CAT22C10LI-30 [ONSEMI]

64X4 NON-VOLATILE SRAM, 300ns, PDIP18, ROHS COMPLIANT, PLASTIC, DIP-18;
CAT22C10LI-30
型号: CAT22C10LI-30
厂家: ONSEMI    ONSEMI
描述:

64X4 NON-VOLATILE SRAM, 300ns, PDIP18, ROHS COMPLIANT, PLASTIC, DIP-18

静态存储器 光电二极管 内存集成电路
文件: 总10页 (文件大小:56K)
中文:  中文翻译
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CAT22C10  
256-Bit Nonvolatile CMOS Static RAM  
FEATURES  
Single 5V Supply  
Low CMOS Power Consumption:  
–Active: 40mA Max.  
–Standby: 30µA Max.  
Fast RAM Access Times:  
–200ns  
–300ns  
JEDEC Standard Pinouts:  
–18-lead DIP  
Infinite EEPROM to RAM Recall  
CMOS and TTL Compatible I/O  
Power Up/Down Protection  
–16-lead SOIC  
10 Year Data Retention  
Commercial, Industrial and Automotive  
100,000 Program/Erase Cycles (E2PROM)  
Temperature Ranges  
DESCRIPTION  
TheCAT22C10NVRAMisa256-bitnonvolatilememory  
organized as 64 words x 4 bits. The high speed Static  
RAM array is bit for bit backed up by a nonvolatile  
EEPROM array which allows for easy transfer of data  
from RAM array to EEPROM (STORE) and from  
EEPROM to RAM (RECALL). STORE operations are  
completed in 10ms max. and RECALL operations typi-  
cally within 1.5µs. The CAT22C10 features unlimited  
RAM write operations either through external RAM  
writes or internal recalls from EEPROM. Internal false  
store protection circuitry prohibits STORE operations  
when VCC is less than 3.0V.  
The CAT22C10 is manufactured using Catalyst’s ad-  
vanced CMOS floating gate technology. It is designed  
to endure 100,000 program/erase cycles (EEPROM)  
and has a data retention of 10 years. The device is  
available in JEDEC approved 18-lead plastic DIP and  
16-lead SOIC packages.  
PIN FUNCTIONS  
PIN CONFIGURATION  
DIP Package (L)  
SOIC Package (W)  
Pin Name  
A0–A5  
I/O0–I/O3  
WE  
Function  
Address  
Data In/Out  
Write Enable  
Chip Select  
Recall  
A
A
A
A
1
2
3
4
5
6
1 6  
1 5  
1 4  
13  
12  
11  
10  
9
V
cc  
A
V
4
3
2
1
1 8  
NC  
cc  
1
2
3
4
5
6
7
8
A
4
5
1 7  
1 6  
1 5  
1 4  
13  
NC  
I/O  
I/O  
I/O  
I/O  
A
A
5
I/O  
4
3
2
1
3
A
2
3
CS  
A
A
I/O  
I/O  
I/O  
0
1
2
1
0
RECALL  
STORE  
VCC  
CS  
A
0
CS  
V
7
8
12  
WE  
RECALL  
ss  
STORE  
Store  
V
11  
WE  
ss  
+5V  
STORE  
9
10  
RECALL  
VSS  
Ground  
NC  
No Connect  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc. No. MD-1082, Rev. R  
1
CAT22C10  
BLOCK DIAGRAM  
EEPROM ARRAY  
A
A
A
ROW  
STATIC RAM  
0
1
2
STORE  
SELECT  
ARRAY  
RECALL  
A
A
A
3
4
5
COLUMN SELECT  
CONTROL  
LOGIC  
READ/WRITE  
CIRCUITS  
STORE  
RECALL  
I/O I/O I/O I/O  
CS WE  
0
1
2
3
MODE SELECTION(1)(2)(3)  
Input  
Mode  
CS  
WE  
X
RECALL  
STORE  
I/O  
Standby  
H
L
H
H
H
L
H
H
H
H
H
L
Output High-Z  
RAM Read  
H
L
Output Data  
RAM Write  
L
Input Data  
(EEPROMRAM)  
(EEPROMRAM)  
(RAMEEPROM)  
(RAMEEPROM)  
X
H
X
H
H
X
Output High-Z RECALL  
Output High-Z RECALL  
Output High-Z STORE  
Output High-Z STORE  
L
H
X
H
H
L
POWER-UP TIMING(4)  
Symbol  
Parameter  
Min.  
