /dt, Diode Current Slope (A/ms)  
F
dI /dt, Diode Current Slope (A/ms)  
F
Figure 18. Diode Reverse Recovery Time  
Figure 17. Diode Reverse Recovery Current  
www.onsemi.com  
6
FGY75T120SWD  
TYPICAL CHARACTERISTICS (CONTINUED)  
12000  
8000  
4000  
0
V
= 600 V, I = 75 A  
F
R
T = 25°C  
J
T = 175°C  
J
400  
600  
800  
1000  
1200  
1400  
1600  
dI /dt, Diode Current Slope (A/ms)  
F
Figure 19. Diode Stored Charge Characteristics  
1
D = 0 is Single Pulse  
0.1  
0.01  
P
Notes:  
DM  
Duty Factor: D = t1 / t2  
t1  
D = 0.00  
D = 0.01  
D = 0.02  
D = 0.05  
D = 0.10  
D = 0.20  
D = 0.50  
Peak T = P  
J
× Z  
+ T  
JC C  
t2  
DM  
0.001  
R1  
R2  
i:  
ri[K/W]: 0.0079  
τ[s]:  
1
2
3
4
0.0591  
0.0490  
0.0562  
1.37E05 1.59E04 4.22E04 1.95E03  
C1=t1/R1  
C2=t2/R2  
0.0001  
6  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
10  
t, Rectangular Pulse Duration (s)  
Figure 20. Transient Thermal Impedance of IGBT  
1
D = 0 is Single Pulse  
0.1  
Note:  
P
DM  
D = 0.00  
D = 0.01  
D = 0.02  
D = 0.05  
D = 0.10  
D = 0.20  
D = 0.50  
Peak T = P  
J
× Z  
+ T  
JC C  
DM  
t1  
0.01  
t2  
R1  
R2  
i:  
ri[K/W]: 0.0135  
τ[s]:  
1
2
3
4
0.0352  
0.0644  
0.0807  
2.08E06 2.19E05 1.61E04 7.50E04  
C1=t1/R1  
C2=t2/R2  
0.001  
6  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
10  
t, Rectangular Pulse Duration (s)  
Figure 21. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO−247−3LD  
CASE 340CD  
ISSUE A  
DATE 18 SEP 2018  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
= Pb−Free Package  
G
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb−Free indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13857G  
TO−247−3LD  
PAGE 1 OF 1  
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