74FST3861 [ONSEMI]

10−Bit Bus Switch; 10位总线开关
74FST3861
型号: 74FST3861
厂家: ONSEMI    ONSEMI
描述:

10−Bit Bus Switch
10位总线开关

开关
文件: 总6页 (文件大小:193K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74FST3861  
10−Bit Bus Switch  
The ON Semiconductor 74FST3861 is a 10bit, high performance  
bus switch. The device is CMOS TTL compatible when operating  
between 4.0 and 5.5 Volts. The device exhibits extremely low R and  
ON  
adds nearly zero propagation delay. The device adds no noise or  
ground bounce to the system.  
http://onsemi.com  
MARKING  
Features  
R t 4 W Typical  
ON  
DIAGRAMS  
Less Than 0.25 nsMax Delay Through Switch  
Nearly Zero Standby Current  
No Circuit Bounce  
Control Inputs are TTL/CMOS Compatible  
PinForPin Compatible With QS3861, FST3861, CBT3861  
All Popular Packages: SOIC24, TSSOP24, QSOP24  
All Devices in Package TSSOP are Inherently PbFree*  
24  
1
24  
FST3861  
AWLYWW  
1
SOIC24  
DW SUFFIX  
CASE 751E  
NC  
V
OE  
B
B
B
B
B
B
B
B
B
B
1
2
3
4
5
6
7
8
9
24  
23  
CC  
24  
A
1
24  
FST  
3861  
ALYW  
A
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
2
1
A
3
2
1
A
4
3
TSSOP24  
DT SUFFIX  
CASE 948H  
1
A
5
4
A
6
5
A
7
6
A
8
7
A
10  
11  
12  
9
8
24  
A
10  
9
24  
GND  
10  
FST3861  
AWLYYWW  
1
SO247/SO248/SO249  
QSOP24  
QS SUFFIX  
CASE 492B  
1
Figure 1. 24Lead  
Pinout  
A
=
Assembly  
Location  
L, WL  
Y, YY  
W, WW  
Week  
TRUTH TABLE  
Input  
=
=
=
Wafer Lot  
Year  
Work  
Operation  
OE  
A Port = B Port  
L
PIN NAMES  
Disconnect  
H
Pin  
Description  
NOTE:  
OE  
Bus Switch Enables  
H = HIGH Voltage Level  
L = LOW Voltage Level  
NC  
No Connect  
Bus A  
A to A  
1
10  
B to B  
Bus B  
1
10  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
June, 2006 Rev. 6  
74FST3861/D  
74FST3861  
2
22  
13  
A
B
B
1
1
11  
23  
A
10  
10  
OE  
Figure 2. Logic Diagram  
ORDERING INFORMATION  
Device Order Number  
Package  
SOIC24  
SOIC24  
Shipping  
48 Units / Rail  
74FST3861DW  
74FST3861DWR2  
74FST3861DT  
2500 Units / Tape & Reel  
96 Units / Rail  
TSSOP24*  
(PbFree)  
74FST3861DTR2  
TSSOP24*  
(PbFree)  
2500 Units / Tape & Reel  
74FST3861QS  
QSOP24  
QSOP24  
96 Units / Rail  
74FST3861QSR  
2500 Units / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently PbFree.  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
*0.5 to )7.0  
*0.5 to )7.0  
*0.5 to )7.0  
*50  
Unit  
V
V
DC Supply Voltage  
CC  
V
DC Input Voltage  
V
I
V
DC Output Voltage  
V
O
I
DC Input Diode Current  
DC Output Diode Current  
DC Output Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
V t GND  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
I
V
t GND  
O
*50  
OK  
I
128  
O
I
$100  
CC  
I
$100  
GND  
T
*65 to )150  
260  
STG  
T
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature Under Bias  
Thermal Resistance  
°C  
L
)150  
°C  
J
q
SOIC  
TSSOP  
QSOP  
125  
170  
200  
°C/W  
JA  
MSL  
Moisture Sensitivity  
Flammability Rating  
ESD Withstand Voltage  
Level 1  
F
Oxygen Index: 28 to 34  
UL 94 V0 @ 0.125 in  
R
V
Human Body Model (Note 1)  
Machine Model (Note 2)  
Charged Device Model (Note 3)  
u2000  
u200  
N/A  
V
ESD  
I
Latchup Performance  
Above V and Below GND at 85°C (Note 4)  
$500  
mA  
Latchup  
CC  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Tested to EIA/JESD22A114A.  
2. Tested to EIA/JESD22A115A.  
3. Tested to JESD22C101A.  
4. Tested to EIA/JESD78.  
http://onsemi.com  
2
 