0.5  
Max.  
Units  
VCCSR  
VCC Slew Rate  
0.005  
V/ms  
Note:  
(1) RECALL signal has priority over STORE signal when both are applied at the same time.  
(2) STORE is inhibited when RECALL is active.  
(3) The store operation is inhibited when V is below 3.0V.  
CC  
(4) This parameter is tested initially and after a design or process change that affects the parameter.  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc. No. MD-1082, Rev. R  
2
CAT22C10  
ABSOLUTE MAXIMUM RATINGS*  
*COMMENT  
Temperature Under Bias ................. 55°C to +125°C  
Storage Temperature....................... 65°C to +150°C  
Stresses above those listed under Absolute Maximum  
Ratingsmay cause permanent damage to the device.  
These are stress ratings only, and functional operation  
of the device at these or any other conditions outside of  
those listed in the operational sections of this specifica-  
tion is not implied. Exposure to any absolute maximum  
rating for extended periods may affect device perfor-  
mance and reliability.  
Voltage on Any Pin with  
Respect to Ground(2) ..............-2.0 to +VCC +2.0V  
VCC with Respect to Ground ................ -2.0V to +7.0V  
Package Power Dissipation  
Capability (Ta = 25°C)................................... 1.0W  
Lead Soldering Temperature (10 secs) ............ 300°C  
Output Short Circuit Current(3) ........................ 100 mA  
RELIABILITY CHARACTERISTICS  
Symbol  
Parameter  
Endurance  
Min.  
100,000  
10  
Max.  
Units  
Cycles/Byte  
Years  
Reference Test Method  
MIL-STD-883, Test Method 1033  
MIL-STD-883, Test Method 1008  
MIL-STD-883, Test Method 3015  
JEDEC Standard 17  
(1)  
NEND  
(1)  
TDR  
Data Retention  
ESD Susceptibility  
Latch-Up  
(1)  
VZAP  
2000  
100  
Volts  
(1)(4)  
ILTH  
mA  
D.C. OPERATING CHARACTERISTICS  
= +5V ±10%, unless otherwise specified.  
V
CC  
Limits  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
Conditions  
ICC  
Current Consumption  
(Operating)  
40  
mA  
All Inputs = 5.5V  
TA = 0°C  
All I/Os Open  
ISB  
Current Consumption  
(Standby)  
30  
µA  
CS = VCC  
All I/Os Open  
ILI  
Input Current  
10  
10  
µA  
µA  
V
0 VIN 5.5V  
ILO  
Output Leakage Current  
High Level Input Voltage  
Low Level Input Voltage  
High Level Output Voltage  
Low Level Output Voltage  
RAM Data Holding Voltage  
0 VOUT 5.5V  
VIH  
VIL  
2
0
VCC  
0.8  
V
VOH  
VOL  
VDH  
2.4  
V
IOH = 2mA  
IOL = 4.2mA  
VCC  
0.4  
5.5  
V
1.5  
V
CAPACITANCE T = 25°C, f = 1.0 MHz, V  
= 5V  
A
CC  
Symbol  
Parameter  
Max.  
Unit  
pF  
Conditions  
VI/O = 0V  
VIN = 0V  
(1)  
CI/O  
Input/Output Capacitance  
Input Capacitance  
10  
6
(1)  
CIN  
pF  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
(2) The minimum DC input voltage is -0.5V. During transitions, inputs may undershoot to -2.0V for periods of less than 20 ns. Maximum DC  
voltage on output pins is V +0.5V, which may overshoot to V +2.0V for periods of less than 20 ns.  
