FGA15N120ANTDTU-F109 [ONSEMI]

IGBT,1200V,15A,NPT 沟槽;
FGA15N120ANTDTU-F109
型号: FGA15N120ANTDTU-F109
厂家: ONSEMI    ONSEMI
描述:

IGBT,1200V,15A,NPT 沟槽

栅 双极性晶体管
文件: 总10页 (文件大小:991K)
中文:  中文翻译
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Is Now  
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www.onsemi.com  
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FGA15N120ANTDTU  
1200 V, 15 A NPT Trench IGBT  
Description  
Using ON Semiconductor's proprietary trench design and  
advanced NPT technology, the 1200V NPT IGBT offers  
superior conduction and switching performances, high  
avalanche ruggedness and easy parallel operation.  
Features  
NPT Trench Technology, Positive temperature coefficient  
Low Saturation Voltage: VCE(sat), typ = 1.9 V  
@ IC = 15 A and TC = 25C  
This device is well suited for the resonant or soft switching appli-  
cation such as induction heating, microwave oven.  
Low Switching Loss: Eoff, typ = 0.6 mJ  
@ IC = 15 A and TC = 25C  
Extremely Enhanced Avalanche Capability  
C
G
TO-3P  
E
G
C
E
Absolute Maximum Ratings  
Symbol  
Description  
Ratings  
Unit  
V
VCES  
VGES  
IC  
Collector-Emitter Voltage  
1200  
Gate-Emitter Voltage  
20  
V
Collector Current  
@ TC  
=
25C  
30  
A
Collector Current  
@ TC = 100C  
15  
A
ICM  
IF  
IFM  
PD  
Pulsed Collector Current (Note 1)  
Diode Continuous Forward Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
45  
A
@ TC = 25C  
@ TC = 100C  
30  
15  
A
A
45  
A
@ TC  
=
25C  
186  
W
W
C  
C  
C  
@ TC = 100C  
74  
TJ  
-55 to +150  
-55 to +150  
300  
Tstg  
TL  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
0.67  
2.88  
40  
Unit  
RJC  
RJC  
Thermal Resistance, Junction-to-Case for IGBT  
Thermal Resistance, Junction-to-Case for Diode  
Thermal Resistance, Junction-to-Ambient  
--  
--  
--  
C/W  
C/W  
C/W  
RJA  
Notes:  
(1) Repetitive rating: Pulse width limited by max. junction temperature  
Publication Order Number:  
FGA15N120ANTDTU/D  
©2006 Semiconductor Components Industries, LLC.  
October-2017,Rev.3  
Package Marking and Ordering Information  
Packing  
Method  
Part Number  
Top Mark  
Package  
Reel Size Tape Width Quantity  
FGA15N120ANTDTU-F109 FGA15N120ANTDTU  
TO-3P  
Tube  
N/A  
N/A  
30  
Electrical Characteristics of the IGBT  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ. Max.  
Unit  
Off Characteristics  
ICES  
IGES  
Collector Cut-Off Current  
G-E Leakage Current  
VCE = VCES, VGE = 0 V  
VGE = VGES, VCE = 0 V  
--  
--  
--  
--  
3
mA  
nA  
± 250  
On Characteristics  
VGE(th)  
G-E Threshold Voltage  
IC = 15 mA, VCE = VGE  
IC = 15 A, VGE = 15 V  
4.5  
--  
6.5  
1.9  
2.2  
8.5  
2.4  
--  
V
V
V
VCE(sat)  
Collector to Emitter  
Saturation Voltage  
IC = 15 A, VGE = 15 V,  
--  
TC = 125C  
IC = 30 A, VGE = 15 V  
--  
2.3  
--  
V
Dynamic Characteristics  
Cies  
Coes  
Cres  
Input Capacitance  
VCE = 30 V VGE = 0 V,  
f = 1 MHz  
--  
--  
--  
2650  
143  
96  
--  
--  
--  
pF  
pF  
pF  
,
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VCC = 600 V, IC = 15 A,  
RG = 10 , VGE = 15 V,  
Inductive Load, TC = 25C  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
15  
20  
--  
--  
ns  
ns  
Rise Time  
Turn-Off Delay Time  
Fall Time  
160  
100  
3
--  
ns  
180  
4.5  
0.9  
5.4  
--  
ns  
Eon  
Eoff  
Ets  
td(on)  
tr  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
mJ  
mJ  
mJ  
ns  
0.6  
3.6  
15  
VCC = 600 V, IC = 15 A,  
RG = 10 , VGE = 15 V,  
20  
--  
ns  
Inductive Load, TC = 125C  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
170  
150  
3.2  
0.8  
4.0  
120  
16  
--  
ns  
--  
ns  
Eon  
Eoff  
Ets  
Qg  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate-Emitter Charge  
Gate-Collector Charge  
4.8  
1.2  
6.0  
180  
22  
65  
mJ  
mJ  
mJ  
nC  
nC  
nC  
VCE = 600 V, IC = 15 A,  
VGE = 15 V  
Qge  
Qgc  
50  
www.onsemi.com  
2
Electrical Characteristics of DIODE  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ. Max.  