74FST3861  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
4.0  
0
Max  
5.5  
Unit  
V
V
Supply Voltage  
Operating, Data Retention Only  
(Note 5)  
CC  
V
Input Voltage  
5.5  
V
I
V
Output Voltage  
(HIGH or LOW State)  
0
5.5  
V
O
T
Operating FreeAir Temperature  
*40  
)85  
°C  
ns/V  
A
Dt/DV  
Input Transition Rise or Fall Rate  
Switch I/O  
Switch Control Input  
CC  
DC  
5
V
= 5.0 V $ 0.5 V  
0
5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.  
DC ELECTRICAL CHARACTERISTICS  
T
= *405C to )855C  
A
V
(V)  
CC  
Min  
Typ*  
Max  
Symbol  
Parameter  
Conditions  
Unit  
V
V
Clamp Diode Resistance  
HighLevel Input Voltage  
LowLevel Input Voltage  
Input Leakage Current  
I
= *18mA  
IN  
4.5  
*1.2  
V
V
IK  
4.0 to 5.5  
4.0 to 5.5  
5.5  
2.0  
IH  
V
I
0.8  
$1.0  
$1.0  
7
V
IL  
0 v V v 5.5 V  
mA  
mA  
W
I
IN  
I
OFFSTATE Leakage Current  
Switch On Resistance (Note 6)  
0 v A, B v V  
5.5  
OZ  
CC  
R
ON  
V
V
V
V
V
= 0 V, I = 64 mA  
4.5  
4
4
IN  
IN  
IN  
IN  
IN  
IN  
= 0 V, I = 30 mA  
4.5  
7
IN  
= 2.4 V, I = 15 mA  
4.5  
8
15  
IN  
= 2.4 V, I = 15 mA  
4.0  
11  
20  
IN  
I
Quiescent Supply Current  
= V or GND, I = 0  
OUT  
5.5  
3
mA  
CC  
CC  
DI  
Increase In I per Input  
One input at 3.4 V, Other inputs at V or GND  
5.5  
2.5  
mA  
CC  
CC  
CC  
*Typical values are at V = 5.0 V and T = 25°C.  
CC  
A
6. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower  
of the voltages on the two (A or B) pins.  
AC ELECTRICAL CHARACTERISTICS  
T
= *405C to )855C  
A
C
L
= 50 pF, RU = RD = 500 W  
V
= 4.55.5 V  
Max  
V
= 4.0 V  
CC  
CC  
Min  
Min  
Max  
Symbol  
Parameter  
Conditions  
V = OPEN  
Unit  
t
,
Prop Delay Bus to Bus (Note 7)  
0.25  
0.25  
ns  
PHL  
I
t
PLH  
t
t
,
Output Enable Time, I to Bus A, B  
V = OPEN for t  
1.0  
1.0  
5.1  
5.5  
5.6  
ns  
ns  
PZH  
OE  
I
PZH  
t
PZL  
,
Output Disable Time, I to Bus A, B  
V = OPEN for t  
5.5  
PHZ  
OE  
I
PHZ  
t
PLZ  
7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the  
typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance).  
CAPACITANCE (Note 8)  
Symbol  
Parameter  
Control Pin Input Capacitance  
A/B Port Input/Output Capacitance  
Conditions  
= 5.0 V  
Typ  
3
Max  
Unit  
pF  
C
IN  
V
V
CC  
C
I/O  
, OE = 5.0 V  
5
pF  
CC  
8. T = )25°C, f = 1 MHz, Capacitance is characterized but not tested.  
A
http://onsemi.com  
3
 