CC  
CC  
(3) Output shorted for no more than one second. No more than one output shorted at a time.  
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from -1V to V +1V.  
CC  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc No. MD-1082, Rev. R  
3
CAT22C10  
A.C. CHARACTERISTICS, Write Cycle  
V
CC  
= +5V ±10%, unless otherwise specified.  
22C10-20  
22C10-30  
Symbol  
tWC  
Parameter  
Min.  
Max.  
Min.  
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Conditions  
Write Cycle Time  
CS Write Pulse Width  
Address Setup Time  
Write Pulse Width  
Write Recovery Time  
Data Valid Time  
200  
150  
50  
300  
150  
50  
tCW  
tAS  
CL = 100pF  
+1TTL gate  
VOH = 2.2V  
VOL = 0.65V  
VIH = 2.2V  
VIL = 0.65V  
tWP  
150  
25  
150  
25  
tWR  
tDW  
100  
0
100  
0
tDH  
Data Hold Time  
(1)  
tWZ  
Output Disable Time  
Output Enable Time  
100  
100  
tOW  
0
0
A.C. CHARACTERISTICS, Read Cycle  
= +5V ±10%, unless otherwise specified.  
V
CC  
22C10-20  
22C10-30  
Symbol  
tRC  
Parameter  
Read Cycle Time  
Address Access Time  
CS Access Time  
Min.  
Max.  
Min.  
Max.  
Unit  
ns  
Conditions  
CL = 100pF  
+1TTL gate  
VOH = 2.2V  
VOL = 0.65V  
VIH = 2.2V  
VIL = 0.65V  
200  
300  
tAA  
200  
200  
300  
300  
ns  
tCO  
ns  
tOH  
Output Data Hold Time  
CS Enable Time  
0
0
0
0
ns  
(1)  
tLZ  
ns  
(1)  
tHZ  
CS Disable Time  
100  
100  
ns  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc. No. MD-1082, Rev. R  
4
CAT22C10  
A.C. CHARACTERISTICS, Store Cycle  
= +5V ±10%, unless otherwise specified.  
V
CC  
Limits  
Symbol  
tSTC  
Parameter  
Store Time  
Min.  
200  
0
Max.  
Units  
ms  
ns  
Conditions  
10  
tSTP  
Store Pulse Width  
Store Disable Time  
Store Enable Time  
CL = 100pF + 1TTL gate  
VOH = 2.2V, VOL = 0.65V  
VIH = 2.2V, VIL = 0.65V  
(1)  
tSTZ  
100  
ns  
(1)  
tOST  
ns  
A.C. CHARACTERISTICS, Recall Cycle  
= +5V ±10%, unless otherwise specified.  
V
CC  
Limits  
Symbol  
tRCC  
Parameter  
Min.  
1.4  
Max.  
Units  
µs  
Conditions  
Recall Cycle Time  
Recall Pulse Width  
Recall Disable Time  
Recall Enable Time  
Recall Data Access Time  
tRCP  
300  
ns  
CL = 100pF + 1TTL gate  
VOH = 2.2V, VOL = 0.65V  
VIH = 2.2V, VIL = 0.65V  
tRCZ  
100  
1.1  
ns  
tORC  
0
ns  
tARC  
µs  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc No. MD-1082, Rev. R  
5
CAT22C10  
array into the Static RAM. When the STORE input is  
taken low, it initiates a store operation which transfers  
the entire Static RAM array contents into the EEPROM  
array.  
DEVICE OPERATION  
The configuration of the CAT22C10 allows a common  
address bus to be directly connected to the address  
inputs. Additionally, the Input/Output (I/O) pins can be  
directly connected to a common I/O bus if the bus has  
less than 1 TTL load and 100pF capacitance. If not, the  
I/O path should be buffered.  