Unit  
VFM  
Diode Forward Voltage  
IF = 15 A  
TC  
C = 125C  
TC 25C  
TC = 125C  
TC 25C  
TC = 125C  
TC 25C  
C = 125C  
=
25C  
--  
--  
--  
--  
--  
--  
--  
--  
1.7  
1.8  
2.7  
--  
V
T
trr  
Diode Reverse Recovery Time  
IF = 15 A  
diF/dt = 200 A/s  
=
210  
280  
27  
330  
--  
ns  
A
Irr  
Diode Peak Reverse Recovery Cur-  
rent  
=
40  
--  
31  
Qrr  
Diode Reverse Recovery Charge  
=
2835  
4340  
6600  
--  
nC  
T
www.onsemi.com  
3
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Saturation Voltage  
Characteristics  
150  
200  
TC = 25oC  
Common Emitter  
VGE = 15V  
20V  
17V  
15V  
12V  
TC  
TC = 125oC  
=
25oC  
120  
90  
60  
30  
0
150  
VGE = 10V  
100  
50  
0
0
2
4
6
8
10  
0
2
4
6
Collector-Emitter Voltage, VCE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 3. Saturation Voltage vs. Case  
Figure 4. Saturation Voltage vs. V  
GE  
Temperature at Variant Current Level  
3.0  
2.5  
2.0  
1.5  
Common Emitter  
VGE = 15V  
Common Emitter  
TC = 25oC  
16  
IC = 24A  
12  
8
IC = 15A  
4
15A  
24A  
IC = 7.5A  
0
0
4
8
12  
16  
20  
25  
50  
75  
100  
125  
150  
Gate-Emitter Voltage, VGE [V]  
Case Temperature, TC [oC]  
Figure 5. Saturation Voltage vs. V  
Figure 6. Capacitance Characteristics  
GE  
3500  
Common Emitter  
TC = 125oC  
16  
3000  
2500  
2000  
1500  
1000  
500  
Ciss  
12  
8
Common Emitter  
VGE = 0V, f = 1MHz  
TC = 25oC  
4
24A  
15A  
Coss  
Crss  
IC = 7.5A  
8
0
0
0.1  
1
10  
0
4
12  
16  
20  
Collector-Emitter Voltage, VCE[V]  
Gate-Emitter Voltage, VGE [V]  
www.onsemi.com  
4
Typical Performance Characteristics (Continued)  
Figure 7. Turn-On Characteristics vs. Gate  
Resistance  
Figure 8. Turn-Off Characteristics vs. Gate  
Resistance  
100  
Common Emitter  
VCC = 600V, VGE = 15V  
1000  
IC = 15A  
td(off)  
TC = 25oC  
TC = 125oC  
tr  
10  
td(on)  
100  
tf  
Common Emitter  
VCC = 600V, VGE = 15V  
IC = 15A  
TC = 25oC  
TC = 125oC  
10  
1
0
10  
20  
30  
40  
50  
60  
70  
0
10  
20  
30  
40  
50  
60  
70  
Gate Resistance, RG []  
Gate Resistance, RG[]  
Figure 9. Switching Loss vs. Gate Resistance  
Figure 10. Turn-On Characteristics vs.  