74FST3861  
AC Loading and Waveforms  
V
I
500 W  
FROM  
OUTPUT  
UNDER  
TEST  
500 W  
C *  
L
NOTES:  
1. Input driven by 50 W source terminated in 50 W.  
2. CL includes load and stray capacitance.  
*C = 50 pF  
L
Figure 3. AC Test Circuit  
t = 2.5 nS  
f
t = 2.5 nS  
f
3.0 V  
GND  
90 %  
1.5 V  
90 %  
1.5 V  
SWITCH  
INPUT  
10 %  
10 %  
t
t
PLH  
PLH  
V
V
OH  
OL  
1.5 V  
1.5 V  
OUTPUT  
Figure 4. Propagation Delays  
t = 2.5 nS  
f
t = 2.5 nS  
f
3.0 V  
90 %  
1.5 V  
90 %  
1.5 V  
ENABLE  
INPUT  
10 %  
10 %  
GND  
t
t
PZL  
PZL  
PZH  
OUTPUT  
OUTPUT  
1.5 V  
V
V
+ 0.3 V  
OL  
OL  
t
t
PHZL  
V
OH  
OH  
V
0.3 V  
1.5 V  
Figure 5. Enable/Disable Delays  
http://onsemi.com  
4
74FST3861  
PACKAGE DIMENSIONS  
SOIC24  
D SUFFIX  
CASE 751E04  
ISSUE E  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A−  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
24  
13  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
B12X P  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
M
M
B
0.010 (0.25)  
1
12  
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
15.54  
7.60  
2.65  
0.49  
0.90  
MAX  
0.612  
0.299  
0.104  
0.019  
0.035  
24X D  
J
A
B
C
D
F
15.25  
7.40  
2.35  
0.35  
0.41  
0.601  
0.292  
0.093  
0.014  
0.016  
M
S
S
0.010 (0.25)  
T
A
B
F
G
J
1.27 BSC  
0.050 BSC  
0.23  
0.13  
0
0.32  
0.29  
8
0.009  
0.005  
0
0.013  
0.011  
8
R X 45  
_
K
M
P
R
_
_
_
_
C
K
10.05  
0.25  
10.55  
0.75  
0.395  
0.010  
0.415  
0.029  
T−  
SEATING  
PLANE  
M
22X G  
TSSOP24  
DT SUFFIX  
CASE 948H01  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
24X KREF  
M
S
S
0.10 (0.004)  
T
U
V
S
0.15 (0.006) T  
U
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
24  
13  
2X L/2  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
B
U−  
L
PIN 1  
IDENT.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
12  
1
7. DIMENSION A AND B ARE TO BE DETERMINED AT  
DATUM PLANE −W−.  
S
U
MILLIMETERS  
DIM MIN MAX  
INCHES  
0.15 (0.006) T  
A
V−  
MIN  
MAX  
0.311  
0.177  
A
B
7.70  
4.30  
−−−  
7.90 0.303  
4.50 0.169  
C
1.20  
−−− 0.047  
0.006  
0.030  
D
0.05  
0.50  
0.15 0.002  
0.75 0.020  
F
C
G
H
0.65 BSC  
0.026 BSC  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.011  
0.015  
0.008  
0.006  
0.012  
0.010  
0.10 (0.004)  
J
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
J1  
K
SEATING  
PLANE  
T−  
G
H
D
K1  
L
6.40 BSC  
0.252 BSC  
0
M
0
8
8
_
_
_
_
N
0.25 (0.010)  
K
K1  
M
W−  
N
J1  
DETAIL E  
F
SECTION NN  
DETAIL E  
J
http://onsemi.com  
5
74FST3861  
PACKAGE DIMENSIONS  
QSOP24  
QS SUFFIX  
CASE 492B01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN  
THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE  
ONLY). BOTTOM PACKAGE DIMENSION SHALL  
FOLLOW THE DIMENSION STATED IN THIS  
DRAWING.  
A−  
Q
R
H x 45  
_
U
MOLD PIN  
MARK  
RAD.  
B−  
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 6 MILS PER  
SIDE.  
5. BOTTOM EJECTOR PIN WILL INCLUDE THE  
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.  
0.013 X 0.005  
DP. MAX  
RAD.  
0.0050.010  
TYP  
G
P
INCHES  
DIM MAX MIN  
MILLIMETERS  
L
DETAIL E  
MAX  
8.56  
3.81  
1.55  
0.20  
0.41  
MIN  
8.74  
3.99  
1.73  
0.31  
0.89  
M
0.25 (0.010)  
T
A
B
C
D
F
0.337  
0.150  
0.061  
0.008  
0.016  
0.344  
0.157  
0.068  
0.012  
0.035  
G
H
J
0.025 BSC  
0.64 BSC  
V
0.008 0.018  
0.0098 0.0075  
0.20  
0.249  
0.10  
5.84  
0
0.46  
0.191  
0.25  
6.20  
8
N 8 PL  
K
L
0.004  
0.230  
0
0.010  
0.244  
8
J
K
M
N
P
Q
R
U
V
_
_
_
_
M
0
0.027  
7
0.037  
0
0.69  
7
0.94  
_
_
_
_
0.035 DIA  
0.89 DIA  
T−  
SEATING  
PLANE  
0.035  
0.035  
0
0.045  
0.045  
8
0.89  
0.89  
0
1.14  
1.14  
8
C
24 PL D  
F
_
_
_
_
M
S
S
A
0.25 (0.010)  
T
B
DETAIL E  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
74FST3861/D  

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