EMI4172 [ONSEMI]
Common Mode Filter with ESD Protection; 共模滤波器与ESD保护
| 型号： | EMI4172 |
| 厂家： | 
ONSEMI |
| 描述： | Common Mode Filter with ESD Protection |
| 文件： | 总10页 (文件大小：776K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EMI4172
Common Mode Filter with
ESD Protection
Functional Description
The EMI4172 is an integrated common mode filter providing both
ESD protection and EMI filtering for high speed digital serial
interfaces such as HDMI or MIPI D-PHY.
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The EMI4172 provides protection for two differential data line pairs
in a small RoHS-compliant WDFN10 package.
MARKING
DIAGRAMS
Features
2TMG
• Highly Integrated Common Mode Filter (CMF) with ESD Protection
provides protection and EMI reduction for systems using High Speed
Serial Data Lines with cost and space savings over discrete solutions
G
WDFN10
CASE 511BM
• Large Differential Mode Bandwidth with Cutoff Frequency > 2 GHz
• High Common Mode Stop Band Attenuation: >15 dB at 700 MHz
2T = Specific Device Code
M
G
= Date Code
= Pb−Free Package
• Provides ESD Protection to IEC61000-4-2 Level 4, 8 kV Contact
(*Note: Microdot may be in either location)
Discharge
• Low Channel Input Capacitance Provides Superior Impedance
Matching Performance
• Low Profile Package with Small Footprint in WDFN10 2 x 2.5 mm
Pb−Free Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PIN CONNECTIONS
1
2
In_1+
In_1−
GND
10
9
Out_1+
Out_1−
GND
Applications
3
4
8
7
• HDMI/DVI Display in Mobile Phones
• MIPI D-PHY (CSI-2, DSI, etc) in Mobile Phones and Digital Still
Cameras
Out_2+
Out_2−
In_2+
5
6
In_2−
1
10
(Top View)
2
4
9
7
External
(Connector)
Internal
(ASIC)
ORDERING INFORMATION
5
6
†
Device
Package
Shipping
EMI4172MTTAG
WDFN10
3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
3, 8
Figure 1. EMI4172 Electrical Schematic
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
October, 2012 − Rev. 0
EMI4172/D
EMI4172
PIN FUNCTION DESCRIPTION
Pin Name
In_1+
Pin No.
Type
I/O
Description
1
2
CMF Channel 1+ to Connector (External)
CMF Channel 1− to Connector (External)
CMF Channel 1+ to ASIC (Internal)
CMF Channel 1− to ASIC (Internal)
CMF Channel 2+ to Connector (External)
CMF Channel 2− to Connector (External)
CMF Channel 2+ to ASIC (Internal)
CMF Channel 2− to ASIC (Internal)
Ground
In_1−
I/O
Out_1+
Out_1−
In_2+
10
9
I/O
I/O
4
I/O
In_2−
5
I/O
Out_2+
Out_2−
7
I/O
6
I/O
V
N
3, 8
GND
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Parameter
Operating Temperature Range
Symbol
Value
−40 to +85
−65 to +150
260
Unit
°C
T
OP
Storage Temperature Range
T
STG
°C
Maximum Lead Temperature for Soldering Purposes
(1/8” from Case for 10 seconds)
T
L
°C
DC Current per Line
I
100
mA
LINE
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Channel Leakage Current
Channel Negative Voltage
Test Conditions
T = 25°C, V = 5 V, GND = 0 V
Min
Typ
Max
1.0
1.5
1.3
Unit
mA
V
I
LEAK
A
IN
V
F
T = 25°C, I = 10 mA
0.1
A
F
C
Channel Input Capacitance to Ground
(Pins 1, 2, 4, 5 to Pins 3, 8)
T = 25°C, At 1 MHz, GND = 0 V,
0.8
8.0
pF
IN
A
IN
V
= 1.65 V
R
Channel Resistance
(Pins 1−10, 2−9, 4−7 and 5−6)
W
CH
f
Differential Mode Cut−off Frequency
50 W Source and Load Termination
@ 700 MHz
2.0
15
GHz
dB
3dB
F
atten
Common Mode Stop Band Attenuation
V
ESD
In−system ESD Withstand Voltage
a) Contact discharge per IEC 61000−4−2
standard, Level 4 (External Pins)
b) Contact discharge per IEC 61000−4−2
standard, Level 1 (Internal Pins)
(Notes 1 and 2)
kV
8
2
V
CL
TLP Clamping Voltage
(See Figure 12)
Forward I = 8 A
12
18
V
V
V
V
PP
Forward I = 16 A
PP
Forward I = −8 A
−6
PP
Forward I = −16 A
−12
PP
R
Dynamic Resistance
Positive Transients
Negative Transients
T = 25°C, I = 1 A, t = 8/20 ms
A PP P
Any I/O pin to Ground;
Notes 1 and 3
DYN
1.36
0.6
V
Reverse Working Voltage
Breakdown Voltage
(Note 3)
5.0
9.0
V
V
RWM
V
I = 1 mA; (Note 4)
T
5.6
BR
1. Standard IEC61000−4−2 with C
= 150 pF, R
= 330, GND grounded.
Discharge
Discharge
2. These measurements performed with no external capacitor.
3. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
), which should be equal to or greater than the DC
RWM
4. V is measured at pulse test current I .
BR
T
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2
EMI4172
TYPICAL CHARACTERISTICS
0
−1
−2
−3
−4
−5
−6
−7
−8
−9
0
−5
−10
−15
−20
−25
−30
−35
−40
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Differential Mode Attenuation vs.