Collector Current  
Common Emitter  
Common Emitter  
VCC = 600V, VGE = 15V  
VGE = 15V, RG = 10  
TC = 25oC  
IC = 15A  
TC = 25oC  
100  
TC = 125oC  
10  
TC = 125oC  
tr  
Eon  
td(on)  
Eoff  
10  
1
10  
15  
20  
25  
30  
0
10  
20  
30  
40  
50  
60  
70  
Collector Current, IC [A]  
Gate Resistance, RG []  
Figure 11. Turn-Off Characteristics vs.  
Collector Current  
Figure 12. Switching Loss vs. Collector Current  
Common Emitter  
VGE = 15V, RG = 10  
TC = 25oC  
TC = 125oC  
Common Emitter  
VGE = 15V, RG = 10  
TC = 25oC  
10  
TC = 125oC  
Eon  
Eoff  
td(off)  
100  
1
tf  
10  
0.1  
10  
15  
20  
25  
30  
5
10  
15  
20  
25  
30  
Collector Current, IC [A]  
Collector Current, IC [A]  
www.onsemi.com  
5
Typical Performance Characteristics (Continued)  
Figure 13. Gate Charge Characteristics  
Figure 14. SOA Characteristics  
15  
Common Emitter  
RL = 40  
100  
TC = 25oC  
Ic MAX (Pulsed)  
12  
50s  
Ic MAX (Continuous)  
100s  
1ms  
600V  
10  
1
9
400V  
DC Operation  
6
3
0
Vcc = 200V  
Single Nonrepetitive  
Pulse Tc = 25o  
Curves must be derated  
linearly with increase  
in temperature  
0.1  
0.01  
C
0
20  
40  
60  
80  
100  
120  
0.1  
1
10  
100  
1000  
Collector - Em itter Voltage, VCE [V]  
Gate Charge, Qg [nC]  
Figure 15. Turn-Off SOA  
100  
10  
Safe Operating Area  
VGE = 15V, TC = 125oC  
1
10  
100  
1000  
Collector-Emitter Voltage, VCE [V]  
Figure 16. Transient Thermal Impedance of IGBT  
10  
1
0.5  
0.2  
0.1  
0.1  
0.05  
Pdm  
0.02  
0.01  
t1  
0.01  
1E-3  
t2  
single pulse  
1E-4  
Duty factor D = t1 / t2  
Peak Tj = Pdm  
1
Zthjc + T  
C
1E-5  
1E-3  
0.01  
0.1  
10  
Rectangular Pulse Duration [sec]  
www.onsemi.com  
6
Typical Performance Characteristics (Continued)  
Figure 17. Forward Characteristics  
Figure 18. Reverse Recovery Current  
50  
30  
diF/dt = 200A/s  
25  
20  
10  
TJ = 125oC  
15  
diF/dt = 100A/s  
TJ = 25oC  
1
10  
5
TC = 125oC  
TC = 25oC  
0.1  
0
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
5
10  
15  
20  
25  
Forward Voltage , VF [V]  
Forward Current , IF [A]  
Figure 19. Stored Charge  
Figure 20. Reverse Recovery Time  
7000  
400  
6000  
diF/dt = 200A/s  
diF/dt = 100A/s  
300  
200  
100  
0
5000  
4000  
3000  
2000  
1000  
0
diF/dt = 100A/s  
diF/dt = 200A/s  
5
10  
15  
20  
25  
5
10  
15  
20  
25  
Forward Current , IF [A]  
Forward Current , IF [A]  
www.onsemi.com  
7
Mechanical Dimensions  
Figure 21. TO-3P 3L - 3LD, T03, PLASTIC, EIAJ SC-65  
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verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms  
and conditions, specif-ically the warranty therein, which covers ON Semiconductor products.  
www.onsemi.com  
8
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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