FDD86369 [ONSEMI]

N 沟道,PowerTrench® MOSFET,80V,90A,7.9mΩ;
FDD86369
型号: FDD86369
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,80V,90A,7.9mΩ

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www.onsemi.com  
FDD86369  
®
N-Channel PowerTrench MOSFET  
80 V, 90 A, 7.9 mΩ  
Features  
„ Typical R  
= 5.9 mΩ at V = 10V, I = 80 A  
GS D  
DS(on)  
D
„ Typical Q  
= 34 nC at V = 10V, I = 80 A  
g(tot)  
GS  
D
„ UIS Capability  
„ RoHS Compliant  
D
G
Applications  
G
„ PowerTrain Management  
S
„ Solenoid and Motor Drivers  
„ Integrated Starter/Alternator  
„ Primary Switch for 12V Systems  
D-PAK  
(TO-252)  
S
For current package drawing, please refer to the ON website at  
http://www.fairchildsemi.com/packagedrawings/  
TO/TO252A03.pdf  
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted.  
Symbol  
VDSS  
Parameter  
Ratings  
Units  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
80  
V
V
VGS  
±20  
Drain Current - Continuous (VGS=10) (Note 1)  
Pulsed Drain Current  
TC = 25°C  
TC = 25°C  
90  
ID  
A
See Figure 4  
EAS  
PD  
Single Pulse Avalanche Energy  
(Note 2)  
(Note 3)  
29  
150  
mJ  
W
W/oC  
oC  
oC/W  
oC/W  
Power Dissipation  
Derate Above 25oC  
1.0  
TJ, TSTG Operating and Storage Temperature  
-55 to + 175  
1.0  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Maximum Thermal Resistance, Junction to Ambient  
52  
Notes:  
1: Current is limited by bondwire configuration.  
2: Starting T = 25°C, L = 14μH, I = 64A, V = 80V during inductor charging and V = 0V during time in avalanche.  
J
AS  
DD  
DD  
3: R  
is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder  
θJA  
mounting surface of the drain pins.  
presented here is based on mounting on a 1 in pad of 2oz copper.  
R
is guaranteed by design, while R is determined by the board design. The maximum rating  
θJC θJA  
2
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FDD86369  
FDD86369  
D-PAK(TO-252)  
13”  
16 mm  
2500 units  
Semiconductor Components Industries, LLC, 2017  
January, 2017, Rev. 1.0  
Publication Order Number:  
FDD86369/D  
1
Electrical Characteristics TJ = 25°C unless otherwise noted.  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BVDSS  
IDSS  
Drain-to-Source Breakdown Voltage  
Drain-to-Source Leakage Current  
Gate-to-Source Leakage Current  
ID = 250μA, VGS = 0V  
80  
-
-
-
-
-
-
1
V
V
DS= 8 0 V , T J = 25oC  
μA  
mA  
nA  
VGS = 0V  
TJ = 175oC (Note 4)  
-
1
IGSS  
VGS = ±20V  
-
±100  
On Characteristics  
VGS(th)  
RDS(on)  
Gate to Source Threshold Voltage  
Drain to Source On Resistance  
VGS = VDS, ID = 250μA  
2.0  
2.7  
5.9  
4.0  
7.9  
V
TJ = 25oC  
-
-
mΩ  
mΩ  
I
D = 80A,  
GS= 10V  
TJ = 175oC (Note 4)  
13.0  
17.4  
V
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
-
-
2530  
430  
16  
-
-
pF  
pF  
pF  
Ω
VDS = 40V, VGS = 0V,  
f = 1MHz  
Coss  
Crss  
Rg  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
-
VGS = 0.5V, f = 1MHz  
2.2  
36  
-
Qg(ToT)  
Qg(th)  
Qgs  
Total Gate Charge  
VGS = 0 to 10V  
54  
-
nC  
nC  
nC  
nC  
V
I
DD = 64V  
D = 80A  
Threshold Gate Charge  
Gate-to-Source Gate Charge  
Gate-to-Drain “Miller“ Charge  
VGS = 0 to 2V  
4.6  
13  
-
Qgd  
8.5  
-
Switching Characteristics  
ton  
td(on)  
tr  
Turn-On Time  
Turn-On Delay  
Rise Time  
-
-
-
-
-
-
-
70  
-
ns  
ns  
ns  
ns  
ns  
ns  
13  
34  
22  
9
-
V
V
DD = 40V, ID = 80A,  
GS = 10V, RGEN = 6Ω  
td(off)  
tf  
Turn-Off Delay  
Fall Time  
-
-
toff  
Turn-Off Time  
-
46  
Drain-Source Diode Characteristics  
I
SD =80A, VGS = 0V  
-
-
-
-
-
1.25  
1.2  
64  
V
VSD  
Source-to-Drain Diode Voltage  
ISD = 40A, VGS = 0V  
-
V
trr  
Reverse-Recovery Time  
49  
40  
ns  
nC  
IF = 80A, dISD/dt = 100A/μs  
Qrr  
Reverse-Recovery Charge  
53  
Note:  
4: The maximum value is specified by design at T = 175°C. Product is not tested to this condition in production.  