Standby Mode  
The chip select (CS) input controls all of the functions of  
the CAT22C10. When a high level is supplied to the CS  
pin, the device goes into the standby mode where the  
outputs are put into a high impendance state and the  
power consumption is drastically reduced. With ISB less  
than 100µA in standby mode, the designer has the  
flexibility to use this part in battery operated systems.  
When the chip select (CS) pin goes low, the device is  
activated. When CS is forced high, the device goes into  
thestandbymodeandconsumesverylittlecurrent.With  
the nonvolatile functions inhibited, the device operates  
like a Static RAM. The Write Enable (WE) pin selects a  
write operation when WE is low and a read operation  
whenWEishigh. Ineitherofthesemodes, anarraybyte  
(4 bits) can be addressed uniquely by using the address  
lines (A0A5), and that byte will be read or written to  
through the Input/Output pins (I/O0I/O3).  
Read  
When the chip is enabled (CS = low), the nonvolatile  
functions are inhibited (STORE = high and RECALL =  
high). With the Write Enable (WE) pin held high, the data  
in the Static RAM array may be accessed by selecting an  
address with input pins A0A5. This will occur when the  
outputsareconnectedtoabuswhichisloadedbynomore  
than 100pF and 1 TTL gate. If the loading is greater than  
this, some additional buffering circuitry is recommended.  
The nonvolatile functions are inhibited by holding the  
STORE input and the RECALL input high. When the  
RECALL input is taken low, it initiates a recall operation  
which transfers the contents of the entire EEPROM  
Figure 1. Read Cycle Timing  
t
RC  
ADDRESS  
t
AA  
t
CO  
CS  
t
t
t
HZ  
LZ  
OH  
HIGH-Z  
DATA I/O  
DATA VALID  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc. No. MD-1082, Rev. R  
6
CAT22C10  
Write  
With the chip enabled and the nonvolatile functions  
inhibited, the Write Enable (WE) pin will select the write  
mode when driven to a low level. In this mode, the  
address must be supplied for the byte being written.  
After the set-up time (tAS), the input data must be  
supplied to pins I/O0I/O3. When these conditions, in-  
cluding the write pulse width time (tWP) are met, the data  
will be written to the specified location in the Static RAM.  
A write function may also be initiated from the standby  
mode by driving WE low, inhibiting the nonvolatile func-  
tions,supplyingvalidaddresses,andthentakingCS low  
and supplying input data.  
Figure 2. Write Cycle Timing  
t
WC  
ADDRESS  
CS  
t
CW  
t
t
t
WP  
WR  
AS  
WE  
t
t
DH  
DW  
DATA VALID  
DATA IN  
t
t
OW  
WZ  
HIGH-Z  
DATA OUT  
Figure 3. Early Write Cycle Timing  
t
WC  
ADDRESS  
t
CW  
CS  
t
AS  
t
WR  
t
WP  
WE  
DATA IN  
t
t
DH  
DW  
DATA VALID  
HIGH-Z  
DATA OUT  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc No. MD-1082, Rev. R  
7
CAT22C10  
Recall  
place independent of the state of CS, WE or A0A5. The  
STOREpinmustbeheldlowforthedurationoftheStore  
Pulse Width (tSTP) to ensure that a store operation is  
initiated. Once initiated, the STORE pin becomes a  
Dont Care, and the store operation will complete its  
transfer of the entire contents of the Static RAM array  
into the EEPROM array within the Store Cycle time  
(tSTC).Ifastoreoperationisinitiatedduringawritecycle,  
the contents of the addressed Static RAM byte and its  
corresponding byte in the EEPROM array will be un-  
known.  
At anytime, except during a store operation, taking the  
RECALL pin low will initiate a recall operation. This is  
independent of the state of CS, WE, or A0A5. After the  
RECALL pin has been held low for the duration of the  
Recall Pulse Width (tRCP), the recall will continue inde-  
pendent of any other inputs. During the recall, the entire  
contents of the EEPROM array is transferred to the  
StaticRAMarray.Thefirstbyteofdatamaybeexternally  
accessedaftertherecalleddataaccesstimefromendof  
recall (tARC) is met. After this, any other byte may be  
accessed by using the normal read mode.  
