FCDN605 [ONSEMI]
1-Channel ESD Protector;
| 型号： | FCDN605 |
| 厂家： | 
ONSEMI |
| 描述： | 1-Channel ESD Protector |
| 文件： | 总3页 (文件大小：304K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FCDN605
1-Channel ESD Protector
Product Description
The FCDN605-UBM provides robust ESD protection for sensitive
parts that may be subjected to electrostatic discharge (ESD). The tiny
form factor and single pad allows it to be used in very confined spaces.
The electrical ‘back-to-back zener’ configuration provides
symmetrical ESD protection in cases where nodes with ac signals are
present. This device is designed and characterized to safely dissipate
ESD strikes of at least 15 kV, according to the MIL-STD-883
(Method 3015) specification for Human Body Model (HBM) ESD.
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Features
Compact Die Protects from ESD Discharges
Almost No Conduction at Signal Amplitudes Less than 5 V
ESD Protection to over 15 kV (Human Body Model HBM) per
MIL_STD_883 International ESD Standard
Applications
LED Lighting
Modules
Interface Circuits
Signal
Node
Signal
Node
Reference
Node
Top View
1
1
2
3
Wirebond Pad
2
DAP
3
4
Test Point
(Green Pad)
Reference Node
(Backside is Bare Silicon)
Figure 1. Electrical Schematic and Top View
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
April, 2011 − Rev. 3
FCDN605/D
FCDN605
Table 1. PIN DESCRIPTIONS
FCDN605−UBM (Schematic and Top View)
Designation
Schematic
Signal Node
Top View
Wirebond Pad
DAP
Metal Composition
1
2
3
4
Al
Signal Node
Cu
−
Reference Node
Reference Node
Test Point
N/A
Bare Silicon
Table 2. ORDERING INFORMATION
Ordering Part Number DAP (Die Attach Pad)
FCDN605−UBM Cu (Copper)
Backside Metal
BG Thickness
10 mils
Shipping Method
Bare Silicon
Wafer Form
SPECIFICATIONS
Table 3. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
C
Operating Junction Temperature Range
Storage Junction Temperature Range
−40 to +150
−65 to +150
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 4. STANDARD OPERATING CONDITIONS
Parameter
Operating Junction Temperature Range
Rating
Unit
−40 to +150
C
Table 5. ELECTRICAL OPERATING CHARACTERISTICS (See Note 1)
Symbol Parameter Test Conditions
V = 5 V, 25C
Min
Typ
Max
Unit
I
Leakage Current
+0.35
−0.35
4.0
mA
mA
mA
LEAK
V = −10 V, 25C
V = 5 V, 150C
V
CL
Clamp Voltage on Signal Node
Positive Polarity
Negative Polarity
T = 25C
V
A
at 10 mA
+5
−14
+7
−11.5
+9
−10
at −10 mA
V
ESD Protection − Withstand Voltage: Human
Body Model (MIL−STD−883, Method 3015)
T = 25C
kV
V
ESD
A
15
V
Clamping Voltage on Signal Node for Transients
Positive Polarity
Negative Polarity
I
= 1 A, t = 8/20 ms
PP P
Positive Transients
Negative Transients
CL_ESD
+7
−12
R
Dynamic Resistance
I
PP
= 1 A, t = 8/20 ms
Positive Transients
Negative Transients
W
DYN
P
R
R
0.4
0.8
DYN+
DYN−
C
Input Capacitance
At 1 MHz, 30 mV osc. Level,
0 VDC Bias (Note 2)
At 1 MHz, 30 mV osc. Level,
3 VDC bias
107
79
pF
IN
1. Operating characteristics are over standard operating conditions unless otherwise specified.
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2
FCDN605
MECHANICAL DETAILS
MECHANICAL PACKAGE DIAGRAM
Table 6. MECHANICAL SPECIFICATIONS
Parameter
Composition
Condition
Unit
Silicon Wafer,
n+ Doped
Die Shape
Rectangular
1260
Length (Stepping Size)
Width (Stepping Size)
BG Thickness
mm
mm
1160
10
mils
mm
Saw Street Widths (Space
between Devices on Wafer)
(Note 1)
40 (X−Direction)
40 (Y−Direction)
Die Attach Pad Length
Die Attach Pad Width
Die Attach Pad (DAP)
Backside Metal
720
mm
mm
720
Cu (Copper)
Bare Silicon
1. The saw street is defined as the passivation−free area between
devices.
Figure 2. Die Dimensions
Figure 3. Die−Array on Wafer
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
FCDN605/D
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