Frequency
Figure 3. Common Mode Attenuation vs.
Frequency
MIPI DSI (D−PHY)
MIPI DSI (D−PHY)
Client
Host
EMI4172
Evaluation
Board
Figure 4. MIPI D−PHY LP Mode Test Setup
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3
EMI4172
Figure 5. EMI4172 MIPI D−PHY LP Mode Measured Results
EMI4172
Figure 6. EMI4172 Eye Diagram Test Setup
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4
EMI4172
Figure 7. EMI4172 Measured Eye Diagram @ 3.4Gbps (EVB through on left, EVB with EMI4172 on right)
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5
EMI4172
Transmission Line Pulse (TLP) Measurements
Transmission Line Pulse (TLP) provides current versus voltage (I-V) curves in which each data point is obtained from a
100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in
Figure 8. TLP I-V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s of
amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 9 where an 8 kV
IEC61000-4-2 current waveform is compared with TLP current pulses at 8 and 16 A. A TLP curve shows the voltage at which
the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I-V curves for
the EMI4172 are shown in Figure 10.
Attenuator
L
50 W Coax Cable
SW
÷
50 W Coax
Cable
VM
IM
10 MW
VC
DUT
Oscilloscope
Figure 8. Simplified Schematic of a Typical TLP System
Figure 9. Comparison Between 8 kV IEC61000−4−2 and 8 A and 16 A TLP Waveforms
Figure 10. Positive and Negative TLP Waveforms
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6
EMI4172
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low
a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per
the IEC61000−4−2 waveform. Since the IEC61000−4−2 was written as a pass/fail spec for larger systems such as cell phones
or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor
has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD
pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these screenshots and how to interpret them please refer to On Semiconductor
Application Notes AND8307/D and AND8308/D.
IEC61000−4−2 Waveform
IEC61000−4−2 Spec.
I
peak
Test
Voltage
(kV)
First Peak
Current
(A)
100%
90%
Current at
30 ns (A)
Current at
60 ns (A)
Level
1
2
3
4
2
4
6
8
7.5
15
4
8
2
4
6
8
I @ 30 ns
22.5
30
12
16
I @ 60 ns
10%
t
P
= 0.7 ns to 1 ns
Oscilloscope
ESD Gun
TVS
50 W
Cable
50 W
Figure 11. Diagram of ESD Test Setup
100
90
80
70
60
50
40
30
20
t
r
PEAK VALUE I
@ 8 ms
RSM
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE I /2 @ 20 ms
RSM
t
P
10
0
0
20
40
t, TIME (ms)
60
80
Figure 12. 8 x 20 ms Pulse Waveform
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7
EMI4172
Figure 13. ESD Clamping Voltage +8 kV per IEC6100−4−2 (external to internal pin)
Figure 14. ESD Clamping Voltage −8 kV per IEC6100−4−2 (external to internal pin)
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8
EMI4172
HDMI Type−A
Connector
EMI4172
D2+
GND
D2−
D1+
TMDS Data 2+
TMDS Data 2−
TMDS Data 1+
GND
D1−
TMDS Data 1−
EMI4172
D0+
TMDS Data 0+
GND
TMDS Data 0−
D0−
CLK+
GND
TMDS Clock+
TMDS Clock−
CEC
CLK−
CEC
SCL
SDA
HEC DATA
SCL
Hot Plug Detect
SDA
GND
NUP4114
+5V Power
5V
(Bottom View)
HTP _D
Black = Top layer
Red = other layer
Figure 15. EMI4172 HDMI Type – A Connector Application Diagram
HDMI Type−D
Connector
EMI4172
TMDS Data 2+
PIN 1
TMDS Data 2−
HTP_D
Util
D2+
GND
D2−
TMDS Data 1+
D1+
GND
D1−
TMDS Data 1−
D0+
GND
TMDS Data 0+
D0−
GND
CEC
SCL
5V
CLK +
TMDS Data 0−
CLK −
GND
SDA
TMDS Clock +
TMDS Clock −
Black = Top layer
Red = other layer
EMI4172
CEC
SCL
+5V Power
SDA
NUP4114
(Bottom View)
Figure 16. EMI4172 HDMI Type − D Connector Application Diagram
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9
EMI4172
PACKAGE DIMENSIONS
WDFN10 2.5x2, 0.5P
CASE 511BM−01
ISSUE O
L
L
NOTES:
A
B
E
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
2X
0.10
C
PIN 1
REFERENCE
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
MILLIMETERS
A3
DIM MIN
MAX
0.80
0.05
EXPOSED Cu
MOLD CMPD
2X
0.10
C
A 0.70
TOP VIEW
A1
A3
b
0.00
0.20 REF
(A3)
0.15
0.25
DETAIL B
0.05
C
D
2.50 BSC
2.00 BSC
0.50 BSC
A1
E
A
e
DETAIL B
L
0.70
0.05
0.90
0.15
ALTERNATE
0.05
C
L1
CONSTRUCTIONS
NOTE 4
A1
SEATING
PLANE
C
SIDE VIEW
DETAIL A
RECOMMENDED
MOUNTING FOOTPRINT
1
5
6
8X
0.30
PACKAGE
8X
OUTLINE
8X
L
1.07
0.10
MIN
2.30
10
b
9X
e
1
M
M
C A B
0.10
0.05
NOTE 3
C
0.45
0.50 PITCH
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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EMI4172/D
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