During the store operation, the outputs are in a high  
impedance state. A minimum of 100,000 store opera-  
tions can be performed reliably and the data written into  
the EEPROM array has a minimum data retention time  
of 10 years.  
If the RECALL pin is held low for the entire Recall Cycle  
time (tRCC), the contents of the Static RAM may be  
immediately accessed by using the normal read mode.  
A recall operation can be performed an unlimited num-  
ber of times without affecting the integrity of the data.  
DATA PROTECTION DURING POWER-UP AND  
POWER-DOWN  
The outputs I/O0I/O3 will go into the high impedance  
state as long as the RECALL signal is held low.  
The CAT22C10 has on-chip circuitry which will prevent  
a store operation from occurring when VCC falls below  
3.0Vtyp. Thisfunctioneliminatesthepotentialhazardof  
spurious signals initiating a store operation when the  
system power is below 3.0V typ.  
Store  
At any time, except during a recall operation, taking the  
STORE pin low will initiate a store operation. This takes  
Figure 4. Recall Cycle Timing  
t
RCC  
ADDRESS  
t
RCP  
RECALL  
CS  
t
ARC  
t
ORC  
HIGH-Z  
DATA I/O  
DATA UNDEFINED  
DATA VALID  
t
RCZ  
Figure 5. Store Cycle Timing  
t
STC  
t
STP  
STORE  
t
STZ  
HIGH-Z  
DATA I/O  
© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc. No. MD-1082, Rev. R  
8
CAT22C10  
EXAMPLE OF ORDERING INFORMATION(1)  
Prefix  
Device #  
22C10  
Suffix  
CAT  
W
I
20  
T1  
Temperature Range  
Company ID  
Product Number  
T: Tape & Reel  
1: 1,000/Reel  
I = Industrial (-40°C to +85°C)  
22C10  
E = Extended (-40°C to +125°C)(3)  
Speed  
20: 200ns  
30: 300ns  
Package  
L: PDIP  
W: SOIC, JEDEC  
ORDERING INFORMATION  
Orderable Part Numbers (for Pb-Free Devices)  
CAT22C10LE20  
CAT22C10LE30  
CAT22C10LI20  
CAT22C10LI30  
CAT22C10WE-20-T1  
CAT22C10WE-30-T1  
CAT22C10WI-20-T1  
CAT22C10WI-30-T1  
Notes:  
(1) The device used in the above example is a CAT22C10WI-20-T1 (SOIC, Industrial Temperature, 200ns, Tape & Reel, 1,000/Reel).  
(2) For additional package option please contact your nearest Catalyst Semiconductor Sales office.  
(3) Extended Temperature available upon request.  
© 2009 SCILLC. All rights reserved.  
Doc No. MD-1082, Rev. R  
9
Characteristics subject to change without notice.  
CAT22C10  
REVISION HISTORY  
Date  
Revision Description  
16-Apr-04  
O
Add Lead free logo  
Update Features  
Update Pin Configuration  
Update Ordering Information  
Update Revision Number  
24-Jun-08  
17-Mar-09  
31-Jul-09  
P
Q
R
Update Example of Ordering Information  
Change logo and fine print to ON Semiconductor  
Update Example of Ordering Information  
Update Ordering Information table  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to  
any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
a
r
i
s
i
n
g
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Typicalparameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operatingparameters,includingTypicalsmustbevalidatedforeachcustomerapplicationbycustomerstechnicalexperts.SCILLCdoesnotconveyanylicenseunderitspatentrights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
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© 2009 SCILLC. All rights reserved.  
Characteristics subject to change without notice.  
Doc. No. MD-1082, Rev. R  
10  

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