J
www.onsemi.com  
2
Typical Characteristics  
120  
100  
80  
60  
40  
20  
0
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VGS = 10V  
CURRENT LIMITED  
BY SILICON  
CURRENT LIMITED  
BY PACKAGE  
25  
50  
75  
100  
125  
150  
175  
200  
0
25  
50  
75  
100  
125  
150  
175  
TC, CASE TEMPERATURE(oC)  
TC, CASE TEMPERATURE(oC)  
Figure 2. Maximum Continuous Drain Current vs.  
Case Temperature  
Figure 1. Normalized Power Dissipation vs. Case  
Temperature  
2
DUTY CYCLE - DESCENDING ORDER  
1
D = 0.50  
0.20  
P
0.10  
DM  
0.05  
0.02  
t
0.01  
1
0.1  
t
2
NOTES:  
DUTY FACTOR: D = t /t  
SINGLE PULSE  
1
2
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJA  
θJA C  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 3. Normalized Maximum Transient Thermal Impedance  
1000  
TC = 25oC  
VGS = 10V  
FOR TEMPERATURES  
ABOVE 25oC DERATE PEAK  
CURRENT AS FOLLOWS:  
175 - TC  
I = I2  
150  
100  
SINGLE PULSE  
10  
10-5  
10-4  
10-3  
10-2  
10-1  
1
10  
t, RECTANGULAR PULSE DURATION(s)  
Figure 4. Peak Current Capability  
www.onsemi.com  
3
Typical Characteristics  
500  
100  
1000  
100  
10  
If R = 0  
= (L)(I )/(1.3*RATED BV  
t
AV  
- V  
)
AS  
DSS  
DD  
If R  
0  
t
AV  
= (L/R)ln[(I *R)/(1.3*RATED BV  
- V ) +1]  
AS  
DSS DD  
100us  
OPERATION IN THIS  
AREA MAY BE  
STARTING TJ = 25oC  
1
LIMITED BY r  
DS(on)  
10  
1ms  
10ms  
100ms  
STARTING TJ = 150oC  
SINGLE PULSE  
0.1  
T
= MAX RATED  
J
o
T
C
= 25 C  
1
0.01  
0.001  
0.01  
0.1  
1
10  
100  
1
10  
100 200  
tAV, TIME IN AVALANCHE (ms)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
NOTE: Refer to ON Application Notes AN7514 and AN7515  
Figure 6. Unclamped Inductive Switching  
Capability  
Figure 5. Forward Bias Safe Operating Area  
200  
400  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
100  
VDD = 5V  
TJ = -55oC  
150  
TJ = 175oC  
TJ = 175 o  
C
TJ = 25 o  
C
10  
1
100  
TJ = 25oC  
50  
0
0.1  
2
4
6
8
10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 7. Transfer Characteristics  
Figure 8. Forward Diode Characteristics  
200  
150  
100  
50  
200  
80μs PULSE WIDTH  
Tj=175oC  
VGS  
VGS  
15V Top  
10V  
8V  
7V  
6V  
15V Top  
10V  
8V  
7V  
6V  
150  
5.5V  
5V Bottom  
5.5V  
5V Bottom  
100  
50  
0
80μs PULSE WIDTH  
Tj=25oC  
0
0
1
2
3
4
5
0
1
2
3
4
5
VDS, DRAIN TO SOURCE VOLTAGE (V)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 9. Saturation Characteristics  
Figure 10. Saturation Characteristics  
www.onsemi.com  
4
Typical Characteristics  
100  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
ID = 80A  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
80  
60  
40  
20  
0
TJ = 175oC  
ID = 80A  
VGS = 10V  
TJ = 25oC  
6
5
7
8
9
10  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE(oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 11. RDSON vs. Gate Voltage  
Figure 12. Normalized RDSON vs. Junction  
Temperature  
1.5  
1.10  
VGS = VDS  
ID = 5mA  
I
D
= 250μA  
1.2  
0.9  
0.6  
0.3  
0.0  
1.05  
1.00  
0.95  
0.90  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE (oC)  
TJ, JUNCTION TEMPERATURE(oC)  
Figure 13. Normalized Gate Threshold Voltage vs.  
Temperature  
Figure 14. Normalized Drain to Source  
Breakdown Voltage vs. Junction Temperature  
10000  
10  
ID = 80A  
VDD =32V  
8
Ciss  
VDD = 40V  
1000  
VDD = 48V  
6
Coss  
100  
4
2
0
10  
Crss  
f = 1MHz  
GS = 0V  
V
1
0.1  
1
10  
100  
0
5
10  
15  
20  
25  
30  
35  
40  
Qg, GATE CHARGE(nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 15. Capacitance vs. Drain to Source  
Voltage  
Figure 16. Gate Charge vs. Gate to Source  
Voltage  
www.onsemi.com  
5
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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